KR20250027743A - 폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법 - Google Patents

폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법 Download PDF

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Publication number
KR20250027743A
KR20250027743A KR1020257002182A KR20257002182A KR20250027743A KR 20250027743 A KR20250027743 A KR 20250027743A KR 1020257002182 A KR1020257002182 A KR 1020257002182A KR 20257002182 A KR20257002182 A KR 20257002182A KR 20250027743 A KR20250027743 A KR 20250027743A
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South Korea
Prior art keywords
polyamic acid
residue
mol
acid composition
polyimide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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KR1020257002182A
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English (en)
Korean (ko)
Inventor
히로후미 나카야마
모에코 가토
류노스케 다키
노부아키 다나카
유키 시라이
에츠오 호리이
Original Assignee
가부시키가이샤 가네카
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Publication of KR20250027743A publication Critical patent/KR20250027743A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020257002182A 2022-06-24 2023-06-08 폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법 Pending KR20250027743A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-101887 2022-06-24
JP2022101887 2022-06-24
PCT/JP2023/021312 WO2023248810A1 (ja) 2022-06-24 2023-06-08 ポリアミド酸組成物、ポリイミドの製造方法、積層体の製造方法及び電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
KR20250027743A true KR20250027743A (ko) 2025-02-27

Family

ID=89379725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257002182A Pending KR20250027743A (ko) 2022-06-24 2023-06-08 폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2023248810A1 (https=)
KR (1) KR20250027743A (https=)
CN (1) CN119452037A (https=)
TW (1) TW202409147A (https=)
WO (1) WO2023248810A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250156742A (ko) * 2023-03-14 2025-11-03 가부시키가이샤 가네카 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 전자 디바이스, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법
WO2025205211A1 (ja) * 2024-03-25 2025-10-02 株式会社カネカ ポリアミド酸組成物、ポリイミドの製造方法、積層体の製造方法及び電子デバイスの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012036382A (ja) 2010-07-14 2012-02-23 Ube Industries Ltd ポリイミド前駆体水溶液組成物
JP2017517582A (ja) 2014-03-26 2017-06-29 エランタス イタリア エス．アール．エル．Ｅｌａｎｔａｓ Ｉｔａｌｉａ Ｓ．Ｒ．Ｌ． ポリアミド−イミド用およびポリイミド用の新規溶媒
WO2022054850A1 (ja) 2020-09-09 2022-03-17 Ｋｊケミカルズ株式会社 樹脂合成用溶媒及び該溶媒を用いた合成樹脂の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007137933A (ja) * 2005-11-15 2007-06-07 Toray Ind Inc 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム
WO2015147046A1 (ja) * 2014-03-28 2015-10-01 出光興産株式会社 抽出蒸留用の抽出溶剤、及びそれを用いた炭化水素類の分離方法
KR20170102527A (ko) * 2015-01-06 2017-09-11 도판 인사츠 가부시키가이샤 축전 디바이스용 외장재
JP6596912B2 (ja) * 2015-05-13 2019-10-30 凸版印刷株式会社 蓄電デバイス用外装材及び蓄電デバイス
JP7075803B2 (ja) * 2018-04-16 2022-05-26 花王株式会社 水系インク
JP7184545B2 (ja) * 2018-06-14 2022-12-06 アース製薬株式会社 殺虫剤組成物
JP2022061487A (ja) * 2020-10-06 2022-04-18 東レ株式会社 樹脂組成物、それを用いた表示デバイスまたは受光デバイスの製造方法、基板ならびにデバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012036382A (ja) 2010-07-14 2012-02-23 Ube Industries Ltd ポリイミド前駆体水溶液組成物
JP2017517582A (ja) 2014-03-26 2017-06-29 エランタス イタリア エス．アール．エル．Ｅｌａｎｔａｓ Ｉｔａｌｉａ Ｓ．Ｒ．Ｌ． ポリアミド−イミド用およびポリイミド用の新規溶媒
WO2022054850A1 (ja) 2020-09-09 2022-03-17 Ｋｊケミカルズ株式会社 樹脂合成用溶媒及び該溶媒を用いた合成樹脂の製造方法

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JPWO2023248810A1 (https=) 2023-12-28
WO2023248810A1 (ja) 2023-12-28
CN119452037A (zh) 2025-02-14
TW202409147A (zh) 2024-03-01

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PA0105 International application

Patent event date: 20250121

Patent event code: PA01051R01D

Comment text: International Patent Application

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