JPWO2023248810A1 - - Google Patents

Info

Publication number
JPWO2023248810A1
JPWO2023248810A1 JP2024528779A JP2024528779A JPWO2023248810A1 JP WO2023248810 A1 JPWO2023248810 A1 JP WO2023248810A1 JP 2024528779 A JP2024528779 A JP 2024528779A JP 2024528779 A JP2024528779 A JP 2024528779A JP WO2023248810 A1 JPWO2023248810 A1 JP WO2023248810A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528779A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248810A1 publication Critical patent/JPWO2023248810A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2024528779A 2022-06-24 2023-06-08 Pending JPWO2023248810A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022101887 2022-06-24
PCT/JP2023/021312 WO2023248810A1 (ja) 2022-06-24 2023-06-08 ポリアミド酸組成物、ポリイミドの製造方法、積層体の製造方法及び電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
JPWO2023248810A1 true JPWO2023248810A1 (https=) 2023-12-28

Family

ID=89379725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528779A Pending JPWO2023248810A1 (https=) 2022-06-24 2023-06-08

Country Status (5)

Country Link
JP (1) JPWO2023248810A1 (https=)
KR (1) KR20250027743A (https=)
CN (1) CN119452037A (https=)
TW (1) TW202409147A (https=)
WO (1) WO2023248810A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250156742A (ko) * 2023-03-14 2025-11-03 가부시키가이샤 가네카 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 전자 디바이스, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법
WO2025205211A1 (ja) * 2024-03-25 2025-10-02 株式会社カネカ ポリアミド酸組成物、ポリイミドの製造方法、積層体の製造方法及び電子デバイスの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007137933A (ja) * 2005-11-15 2007-06-07 Toray Ind Inc 樹脂組成物、これを用いた耐熱性樹脂積層フィルム、及び金属層付き積層フィルム
JP5733070B2 (ja) 2010-07-14 2015-06-10 宇部興産株式会社 ポリイミド前駆体水溶液組成物
DE102014104223A1 (de) 2014-03-26 2015-10-01 Elantas Italia S.R.L. Neues Lösemittel für Polyamidimide und Polyimide
WO2015147046A1 (ja) * 2014-03-28 2015-10-01 出光興産株式会社 抽出蒸留用の抽出溶剤、及びそれを用いた炭化水素類の分離方法
KR20170102527A (ko) * 2015-01-06 2017-09-11 도판 인사츠 가부시키가이샤 축전 디바이스용 외장재
JP6596912B2 (ja) * 2015-05-13 2019-10-30 凸版印刷株式会社 蓄電デバイス用外装材及び蓄電デバイス
JP7075803B2 (ja) * 2018-04-16 2022-05-26 花王株式会社 水系インク
JP7184545B2 (ja) * 2018-06-14 2022-12-06 アース製薬株式会社 殺虫剤組成物
EP4212574A4 (en) 2020-09-09 2024-10-09 KJ Chemicals Corporation SOLVENT FOR RESIN SYNTHESIS AND METHOD FOR PRODUCING SYNTHETIC RESIN USING SAID SOLVENT
JP2022061487A (ja) * 2020-10-06 2022-04-18 東レ株式会社 樹脂組成物、それを用いた表示デバイスまたは受光デバイスの製造方法、基板ならびにデバイス

Also Published As

Publication number Publication date
WO2023248810A1 (ja) 2023-12-28
CN119452037A (zh) 2025-02-14
KR20250027743A (ko) 2025-02-27
TW202409147A (zh) 2024-03-01

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Effective date: 20260420