KR20250011129A - 하이드로카빌 리간드에 산소 헤테로원자를 갖는 방사선 민감성 유기주석 조성물 - Google Patents

하이드로카빌 리간드에 산소 헤테로원자를 갖는 방사선 민감성 유기주석 조성물 Download PDF

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Publication number
KR20250011129A
KR20250011129A KR1020247040538A KR20247040538A KR20250011129A KR 20250011129 A KR20250011129 A KR 20250011129A KR 1020247040538 A KR1020247040538 A KR 1020247040538A KR 20247040538 A KR20247040538 A KR 20247040538A KR 20250011129 A KR20250011129 A KR 20250011129A
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KR
South Korea
Prior art keywords
carbon atoms
optional
formula
organotin
coating
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Pending
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KR1020247040538A
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English (en)
Korean (ko)
Inventor
로버트 이. 질렉
브라이언 제이. 카르디네우
루시 수 샤오 호프만
스티븐 티. 메이어스
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인프리아 코포레이션
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Publication of KR20250011129A publication Critical patent/KR20250011129A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/22Tin compounds
    • C07F7/2208Compounds having tin linked only to carbon, hydrogen and/or halogen
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/22Tin compounds
    • C07F7/2224Compounds having one or more tin-oxygen linkages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0042Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/325Non-aqueous compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
KR1020247040538A 2022-05-18 2023-05-17 하이드로카빌 리간드에 산소 헤테로원자를 갖는 방사선 민감성 유기주석 조성물 Pending KR20250011129A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263343331P 2022-05-18 2022-05-18
US63/343,331 2022-05-18
PCT/US2023/022478 WO2023225046A1 (en) 2022-05-18 2023-05-17 Radiation sensitive organotin compositions having oxygen heteroatoms in hydrocarbyl ligand

Publications (1)

Publication Number Publication Date
KR20250011129A true KR20250011129A (ko) 2025-01-21

Family

ID=88792199

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247040538A Pending KR20250011129A (ko) 2022-05-18 2023-05-17 하이드로카빌 리간드에 산소 헤테로원자를 갖는 방사선 민감성 유기주석 조성물

Country Status (6)

Country Link
US (1) US20230374338A1 (https=)
EP (1) EP4526734A1 (https=)
JP (1) JP2025517914A (https=)
KR (1) KR20250011129A (https=)
TW (1) TW202402768A (https=)
WO (1) WO2023225046A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI796816B (zh) * 2018-06-21 2023-03-21 美商英培雅股份有限公司 單烷基錫烷氧化物的穩定溶液及其水解與縮合產物
WO2023235534A1 (en) 2022-06-02 2023-12-07 Gelest, Inc. High purity alkyl tin compounds and manufacturing methods thereof
KR102703674B1 (ko) * 2022-08-02 2024-09-04 삼성에스디아이 주식회사 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법
EP4568977A1 (en) 2022-08-12 2025-06-18 Gelest, Inc. High purity tin compounds containing unsaturated substituent and method for preparation thereof
US12607929B2 (en) * 2022-08-29 2026-04-21 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and formation method thereof
US12606577B2 (en) 2022-09-28 2026-04-21 Gelest, Inc. Iodoalkyl tin compounds and preparation methods thereof
CN121866261A (zh) 2023-09-13 2026-04-14 默克专利有限公司 具有改善的热和光稳定性的分子内稳定化单烷基金属化合物及其用途
KR20250106992A (ko) * 2024-01-04 2025-07-11 삼성에스디아이 주식회사 패턴 형성 방법 및 포토레지스트 막
KR20250125796A (ko) * 2024-02-15 2025-08-22 삼성에스디아이 주식회사 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법
WO2026052767A1 (en) 2024-09-09 2026-03-12 Merck Patent Gmbh Intramolecular stabilized mono alkyl metal alkoxides and their use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9310684B2 (en) * 2013-08-22 2016-04-12 Inpria Corporation Organometallic solution based high resolution patterning compositions
CA2975104A1 (en) * 2017-08-02 2019-02-02 Seastar Chemicals Inc. Organometallic compounds and methods for the deposition of high purity tin oxide
US10787466B2 (en) * 2018-04-11 2020-09-29 Inpria Corporation Monoalkyl tin compounds with low polyalkyl contamination, their compositions and methods
US12211691B2 (en) * 2018-12-20 2025-01-28 Lam Research Corporation Dry development of resists
WO2022046736A1 (en) * 2020-08-25 2022-03-03 Inpria Corporation Methods to produce organotin compositions with convenient ligand providing reactants

Also Published As

Publication number Publication date
WO2023225046A1 (en) 2023-11-23
WO2023225046A9 (en) 2024-11-28
US20230374338A1 (en) 2023-11-23
EP4526734A1 (en) 2025-03-26
JP2025517914A (ja) 2025-06-12
TW202402768A (zh) 2024-01-16

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Date Code Title Description
PA0105 International application

Patent event date: 20241206

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application