KR20240076415A - 수지 조성물의 토출 방법, 전자 부품의 제조 방법, 및 전자 부품 - Google Patents
수지 조성물의 토출 방법, 전자 부품의 제조 방법, 및 전자 부품 Download PDFInfo
- Publication number
- KR20240076415A KR20240076415A KR1020247004856A KR20247004856A KR20240076415A KR 20240076415 A KR20240076415 A KR 20240076415A KR 1020247004856 A KR1020247004856 A KR 1020247004856A KR 20247004856 A KR20247004856 A KR 20247004856A KR 20240076415 A KR20240076415 A KR 20240076415A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- component
- compound
- discharging
- methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-169262 | 2021-10-15 | ||
| JP2021169262 | 2021-10-15 | ||
| PCT/JP2022/031256 WO2023062938A1 (ja) | 2021-10-15 | 2022-08-18 | 樹脂組成物の吐出方法、電子部品の製造方法、及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240076415A true KR20240076415A (ko) | 2024-05-30 |
Family
ID=85987368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247004856A Pending KR20240076415A (ko) | 2021-10-15 | 2022-08-18 | 수지 조성물의 토출 방법, 전자 부품의 제조 방법, 및 전자 부품 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023062938A1 (https=) |
| KR (1) | KR20240076415A (https=) |
| CN (1) | CN117957068A (https=) |
| TW (1) | TW202317701A (https=) |
| WO (1) | WO2023062938A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018203910A (ja) | 2017-06-06 | 2018-12-27 | 日本化薬株式会社 | 電子部品用樹脂組成物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201978871U (zh) * | 2011-03-04 | 2011-09-21 | 深圳市高尚能源科技有限公司 | 一种高速喷射点胶机撞针 |
| WO2015156192A1 (ja) * | 2014-04-07 | 2015-10-15 | 株式会社ブリヂストン | 組成物、接着剤及び積層体 |
| JP6329030B2 (ja) * | 2014-08-25 | 2018-05-23 | ナミックス株式会社 | 接着剤 |
| JP6716072B2 (ja) * | 2015-07-31 | 2020-07-01 | 協立化学産業株式会社 | 樹脂組成物、及びそれを用いた積層体の製造方法 |
| JP7359064B2 (ja) * | 2020-03-31 | 2023-10-11 | 日油株式会社 | フィルム液晶パネル用の封止材に使用する硬化性樹脂組成物、及び該硬化性樹脂組成物で端部を封止したフィルム液晶パネル |
-
2022
- 2022-08-18 KR KR1020247004856A patent/KR20240076415A/ko active Pending
- 2022-08-18 CN CN202280060911.6A patent/CN117957068A/zh active Pending
- 2022-08-18 WO PCT/JP2022/031256 patent/WO2023062938A1/ja not_active Ceased
- 2022-08-18 JP JP2023554946A patent/JPWO2023062938A1/ja active Pending
- 2022-08-31 TW TW111132987A patent/TW202317701A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018203910A (ja) | 2017-06-06 | 2018-12-27 | 日本化薬株式会社 | 電子部品用樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117957068A (zh) | 2024-04-30 |
| TW202317701A (zh) | 2023-05-01 |
| JPWO2023062938A1 (https=) | 2023-04-20 |
| WO2023062938A1 (ja) | 2023-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20240208 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20250317 Comment text: Request for Examination of Application |