KR20240064729A - Holding device for holding a substrate, carrier for holding a substrate, and method for releasing a substrate from a holding device - Google Patents

Abstract

A holding device 100 for holding a substrate 101 is described. The holding device 100 includes a main body 110; an adhesive arrangement 120 provided on the surface 111 of the main body 110; and a shape memory element 130 in contact with the main body 110. Additionally, a carrier comprising one or more holding devices for holding a substrate is described. Additionally, a method for releasing a substrate from a holding device is described.

Description

A holding device for holding a substrate, a carrier for holding the substrate, and a method for releasing the substrate from the holding device {HOLDING DEVICE FOR HOLDING A SUBSTRATE, CARRIER FOR HOLDING A SUBSTRATE, AND METHOD FOR RELEASING A SUBSTRATE FROM A HOLDING DEVICE}

[0001] Embodiments of the present disclosure relate to holding devices for holding a substrate, carriers for holding a substrate, and methods for releasing a substrate from a holding device. In particular, embodiments of the present disclosure relate to holding devices and carriers for maintaining a substrate substantially vertically during substrate processing in a vacuum processing chamber, such as during layer deposition on the substrate.

[0002] Layer deposition techniques on a substrate include, for example, thermal evaporation, chemical vapor deposition (CVD) and physical vapor deposition (PVD), such as sputtering deposition. Sputter deposition processes can be used to deposit a layer of material, such as a layer of insulating material, on a substrate. During the sputter deposition process, a target having a target material to be deposited on a substrate is bombarded with ions generated in the plasma region, causing atoms of the target material to dislodge from the surface of the target. The dislodged atoms can form a layer of material on the substrate. In a reactive sputter deposition process, the dislodged atoms may react with gases, such as nitrogen or oxygen, in the plasma region to form oxides, nitrides or oxynitrides of the target material on the substrate.

[0003] Coated materials can be used in several applications and many fields of technology. For example, the coated materials can be used in the field of microelectronics, such as for the creation of semiconductor devices. Additionally, substrates for displays can be coated using a PVD process. Additional applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters, etc.

[0004] The trend towards larger and thinner substrates can result in bulging of the substrate, for example due to the stress applied to the substrate during the deposition process. In particular, conventional support systems that hold a substrate during a deposition process induce swelling on the substrate, for example due to forces pushing the substrate edge toward the center of the substrate. Swelling can ultimately cause problems due to increased likelihood of breakage. Additionally, it is challenging to release thin, large area substrates from support systems, such as substrate carriers, without swelling or damaging the substrate.

[0005] In view of the foregoing, it is proposed to provide improved holding devices and carriers for retaining substrates, as well as for releasing substrates from the retaining devices and carriers, that overcome at least some of the problems in the art. There is a need to provide improved methods.

[0006] Taking the above into account, there is provided a holding device for holding a substrate, a carrier for holding a substrate, and a method for releasing the substrate from the holding device according to the independent claims. Additional aspects, advantages and features are apparent from the dependent claims, detailed description and accompanying drawings.

[0007] According to one aspect of the disclosure, a holding device for holding a substrate is provided. The holding device includes a main body. Additionally, the holding device includes an adhesive arrangement provided on the surface of the main body. Additionally, the holding device includes a shape memory element that is in contact with the main body.

[0008] According to a further aspect of the disclosure, a holding device for holding a substrate is provided. The retention device includes a main body of flexible material. Additionally, the holding device includes an adhesive arrangement provided on the surface of the main body. Additionally, the holding device includes a retraction device arranged and configured to retract the main body to bend the surface.

[0009] According to another aspect of the disclosure, a carrier for holding a substrate is provided. The carrier includes a carrier body and one or more retention devices according to any of the embodiments described herein. One or more retention devices are mounted on the carrier body.

[0010] According to a further aspect of the disclosure, a method is provided for releasing a substrate from a retention device. The method includes bending the surface of the main body of the holding device. The surface of the main body includes an adhesive arrangement to retain the substrate. The bending step is performed by contracting the main body in a direction substantially parallel to the surface.

[0011] According to a further aspect of the disclosure, a method of manufacturing an electronic device is provided. The method includes using a retention device according to any of the embodiments described herein.

[0012] Embodiments also relate to apparatuses for practicing the disclosed methods, and include apparatus portions for performing the described method aspects. These method aspects may be performed by hardware components, by a computer programmed with appropriate software, by any combination of the two, or in any other manner. Moreover, embodiments according to the present disclosure also relate to methods for operating the described device. Methods for operating the described device include method aspects for executing every respective function of the device.

[0013] A more detailed description of the disclosure briefly summarized above may be made with reference to the embodiments in such a way that the above-enumerated features of the disclosure may be understood in detail. The accompanying drawings relate to embodiments of the present disclosure and are described below.
1A shows a schematic cross-sectional side view of a retention device according to embodiments described herein.
Figure 1b shows a schematic cross-sectional side view of the holding device of Figure 1a in a bent state.
Figure 2 shows a schematic top view of a holding device according to further embodiments described herein.
Figure 3a shows a schematic side cross-sectional view of the retention device of Figure 2;
Figure 3b shows a schematic cross-sectional side view of the holding device of Figure 3a in a bent state.
Figure 4A shows a schematic cross-sectional side view of a retention device attached to a substrate according to embodiments described herein.
FIG. 4B shows a schematic cross-sectional side view of the retention device of FIG. 4A with the substrate separated from the retention device.
FIG. 4C shows a flow diagram to illustrate a method for releasing a substrate from a retention device in accordance with embodiments described herein.
Figure 5 shows a schematic top view of a section of a carrier for holding a substrate according to embodiments described herein.
Figure 6 shows a schematic cross-sectional view along line AA of the section of the carrier shown in Figure 5;
7A and 7B show schematic front views of embodiments of a carrier according to embodiments described herein.
Figure 7c shows a schematic cross-sectional view along line BB of the carrier shown in Figure 7b.

[0014] Detailed reference will now be made to various embodiments of the present disclosure, one or more examples of which are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. Only differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not to be considered a limitation of the disclosure. Additionally, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments to give rise to further embodiments. The description is intended to include such modifications and variations.

[0015] 1A and 1B, a holding device 100 for holding a substrate 101 according to the present disclosure is described. Figure 1A shows the holding device 100 in an attached state, i.e. a substrate can be attached to the holding device. As exemplarily shown in Figure 1A, in the attached state the retention device has a substantially planar configuration, ie the retention device is not bent.

[0016] FIG. 1B shows the holding device 100 in a disconnected state, ie the substrate can be separated from the holding device. As exemplarily shown in Figure 1b, in the separated state the holding device has a bent configuration, ie the holding device is bent.

[0017] According to embodiments that can be combined with other embodiments described herein, the holding device 100 comprises, in particular, a main body 110 of flexible material. Accordingly, the main body 110 may be bent as exemplarily shown in FIG. 1B.

[0018] Additionally, the holding device 100 includes an adhesive arrangement 120 provided on the surface 111 of the main body 110 . In particular, the adhesive arrangement 120 may be directly attached to the surface 111 of the main body 110. Typically, in the attached state, the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is a substantially planar surface, as exemplarily shown in FIG. 1A. In the separated state, ie when the holding device is bent, as exemplarily shown in FIG. 1B , the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is a curved surface, in particular an arcuate surface. In particular, in the detached state of the holding device, the surface 111 of the main body 110 is a convex curved surface, in particular a convex arcuate surface.

[0019] As exemplarily shown in FIGS. 1A and 1B , the surface 111 of the main body 110 on which the adhesive arrangement 120 is typically provided is parallel to the bottom surface 112 of the main body 110 . Accordingly, in the attached state, the bottom surface 112 of the main body 110 is a substantially planar surface, as exemplarily shown in FIG. 1A. In the separated state, ie when the holding device is bent, as exemplarily shown in FIG. 1B , the bottom surface 112 of the main body 110 is a curved surface, in particular an arcuate surface. In particular, in the detached state of the holding device, the bottom surface 112 of the main body 110 is a concave curved surface, in particular a concave arcuate surface.

[0020] Additionally, as exemplarily shown in FIGS. 1A and 1B , the holding device 100 includes a shape memory element 130 that is in contact with the main body 110 . For example, the shape memory element 130 may be provided inside the main body 110 as exemplarily shown in FIGS. 1A and 1B. In particular, the shape memory element 130 may be built into the main body 110. Although not explicitly shown, it should be understood that the shape memory element 130 could alternatively be attached to the bottom surface 112 of the main body.

[0021] In particular, shape memory element 130 is typically configured such that shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For example, a change from a first temperature to a second temperature can be induced by applying a voltage to the shape memory element, where the second temperature is higher than the first temperature. Typically, shape memory elements are made of shape memory alloys.

[0022] As illustratively shown in FIG. 1A , the first configuration of shape memory element 130 may include a first length L1 and, as illustratively shown in FIG. 1B , shape memory element 130 ) may include a second length (L2) that is shorter than the first length (L1). 1A and 1B, it should be understood that the second configuration of the shape memory element 130 is typically a contracted configuration compared to the first configuration of the shape memory element 130. Accordingly, as exemplarily shown in FIG. 1B, when the shape memory element 130 is contracted, the opposing ends 113 of the main body 110 may be pulled inward, thereby bending the main body. As a result, the adhesive arrangement 120 provided on the surface 111 of the main body 110 may be bent to provide a separated state of the holding device.

[0023] Accordingly, compared to the known technology, an improved holding device for holding a substrate is provided. In particular, compared to conventional retaining devices, embodiments of the retaining device described herein advantageously allow bending of the adhesive arrangement of the retaining device to be achieved, such that the substrate can be converted to a retaining device in a simpler and more efficient manner. It is configured to be separated or released from. In particular, as exemplarily illustrated with reference to FIGS. 4A and 4B, embodiments of the retention device of the present disclosure may provide for relative movement of the adhesive arrangement with respect to the surface of the substrate to release the substrate from the retention device. It is structured so that More specifically, the retention device described herein is configured such that shear forces can be induced at the interface between the adhesive arrangement and the substrate attached to the adhesive arrangement. In particular, shear forces at the interface between the adhesive arrangement and the substrate can be induced by using a shape memory element such as described herein to bend the surface of the main body on which the adhesive arrangement is provided. This can advantageously provide a smooth separation of the substrate from the holding device, so that the risk of substrate breakage is reduced or even eliminated.

[0024] Before various additional embodiments of the disclosure are described in more detail, some aspects are explained with respect to some terms used herein.

[0025] In the present disclosure, a “device for holding a substrate” may be understood as a device configured to hold a substrate as described herein. In particular, the device can be configured to hold a large area substrate in an upright position. More specifically, the holding device described herein can be understood as a part or component of a carrier that is configured so that a substrate can be attached to the holding device.

[0026] In this disclosure, the term “substrate” as used herein will particularly encompass inflexible substrates, such as glass plates and metal plates. However, the present disclosure is not limited thereto and the term “substrate” can also encompass flexible substrates such as webs or foils. According to some embodiments, the substrate may be made of any material suitable for material deposition. For example, the substrate can be glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, mica, or any other material that can be coated by a deposition process. or may be made of a material selected from the group consisting of a combination of materials. For example, the substrate may have a thickness of 0.1 mm to 1.8 mm, such as 0.7 mm, 0.5 mm or 0.3 mm. In some implementations, the thickness of the substrate may be greater than or equal to 50 μm and/or less than or equal to 700 μm. Handling thin substrates with a thickness of only a few microns, for example between 8 μm and 50 μm, can be challenging.

[0027] According to some embodiments, the substrate may be a “large area substrate” and may be used in display manufacturing. For example, the substrate may be a glass or plastic substrate. For example, the substrates described in this specification will include substrates commonly used in LCD (Liquid Crystal Display), PDP (Plasma Display Panel), etc. For example, a “large area substrate” may have a major surface with an area of 0.5 m2 or more, especially 1 m2 or more. In some embodiments, the large area substrate may be a GEN 4.5 corresponding to a substrate of approximately 0.67 m2 (0.73 m x 0.92 m), a GEN 5 corresponding to a substrate of approximately 1.4 m2 (1.1 m x 1.3 m), or a GEN 5 corresponding to a substrate of approximately 1.4 m2 (1.1 m x 1.3 m). GEN 7.5 corresponding to a substrate of approximately 5.7 m2 (2.2 m × 2.5 m), or even GEN corresponding to a substrate of approximately 8.7 m2 (2.85 m × 3.05 m) It could be 10. Even larger generations, such as GEN 11 and GEN 12 and corresponding substrate areas, can be implemented similarly.

[0028] In the present disclosure, the “main body” of the holding device can be understood as the base structure of the holding device, in particular a rigid base structure. According to a non-limiting example, the main body may have a disk shape as exemplarily shown in FIG. 2. Alternatively, the main body may be a rectangular cube or a square cube. In particular, the main body of the holding device is typically made of flexible or bendable material. For example, the main body of the holding device may include or be composed of a high temperature polymer. For example, the high temperature polymer may have a temperature resistance of at least 150°C, specifically at least 200°C, and more particularly at least 250°C. Accordingly, the holding device may be configured to withstand continuous service temperatures of at least 150° C., in particular at least 200° C., and more particularly at least 250° C. For example, high temperature polymers used in the main body can have temperature resistance of up to 300°C. For example, the main body of the holding device is from the group consisting of polyimide (PI), polyaryletherketone (PAEK), polyphenylene sulfide (PPS), polyarylsulfone (PAS) and fluoropolymers (PTFE). It may be made from at least one selected material. According to another example, the main body of the retention device may be made of silicone, also referred to as polysiloxane.

[0029] In the present disclosure, an “adhesive arrangement” may be understood as an arrangement configured to provide adhesion for attaching a substrate as described herein. In particular, the adhesive arrangement is typically provided on a planar surface when the holding device is in the attached state. More specifically, the adhesive arrangements described herein may include dry adhesive materials. For example, dry adhesive materials can be configured to provide adhesion by van der Waals forces.

[0030] In the present disclosure, a “shape memory element” may be understood as an element configured to exhibit shape memory properties. In particular, the shape memory element may include or be composed of a shape memory alloy (SMA). Shape memory alloys may also be referred to as smart metals, memory metals, memory alloys, muscle wires or smart alloys. Accordingly, a shape memory element described herein is understood as an element capable of having a first predefined configuration at a first temperature and a second predefined configuration at a second temperature higher than the first temperature. It can be. For example, a change from the first temperature to the second temperature can be induced by applying a voltage to the shape memory element.

[0031] 2 , the shape memory element 130 surrounds the inner portion 115 of the main body 110, according to embodiments that may be combined with other embodiments described herein. . The boundary of the inner portion 115 of the main body 110 is exemplarily indicated by the dotted line shown in FIG. 2 . Accordingly, the shape memory element 130 may be an elongated element surrounding the inner portion 115 of the main body 110, as exemplarily shown in FIG. 2 . In particular, the shape memory element 130 may have a loop configuration surrounding the inner portion 115 of the main body 110.

[0032] That is, the shape memory element 130, for example an elongated element, may be arranged on the outer edge portion 116 of the main body 110. The outer edge portion 116 may be understood as a portion extending from the edge 117 of the main body to the inside of the main body. In particular, the outer edge portion 116 extends from the edge 117 of the main body 110 to the inside of the main body by 50% or less of the lateral dimension of the main body, specifically by 30% or less of the lateral dimension of the main body, More specifically, it may extend by no more than 15% of the lateral dimension of the main body.

[0033] According to embodiments that may be combined with other embodiments described herein, shape memory element 130 may include one or more wires. For example, one or more wires may be twisted. Typically, one or more wires are made of a shape memory alloy.

[0034] As exemplarily shown in FIGS. 2, 3A and 3B, the shape memory element 130 typically includes an electrical connection 131. In particular, the electrical connection part 131 is configured to be connected to the voltage supply part 132.

[0035] 3A and 3B, according to embodiments that may be combined with other embodiments described herein, a retaining device holds plate element 140 in contact with main body 110. Includes more. In particular, as shown in FIG. 3A , which shows the unbent state of the holding device, the plate element 140 is arranged substantially parallel to the surface 111 of the main body 110 . For example, the plate element 140 may be built into the main body 110. The plate element may be advantageous for switching between attached and detached states of the retention device. For example, the plate element may be made of metal, especially spring steel. Alternatively, the plate element may be made of plastic. In particular, as exemplarily shown in Figure 3B, when the shape memory element 130 is in the second configuration, i.e., the collapsed configuration, the plate element is compressed and bent. The plate element thus has the advantage that the homogeneity of the bending of the main body can be improved, resulting in an improved and smoother separation of the substrate from the holding device.

[0036] According to embodiments that can be combined with other embodiments described herein, the shape memory element 130 is positioned around the plate element 140, as exemplarily shown in FIGS. 2, 3A, and 3B. can be provided. In particular, as exemplarily shown in FIG. 3A , in the attached state of the holding device, the shape memory element 130 and the plate element 140 may have at least one common plane. Accordingly, by providing the shape memory element 130 around the plate element 140, the homogeneity of compression and bending of the plate element by the shape memory element 130 can be improved.

[0037] 2, 3A and 3B, according to embodiments that may be combined with other embodiments described herein, the adhesive arrangement 120 includes a plurality of filaments 121. (For illustrative purposes, only some filaments are indicated with reference numbers). For example, the filaments may be or include nanotubes, such as carbon nanotubes. Additionally or alternatively, the plurality of filaments 121 may be made of or comprise a polymeric material, especially a synthetic polymeric material. Each of the plurality of filaments may be a substantially longitudinal member. Specifically, each of the plurality of filaments may have one dimension that is larger than the other two dimensions. In particular, the longest dimension of the filaments may be the length of the filament. That is, the filaments can be elongated along the longitudinal direction.

[0038] According to embodiments that may be combined with other embodiments described herein, the adhesive arrangement, particularly the plurality of filaments, may be made from a high temperature polymer. For example, the adhesive arrangement may be made of a high temperature polymer having a temperature resistance of at least 150°C, particularly at least 200°C, more particularly at least 250°C. Accordingly, the adhesive arrangement may be configured to withstand continuous service temperatures of at least 150° C., in particular at least 200° C., and more particularly at least 250° C. For example, high temperature polymers used in adhesive arrangements, especially multiple filaments, can have temperature resistances of up to 300°C. For example, the adhesive arrangement, especially the plurality of filaments, is composed of polyimide (PI), polyaryletherketone (PAEK), polyphenylene sulfide (PPS), polyarylsulfone (PAS) and fluoropolymers (PTFE). It can be made from at least one material selected from the group. According to another example, the adhesive arrangement may be made of silicone, also referred to as polysiloxane.

[0039] As exemplarily shown in FIGS. 3A and 3B, each filament of the plurality of filaments 121 may be attached to the surface 111 of the main body 110. In particular, each filament of the plurality of filaments 121 may extend away from the surface 111 of the main body 110, for example, perpendicular to the surface 111 of the main body 110. Accordingly, each filament of the plurality of filaments 121 may have a free second end, for example, for attachment of a substrate as described herein. In particular, the second end of each filament of the plurality of filaments 121 may be configured to be attachable to the substrate 101. Specifically, the second end of each filament may be configured to be attached to the substrate 101 by van der Waals forces.

[0040] According to embodiments that may be combined with other embodiments described herein, adhesive arrangement 120 includes dry adhesive material for attaching substrate 101. For example, the dry adhesive material may be a synthetic setae material. Dry adhesive materials, such as synthetic bristle materials, may be inorganic. In particular, the dry adhesive material may be substantially 100% inorganic. In one example, the dry adhesive material can have a microstructure that includes nanotubes. For example, the microstructure of the dry adhesive material may include carbon nanotubes.

[0041] In particular, the dry adhesive material may be Gecko adhesive. For example, Gecko adhesive can be Gecko Tape or Gecko Element. The adhesive abilities of dry adhesive materials, specifically synthetic bristle materials, can be related to the adhesive properties of gecko feet. The natural adhesive abilities of gecko feet allow the animal to adhere to many types of surfaces under most conditions. The adhesive ability of gecko feet is provided by numerous hair-type extensions called bristles on the gecko's feet. It is noted that the term "synthetic bristle material" herein can be understood as a synthetic material that mimics the natural adhesive ability of a gecko's paw and contains similar adhesive capabilities to that of a gecko's paw. Moreover, the term “synthetic bristle material” may be used synonymously with the term “synthetic gecko bristle material” or the term “gecko tape material.” However, the present disclosure is not limited to this, and other dry adhesive materials suitable for holding the substrate may be used.

[0042] In the context of this disclosure, “gecko adhesive” may be understood as an adhesive that mimics the ability of a gecko's paws to attach to surfaces, for example vertical surfaces. In particular, the dry adhesive material of the adhesive arrangement 120 as described herein may be configured to adhere to the substrate 101 due to van der Waals forces between the dry adhesive material and the surface of the substrate 101. However, the present disclosure is not limited to this, and other adhesives suitable for holding the substrate may be used.

[0043] According to embodiments that may be combined with any other embodiments described herein, the adhesion provided by the dry adhesive material may be sufficient to retain the substrate as described herein. In particular, the dry adhesive material may be configured to provide an adhesion of at least about 2 N/cm2, particularly at least 3 N/cm2, more specifically at least 4 N/cm2, such as at least 5 N/cm2.

[0044] Accordingly, it should be understood that compared to the known technology, an improved holding device 100 for holding the substrate 101 is provided. The holding device 100 comprises, in particular, a main body 110 of flexible material and an adhesive arrangement 120, for example comprising a dry adhesive, provided on a surface 111 of the main body 110. Additionally, the holding device 100 includes a retraction device arranged and configured to retract the main body 110 to bend the surface 111 together with the adhesive arrangement 120 . In particular, the constriction device typically includes a shape memory element 130. Shape memory element 130 is configured such that shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For example, a change from a first temperature to a second temperature can be induced by applying a voltage to the shape memory element, where the second temperature is higher than the first temperature. Typically, shape memory elements are made of shape memory alloys. Accordingly, the shrinking device may include a shape memory element configured to shrink upon application of a voltage.

[0045] In the present disclosure, a “deflation device” may be understood as a device configured to perform deflation. In particular, shrinking of the shrinking device may be initiated by a temperature change of the shrinking device from a first temperature (T1) to a second temperature (T2) that is higher than the first temperature (T2>T1). Typically, shrinkage involves a reduction of the shrink device, especially the shape memory element 130, from a first length L1 to a second length L2, as described for example with reference to FIGS. 1A and 1B. In particular, as can be seen by comparing FIGS. 1A and 1B , the contraction device (e.g., shape memory element 130) typically contracts substantially parallel to the surface 111 of the main body 110. It is configured that the surface 111 of the main body 110 is in an attached state (i.e., not bent).

[0046] With illustrative reference to the flow chart shown in FIG. 4C, embodiments of a method 300 for releasing a substrate from a retention device in accordance with the present disclosure are described. According to embodiments that may be combined with other embodiments described herein, the method 300 includes bending the surface 111 of the main body 110 of the holding device 100 (in FIG. 4C (represented by block 310). The surface 111 of the main body 110 includes an adhesive arrangement 120 for retaining the substrate. As exemplarily represented by block 320 in FIG. 4C , the bending step is performed by contracting the main body 110 in a direction substantially parallel to the surface 111 on which the adhesive arrangement 120 is provided.

[0047] In particular, as exemplarily shown in FIG. 1B , contracting the main body 110 typically includes pulling opposing ends 113 of the main body 110 inward, causing the main body to bend. . As a result, the adhesive arrangement 120 provided on the surface 111 of the main body 110 may be bent to provide a separated state of the holding device. Accordingly, shear forces can be induced at the interface between the adhesive arrangement and the substrate attached to the adhesive arrangement. This can advantageously provide a smooth separation of the substrate from the holding device, so that the risk of substrate breakage can be reduced or even eliminated.

[0048] According to embodiments that can be combined with other embodiments described herein, the step of bending the surface 111 of the main body 110 of the holding device 100 is as exemplarily shown in FIG. 4B. and providing a convex curved surface, particularly a convex arcuate surface.

[0049] According to embodiments that can be combined with other embodiments described herein, contracting the main body 110 involves providing a current to the shape memory element 130 that is in contact with the main body 110. It can be included. In particular, shape memory element 130 may have any configuration as described herein.

[0050] Accordingly, from FIGS. 4A and 4B , which show cross-sectional side views of the holding device in the attached and detached states, respectively, the step of bending the surface 111 of the main body 110 includes the adhesive arrangement 120 and the substrate 101. ), which has the advantage that a smooth separation of the substrate from the holding device can be provided and the risk of substrate breakage can be reduced or even eliminated.

[0051] It should be understood that the method 300 for releasing a substrate from a retention device as described herein typically includes using embodiments of the retention device of the present disclosure.

[0052] 5, 6 and 7A-7C, a carrier 200 for holding a substrate according to the present disclosure is described. According to embodiments that can be combined with other embodiments described herein, the carrier includes one or more retention devices 100 and a carrier body 210 according to any of the embodiments described herein. do. One or more retention devices 100 are mounted to the carrier body 210 , for example via one or more support structures 220 .

[0053] For example, each of the one or more retention devices 100 may be connected to respective support structures 220 . Support structures 220 may be connected to carrier body 210 . Accordingly, the carrier 200 with one or more holding devices 100 described herein is configured to hold a substrate, in particular the substrate described herein. Typically, one or more retention devices 100 are configured to provide retention force to retain the substrate. For example, the holding force may be substantially parallel to the surface of the substrate, especially if the substrate is substantially vertically oriented. In particular, retention force may be provided by the adhesive arrangement 120 of retention device 100 as described herein.

[0054] In the present disclosure, a “carrier for holding a substrate” can be understood as a carrier configured to hold a substrate as described herein, particularly a large area substrate as described herein. Typically, a substrate held or supported by a carrier as described herein includes a front side and a back side, where the front side is, for example, the surface of the substrate being processed, on which a layer of material is to be deposited. Typically, the carrier is configured such that an edge portion of the back side of the substrate can be attached to a retaining device, particularly the adhesive arrangement of the retaining device described herein.

[0055] In the present disclosure, “carrier body” should be understood as a body of the carrier configured to hold a substrate. For example, the carrier body may be a frame or plate configured to hold a substrate as described herein. Accordingly, the carrier body described herein may be configured to support the surface of the substrate, such as an edge portion of the rear surface of the substrate.

[0056] According to embodiments, which may be combined with any other embodiments described herein, the carrier 200 is configured to support a substrate during substrate processing, for example during a layer deposition process, such as a sputtering process. 7A to 7C, the carrier body 210 may be configured as a frame. Alternatively, the carrier body 210 may be configured as a plate. Carrier body 210 may include and/or be made of aluminum, aluminum alloys, titanium, alloys thereof, stainless steel, etc. According to some embodiments, which may be combined with other embodiments described herein, the carrier body 210 may include two or more elements, such as a top bar, side bars, and a bottom bar. Two or more elements may define the aperture opening 215, as exemplarily shown in FIG. 7C. In some implementations, the carrier may be provided with a masking device to mask one or more portions of the substrate. In one example, the masking device may be an edge exclusion mask.

[0057] As exemplarily shown in FIG. 7C, the substrate 101 may typically have a first surface 101A and a second surface 101B. The first surface and the second surface may be opposing surfaces of the substrate 101 . In particular, the first surface may be the back surface of the substrate 101 . In one example, the first surface 101A may be arranged to face one or more holding devices 100 of the carrier 200 .

[0058] Accordingly, the adhesion of one or more retention devices 100 of the carrier 200, according to some embodiments which may be combined with other embodiments described herein, as exemplarily shown in FIG. 7C The arrangement 120 may be configured to contact the first surface 101A of the substrate 101. Additionally, as exemplarily shown in FIG. 7C, the second surface 101B may be the front surface of the substrate 101. In particular, the second surface may be the surface of the substrate to be processed in a processing system, especially in a vacuum processing chamber. In one example, the second surface of the substrate can be configured for depositing a layer on the second surface.

[0059] 7A-7C , in accordance with embodiments that may be combined with other embodiments described herein, the carrier 200 is coupled to the substrate (200) in a substantially vertical orientation, e.g., during a layer deposition process. 101) may be configured to maintain or support. In one example, one or more retention devices 100 may be configured to maintain substrate 101 in a substantially vertical orientation. As used throughout this disclosure, “substantially perpendicular” is understood to allow for deviations from the vertical direction or orientation of no more than ±20°, such as no more than ±10°, especially when referring to substrate orientation. It can be. This deviation may be provided, for example, because a substrate support with a slight deviation from vertical orientation may result in a more stable substrate position. However, for example, the substrate orientation during a layer deposition process may be considered substantially vertical, which may be considered different from a horizontal substrate orientation.

[0060] As exemplarily shown in FIGS. 7A and 7B, the substrate 101 has a top surface 11, a bottom surface 12, and two sides 13 (e.g., a left side and a right side). You can. A top surface 11 , a bottom surface 12 and two sides 13 may be defined relative to the vertical orientation of the substrate 101 . Likewise, carrier 200 or carrier body 210 may have a top surface, a bottom surface, and two sides (eg, a left side and a right side).

[0061] In some implementations, one or more retaining devices 100 are provided on the carrier body to retain at least one of the two sides 13 of the substrate 101 and at least one of the top surface 11 and the bottom surface 12. It can be mounted on (210). For example, as exemplarily shown in FIG. 7A , one or more retention devices 100 (eg, two retention arrangements) may be provided to retain the upper surface 11 . According to another implementation, one or more retention devices 100 (e.g., two retention devices) may be provided to retain the bottom surface 12 of the substrate, as exemplarily shown in FIG. 7B and/ Alternatively, two or more holding devices 100 may be provided to hold each side of the two sides 13 (e.g. two holding arrangements for the left side and two holding arrangements for the right side). there is.

[0062] According to some embodiments described herein, one or more holding devices 100 may be mounted on the carrier body 210 to maintain the substrate 101 in a suspended state. Specifically, one or more retaining devices 100 may be configured to retain the top surface 11 of the substrate 101 . For example, in some implementations, exemplarily shown in Figure 7A, substrate 101 is maintained only at top surface 11. Accordingly, the carrier 200 may include one or more holding devices 100 (e.g., two holding devices) only on the upper surface of the carrier body 210 to maintain the upper surface 11 of the substrate 101. You can.

[0063] 7C , according to some embodiments, which may be combined with other embodiments described herein, the retention device 100 is positioned on one surface of the substrate 101, particularly the back side of the substrate, i.e. It may be configured to contact the substrate 101 only on the untreated surface of the substrate 101 . Additionally, a support structure 220 may be provided between each of the one or more holding devices 100 and the carrier body 210 . As exemplarily shown in FIG. 7C , the aperture opening 215 may correspond to or be larger than the surface area of the substrate 101 to be processed, and may specifically be slightly larger. Accordingly, embodiments of the carrier described herein are configured so that the entire front surface of the substrate can be processed. Specifically, some embodiments described herein can be practiced without devices that provide edge exclusion. According to other embodiments (not explicitly shown), the aperture opening 215 may be slightly smaller than the surface area of the substrate to be processed. Accordingly, the aperture opening 215 may be configured to provide a raw edge of the substrate, particularly an uncoated edge of the substrate.

[0064] It should be understood that carriers according to embodiments described herein can be used in stationary processes as well as non-stationary processes.

[0065] Accordingly, in view of the above, it should be understood that the embodiments of the holding device, the embodiments of the carrier and the embodiments of the methods for releasing the substrate from the holding device as described herein are improvements compared to the known art. do. In particular, according to embodiments of the present disclosure, a smooth separation of the substrate from the holding device can advantageously be provided, so that the risk of substrate breakage can be reduced or even substantially eliminated.

[0066] This written description is intended to disclose the disclosure, including the best mode, and also includes any person skilled in the art to make and use any device or system and perform any integrated methods. Examples are used to enable practice of the claimed subject matter. Although various specific embodiments have been disclosed in the foregoing, non-mutually exclusive features of the previously described embodiments may be combined with each other. The patentable scope is defined by the claims, and other examples are provided by the claims if the examples have structural elements that do not differ from the wording of the claims, or if they include equivalent structural elements with minor differences from the wording of the claims. It is intended to be within range.

[0067] Although the foregoing relates to embodiments, other and additional embodiments may be devised without departing from the basic scope, and the scope is determined by the claims below.

Claims (16)

- Main body (110);
- an adhesive arrangement 120 provided on the surface 111 of the main body 110; and
- comprising a shape memory element 130 in contact with the main body 110,
A holding device 100 for holding the substrate 101. According to claim 1,
The shape memory element 130 surrounds the inner portion of the main body 110,
A holding device 100 for holding the substrate 101. According to claim 1 or 2,
The shape memory element 130 includes one or more wires of shape memory alloy,
A holding device 100 for holding the substrate 101. According to any one of claims 1 to 3,
It further includes a plate element 140 in contact with the main body 110,
The plate element 140 is arranged substantially parallel to the surface 111 of the main body 110,
A holding device 100 for holding the substrate 101. According to clause 4,
The shape memory element 130 is provided around the plate element 140,
A holding device 100 for holding the substrate 101. The method according to any one of claims 1 to 5,
The adhesive arrangement 120 includes a plurality of filaments 121,
A holding device 100 for holding the substrate 101. The method according to any one of claims 1 to 6,
The adhesive arrangement (120) includes a dry adhesive material for attaching the substrate (101).
A holding device 100 for holding the substrate 101. According to clause 7,
The dry adhesive material is a synthetic setae material, especially Gecko adhesive,
A holding device 100 for holding the substrate 101. The method according to any one of claims 1 to 8,
The shape memory element 130 has an electrical connection 131 for connection to a voltage supply,
A holding device 100 for holding the substrate 101. - main body 110 of flexible material;
- an adhesive arrangement 120 provided on the surface 111 of the main body 110; and
- a contraction device arranged and configured to contract the main body (110) to bend the surface (111),
A holding device 100 for holding the substrate 101. According to claim 10,
The shrinking device includes a shape memory element (130) configured to shrink upon application of a voltage.
A holding device 100 for holding the substrate 101. - Carrier body (210); and
- comprising one or more holding devices (100) according to any one of claims 1 to 11,
The one or more holding devices (100) are mounted on the carrier body (210),
A carrier 200 for holding the substrate 101. A method (300) for releasing a substrate (101) from a holding device (100), comprising:
and bending the surface (111) of the main body (110) of the holding device,
The surface (111) includes an adhesive arrangement (120) for retaining the substrate,
The bending step is performed by contracting the main body 110 in a direction substantially parallel to the surface 111.
Method (300) for releasing a substrate (101) from a holding device (100). According to claim 13,
Contracting the main body 110 includes providing current to a shape memory element 130 that is in contact with the main body 110,
Method (300) for releasing a substrate (101) from a holding device (100). The method of claim 13 or 14,
Bending the surface 111 of the main body 110 induces shear forces at the interface between the adhesive arrangement 120 and the substrate 101.
Method (300) for releasing a substrate (101) from a holding device (100). Method for manufacturing an electronic device using a holding device (100) according to any one of claims 1 to 11.