CN112867809A

CN112867809A - Holding device for holding a substrate, carrier for holding a substrate and method for releasing a substrate from a holding device

Info

Publication number: CN112867809A
Application number: CN201880098449.2A
Authority: CN
Inventors: 西蒙·刘; 莱内尔·欣特舒斯特
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2018-10-18
Filing date: 2018-10-18
Publication date: 2021-05-28
Also published as: KR20210075176A; WO2020078559A1; KR20240064729A

Abstract

A holding device (100) for holding a substrate (101) is described. The holding device (100) comprises: a main body (110); a bonding arrangement (120) provided on a surface (111) of the body (110); and a shape memory element (130) in contact with the body (110). Further, a carrier is described, the carrier comprising one or more holding devices for holding a substrate. Furthermore, a method for releasing a substrate from a holding device is described.

Description

Holding device for holding a substrate, carrier for holding a substrate and method for releasing a substrate from a holding device

Technical Field

Embodiments of the present disclosure relate to a holding device for holding a substrate, a carrier for holding a substrate, and a method for releasing a substrate from a holding device. In particular, embodiments of the present disclosure relate to a holding device and a carrier for holding a substrate substantially vertically during processing of the substrate in a vacuum processing chamber, for example during layer deposition on the substrate.

Background

Techniques for layer deposition on a substrate include, for example, thermal evaporation, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD), such as sputter deposition. A sputter deposition process may be used to deposit a layer of material, such as a layer of insulating material, on the substrate. During a sputter deposition process, a target having target material to be deposited on a substrate is bombarded with ions generated in a plasma region to dislodge atoms of the target material from the surface of the target. The dislodged atoms may form a layer of material on the substrate. In a reactive sputter deposition process, the dislodged atoms can react with a gas (e.g., nitrogen or oxygen) in the plasma region to form an oxide, nitride, or oxynitride of the target material on the substrate.

The coating material can be used in several applications and in several technical fields. For example, the coating material may be used in the field of microelectronics, such as for producing semiconductor devices. Also, the substrate for the display may be coated using a PVD process. Additional applications include insulating panels, Organic Light Emitting Diode (OLED) panels, substrates with Thin Film Transistors (TFTs), color filters, and the like.

The tendency for larger and also thinner substrates may cause the substrate to bulge due to stresses applied to the substrate, for example, during the deposition process. In particular, conventional support systems that hold the substrate during the deposition process, for example, bulge on the substrate due to the force pushing the edge of the substrate toward the center of the substrate. Bulging can in turn lead to problems due to increased likelihood of breakage. Furthermore, it is challenging to release a thin large area substrate from a support system, e.g., from a substrate carrier, without bulging or damaging the substrate.

In view of the above, there is a need to provide an improved holding device and carrier for holding a substrate and to provide an improved method for releasing a substrate from a holding device and carrier that overcomes at least some of the problems in the art.

Disclosure of Invention

In view of the above, a holding device for holding a substrate, a carrier for holding a substrate and a method for releasing a substrate from a holding device according to the independent claims are provided. Further aspects, advantages and features are apparent from the dependent claims, the description and the drawings.

According to one aspect of the present disclosure, a holding device for holding a substrate is provided. The holding device includes a body. In addition, the retaining means comprises an adhesive arrangement provided on a surface of the body. Furthermore, the retaining means comprise a shape memory element in contact with the body.

According to another aspect of the present disclosure, a holding device for holding a substrate is provided. The retaining means comprises a body of flexible material. In addition, the retaining means comprises an adhesive arrangement provided on a surface of the body. Furthermore, the holding device comprises a contraction device arranged and configured to contract the body to curve the surface.

According to another aspect of the present disclosure, a carrier for holding a substrate is provided. The carrier includes: a carrier body; and one or more retaining devices according to any embodiment described herein. The one or more retaining devices are mounted to the carrier body.

According to another aspect of the present disclosure, a method for releasing a substrate from a holding device is provided. The method includes bending a surface of a body of the holding device. The surface of the body comprises an adhesive arrangement for holding the substrate. The bending is performed by contracting the body in a direction substantially parallel to the surface.

According to another aspect of the present disclosure, a method for manufacturing an electronic device is provided. The method comprises using a holding device according to any embodiment described herein.

Embodiments are also directed to apparatuses for performing the disclosed methods and including apparatus portions for performing the described method aspects. These method aspects may be performed by hardware components, a computer programmed by appropriate software, any combination of the two, or in any other manner. Furthermore, embodiments according to the present disclosure also relate to a method for operating the described device. The method for operating the described apparatus includes method aspects for performing each function of the apparatus.

Drawings

So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The drawings relate to embodiments of the disclosure and are described below:

fig. 1A shows a schematic cross-sectional side view of a holding device according to embodiments described herein;

FIG. 1B shows a schematic cross-sectional side view of the holding device of FIG. 1A in a flexed state;

fig. 2 shows a schematic top view of a holding device according to further embodiments described herein;

FIG. 3A shows a schematic cross-sectional side view of the holding device of FIG. 2;

FIG. 3B shows a schematic cross-sectional side view of the holding device of FIG. 3A in a flexed state;

fig. 4A shows a schematic cross-sectional side view of a holding device attached to a substrate according to embodiments described herein;

FIG. 4B shows a schematic cross-sectional side view of the holding device of FIG. 4A in a state where the substrate is disengaged from the holding device;

fig. 4C illustrates a flow chart showing a method for releasing a substrate from a holding device according to embodiments described herein;

fig. 5 shows a schematic top view of a section of a carrier for holding substrates according to embodiments described herein;

fig. 6 shows a schematic cross-sectional view along the line a-a of the section of the carrier shown in fig. 5;

fig. 7A and 7B show schematic front views of embodiments of a carrier according to embodiments described herein; and

fig. 7C shows a schematic cross-sectional view along line B-B of the carrier shown in fig. 7B.

Detailed Description

Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, like reference numerals refer to like parts. Only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the disclosure, and is not intended as a limitation of the disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the specification include such modifications and variations.

Referring to fig. 1A and 1B by way of example, a holding device 100 for holding a substrate 101 according to the present disclosure is described. Fig. 1A shows the holding device 100 in an attached state, i.e. in a state in which a substrate can be attached to the holding device. As exemplarily shown in fig. 1A, in the attached state, the holding device has a substantially planar configuration, i.e. the holding device is not bent.

Fig. 1B shows the holding device 100 in a disengaged state, i.e. in a state in which the substrate can be disengaged from the holding device. As exemplarily shown in fig. 1B, in the disengaged state, the holding device has a curved configuration, i.e. the holding device is curved.

According to embodiments, which can be combined with other embodiments described herein, the holding device 100 comprises a body 110, in particular a body of flexible material. Thus, the body 110 may be curved as exemplarily shown in fig. 1B.

In addition, the holding device 100 comprises an adhesive arrangement 120, which is provided on the surface 111 of the body 110. In particular, the adhesive arrangement 120 may be directly attached to the surface 111 of the body 110. Typically, in the attached state, the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is a substantially planar surface, as exemplarily shown in fig. lA. In the disengaged state, i.e. when the holding device is bent, as exemplarily shown in fig. 1B, the surface 111 of the body 110 on which the adhesive arrangement 120 is provided is a curved surface, in particular an arched surface. In particular, in the disengaged state of the retaining device, the surface 111 of the body 110 is a convex curved surface, in particular a convex arched surface.

As exemplarily shown in fig. 1A and 1B, typically, the surface 111 of the body 110 on which the adhesive arrangement 120 is provided is parallel to the bottom surface 112 of the body 110. Thus, in the attached state, the bottom surface 112 of the main body 110 is a substantially planar surface, as exemplarily shown in fig. lA. In the disengaged state, i.e. when the holding device is bent, as exemplarily shown in fig. 1B, the bottom surface 112 of the body 110 is a curved surface, in particular an arched surface. In particular, in the disengaged state of the holding device, the bottom surface 112 of the body 110 is a concave curved surface, in particular a concave arched surface.

Furthermore, as exemplarily shown in fig. 1A and 1B, the holding device 100 includes a shape memory element 130 in contact with the body 110. For example, the shape memory element 130 may be provided inside the body 110, as exemplarily shown in fig. 1A and 1B. In particular, the shape memory element 130 may be embedded in the body 110. Although not explicitly shown, it is understood that shape memory element 130 may alternatively be attached to bottom surface 112 of the body.

In particular, typically, the shape memory element 130 is configured such that the shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For example, a change from a first temperature to a second temperature, higher than the first temperature, may be induced by applying a voltage to the shape memory element. Typically, the shape memory element is made of a shape memory alloy.

As exemplarily shown in fig. 1A, the first configuration of the shape memory element 130 can include a first length L1, and as exemplarily shown in fig. 1B, the second configuration of the shape memory element 130 can include a second length L2 that is shorter than the first length L1. From fig. 1A and 1B, it will be appreciated that the second configuration of the shape memory element 130 is typically a collapsed configuration compared to the first configuration of the shape memory element 130. Thus, as exemplarily shown in fig. 1B, upon contraction of the shape memory element 130, the opposite ends 113 of the body 110 may be pulled inward, causing the body to bend. Thus, the adhesive arrangement 120 provided on the surface 111 of the body 110 is bent such that a disengaged state of the holding device may be provided.

Thus, an improved holding device for holding a substrate is provided compared to the prior art. In particular, embodiments of the holding device as described herein are advantageously configured such that a bending of the adhesive arrangement of the holding device may be achieved such that the substrate may be detached or released from the holding device in a simpler and more efficient manner compared to conventional holding devices. In particular, as exemplarily described with reference to fig. 4A and 4B, embodiments of the holding device of the present disclosure are configured such that for releasing the substrate from the holding device a relative movement of the adhesive arrangement with respect to the surface of the substrate may be provided. More specifically, the holding device as described herein is configured such that shear forces at the interface between the adhesive arrangement and the substrate attached thereto may be induced. In particular, the surface of the body on which the adhesive arrangement is provided may be curved by employing a shape memory element as described herein to induce a shear force at the interface between the adhesive arrangement and the substrate. Thus, advantageously, a smooth detachment of the substrate from the holding means may be provided, such that the risk of substrate breakage is reduced or even eliminated.

Before describing various additional embodiments of the present disclosure in more detail, some aspects related to some of the terms used herein are explained.

In the present disclosure, "a holding device for holding a substrate" may be understood as a device configured for holding a substrate as described herein. In particular, the apparatus may be configured for holding a large area substrate in a vertical state. More particularly, a holding device as described herein may be understood as a part or component of a carrier configured such that a substrate may be attached to the holding device.

In the present disclosure, the term "substrate" as used herein shall specifically cover non-flexible substrates, such as glass plates and metal plates. However, the present disclosure is not so limited, and the term "substrate" may also encompass flexible substrates, such as webs or foils. According to some embodiments, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of: glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, mica, or any other material or combination of materials that can be coated by a deposition process. For example, the substrate may have a thickness of 0.1mm to 1.8mm, such as 0.7mm, 0.5mm, or 0.3 mm. In some implementations, the substrate can have a thickness of 50 μm or more and/or 700 μm or less. Processing thin substrates with thicknesses of only a few microns (e.g., 8 μm or more and 50 μm or less) can be challenging.

According to some embodiments, the substrate may be a "large area substrate" and may be used for display manufacturing. For example, the substrate may be a glass or plastic substrate. For example, the substrate described herein shall cover substrates typically used for LCDs (liquid crystal displays), PDPs (plasma display panels), and the like. For example, a "large area substrate" may have an area of 0.5m²Or larger, in particular 1m²Or a larger major surface. In some embodiments, the large area substrate may be generation 4.5 (which corresponds to about 0.67 m)²Substrate (0.73m × 0.92m)), generation 5 (which corresponds to about 1.4 m)²Substrate (1.1m × 1.3m)), generation 7.5 (which corresponds to about 4.29 m)²Substrate (1.95m × 2.2m)), generation 8.5 (which corresponds to about 5.7 m)²Substrate (2.2m x 2.5m)) or even generation 10 (which corresponds to about 8.7 m)²Substrate (2.85m × 3.05 m)). Can similarly be realized even higherGeneration (such as generation 11 and generation 12) and corresponding substrate area.

In the present disclosure, a "body" of the holding device may be understood as a base structure of the holding device, in particular a solid base structure. According to a non-limiting example, the body may have a disc-like shape, as exemplarily shown in fig. 2. Alternatively, the body may be a rectangular cuboid or a square cuboid. In particular, the body of the holding device is typically made of a flexible or bendable material. For example, the body of the holding device may comprise or consist of a high temperature polymer. For example, the high temperature polymer may have a heat resistance of at least 150 ℃, particularly at least 200 ℃, more particularly at least 250 ℃. Thus, the holding device may be configured to withstand a continuous use temperature of at least 150 ℃, in particular at least 200 ℃, more in particular at least 250 ℃. For example, the high temperature polymer used for the body may have heat resistance up to 300 ℃. For example, the body of the holding device may be made of at least one material selected from the group consisting of: polyimide (PI), Polyaryletherketone (PAEK), polyphenylene sulfide (PPS), Polyarylsulfone (PAS), and fluoropolymer (PTEE). According to another example, the body of the holding device may be made of silicone (also referred to as polysiloxane).

In the present disclosure, "adhesive arrangement" may be understood as an arrangement configured to provide adhesive force to attach a substrate as described herein. In particular, typically, the adhesive arrangement is provided on a planar surface when the holding device is in the attached state. More specifically, the bonding arrangement as described herein may comprise a dry adhesive material. For example, the dry adhesive material may be configured to provide adhesion by van der waals forces.

In the present disclosure, a "shape memory element" may be understood as an element configured to exhibit shape memory properties. In particular, the shape memory element may comprise or consist of a Shape Memory Alloy (SMA). Shape memory alloys may also be referred to as smart metals, memory alloys, muscle wires, or smart alloys. Thus, a shape memory element described herein may be understood as an element that may have a first predefined configuration at a first temperature and may have a second predefined configuration at a second temperature higher than the first temperature. For example, a change from a first temperature to a second temperature may be induced by applying a voltage to the shape memory element.

With exemplary reference to fig. 2, a shape memory element 130 overlies the interior portion 115 of the body 110 according to embodiments that may be combined with other embodiments described herein. The boundaries of the interior portion 115 of the body 110 are exemplarily indicated by the dashed lines shown in fig. 2. Thus, the shape memory element 130 may be an elongated element overlying the interior portion 115 of the body 110, as exemplarily shown in fig. 2. In particular, the shape memory element 130 may have an annular configuration overlying the interior portion 115 of the body 110.

In other words, the shape memory element 130 (e.g., which is an elongated element) may be disposed in the outer edge portion 116 of the body 110. The outer edge portion 116 may be understood as a portion extending from the edge 117 of the body to the interior of the body. In particular, the outer edge portion 116 can extend from the edge 117 of the body 110 into the interior of the body for 50% or less of the lateral dimension of the body, specifically 30% or less of the lateral dimension of the body, more specifically 15% or less of the lateral dimension of the body.

According to embodiments, which can be combined with other embodiments described herein, the shape memory element 130 can comprise one or more wires. For example, one or more wires may be kinked. Typically, one or more wires are made of a shape memory alloy.

As exemplarily shown in fig. 2, 3A and 3B, the shape memory element 130 typically includes an electrical connection 131. In particular, the electrical connection 131 is configured for connection to a voltage source 132.

Referring exemplarily to fig. 3A and 3B, according to embodiments that can be combined with other embodiments described herein, the holding device further comprises a plate member 140 in contact with the body 110. In particular, as shown in fig. 3A, which illustrates the non-bent state of the holding device, the plate member 140 is arranged substantially parallel to the surface 111 of the main body 110. For example, the plate member 140 may be embedded in the body 110. The plate element may be beneficial for switching between the attached state and the detached state of the retaining device. For example, the plate element may be made of metal, in particular spring steel. Alternatively, the plate element may be made of plastic. In particular, as exemplarily shown in fig. 3B, when the shape memory element 130 is in the second configuration, i.e., the collapsed configuration, the plate element is compressed and bent. Thus, the plate member has the advantage that the uniformity of bending of the body can be improved, resulting in an improved and smoother disengagement of the substrate from the holding means.

According to embodiments, which can be combined with other embodiments described herein, the shape memory element 130 can be provided around the plate element 140, as exemplarily shown in fig. 2, 3A and 3B. In particular, as exemplarily shown in fig. 3A, in the attached state of the retaining device, the shape memory element 130 and the plate element 140 may have at least one common plane. Therefore, by providing the shape memory member 130 around the plate member 140, the uniformity of compression and bending of the plate member by the shape memory member 130 can be improved.

With exemplary reference to fig. 2, 3A, and 3B, according to embodiments that may be combined with other embodiments described herein, the bonding arrangement 120 includes a plurality of filaments 121 (only some of the filaments are labeled with a reference numeral for illustrative purposes). For example, the filaments may be or include nanotubes, such as carbon nanotubes. Additionally or alternatively, the plurality of filaments 121 may be made of or comprise a polymeric material, in particular a synthetic polymeric material. Each of the plurality of filaments may be a substantially longitudinal member. In particular, each of the plurality of filaments may have one dimension that is greater than the remaining two dimensions. In particular, the longest dimension of the filament may be the length of the filament. That is, the filaments may be elongated along the length direction.

According to embodiments, which can be combined with other embodiments described herein, the bonding arrangement, in particular the plurality of filaments, can be made of a high temperature polymer. For example, the adhesive arrangement may be made of a high temperature polymer having a heat resistance of at least 150 ℃, particularly at least 200 ℃, more particularly at least 250 ℃. Thus, the bonding arrangement may be configured to withstand a continuous use temperature of at least 150 ℃, particularly at least 200 ℃, more particularly at least 250 ℃. For example, the high temperature polymer used for the adhesive arrangement, in particular the plurality of filaments, may have a heat resistance of up to 300 ℃. For example, the adhesive arrangement, in particular the plurality of filaments, may be made of at least one material selected from the group consisting of: polyimide (PI), Polyaryletherketone (PAEK), polyphenylene sulfide (PPS), Polyarylsulfone (PAS), and fluoropolymer (PTEE). According to another example, the adhesive arrangement may be made of silicone (also referred to as polysiloxane).

As exemplarily shown in fig. 3A and 3B, each filament of the plurality of filaments 121 may be attached to the surface 111 of the body 110. In particular, each filament of the plurality of filaments 121 may extend away from the surface 111 of the body 110, e.g., perpendicular to the surface 111 of the body 110. Thus, each filament of plurality of filaments 121 may have a second end that is free, e.g., for attachment of a substrate as described herein. In particular, a second end of each filament of the plurality of filaments 121 may be configured to be attachable to the substrate 101. In particular, the second end of each filament may be configured to adhere to the substrate 101 by van der waals forces.

According to embodiments, which can be combined with other embodiments described herein, the bonding arrangement 120 comprises a dry adhesive material to attach the substrate 101. For example, the dry binder material may be a synthetic bristle material. The dry binder material (e.g., synthetic bristle material) can be inorganic. In particular, the dry binder material may be substantially 100% inorganic. As one example, the dry binder material may have a microstructure comprising nanotubes. For example, the microstructures of the dry binder material may comprise carbon nanotubes.

In particular, the dry adhesive material may be a gecko-like adhesive. For example, the gecko-like adhesive may be a gecko-like tape or a gecko-like element. The adhesive ability of dry adhesive materials, particularly synthetic setae materials, can be related to the adhesive properties of the gecko's foot. The natural adhesive ability of the gecko feet allows animals to adhere to many types of surfaces in most situations. The adhesive ability of the gecko foot is provided by a number of hair-type extensions (called "bristles") on the gecko foot. It is noted herein that the term "synthetic setae material" may be understood to be a synthetic material that mimics the natural adhesive capabilities of a gecko foot and includes adhesive capabilities similar to those of a gecko foot. Further, the term "synthetic setae material" may be used synonymously with the term "synthetic gecko-like setae material" or the term "gecko-like tape material". However, the present disclosure is not so limited and other dry adhesive materials suitable for holding substrates may be used.

In the context of the present disclosure, a "gecko-like adhesive" may be understood as an adhesive that mimics the ability of a gecko's foot to adhere to a surface (such as, for example, a vertical surface). In particular, the dry adhesive material of the adhesion arrangement 120 as described herein may be configured to adhere to the substrate 101 due to van der waals forces between the dry adhesive material and the surface of the substrate 101. However, the present disclosure is not limited thereto, and other adhesive materials suitable for holding substrates may be used.

According to embodiments that may be combined with any other embodiments described herein, the adhesive force provided by the dry adhesive material may be sufficient to hold the substrate as described herein. In particular, the dry binder material may be configured to provide about 2N/cm²Or larger, in particular 3N/cm²Or larger, more particularly 4N/cm²Or greater (e.g., at least 5N/cm)²) The adhesive force of (1).

It will therefore be appreciated that an improved holding device 100 for holding a substrate 101 is provided compared to the prior art. The holding device 100 comprises a body 110, in particular of a flexible material, and an adhesive arrangement 120, for example comprising a dry adhesive, provided on a surface 111 of the body 110. Furthermore, the holding device 100 comprises a contraction device arranged and configured to contract the body 110 with the adhesive arrangement 120 to curve the surface 111. In particular, the constriction device typically comprises a shape memory element 130. The shape memory element 130 is configured such that the shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For example, a change from a first temperature to a second temperature, higher than the first temperature, may be induced by applying a voltage to the shape memory element. Typically, the shape memory element is made of a shape memory alloy. Thus, the constriction device may comprise a shape memory element configured to constrict upon application of a voltage.

In the present disclosure, "constriction device" may be understood as a device configured to perform constriction. In particular, the contraction of the constriction device may be initiated by a temperature change of the constriction device from a first temperature T1 to a second temperature T2, the second temperature being higher than the first temperature (T2 > T1). Typically, the contraction involves a reduction of the first length L1 to the second length L2 of the contraction device, in particular the shape memory element 130, e.g. as described with reference to fig. 1A and 1B. In particular, as can be seen by comparing fig. 1A and 1B, the constriction device (e.g., the shape memory element 130) is typically configured to constrict substantially parallel to the surface 111 of the body 110, with the surface 111 of the body 110 in an attached state (i.e., unbent).

Referring exemplarily to the flowchart shown in fig. 4C, an embodiment of a method 300 for releasing a substrate from a holding device according to the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the method 300 includes bending (represented by block 310 in fig. 4C) the surface 111 of the body 110 of the holding device 100. The surface 111 of the body 110 comprises an adhesive arrangement 120 for holding a substrate. As exemplarily indicated by block 320 in fig. 4C, the body 110 is bent by shrinking in a direction substantially parallel to the surface 111 on which the adhesive arrangement 120 is provided.

In particular, as exemplarily shown in fig. 1B, contracting the body 110 typically includes pulling opposite ends 113 of the body 110 inward, causing the body to bend. Thus, the adhesive arrangement 120 provided on the surface 111 of the body 110 is bent such that a disengaged state of the holding device may be provided. Thus, shear forces may be induced at the interface between the adhesive arrangement and the substrate attached thereto. Thus, advantageously, a smooth detachment of the substrate from the holding means may be provided, such that the risk of substrate breakage is reduced or even eliminated.

According to embodiments, which can be combined with other embodiments described herein, the surface 111 of the body 110 of the curved retention device 100 comprises a surface providing a convex curved surface, in particular a convex arched surface, as exemplarily shown in fig. 4B.

According to embodiments, which can be combined with other embodiments described herein, contracting the body 110 can include providing an electrical current to a shape memory element 130 in contact with the body 110. In particular, the shape memory element 130 may have any configuration as described herein.

Thus, from fig. 4A and 4B, which show cross-sectional side views of the holding device in the attached state and in the detached state, respectively, it will be appreciated that the surface 111 of the curved body 110 causes a shear force at the interface between the adhesive arrangement 120 and the substrate 101, which has the advantage that a smooth detachment of the substrate from the holding device may be provided such that the risk of substrate breakage is reduced or even eliminated.

It is to be understood that the method 300 for releasing a substrate from a holding device, as described herein, typically includes embodiments employing a holding device of the present disclosure.

Referring to fig. 5, 6, and 7A-7C by way of example, a carrier 200 for holding substrates according to the present disclosure is described. According to embodiments, which can be combined with other embodiments described herein, the carrier comprises a carrier body 210, and one or more holding devices 100 according to any embodiment described herein. One or more holding devices 100 are mounted to the carrier body 210, for example, via one or more support structures 220.

For example, each of the one or more holding devices 100 may be connected to a respective support structure 220. The support structure 220 may be connected to the carrier body 210. Thus, the carrier 200 with one or more holding devices 100 as described herein is configured for holding a substrate, in particular a substrate as described herein. Typically, one or more holding devices 100 are configured to provide a holding force for holding a substrate. For example, the retention force may be substantially parallel to the surface of the substrate, particularly when the substrate is in a substantially vertical orientation. In particular, the retention force may be provided by the adhesive arrangement 120 of the retention device 100 as described herein.

In the present disclosure, "carrier for holding a substrate" may be understood as a carrier configured for holding a substrate, in particular a large area substrate, as described herein. Typically, a substrate held or supported by a carrier as described herein comprises a front surface and a back surface, wherein the front surface is the surface of the substrate being processed, e.g., on which a layer of material is deposited. Typically, the carrier is configured such that an edge portion of the back surface of the substrate may be attached to the holding device, in particular the adhesive arrangement of the holding device as described herein.

In the present disclosure, a "carrier body" is understood to be a body of a carrier configured for holding a substrate. For example, the carrier may be a frame or plate configured for holding a substrate as described herein. Accordingly, a carrier as described herein may be configured to support a surface of a substrate, such as an edge portion of a back surface of the substrate.

According to an embodiment, which can be combined with any other embodiment described herein, the carrier 200 is configured to support a substrate during substrate processing, for example during a layer deposition process (such as a sputtering process). Referring exemplarily to fig. 7A to 7C, the carrier body 210 may be configured as a frame. Alternatively, the carrier body 210 may be configured as a plate. The carrier body 210 may comprise and/or be made of aluminum, aluminum alloys, titanium alloys, stainless steel, and the like. According to some embodiments, which can be combined with other embodiments described herein, the carrier body 210 can include two or more elements, such as a top bar, a side bar, and a bottom bar. Two or more elements may define an aperture 215, as exemplarily shown in fig. 7C. In some implementations, a masking device may be provided at the carrier to mask one or more portions of the substrate. As one example, the masking means may be an edge exclusion mask.

As exemplarily shown in fig. 7C, the substrate 101 may typically have a first surface 101A and a second surface 101B. The first surface and the second surface may be opposite surfaces of the substrate 101. In particular, the first surface may be a back surface of the substrate 101. As an example, the first surface 101A may be arranged to face one or more holding devices 100 of the carrier 200.

Thus, as exemplarily shown in fig. 7C, according to some embodiments, which can be combined with other embodiments described herein, the adhesive arrangement 120 of the one or more holding devices 100 of the carrier 200 can be configured to contact the first surface 101A of the substrate 101. Further, as exemplarily shown in fig. 7C, the second surface 101B may be a front surface of the substrate 101. In particular, the second surface may be a surface of a substrate to be processed in a processing system, in particular in a vacuum processing chamber. As one example, the second surface of the substrate may be configured for depositing a layer thereon.

Referring exemplarily to fig. 7A-7C, according to embodiments that may be combined with other embodiments described herein, the carrier 200 may be configured to hold or support the substrate 101 in a substantially vertical orientation, e.g. during a layer deposition process. As one example, one or more holding devices 100 may be configured to hold the substrate 101 in a substantially vertical orientation. As used throughout this disclosure, "substantially vertical," particularly when referring to a substrate orientation, can be understood to allow for a deviation of ± 20 ° or less (e.g., ± 10 ° or less) from a vertical direction or orientation. The deviation may be provided, for example, because a substrate support with some deviation from a vertical orientation may result in a more stable substrate position. However, the substrate orientation, e.g. during a layer deposition process, may be considered substantially vertical, which may be considered different from a horizontal substrate orientation.

As exemplarily shown in fig. 7A and 7B, the substrate 101 may have an upper side 11, a lower side 12, and two side surfaces 13 (e.g., left and right sides). The upper side 11, the lower side 12 and the two side faces 13 may be defined with respect to the vertical orientation of the substrate 101. Likewise, the carrier 200 or the carrier body 210 may have an upper side, a lower side, and two sides (e.g., left and right sides).

In some implementations, one or more holding devices 100 can be mounted to the carrier body 210 to hold at least one of: an upper side 11, a lower side 12, and at least one of two side surfaces 13 of the substrate 101. For example, as exemplarily shown in fig. 7A, one or more holding devices 100 (e.g., two holding devices) may be provided to hold the upper side 11. According to another embodiment, one or more holding devices 100 (e.g., two holding devices) may be provided to hold the underside 12 of the substrate, and/or two or more holding devices 100 may be provided to hold each of the two sides 13 (e.g., two holding devices for the left side and two holding devices for the right side), as exemplarily shown in fig. 7B.

According to some embodiments described herein, one or more holding devices 100 may be mounted on the carrier body 210 to hold the substrate 101 in a suspended state. In particular, one or more holding devices 100 may be configured to hold the upper side 11 of the substrate 101. For example, in some implementations, as exemplarily shown in fig. 7A, the substrate 101 is held only at the upper side 11. Thus, the carrier 200 may comprise one or more holding devices 100 (e.g. two holding devices) only at the upper side of the carrier body 210 to hold the upper side 11 of the substrate 101.

Referring exemplarily to fig. 7C, according to some embodiments, which can be combined with other embodiments described herein, the holding device 100 can be configured to contact the substrate 101 only on one surface of the substrate 101, in particular, the back surface of the substrate (i.e., the unprocessed surface of the substrate 101). Further, a support structure 220 may be provided between each of the one or more holding devices 100 and the carrier body 210. As exemplarily shown in fig. 7C, the aperture 215 may correspond to or be larger than, in particular slightly larger than, the surface area of the substrate 101 to be processed. Thus, embodiments of the carrier as described herein are configured such that the entire front side of the substrate may be processed. In particular, some embodiments described herein may be practiced without a device that provides edge exclusion. According to other embodiments (not explicitly shown), the aperture 215 may be slightly smaller than the surface area of the substrate to be processed. Thus, the aperture 215 may be configured such that an untreated edge of the substrate, in particular an uncoated edge of the substrate, may be provided.

It will be understood that the support according to embodiments described herein may be used in static processes as well as in non-static processes.

Thus, in view of the above, it will be appreciated that embodiments of the holding device, embodiments of the carrier and embodiments of the method for releasing a substrate from the holding device as described herein are improved compared to the prior art. In particular, by embodiments of the present disclosure, advantageously, a smooth detachment of the substrate from the holding device may be provided such that the risk of substrate breakage is reduced or even substantially eliminated.

This written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject matter, including making and using any devices or systems and performing any incorporated methods. Although various specific embodiments have been disclosed above, the non-mutually exclusive features of the embodiments described above may be combined with each other. The scope of patent protection is defined by the claims, and other examples are intended to be within the scope of the claims, provided they have structural elements that do not differ from the literal language of the claims, or provided they include equivalent structural elements with insubstantial differences from the literal language of the claims.

While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A holding device (100) for holding a substrate (101), comprising:

-a body (110);

-a bonding arrangement (120) provided on a surface (111) of the body (110); and

-a shape memory element (130) in contact with the body (110).

2. The holding device (100) according to claim 1, wherein the shape memory element (130) overlies an inner portion of the body (110).

3. The holding device (100) according to claim 1 or 2, wherein the shape memory element (130) comprises one or more shape memory alloy wires.

4. The holding device (100) of any one of claims 1 to 3, further comprising a plate element (140) in contact with the main body (110), the plate element (140) being arranged substantially parallel to the surface (111) of the main body (110).

5. The retaining device (100) of claim 4, wherein the shape memory element (130) is provided around the plate element (140).

6. The holding device (100) according to any one of claims 1 to 5, wherein the adhesive arrangement (120) comprises a plurality of filaments (121).

7. The holding device (100) of any one of claims 1 to 6, wherein the adhesive arrangement (120) comprises a dry adhesive material to attach the substrate (101).

8. The holding device (100) of claim 7, wherein the dry adhesive material is a synthetic seta material, in particular a gecko-like adhesive.

9. The holding device (100) according to any one of claims 1 to 8, the shape memory element (130) having an electrical connection (131) for connection to a voltage source.

10. A holding device (100) for holding a substrate (101), comprising:

-a body (110) of flexible material;

-a bonding arrangement (120) provided on a surface (111) of the body (110); and

-a contraction device arranged and configured to contract the body (110) to bend the surface (111).

11. The holding device of claim 10, wherein the contraction device comprises a shape memory element (130) configured to contract upon application of a voltage.

12. A carrier (200) for holding a substrate (101), comprising:

-a carrier body (210); and

-one or more holding devices (100) according to any one of claims 1 to 11, wherein the one or more holding devices (100) are mounted to the carrier body (210).

13. A method (300) for releasing a substrate (101) from a holding device (100), the method comprising bending a surface (111) of a body (110) of the holding device, the surface (111) comprising an adhesive arrangement (120) for holding the substrate, wherein the bending is performed by shrinking the body (110) in a direction substantially parallel to the surface (111).

14. The method (300) of claim 13, wherein contracting the body (110) comprises providing an electrical current to a shape memory element (130) in contact with the body (110).

15. The method (300) according to claim 13 or 14, wherein bending the surface (111) of the body (110) causes a shear force at an interface between the bonding arrangement (120) and the substrate (101).

16. A method of manufacturing an electronic device using a holding device (100) according to any of claims 1 to 11.