CN102332436A - Package of shape memory alloy core structure - Google Patents
Package of shape memory alloy core structure Download PDFInfo
- Publication number
- CN102332436A CN102332436A CN201110281884A CN201110281884A CN102332436A CN 102332436 A CN102332436 A CN 102332436A CN 201110281884 A CN201110281884 A CN 201110281884A CN 201110281884 A CN201110281884 A CN 201110281884A CN 102332436 A CN102332436 A CN 102332436A
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- substrate
- marmem
- packaging part
- high temperature
- deformation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a package of a shape memory alloy core structure, comprising a substrate, a chip arranged on the substrate, a plastic package material used for packing the chip on the substrate and a shape memory alloy embedded in the substrate. The package with the shape memory alloy embedded in the substrate improves the heat dispersion; due to the deformation of the shape memory alloy in the process of high temperature backflow in a packaging technology, the package can control the deformation direction to be opposite to the deformation directions of the substrate [such as a PCB (printed circuit board)] and the plastic package, thus at least partially restraining and/or offsetting the deformation of the substrate (such as the PCB) at a high temperature, and solving the problem of the packaging structure failure due to the deformation of the substrate and the plastic package at the high temperature.
Description
Technical field
The present invention relates to a kind of packaging part of marmem core texture.Specifically, the present invention relates to a kind of packaging part that is embedded into the marmem in the substrate (for example printed circuit board (PCB) (PCB)) that contains.
Background technology
Along with the develop rapidly of semiconductor industry and to the rapid permeability of every profession and trade; Electronic Packaging has progressively become a bottleneck realizing the semiconductor chip function; Therefore Electronic Packaging has obtained huge development at nearly twenty or thirty in year, and has obtained significant progress.
Present Electronic Packaging not only will provide the chip protection, also will when controlling cost, satisfy performances such as ever-increasing function, reliability, thermal diffusivity.The design of Electronic Packaging and manufacturing are just becoming more and more important to system applies, and the design of Electronic Packaging and manufacturing need be started with to obtain the best ratio of performance to price from system from the beginning.
The actuating force of Electronic Packaging development is mainly derived from the development and the market demand of semiconductor chip, may be summarized to be following some: the increase of speed and disposal ability needs more pins number, clock frequency and better power distribution faster.The market demand electronic product has greater functionality, longer battery life and littler physical dimension.The requirement of electronic device and electronic product constantly increases, and new device continues to bring out.Market competition is increasingly sharpened, the development of manufacture of microchips and the market demand of electronic product with the developing trend of final decision Electronic Packaging in littler, thinner, lighter, with better function, energy consumption is littler, better reliability, more compliance with environmental protection requirements, cheapness etc. more.
The consumer expects that electronic product is all compact in every respect, and this also is the major impetus that electronic product dwindles day by day.So enterprise is constantly dwindling the overall dimension of end product, and this will utilize less semiconductor packages to realize.Therefore, dwindling encapsulation is a main development trend of semiconductor packages industry.
In the various packing forms in using now, stacked package is a kind of good way that realizes microminiaturization with high integration degree.In stacked package, encapsulation (PiP) and encapsulation outer package (PoP) are more and more important to Packaging Industry in the encapsulation, because this technology can be piled up highdensity equipment.The PoP product has encapsulation more than two, and a top that is encapsulated in another combines their encapsulation with soldered ball.This encapsulation is integrated in logic and memory component respectively in the different encapsulation.For example, mobile phone just adopts the PoP encapsulation to come integrated application processor and memory.
Yet; For the thin packaging part or the packaging part of PoP form; In manufacture process, need a series of high temperature reflux technology of experience; A part of material in the packaging part at high temperature can produce distortion, and the distortion meeting of packaging part produces certain harmful effect to high-temperature technology and subsequent technique, for example possibly cause the inefficacy of packaging part.
Summary of the invention
The object of the present invention is to provide a kind of packaging part that is embedded into the marmem in the substrate (for example pcb board) that contains.
According to an aspect of the present invention, a kind of packaging part of memorial alloy core texture is provided, the packaging part of said memorial alloy core texture comprises: substrate; Chip is arranged on the substrate; Plastic packaging material is sealed the chip that is arranged on the substrate; Marmem is embedded in the substrate.
According to an aspect of the present invention, the deformation temperature of said marmem can be 200 ℃ to 260 ℃.
According to an aspect of the present invention, said marmem can comprise copper-Ni-Ti alloy, iron-Ni-Ti alloy or Ni-Ti-silicon alloy.
According to an aspect of the present invention, said marmem can have distortion at 200 ℃ to 260 ℃, and can after returning to normal temperature, return to original shape.
According to an aspect of the present invention, said substrate can be printed circuit board (PCB).
According to an aspect of the present invention, in the reflux technique of packaging part, said marmem can be controlled as has the deformation direction in the opposite direction with substrate deformation.
The packaging part that is embedded into the marmem in the substrate of containing according to the present invention has the heat dispersion that has improved; And; Because marmem can produce distortion in the high temperature reflux process of packaging technology; It is opposite with the deformation direction of plastic packaging material to control said distortion and substrate (for example pcb board); Thereby suppress at least in part and/or offset substrate (for example pcb board) and plastic packaging material distortion at high temperature, solve because the problem that substrate and plastic packaging material distortion at high temperature cause encapsulating structure to lose efficacy.
Description of drawings
Through the detailed description of exemplary embodiment of the present invention being carried out below in conjunction with accompanying drawing, above-mentioned and other feature and advantage of the present invention will become apparent, wherein:
Fig. 1 is the sketch map that illustrates according to the packaging part of prior art.
Fig. 2 illustrates the sketch map that the packaging part according to prior art shown in Fig. 1 at high temperature is out of shape.
Fig. 3 simply illustrates the sketch map that packaging part at high temperature is out of shape.
Fig. 4 A illustrates the sketch map that marmem according to an exemplary embodiment of the present invention at high temperature is out of shape.
Fig. 4 B illustrates marmem sketch map at normal temperatures according to an exemplary embodiment of the present invention.
Fig. 5 illustrates to contain the packaging part sketch map at normal temperatures that is embedded into the marmem in the substrate.
Fig. 6 illustrates to contain the packaging part sketch map at high temperature that is embedded into the marmem in the substrate.
Embodiment
Hereinafter, will describe exemplary embodiment of the present invention in detail with reference to accompanying drawing.Yet the present invention can implement with many different forms, and should not be limited to the exemplary embodiment of setting forth here.On the contrary, provide these exemplary embodiments to make that the disclosure will be thorough and complete, and can convey to those skilled in the art to the scope of exemplary embodiment fully.For the sake of clarity, possibly exaggerate the size and the relative size in layer and zone in the accompanying drawings.In addition, in the accompanying drawings, same or analogous label can be represented same or analogous element.
Fig. 1 is the sketch map that illustrates according to the packaging part of prior art.
With reference to Fig. 1, can comprise according to the packaging part of prior art: substrate 2; Chip on substrate 2; Soldered ball is formed under the substrate, and wherein, said substrate can be for example pcb board, and chip is attached to soldered ball with the mode of lead-in wire bonding through through hole, to realize and outside being electrically connected.
Fig. 2 illustrates the sketch map that the packaging part according to prior art shown in Fig. 1 at high temperature is out of shape.
With reference to Fig. 2, chip is encapsulated and realizes and the outside technology that is electrically connected in, packaging part need experience solder bond technology at high temperature, that is, high temperature reflux technology, wherein, said high temperature for example is 200 ℃ to 260 ℃.In high temperature reflux technology, packaging part can deform.At substrate is under the situation of pcb board, and usually, packaging part maybe be bent to a lateral bending that is encapsulated with plastic packaging material, as shown in Figure 2.
Fig. 3 simply illustrates the sketch map that packaging part at high temperature is out of shape.Among Fig. 3, label 1 expression plastic packaging material, label 2 expression substrate, for example PCB substrates.Other elements such as the for example chip that comprises in the packaging part, wiring, soldered ball are not shown in the schematic drawing of Fig. 3.
Memorial alloy is to have the SMART METALS of " memory " to make by a kind of; Its microstructure has two kinds of metastable states; At high temperature this alloy can change shape, and alloy can recover the shape under the original normal temperature state again under lower temperature (for example normal temperature), if it is reheated; Can also deform, its shape can be identical with the deformed shape under the high temperature before.Marmem can be nickel-titanium alloy material usually; For example; Marmem according to exemplary embodiment of the present invention can comprise copper-Ni-Ti alloy, iron-Ni-Ti alloy or Ni-Ti-silicon alloy; But the invention is not restricted to this, can also comprise the marmem of other kind according to the marmem of exemplary embodiment of the present invention.
According to this specific character of marmem, can confirm the distortion (for example deformation direction) that marmem takes place according to experiment in advance.
Fig. 4 A illustrates the sketch map that marmem according to an exemplary embodiment of the present invention at high temperature is out of shape.Fig. 4 B illustrates according to an exemplary embodiment of the present invention marmem sketch map at normal temperatures.
With reference to Fig. 4 A and Fig. 4 B, as stated, can confirm the distortion (for example deformation direction) that marmem takes place according to experiment in advance.
In order to utilize this specific character of marmem, according to exemplary embodiment of the present invention, in the manufacture process of packaging part, marmem 3 is embedded in the substrate, as shown in Figure 5.Said substrate can be for example pcb board, but the invention is not restricted to this, and said substrate can be the substrate of other type.
Said telescopiny can adopt the mode of lamination, but the invention is not restricted to this, can adopt other mode that marmem 3 is embedded in the substrate.
Fig. 6 illustrates to contain the packaging part sketch map at high temperature that is embedded into the marmem in the substrate.
In the high temperature reflux technology of packaging part, packaging part has the tendency that deforms.Because marmem can produce distortion in the high temperature reflux process of packaging technology; Promptly; The deformation temperature of said marmem is approximately 200 ℃ to 260 ℃, and therefore, it is opposite with the deformation direction of plastic packaging material to control said distortion and substrate (for example pcb board); Thereby suppress at least in part and/or offset substrate (for example pcb board) and plastic packaging material distortion at high temperature, as shown in Figure 6.This can solve because the problem that substrate and plastic packaging material distortion at high temperature cause encapsulating structure to lose efficacy.
It should be noted; Fig. 6 is illustrated in to contain the packaging part sketch map at high temperature that is embedded into the marmem in the substrate under the perfect condition; In the high temperature reflux technology of reality, packaging part still can slightly be out of shape, but because marmem distortion at high temperature; Thereby can suppress at least in part and/or offset substrate (for example pcb board) and plastic packaging material distortion at high temperature, thereby help high temperature reflux technology and follow-up technology.
In addition, marmem is embedded the heat dispersion that also helps to improve packaging part in the substrate (for example can be pcb board).
In sum; The packaging part that is embedded into the marmem in the substrate of containing according to the present invention has the heat dispersion that has improved; And; Because marmem can produce distortion in the high temperature reflux process of packaging technology; It is opposite with the deformation direction of plastic packaging material to control said distortion and substrate (for example pcb board), thereby suppresses at least in part and/or offset substrate (for example pcb board) and plastic packaging material distortion at high temperature, solves because the problem that substrate and plastic packaging material distortion at high temperature cause encapsulating structure to lose efficacy.
Though illustrated and described the example of exemplary embodiment of the present invention; But what those skilled in the art should understand that is; Exemplary embodiment of the present invention is not limited thereto; Do not breaking away under the situation of the spirit and scope of the present invention that limit like claim, can carry out various modifications exemplary embodiment of the present invention.
Claims (6)
1. the packaging part of a memorial alloy core texture, the packaging part of said memorial alloy core texture comprises:
Substrate;
Chip is arranged on the substrate;
Plastic packaging material is sealed the chip that is arranged on the substrate;
Marmem is embedded in the substrate.
2. the packaging part of memorial alloy core texture as claimed in claim 1 is characterized in that, the deformation temperature of said marmem is 200 ℃ to 260 ℃.
3. the packaging part of memorial alloy core texture as claimed in claim 1 is characterized in that, said marmem comprises copper-Ni-Ti alloy, iron-Ni-Ti alloy or Ni-Ti-silicon alloy.
4. the packaging part of memorial alloy core texture as claimed in claim 1 is characterized in that, said marmem has distortion at 200 ℃ to 260 ℃, and after returning to normal temperature, returns to original shape.
5. the packaging part of memorial alloy core texture as claimed in claim 1 is characterized in that, said substrate is a printed circuit board (PCB).
6. the packaging part of memorial alloy core texture as claimed in claim 1 is characterized in that, in the reflux technique of packaging part, said marmem is controlled as has the deformation direction in the opposite direction with substrate deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110281884A CN102332436A (en) | 2011-09-16 | 2011-09-16 | Package of shape memory alloy core structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110281884A CN102332436A (en) | 2011-09-16 | 2011-09-16 | Package of shape memory alloy core structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102332436A true CN102332436A (en) | 2012-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110281884A Pending CN102332436A (en) | 2011-09-16 | 2011-09-16 | Package of shape memory alloy core structure |
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| CN (1) | CN102332436A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103310826A (en) * | 2012-03-16 | 2013-09-18 | 联想(北京)有限公司 | Hard disk bracket |
| EP2983200A1 (en) * | 2014-08-07 | 2016-02-10 | Hamilton Sundstrand Corporation | System and method for metal matrix mounting scheme |
| CN105552036A (en) * | 2015-12-16 | 2016-05-04 | 鸿秦（北京）科技有限公司 | Shape memory alloy based chip destroying device and method |
| CN107809882A (en) * | 2017-09-21 | 2018-03-16 | 维沃移动通信有限公司 | A kind of method and mobile terminal for repairing pcb board deformation |
| CN112518232A (en) * | 2019-09-19 | 2021-03-19 | 中国航发商用航空发动机有限责任公司 | Compressor blade for engine and machining method thereof |
| CN112867809A (en) * | 2018-10-18 | 2021-05-28 | 应用材料公司 | Holding device for holding a substrate, carrier for holding a substrate and method for releasing a substrate from a holding device |
| CN114512823A (en) * | 2022-01-12 | 2022-05-17 | 中国电子科技集团公司第十研究所 | Self-adaptive packaging process method for large-scale array elements of phased-array antenna |
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| CN101142673A (en) * | 2005-03-18 | 2008-03-12 | 富士通株式会社 | Semiconductor device and its making method |
| CN101500391A (en) * | 2008-01-29 | 2009-08-05 | 瑞鼎科技股份有限公司 | Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103310826A (en) * | 2012-03-16 | 2013-09-18 | 联想(北京)有限公司 | Hard disk bracket |
| EP2983200A1 (en) * | 2014-08-07 | 2016-02-10 | Hamilton Sundstrand Corporation | System and method for metal matrix mounting scheme |
| US9431330B2 (en) | 2014-08-07 | 2016-08-30 | Hamilton Sundstrand Corporation | System and method for metal matrix mounting scheme |
| CN105552036A (en) * | 2015-12-16 | 2016-05-04 | 鸿秦（北京）科技有限公司 | Shape memory alloy based chip destroying device and method |
| CN105552036B (en) * | 2015-12-16 | 2018-02-06 | 鸿秦（北京）科技有限公司 | A kind of chip apparatus for destroying and method based on marmem |
| CN107809882A (en) * | 2017-09-21 | 2018-03-16 | 维沃移动通信有限公司 | A kind of method and mobile terminal for repairing pcb board deformation |
| CN107809882B (en) * | 2017-09-21 | 2019-10-15 | 维沃移动通信有限公司 | A kind of method and mobile terminal for repairing pcb board deformation |
| CN112867809A (en) * | 2018-10-18 | 2021-05-28 | 应用材料公司 | Holding device for holding a substrate, carrier for holding a substrate and method for releasing a substrate from a holding device |
| CN112518232A (en) * | 2019-09-19 | 2021-03-19 | 中国航发商用航空发动机有限责任公司 | Compressor blade for engine and machining method thereof |
| CN112518232B (en) * | 2019-09-19 | 2022-02-01 | 中国航发商用航空发动机有限责任公司 | Compressor blade for engine and machining method thereof |
| CN114512823A (en) * | 2022-01-12 | 2022-05-17 | 中国电子科技集团公司第十研究所 | Self-adaptive packaging process method for large-scale array elements of phased-array antenna |
| CN114512823B (en) * | 2022-01-12 | 2023-09-01 | 中国电子科技集团公司第十研究所 | Phased array antenna array surface array element self-adaptive packaging process method |
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Application publication date: 20120125 |