WO2020078559A1

WO2020078559A1 - Holding device for holding a substrate, carrier for holding a substrate, and method for releasing a substrate from a holding device

Info

Publication number: WO2020078559A1
Application number: PCT/EP2018/078627
Authority: WO
Inventors: Simon Lau; Reiner Hinterschuster
Original assignee: Applied Materials, Inc.
Priority date: 2018-10-18
Filing date: 2018-10-18
Publication date: 2020-04-23
Also published as: CN112867809A; KR20210075176A

Abstract

A holding device (100) for holding a substrate (101) is described. The holding device (100) includes a main body (110); an adhesive arrangement (120) provided on a surface (111) of the main body (110); and a shape memory element (130) being in contact with the main body (110). Additionally, a carrier including one or more holding devices for holding a substrate is described. Further, a method for releasing a substrate from a holding device is described.

Description

HOLDING DEVICE FOR HOLDING A SUBSTRATE, CARRIER FOR HOLDING A SUBSTRATE, AND METHOD FOR RELEASING A

SUBSTRATE FROM A HOLDING DEVICE

TECHNICAL FIELD [0001] Embodiments of the present disclosure relate to holding devices for holding a substrate, carriers for holding a substrate, and methods for releasing a substrate from a holding device. In particular, embodiments of the present disclosure relate to holding devices and carriers for substantially vertically holding a substrate during substrate processing in a vacuum processing chamber, e.g. during layer deposition on the substrate.

BACKGROUND

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, chemical vapor deposition (CVD) and physical vapor deposition (PVD) such as sputtering deposition. A sputter deposition process can be used to deposit a material layer on the substrate, such as a layer of an insulating material. During the sputter deposition process, a target having a target material to be deposited on the substrate is bombarded with ions generated in a plasma region to dislodge atoms of the target material from a surface of the target. The dislodged atoms can form the material layer on the substrate. In a reactive sputter deposition process, the dislodged atoms can react with a gas in the plasma region, for example, nitrogen or oxygen, to form an oxide, a nitride or an oxinitride of the target material on the substrate.

[0003] Coated materials can be used in several applications and in several technical fields. For instance, coated materials may be used in the field of microelectronics, such as for generating semiconductor devices. Also, substrates for displays can be coated using a PVD process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFTs), color filters or the like.

[0004] The tendency toward larger and also thinner substrates can result in bulging of the substrates due to stress applied to the substrate, e.g., during a deposition process. In particular, conventional support systems which hold a substrate during a deposition process introduce bulging on the substrate, e.g., due to forces that push the substrate edge towards the center of the substrate. Bulging can, in turn, cause problems due to the increasing likelihood of breakage. Further, releasing a thin large area substrate from support systems, e.g. from substrate carriers, without bulging or damaging the substrate is challenging.

[0005] In light of the foregoing, there is a need to provide improved holding devices and carriers for holding a substrate as well as to provide improved methods for releasing substrates from holding devices and carriers that overcome at least some of the problems in the art.

SUMMARY

[0006] In light of the above, a holding device for holding a substrate, a carrier for holding a substrate, and a method for releasing a substrate from a holding device according to the independent claims are provided. Further aspects, advantages, and features are apparent from the dependent claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, a holding device for holding a substrate is provided. The holding device includes a main body. Additionally, the holding device includes an adhesive arrangement provided on a surface of the main body. Further, the holding device includes a shape memory element being in contact with the main body.

[0008] According to a further aspect of the present disclosure, a holding device for holding a substrate is provided. The holding device includes a main body of flexible material. Additionally, the holding device includes an adhesive arrangement provided on a surface of the main body. Further, the holding device includes a contraction device arranged and configured to contract the main body to bend the surface. [0009] According to another aspect of the present disclosure, a carrier for holding a substrate is provided. The carrier includes a carrier body and one or more holding devices according to any embodiments described herein. The one or more holding devices are mounted to the carrier body.

[0010] According to a further aspect of the present disclosure, a method for releasing a substrate from a holding device is provided. The method includes bending a surface of a main body of the holding device. The surface of the main body includes an adhesive arrangement for holding the substrate. Bending is conducted by contracting the main body in a direction substantially parallel to the surface. [0011] According to a further aspect of the present disclosure, a method of manufacturing an electronic device is provided. The method includes using a holding device according any embodiments described herein.

[0012] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing the described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1A shows a schematic cross-sectional side view of a holding device according to embodiments described herein;

FIG. 1B shows a schematic cross-sectional side view of the holding device of

FIG. 1A in a bent state;

FIG. 2 shows a schematic top view of a holding device according to further embodiments described herein; FIG. 3A shows a schematic cross-sectional side view of the holding device of

FIG. 2,

FIG. 3B shows a schematic cross-sectional side view of the holding device of

FIG. 3A in a bent state;

FIG. 4A shows a schematic cross-sectional side view of a holding device attached to a substrate according to embodiments described herein;

FIG. 4B shows a schematic cross-sectional side view of the holding device of

FIG. 4A in a state in which the substrate is detached from the holding device;

FIG. 4C shows a flowchart for illustrating a method for releasing a substrate from a holding device according to embodiments described herein.

FIG. 5 shows a schematic top view of a section of a carrier for holding a substrate according to embodiments described herein;

FIG. 6 shows a schematic cross-sectional view along the line A-A of the section of the carrier shown in FIG. 5; FIGS. 7A and 7B show schematic front views of embodiments of a carrier according to embodiments described herein; and

FIG. 7C shows a schematic sectional view along the line B-B of the carrier shown in FIG. 7B. DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations. [0015] With exemplary reference to FIGS. 1A and 1B, a holding device 100 for holding a substrate 101 according to the present disclosure is described. FIG. 1A shows a holding device 100 in an attachment state, i.e. in a state in which a substrate can be attached to the holding device. As exemplarily shown in FIG. 1A, in the attachment state the holding device has a substantially planar configuration, i.e. the holding device is unbent.

[0016] FIG. 1B shows the holding device 100 in a detachment state, i.e. in a state in which a substrate can be detached from the holding device. As exemplarily shown in FIG. 1B, in the detachment state the holding device has a bent configuration, i.e. the holding device is bent. [0017] According to embodiments which can be combined with other embodiments described herein, the holding device 100 includes a main body 110, particularly of flexible material. Accordingly, the main body 110 can be bent as exemplarily shown in FIG. 1B. [0018] Additionally, the holding device 100 includes an adhesive arrangement 120 provided on a surface 111 of the main body 110. In particular, the adhesive arrangement 120 may be directly attached to the surface 111 of the main body 110. Typically, in the attachment state, the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is a substantially planar surface, as exemplarily shown in FIG. 1A. In the detachment state, i.e. when the holding device is bent, as exemplarily shown in FIG. 1B, the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is a curved surface, particularly an arch-shaped surface. In particular, in the detachment state of the holding device, the surface 111 of the main body 110 is a convex curved surface, particularly a convex arch- shaped surface.

[0019] As exemplarily shown in FIGS. 1A and 1B, typically the surface 111 of the main body 110 on which the adhesive arrangement 120 is provided is parallel to the bottom surface 112 of the main body 110. Accordingly, in the attachment state, the bottom surface 112 of the main body 110 is a substantially planar surface, as exemplarily shown in FIG. 1A. In the detachment state, i.e. when the holding device is bent, as exemplarily shown in FIG. 1B, the bottom surface 112 of the main body 110 is a curved surface, particularly an arch-shaped surface. In particular, in the detachment state of the holding device, the bottom surface 112 of the main body 110 is a concave curved surface, particularly a concave arch-shaped surface.

[0020] Further, as exemplarily shown in FIGS. 1A and 1B, the holding device 100 includes a shape memory element 130 being in contact with the main body 110. For instance, the shape memory element 130 can be provided inside the main body 110 as exemplarily shown in FIGS. 1A and 1B. In particular, the shape memory element 130 can be embedded in the main body 110. Although not explicitly shown, it is to be understood that alternatively the shape memory element 130 may be attached to a bottom surface 112 of the main body.

[0021] In particular, typically the shape memory element 130 is configured such that the shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For instance, a change from the first temperature to the second temperature, the second temperature being higher than the first temperature, can be induced by applying a voltage to the shape memory element. Typically, the shape memory element is made of a shape memory alloy.

[0022] As exemplarily shown in FIG. 1A, the first configuration of the shape memory element 130 may include a first length Ll and the second configuration of the shape memory element 130, as exemplarily shown in FIG. 1B, may include a second length L2 being shorter than the first length Ll. From FIGS. 1A and 1B, it is to be understood that the second configuration of the shape memory element 130 typically is a contracted configuration compared to the first configuration of the shape memory element 130. Accordingly, as exemplarily shown in FIG. 1B, upon contraction of the shape memory element 130, opposite ends 113 of the main body 110 may be pulled inwardly, such that the main body bends. Consequently, the adhesive arrangement 120 provided on the surface 111 of the main body 110 bends such that a detachment state of the holding device can be provided.

[0023] Accordingly, compared to the state of the art, an improved holding device for holding a substrate is provided. In particular, compared to conventional holding devices, embodiments of the holding device as described herein are beneficially configured such that a bending of an adhesive arrangement of the holding device can be achieved, such that a substrate can be detached or released from the holding device in a simpler and more efficient manner. In particular, as exemplarily described with reference to FIGS. 4A and 4B, embodiments of the holding device of the present disclosure are configured such that for releasing the substrate from the holding device, a relative movement of the adhesive arrangement with respect to the surface of the substrate can be provided. More specifically, the holding device as described herein is configured such that shear forces at the interface between the adhesive arrangement and the substrate attached thereto can be induced. In particular, the shear forces at the interface between the adhesive arrangement and the substrate can be induced by employing the shape memory element as described herein for bending the surface of the main body on which the adhesive arrangement is provided. Accordingly, beneficially a smooth detachment of the substrate from the holding device can be provided, such that the risk of substrate breakage is reduced or even eliminated.

[0024] Before various further embodiments of the present disclosure are described in more detail, some aspects with respect to some terms used herein are explained.

[0025] In the present disclosure, a“holding device for holding a substrate” can be understood as a device configured for holding a substrate as described herein. In particular, the device can be configured for holding a large area substrate in a vertical state. More particularly, a holding device as described herein can be understood as a part or component of a carrier which is configured such that a substrate can be attached to the holding device.

[0026] In the present disclosure, the term “substrate” as used herein shall particularly encompass inflexible substrates, e.g., glass plates and metal plates. However, the present disclosure is not limited thereto, and the term“substrate” can also encompass flexible substrates such as a web or a foil. According to some embodiments, the substrate can be made of any material suitable for material deposition. For instance, the substrate can be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, mica or any other material or combination of materials which can be coated by a deposition process. For example, the substrate can have a thickness of 0.1 mm to 1.8 mm, such as 0.7 mm, 0.5 mm or 0.3 mm. In some implementations, the thickness of the substrate may be 50 pm or more and/or 700 pm or less. Handling of thin substrates with a thickness of only a few microns, e.g. 8 pm or more and 50 pm or less, may be challenging.

[0027] According to some embodiments, the substrate can be a“large area substrate” and may be used for display manufacturing. For instance, the substrate may be a glass or plastic substrate. For example, substrates as described herein shall embrace substrates which are typically used for an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), and the like. For instance, a“large area substrate” can have a main surface with an area of 0.5 m² or larger, particularly of 1 m² or larger. In some embodiments, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m² of substrate (0.73x0.92m), GEN 5, which corresponds to about 1.4 m² of substrate (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m² of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² of substrate (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0028] In the present disclosure, a“main body” of the holding device can be understood as a base structure, particularly a solid base structure, of the holding device. According to a non-limiting example, the main body can have a disk-like shape as exemplarily shown in FIG. 2. Alternatively, the main body may be a rectangular cuboid or a square cuboid. In particular, typically the main body of the holding device is made of a flexible or bendable material. For instance, the main body of the holding device may include or consist of a high temperature polymer. For instance, the high temperature polymer may have a temperature resistance of at least l50°C, particularly of at least 200°C, more particularly of at least 250°C. Accordingly, the holding device can be configured to be resistant to a continuous service temperature of at least l50°C, particularly of at least 200°C, more particularly of at least 250°C. For instance, the high temperature polymer employed for the main body can have a temperature resistance of up to 300°C. For example, the main body of the holding device may be made of at least one material selected from the group consisting of polyimide (PI), polyaryletherketone (PAEK), polyphenylensulfide (PPS), polyarylsulfone (PAS) and fluoropolymers (PTFE). According to another example, the main body of the holding device can be made of silicone, also referred to as polysiloxane.

[0029] In the present disclosure, an“adhesive arrangement” can be understood as an arrangement being configured for providing an adhesive force to attach a substrate as described herein. In particular, typically the adhesive arrangement is provided on a planar surface when the holding device is in an attachment state. More specifically, the adhesive arrangement as described herein may include a dry adhesive material. For instance, the dry adhesive material can be configured for providing adhesive force by van der Waals forces.

[0030] In the present disclosure, a“shape memory element” can be understood as an element configured to exhibit shape memory properties. In particular, the shape memory element may include or consist of a shape memory alloy (SMA). The shape memory alloy may also be referred to as smart metal, memory metal, memory alloy, muscle wire, or smart alloy. Accordingly, a shape memory element as described herein can be understood as an element that can have a first predefined configuration at a first temperature and a second predefined configuration at a second temperature being higher than the first temperature. For instance, a change from the first temperature to the second temperature can be induced by applying a voltage to the shape memory element.

[0031] With exemplary reference to FIG. 2, according to embodiments which can be combined with other embodiments described herein, the shape memory element 130 encompasses an inner portion 115 of the main body 110. The boundary of the inner portion 115 of the main body 110 is exemplarily indicated by the dotted line shown in FIG. 2. Accordingly, the shape memory element 130 can be an elongated element encompassing the inner portion 115 of the main body 110, as exemplarily shown in FIG. 2. In particular, the shape memory element 130 may have a loop configuration encompassing the inner portion 115 of the main body 110.

[0032] In other words, the shape memory element 130, e.g. being an elongated element, may be arranged in an outer edge portion 116 of the main body 110. The outer edge portion 116 can be understood as a portion extending from the edge 117 of the main body to the interior of the main body. In particular, the outer edge portion 116 may extend from the edge 117 of the main body 110 to the interior of the main body by 50% or less of the lateral dimension of the main body, particularly by 30% or less of the lateral dimension of the main body, more particularly by 15% or less of the lateral dimension of the main body. [0033] According to embodiments which can be combined with other embodiments described herein, the shape memory element 130 may include one or more wires. For instance, the one or more wires can be twisted. Typically, the one or more wires are made of a shape memory alloy.

[0034] As exemplarily shown in FIGS. 2, 3 A and 3B, the shape memory element 130 typically includes an electrical connection 131. In particular, the electrical connection 131 is configured for being connected to a voltage supply 132.

[0035] With exemplary reference to FIGS. 3A and 3B, according to embodiments which can be combined with other embodiments described herein, the holding device further includes a plate element 140 being in contact with the main body 110. In particular, as shown in FIG. 3A showing a non-bent state of the holding device, the plate element 140 is arranged substantially parallel to the surface 111 of the main body 110. For instance, the plate element 140 can be embedded in the main body 110. The plate element may be beneficial for switching between the attachment state and the detachment state of the holding device. For instance, the plate element can be made of metal, particularly spring steel. Alternatively, the plate element can be made of plastic. In particular, as exemplarily shown in FIG. 3B, when the shape memory element 130 is in the second configuration, i.e. the contracted configuration, the plate element is compressed and bent. Accordingly, the plate element has the advantage that a homogeneity of the bending of the main body can be improved, resulting in an improved and smoother detachment of the substrate from the holding device.

[0036] According to embodiments which can be combined with other embodiments described herein, the shape memory element 130 may be provided around the plate element 140, as exemplarily shown in FIGS. 2, 3A and 3B. In particular, as exemplarily shown in FIG. 3 A, in the attachment state of the holding device, the shape memory element 130 and the plate element 140 may have at least one common plane. Accordingly, by providing the shape memory element 130 around the plate element 140, the homogeneity of the compressing and bending of the plate element by the shape memory element 130 can be improved. [0037] With exemplary reference to FIGS. 2, 3A and 3B, according to embodiments which can be combined with other embodiments described herein, the adhesive arrangement 120 includes a plurality of filaments 121 (for illustration purposes only some filaments are marked by the reference sign). For instance, the filaments can be or include nanotubes, for instance carbon nanotubes. Additionally or alternatively, the plurality of filaments 121 can be made of or include a polymeric material, particularly a synthetic polymeric material. Each of the plurality filaments can be a substantially longitudinal member. Specifically, each of the plurality filaments can have one dimension that is larger than the remaining two dimensions. In particular, the longest dimension of the filaments can be the length of the filament. That is, the filaments can be elongated along a length direction.

[0038] According to embodiments which can be combined with other embodiments described herein, the adhesive arrangement, particularly the plurality of filaments, may be made of a high temperature polymer. For instance, the adhesive arrangement can be made of a high temperature polymer having a temperature resistance of at least l50°C, particularly of at least 200°C, more particularly of at least 250°C. Accordingly, the adhesive arrangement can be configured to be resistant to a continuous service temperature of at least l50°C, particularly of at least 200°C, more particularly of at least 250°C. For instance, the high temperature polymer employed for the adhesive arrangement, particularly the plurality of filaments, can have a temperature resistance of up to 300°C. For example, the adhesive arrangement, particularly the plurality of filaments, may be made of at least one material selected from the group consisting of polyimide (PI), polyaryletherketone (PAEK), polyphenylensulfide (PPS), polyarylsulfone (PAS) and fluoropolymers (PTFE). According to another example, the adhesive arrangement can be made of silicone, also referred to as polysiloxane.

[0039] As exemplarily shown in FIGS. 3A and 3B, each filament of the plurality of filaments 121 can be attached to the surface 111 of the main body 110. In particular, each filament of the plurality of filaments 121 can extend away from the surface 111 of the main body 110, for instance perpendicular to the surface 111 of the main body 110. Accordingly, each filament of the plurality of filaments 121 can have a second end that is free, for instance for an attachment of a substrate as described herein. In particular, the second end of each filament of the plurality of filaments 121 can be configured to be attachable to the substrate 101. Specifically, the second end of each filament can be configured to adhere to the substrate 101 by van der Waals forces.

[0040] According to embodiments which can be combined with other embodiments described herein, the adhesive arrangement 120 includes a dry adhesive material to attach the substrate 101. For instance, the dry adhesive material can be a synthetic setae material. The dry adhesive material, for example the synthetic setae material, can be inorganic. In particular, the dry adhesive material can be substantially 100% inorganic. As an example, the dry adhesive material may have a micro structure including nanotubes. For instance, the micro structure of the dry adhesive material can include carbon nanotubes.

[0041] In particular, the dry adhesive material can be a Gecko adhesive. For example, the gecko adhesive may be a gecko tape or a gecko element. The adhesive capabilities of the dry adhesive material, specifically of the synthetic setae material, can be related to the adhesive properties of a gecko foot. The natural adhesive capability of the gecko foot allows the animal to adhere to many types of surfaces under most conditions. The adhesive capability of the gecko foot is provided by numerous hair- type extensions, called setae, on the feet of the gecko. It is noted here that the term“synthetic setae material” can be understood as a synthetic material which emulates the natural adhesive capability of the gecko foot and which includes similar adhesive capabilities to the gecko foot. Moreover, the term “synthetic setae material” can be synonymously used with the term“synthetic gecko setae material” or with the term“gecko tape material”. However, the present disclosure is not limited thereto, and other dry adhesive materials suitable for holding the substrate can be used.

[0042] In the context of the present disclosure, a“gecko adhesive” can be understood as an adhesive that mimics the ability of geckos’ feet to adhere to surfaces, such as for example vertical surfaces. In particular, the dry adhesive material of the adhesive arrangement 120 as described herein can be configured to adhere to the substrate 101 due to van der Waals forces between the dry adhesive material and a surface of the substrate 101. However, the present disclosure is not limited thereto, and other adhesives suitable for holding the substrate can be used.

[0043] According to embodiments, which can be combined with any other embodiments described herein, the adhesive force provided by the dry adhesive material can be sufficient for holding a substrate as described herein. In particular, the dry adhesive material can be configured to provide an adhesive force of about 2 N/cm or more, particularly 3 N/cm or more, more particularly 4 N/cm or more, for instance at least 5 N/cm .

[0044] Accordingly, it is to be understood that, compared to the state of the art, an improved holding device 100 for holding a substrate 101 is provided. The holding device 100 includes a main body 110, particularly of flexible material, and an adhesive arrangement 120, e.g. including a dry adhesive, provided on a surface 111 of the main body 110. Further, holding device 100 includes a contraction device arranged and configured to contract the main body 110 to bend the surface 111 with the adhesive arrangement 120. In particular, the contraction device typically includes a shape memory element 130. The shape memory element 130 is configured such that the shape memory element 130 has a first configuration at a first temperature and a second configuration at a second temperature. For instance, a change from the first temperature to the second temperature, the second temperature being higher than the first temperature, can be induced by applying a voltage to the shape memory element. Typically, the shape memory element is made of a shape memory alloy. Accordingly, the contraction device may include a shape memory element configured to contract upon voltage application.

[0045] In the present disclosure, a“contraction device” can be understood as a device configured to perform a contraction. In particular, the contraction of the contraction device may be initiated by a temperature change of the contraction device from a first temperature Tl to a second temperature T2 (T2>Tl) being higher than the first temperature. Typically, the contraction includes a reduction of a first length Ll to a second length L2 of the contraction device, particularly the shape memory element 130, e.g. as described with reference to FIGS. 1A and 1B. In particular, as can be seen by a comparison of FIG. 1A with a FIG. 1B, the contraction device (e.g. the shape memory element 130), is typically configured to contract substantially parallel to the surface 111 of the main body 110, the surface 111 of the main body 110 being in the attachment state (i.e. non-bent).

[0046] With exemplary reference to the flowchart shown in FIG. 4C, embodiments of a method 300 for releasing a substrate from a holding device according to the present disclosure are described. According to embodiments which can be combined with other embodiments described herein, the method 300 includes bending (represented by block 310 in FIG. 4C) a surface 111 of a main body 110 of the holding device 100. The surface 111 of the main body 110 includes an adhesive arrangement 120 for holding the substrate. As exemplarily represented by block 320 in FIG. 4C, bending is conducted by contracting the main body 110 in a direction substantially parallel to the surface 111 on which the adhesive arrangement 120 is provided.

[0047] In particular, as exemplarily shown in FIG. 1B, contracting the main body 110 typically includes pulling opposite ends 113 of the main body 110 inwardly, such that the main body bends. Consequently, the adhesive arrangement 120 provided on the surface 111 of the main body 110 bends such that a detachment state of the holding device can be provided. Accordingly, shear forces at the interface between the adhesive arrangement and the substrate attached thereto can be induced. Accordingly, beneficially a smooth detachment of the substrate from the holding device can be provided such that the risk of substrate breakage is reduced or even eliminated.

[0048] According to embodiments which can be combined with other embodiments described herein, bending the surface 111 of the main body 110 of the holding device 100 includes providing a convex curved surface, particularly a convex arch-shaped surface, as exemplarily shown in FIG. 4B. [0049] According to embodiments which can be combined with other embodiments described herein, contracting the main body 110 may include providing an electrical current to a shape memory element 130 being in contact with the main body 110. In particular, the shape memory element 130 can have any configuration as described herein.

[0050] Accordingly, from FIGS. 4A and 4B showing cross-sectional side views of a holding device in an attachment state and in an detachment state respectively, it is to be understood that bending the surface 111 of the main body 110 induces shear forces at an interface between the adhesive arrangement 120 and the substrate 101, which has the advantage that a smooth detachment of the substrate from the holding device can be provided such that the risk of substrate breakage is reduced or even eliminated.

[0051] It is to be understood that the method 300 for releasing a substrate from a holding device as described herein typically includes employing embodiments of the holding device of the present disclosure.

[0052] With exemplary reference to FIGS. 5, 6, and 7A to 7C, a carrier 200 for holding a substrate according to the present disclosure is described. According to embodiments which can be combined with other embodiments described herein, the carrier includes a carrier body 210 and one or more holding devices 100 according to any embodiments described herein. The one or more holding devices 100 are mounted to the carrier body 210, e.g. via one or more support structures 220.

[0053] For instance, each of the one or more holding devices 100 can be connected to respective support structures 220. The support structures 220 can be connected to the carrier body 210. Accordingly, the carrier 200 having one or more holding devices 100 as described herein, is configured for holding a substrate, particularly a substrate as described herein. Typically, the one or more holding devices 100 are configured to provide a holding force for holding the substrate. For instance, the holding force can be substantially parallel to a surface of the substrate, in particular when the substrate is in a substantially vertical orientation. In particular, the holding force can be provided by the adhesive arrangement 120 of the holding device 100 as described herein.

[0054] In the present disclosure, a“carrier for holding a substrate” can be understood as a carrier which is configured for holding a substrate as described herein, particularly a large area substrate as described herein. Typically, the substrate held or supported by a carrier as described herein includes a front surface and a back surface, wherein the front surface is a surface of the substrate being processed, for example on which a material layer is to be deposited. Typically, the carrier is configured such that an edge portion of the back surface of the substrate can be attached to a holding device, particularly to an adhesive arrangement of the holding device as described herein.

[0055] In the present disclosure, a“carrier body” is to be understood as a body of the carrier which is configured for holding the substrate. For instance, the carrier body can be a frame or a plate which is configured for holding a substrate as described herein. Accordingly, the carrier body as described herein can be configured to support a surface of the substrate, such as an edge portion of the back surface of the substrate.

[0056] According to embodiments, which can be combined with any other embodiments described herein, the carrier 200 is configured to support the substrate during substrate processing, for example, during a layer deposition process, such as a sputtering process. With exemplary reference to FIGS. 7A to 7C, the carrier body 210 may be configured as a frame. Alternatively, the carrier body 210 may be configured as a plate. The carrier body 210 can include and/or be made of aluminum, aluminum alloys, titanium, alloys thereof, stainless steel or the like. According to some embodiments, which can be combined with other embodiments described herein, the carrier body 210 can include two or more elements such as a top bar, sidebars and a bottom bar. The two or more elements can define an aperture opening 215, as exemplarily shown in FIG. 7C. In some implementations, a masking device can be provided at the carrier to mask one or more portions of the substrate. As an example, the masking device can be an edge exclusion mask. [0057] As exemplarily shown in FIG. 7C, typically the substrate 101 can have a first surface 101 A and a second surface 101B. The first surface and the second surface can be opposite surfaces of the substrate 101. In particular, the first surface can be a backside surface of the substrate 101. As an example, the first surface 101A can be arranged to face towards the one or more holding devices 100 of the carrier 200.

[0058] Accordingly, as exemplarily shown in FIG. 7C, according to some embodiments which can be combined with other embodiments described herein, the adhesive arrangement 120 of the one or more holding devices 100 of the carrier 200 can be configured to contact the first surface 101 A of the substrate 101. Further, as exemplarily shown in FIG. 7C, the second surface 101B can be a front surface of the substrate 101. In particular, the second surface can be a surface of the substrate to be processed in a processing system, particularly in a vacuum processing chamber. As an example, the second surface of the substrate can be configured for layer deposition thereon.

[0059] With exemplarily reference to FIGS. 7A to 7C, according to embodiments which can be combined with other embodiments described herein, the carrier 200 can be configured for holding or supporting the substrate 101 in a substantially vertical orientation, e.g., during a layer deposition process. As an example, the one or more holding devices 100 can be configured to hold the substrate 101 in the substantially vertical orientation. As used throughout the present disclosure, “substantially vertical” can be understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ±20° or below, e.g. of ±10° or below. This deviation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position. Yet, the substrate orientation, e.g., during the layer deposition process, can be considered substantially vertical, which can be considered different from the horizontal substrate orientation. [0060] As exemplarily shown in FIGS. 7A and 7B, the substrate 101 can have an upper side 11, a lower side 12 and two lateral sides 13 (e.g., a left side and a right side). The upper side 11, the lower side 12 and the two lateral sides 13 can be defined with respect to a vertical orientation of the substrate 101. Likewise, the carrier 200 or carrier body 210 can have an upper side, a lower side and two lateral sides (e.g., a left side and a right side).

[0061] In some implementations, the one or more holding devices 100 can be mounted to the carrier body 210 to hold at least one of the upper side 11, the lower side 12, and at least one of the two lateral sides 13 of the substrate 101. For instance, as exemplarily shown in FIG. 7A, one or more holding devices 100 (e.g., two holding arrangements) can be provided to hold the upper side 11. According to another implementation, one or more holding devices 100 (e.g., two holding devices) can be provided to hold the lower side 12 of the substrate and/or two or more holding devices 100 can be provided to hold each side of the two lateral sides 13 (e.g., two holding arrangements for the left side and two holding arrangements for the right side), as exemplarily shown in FIG. 7B.

[0062] According to some embodiments described herein, the one or more holding devices 100 can be mounted on the carrier body 210 to hold the substrate 101 in a suspended state. Specifically, the one or more holding devices 100 can be configured to hold the upper side 11 of the substrate 101. For instance, in some implementations as exemplarily shown in FIG. 7 A, the substrate 101 is only held at the upper side 11. Accordingly, the carrier 200 may include one or more holding devices 100 (e.g., two holding devices) only at the upper side of the carrier body 210 to hold the upper side 11 of the substrate 101.

[0063] With exemplary reference to FIG. 7C, according to some embodiments which can be combined with other embodiments described herein, the holding device 100 can be configured to contact the substrate 101 only on one surface of the substrate 101, particularly the back side of the substrate, i.e. the surface of the substrate 101 that is not processed. Further, the support structure 220 can be provided between each of the one or more holding devices 100 and the carrier body 210. As exemplarily shown in FIG. 7C, the aperture opening 215 can correspond to or be larger, specifically slightly larger, than a surface area of the substrate 101 to be processed. Accordingly, embodiments of the carrier as described herein are configured such that the whole front side of the substrate can be processed. Specifically, some embodiments described herein can be practiced without devices providing edge exclusion. According to other embodiments (not explicitly shown), the aperture opening 215 can be slightly smaller than a surface area of the substrate to be processed. Accordingly, the aperture opening 215 can be configured such that an unprocessed edge of the substrate, particularly an uncoated edge of the substrate, can be provided.

[0064] It is to be understood that a carrier according to embodiments described herein can be employed for stationary processes as well as for non- stationary processes.

[0065] Accordingly, in view of the above, it is to be understood that the embodiments of the holding device, the embodiments of the carrier and the embodiments of the methods for releasing a substrate from the holding device as described herein are improved compared to the state of the art. In particular, with the embodiments of the present disclosure, beneficially a smooth detachment of the substrate from the holding device can be provided such that the risk of substrate breakage is reduced or even substantially eliminated.

[0066] This written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any apparatus or system and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims. [0067] While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.

Claims

1. A holding device (100) for holding a substrate (101), comprising:

- a main body (110);

- an adhesive arrangement (120) provided on a surface (111) of the main body (110); and

- an shape memory element (130) being in contact with the main body (110).

2. The holding device (100) of claim 1, wherein the shape memory element (130) encompasses an inner portion of the main body (110).

3. The holding device (100) of claim 1 or 2, wherein the shape memory element (130) comprises one or more wires of a shape memory alloy.

4. The holding device (100) of any of claims 1 to 3, further comprising a plate

element (140) being in contact with the main body (110), the plate element (140) being arranged substantially parallel to the surface (111) of the main body (110).

5. The holding device (100) of claim 4, wherein the shape memory element (130) is provided around the plate element (140).

6. The holding device (100) of any of claims 1 to 5, wherein the adhesive arrangement (120) includes a plurality of filaments (121).

7. The holding device (100) of any of claims 1 to 6, wherein the adhesive arrangement (120) comprises a dry adhesive material to attach the substrate (101).

8. The holding device (100) of claim 7, wherein the dry adhesive material is a synthetic setae material, particularly a Gecko adhesive.

9. The holding device (100) of any of claims 1 to 8, the shape memory element (130) having an electrical connection (131) for being connected to a voltage supply.

10. A holding device (100) for holding a substrate (101), comprising:

- a main body (110) of flexible material;

- a contraction device arranged and configured to contract the main body (110) to bend the surface (111).

11. The holding device of claim 10, wherein the contraction device comprises a shape memory element (130) configured to contract upon voltage application.

12. A carrier (200) for holding a substrate (101), comprising:

- a carrier body (210); and

- one or more holding devices (100) according to any of claims 1 to 11, wherein the one or more holding devices (100) are mounted to the carrier body (210).

13. A method (300) for releasing a substrate (101) from a holding device (100), the method comprising bending a surface (111) of a main body (110) of the holding device, the surface (111) comprising an adhesive arrangement (120) for holding the substrate, wherein bending is conducted by contracting the main body (110) in a direction substantially parallel to the surface (111).

14. The method (300) of claim 13, wherein contracting the main body (110) comprises providing an electrical current to a shape memory element (130) being in contact with the main body (110).

15. The method (300) according to claim 13 or 14, wherein bending the surface (111) of the main body (110) induces shear forces at an interface between the adhesive arrangement (120) and the substrate (101).

16. A method of manufacturing an electronic device using a holding device (100) according to any of claims 1 to 11.