CN110675750B - Carrier substrate, flexible display panel and manufacturing method of flexible display panel - Google Patents
Carrier substrate, flexible display panel and manufacturing method of flexible display panel Download PDFInfo
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- CN110675750B CN110675750B CN201910904344.8A CN201910904344A CN110675750B CN 110675750 B CN110675750 B CN 110675750B CN 201910904344 A CN201910904344 A CN 201910904344A CN 110675750 B CN110675750 B CN 110675750B
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application relates to a carrier substrate, a flexible display panel and a manufacturing method of the flexible display panel, comprising a base body, a flexible substrate and a flexible display panel, wherein the base body is provided with an upper surface facing the flexible substrate; the release structure is formed on at least partial area of the upper surface of the substrate; the release structure comprises a convex part with a stripping surface and an occlusion part formed on the convex part, and the occlusion part and the stripping surface are mutually independently arranged and are used for occluding with the flexible substrate; the flexible substrate is provided with a peeling surface, wherein the peeling surface has a certain gradient, and the peeling force required for peeling the flexible substrate along the ascending direction of the peeling surface is smaller than the peeling force required for peeling the flexible substrate along any other direction of the peeling surface. When the flexible display panel is manufactured, under the occlusion action of the occlusion part and the flexible substrate, the flexible substrate is not easy to be dislocated with the carrier substrate, so that the subsequent process can be conveniently carried out; when the flexible substrate needs to be peeled off from the carrier substrate, the flexible substrate is peeled off along the ascending direction of the peeling surface, and the flexible display panel is not easily damaged.
Description
Technical Field
The invention relates to the technical field of touch display, in particular to a carrier substrate, a flexible display panel and a manufacturing method of the flexible display panel.
Background
With the rapid development of electronic devices, people's requirements for electronic devices are no longer limited to flat display, and it is expected that electronic devices have curved and more stereoscopic display effects, so flexible display technologies are in force.
In the flexible display technology, the flexible substrate included in the flexible display panel has high stretchability, and therefore, it is difficult to directly fabricate a display device on the flexible substrate. Therefore, it is first necessary to fabricate the flexible substrate on the rigid carrier substrate to have high stability during the fabrication process, and then fabricate the display device on the fixed flexible substrate.
In this way, after the flexible display panel is manufactured, the flexible substrate needs to be peeled off from the carrier substrate. In order to reduce the production cost and improve the production efficiency, a mechanical peeling method is often used to peel the flexible substrate from the carrier substrate. However, when the adhesion between the flexible substrate and the release film is not moderate, the flexible display panel is easily abnormal during the manufacturing and/or mechanical peeling process.
Disclosure of Invention
In view of the above, it is necessary to provide a carrier substrate, a flexible display panel and a method for manufacturing a flexible display panel, which can solve the above problem, in order to solve the problem that the conventional flexible display panel is prone to abnormality during the manufacturing and/or mechanical peeling process.
According to an aspect of the present application, there is provided a carrier substrate for supporting a flexible substrate, comprising:
a base having an upper surface facing the flexible substrate; and
the release structure is formed on at least partial area of the upper surface of the substrate; the release structure comprises a convex part with a stripping surface and an occlusion part formed on the convex part, and the occlusion part and the stripping surface are mutually independently arranged and are used for occluding with the flexible substrate;
the peeling surface has a certain gradient, and the peeling force required for peeling the flexible substrate along the upward slope direction of the peeling surface is smaller than the peeling force required for peeling the flexible substrate along any other direction of the peeling surface.
In one embodiment, a peeling direction for peeling the flexible substrate along an ascending direction of the peeling surface is defined, and an opening is arranged on one side of the occlusion part along the peeling direction.
In one embodiment, the occlusion part and the base body define an occlusion position for occluding with the flexible substrate; and/or
The occlusion part is provided with an occlusion position for occluding with the flexible substrate.
In one embodiment, a peeling direction in which the flexible substrate is peeled off is defined in an uphill direction of the peeling surface, and the bite position is located in the peeling direction relative to the peeling surface; or
The bite is located on at least one side of the peeling surface in a direction intersecting the peeling direction.
In one embodiment, a peeling direction in which the flexible substrate is peeled off is defined in an uphill direction of the peeling surface;
the occlusion part protrudes out of the convex part along the peeling direction, an occlusion position used for being occluded with the flexible substrate is defined between the occlusion part and the base body, and an opening is formed in one side, facing the peeling direction, of the occlusion position.
In one embodiment, the release structure is a fish scale structure, an engagement position for engaging with the flexible substrate is defined between an open end of the fish scale structure and the base body, and an opening direction of the open end in the fish scale structure is a peeling direction of the flexible substrate.
In one embodiment, the release structure comprises a plurality of release structures, and the ascending directions of the stripping surfaces in the plurality of release structures are the same.
In one embodiment, the slope height of the stripping surface is smaller than the thickness of the flexible substrate, and the slope height of the stripping surface is larger than the preset slope height of the stripping surface when the occlusion part and the flexible substrate have preset occlusion force;
preferably, the slope height of the stripping surface is 0.1um-5 um;
preferably, the stripping surface is arranged at an obtuse angle with the surface of the base body facing the stripping surface;
preferably, the angle between the release surface and the surface of the base facing the release surface is between 100 ° and 170 °.
According to another aspect of the present application, a flexible display panel is provided, which includes a flexible substrate and a display device disposed on the flexible substrate, wherein a structure of a surface of the flexible substrate facing away from the display device is complementary to a structure of a surface of the carrier substrate having the release structure.
According to still another aspect of the present application, there is provided a method of manufacturing a flexible display panel, including the steps of:
forming a flexible substrate on one side of the carrier substrate with a release structure;
manufacturing a display device on the flexible substrate;
and peeling the flexible substrate and the display device from the carrier substrate along the peeling direction.
According to the carrier substrate, the flexible display panel and the manufacturing method of the flexible display panel, when the flexible display panel is manufactured, the flexible substrate is not easy to be dislocated with the carrier substrate under the occlusion effect of the occlusion part and the flexible substrate, so that the subsequent process can be conveniently carried out; when the flexible substrate needs to be peeled from the carrier substrate, the peeling force required for peeling the flexible substrate along the upward slope direction of the peeling surface is smaller than the peeling force required for peeling the flexible substrate along any other direction of the peeling surface, so that the flexible substrate can be peeled along the upward slope direction of the peeling surface, and the flexible display panel is not easily damaged.
Drawings
Fig. 1 is a schematic plan view of a carrier substrate according to an embodiment of the present application;
FIG. 2 is an enlarged view of the carrier substrate shown in FIG. 1 at A;
fig. 3 is a schematic cross-sectional view (cross-sectional view of a plane a-a) of a release structure of the carrier substrate shown in fig. 2 along a first direction;
FIG. 4 is a schematic view of a portion of the structure of the flexible substrate formed on the carrier substrate shown in FIG. 2;
fig. 5 is a schematic cross-sectional view (cross-sectional view on plane B-B) of the release structure of the carrier substrate shown in fig. 2 along a second direction;
FIG. 6 is a schematic plan view of a carrier substrate according to another embodiment of the present application;
FIG. 7 is an enlarged view of the carrier substrate shown in FIG. 6 at B;
fig. 8 is a schematic cross-sectional view (cross-sectional view of plane C-C) of the release structure of the carrier substrate shown in fig. 7 along a first direction;
fig. 9 is a schematic cross-sectional view (cross-sectional view of D-D plane) of the release structure of the carrier substrate shown in fig. 7 along a second direction;
fig. 10 is a schematic plan view of a carrier substrate according to yet another embodiment of the present application;
FIG. 11 is an enlarged view of the carrier substrate shown in FIG. 10 at C;
fig. 12 is a schematic cross-sectional view (cross-sectional view of plane E-E) of the release structure of the carrier substrate shown in fig. 11 along a first direction;
fig. 13 is a schematic cross-sectional view (cross-sectional view of F-F plane) of the release structure of the carrier substrate shown in fig. 11 along a second direction;
fig. 14 is a schematic cross-sectional view of a release structure of a carrier substrate according to yet another embodiment of the present application along a second direction;
FIG. 15 is a schematic plan view of a carrier substrate according to yet another embodiment of the present application;
fig. 16 is a schematic cross-sectional view (cross-sectional view of G-G plane) of the release structure of the carrier substrate shown in fig. 15 along a first direction;
fig. 17 is a schematic cross-sectional view (cross-sectional view of H-H plane) of the release structure of the carrier substrate shown in fig. 15 along a second direction;
fig. 18 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present application.
The carrier substrate 100 has a base 10, a release structure 20, a protrusion 21, a release surface 211, a snap-in portion 22, a snap-in portion 221, an opening 222, and an angle a of the flexible substrate 200
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Further, in the specification, the phrase "plan view" refers to a drawing when the target portion is viewed from above, and the phrase "sectional view" refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.
Furthermore, the drawings are not 1: 1, and the relative dimensions of the various elements in the figures are drawn for illustration only and not necessarily to true scale.
As described in the background art, since the flexible substrate included in the flexible display panel has high stretchability, it is difficult to directly fabricate the display device on the flexible substrate, and therefore, in the fabrication process of the flexible display panel, the flexible substrate needs to be fabricated on a rigid carrier substrate first, so that the flexible substrate has high stability in the fabrication process. The release film is arranged between the flexible substrate and the carrier substrate, and on one hand, the release film enables the flexible substrate and the carrier substrate to be bonded, and on the other hand, the release film provides supporting force for the flexible substrate on the carrier substrate.
However, after the flexible display panel is manufactured, the flexible substrate needs to be peeled off from the carrier substrate. The flexible substrate is typically peeled from the carrier substrate by laser or mechanical peeling. The laser stripping is to irradiate the flexible substrate from one side of the flexible substrate and then separate the flexible substrate from the carrier substrate, so that the production efficiency and the cost are high, and the laser stripping also easily causes display abnormalities such as black spots and the like of the manufactured flexible display panel, thereby affecting the display effect of the flexible display panel.
In order to reduce the production cost, improve the production efficiency and ensure the display effect of the flexible display panel, a mechanical peeling method is often used to peel the flexible substrate from the carrier substrate.
The mechanical stripping step is generally: and lifting the flexible substrate from the edge by adopting a mechanical stripping device or manually, and then lifting the whole flexible substrate to realize stripping. However, if the release film with high adhesive force is used, the adhesive force of the release film is too high, which may cause damage to the flexible substrate during mechanical peeling, and if the release film with low adhesive force is used, the flexible substrate may be easily dislocated from the carrier substrate due to insufficient adhesive force of the release film during manufacturing of the flexible display panel, thereby preventing subsequent processes from being performed.
In order to solve the above problems, the present application provides a carrier substrate, a flexible display panel, and a method for manufacturing a flexible display panel, which can preferably solve the above problems.
Fig. 1 shows a schematic plan view of a carrier substrate 100 in an embodiment of the present application; fig. 2 shows an enlarged view of the carrier substrate 100 of fig. 1 at a; fig. 3 shows a schematic cross-sectional view (cross-sectional view of a plane a-a) of the release structure 20 of the carrier substrate 100 in fig. 2 along a first direction; fig. 4 shows a schematic partial structure of a flexible substrate 200 formed on the carrier substrate 100 shown in fig. 2; fig. 5 shows a schematic cross-sectional view (cross-sectional view of plane B-B) of the release structure 20 of the carrier substrate 100 in fig. 2 along a second direction.
Before explaining the embodiment provided in fig. 1 in detail, some contents are explained first to facilitate a clearer understanding of the technical solution of the present application.
The following embodiments describe "first direction" and "second direction" with reference to the carrier substrate 100 shown in fig. 1, that is, the first direction refers to a direction pointing from the lower left corner to the upper right corner in fig. 1, and the second direction refers to a direction pointing from the upper left corner to the lower right corner in fig. 1.
Referring to fig. 1, the present application provides a carrier substrate 100 for supporting a flexible substrate 200 (see fig. 4), including a base 10 and a release structure 20, wherein the base 10 has an upper surface facing the flexible substrate 200, and the release structure 20 is formed on at least a partial region of the upper surface of the base 10. As an embodiment, the release structure 20 is formed on the entire upper surface of the base 10 to increase the friction force between the flexible substrate 200 and the carrier substrate 100, but the release structure 20 may be formed on a partial region of the base 10 in other embodiments, which is not limited herein.
As an embodiment, the release structure 20 is formed on the substrate 10 by performing a concavo-convex treatment on the substrate 10 through a chemical method (solution roughening) or a physical method (nano-imprinting). In this embodiment, the release structure 20 is provided as a part of the base 10.
It is understood that, in other embodiments, the release structure 20 is not a part of the substrate 10, but is disposed independently of the substrate 10, such as coating a release film on the upper surface of the substrate 10, and performing a roughening process on the release film to form the release structure 20, which is not limited herein.
However, it is worth mentioning that in any of the above embodiments, the substrate 10 is made of a material with a relatively high hardness, such as glass or metal.
Referring to fig. 3 and 5, the releasing structure 20 includes a protrusion 21 having a peeling surface 211 and an engaging portion 22 formed on the protrusion 21, the engaging portion 22 and the peeling surface 211 are independently disposed, and the flexible substrate 200 is engaged with the engaging portion 22. In this way, when the flexible display panel is manufactured, the flexible substrate 200 is not easily dislocated from the carrier substrate 100 due to the engagement between the engaging portion 22 and the flexible substrate 200, which facilitates the subsequent processes.
Specifically, the peeling surface 211 has a slope, and a peeling force required to peel the flexible substrate 200 in an uphill direction of the peeling surface 211 is smaller than a peeling force required to peel the flexible substrate 200 in any other direction of the peeling surface 211. In this way, when the flexible substrate 200 needs to be peeled off from the carrier substrate 100, the flexible substrate 200 may be peeled off in the ascending direction of the peeling surface 211, and the flexible substrate 200 is not easily damaged; the flexible substrate 200 is limited to a certain extent in other directions along the peeling surface 211, so that the flexible substrate 200 and the carrier substrate 10 are not easily dislocated or the flexible substrate 200 is not easily detached from the carrier substrate 10.
Referring to fig. 1, in some embodiments, the releasing structure 20 includes a plurality of releasing structures, and the ascending directions of the peeling surfaces 211 of the plurality of releasing structures 20 are the same. Thus, when the flexible substrate 200 needs to be peeled off from the carrier substrate 100, the flexible substrate 200 is peeled off along the ascending direction of all the peeling surfaces 211 in the plurality of releasing structures 20, and the peeling force required is the minimum. And because the direction of the ascending slope is the same as the peeling direction, the unnecessary damage of the release structure 20 to the flexible substrate 200 in the peeling process can be avoided. Specifically, the number of the release structures 20 is two or more, and is not limited herein. It is contemplated that in other embodiments, there may be one release structure 20, and the number is not limited herein.
Specifically, all the release structures 20 are formed on the substrate in rows along the first direction and/or in columns along the second direction, so as to ensure that the ascending directions of the peeling surfaces 211 of the plurality of release structures 20 are the same.
Referring to fig. 3, defining the direction of the peeling direction along the ascending slope of the peeling surface 211 as the peeling direction for peeling the flexible substrate 200 (the peeling direction passes through the plane a-a in fig. 2), since the peeling surface 211 has only one ascending slope direction in the present embodiment, accordingly, the peeling force required for peeling the flexible substrate 200 has only one peeling direction at this time is the smallest. It is understood that in other embodiments, there may be two ascending directions on the peeling surface 211 of each release structure 20, and accordingly, there are two peeling directions to peel off the flexible substrate 200 with the minimum peeling force, which is not limited herein.
Referring to fig. 3, in one embodiment, the peeling surface 211 is a slope, specifically, a linear slope or a circular arc slope, so as to ensure that when the flexible substrate 200 is peeled along the ascending direction of the peeling surface 211, since there is no design of pattern engagement between the linear slope or the circular arc slope and the flexible substrate 200, the peeling is facilitated. It is understood that in other embodiments, the peeling surface 211 may also be a right-angle slope or a stepped slope, which is not limited herein.
The inventors have studied and found that if the height of the release surface 211 (see fig. 3, which is the difference in height between the upper surface of the base 10 and the apex of the release surface 211) is small, the biting force between the engaging portion 22 and the flexible substrate 200 is insufficient, and the carrier substrate 100 cannot be sufficiently engaged with the flexible substrate 200 when manufacturing a flexible display panel; if the slope of the peeling surface 211 is large, the thickness of the release structure 20 is larger than that of the flexible substrate 200 to be molded, and thus a qualified flexible display panel cannot be manufactured.
Specifically, the slope height of the peeling surface 211 is set to be smaller than the thickness of the flexible substrate 200 to be manufactured, so as to manufacture a qualified flexible display panel; the slope height of the peeling surface 211 is smaller than the preset height of the peeling surface 211 when the preset biting force is provided between the engaging portion 22 and the flexible substrate 200, so that the biting force between the engaging portion 22 and the flexible substrate 200 is larger than the preset biting force, and the carrier substrate 100 and the flexible substrate 200 are ensured to be fully engaged.
Preferably, the slope height of the peeling surface 211 is 0.1um to 5um, so as to ensure that the engaging portion 22 is sufficiently engaged with the flexible substrate 200 and to facilitate the manufacture of a qualified flexible display panel.
Of course, in other embodiments, the slope height of the peeling surface 211 may be other parameters, and is not limited herein.
Further, the peeling surface 211 is disposed at an obtuse angle with respect to the surface of the base 10 facing the peeling surface 211, so as to peel the flexible substrate 200 in an ascending direction of the peeling surface 211. Specifically, the angle a between the release surface 211 and the surface of the base 10 facing the release surface 211 is 100 ° to 170 °.
Referring to fig. 3, in one embodiment, a peeling direction for peeling off the flexible substrate 200 is defined as an ascending direction along each peeling surface 211, and an opening 222 is provided on a side of the engaging portion 22 facing the peeling direction. Since the opening 222 is provided on the side of the engaging portion 22 facing the peeling direction, the flexible substrate 200 is easily pulled out of the engaging portion 22 when the flexible substrate 200 is peeled from the peeling direction, which facilitates the peeling of the flexible substrate 200.
Referring to fig. 3 and 5, in one embodiment, the engaging portion 22 and the base 10 define an engaging position 221 therebetween for engaging with the flexible substrate 200. It is understood that in some other embodiments, the engaging portion 22 is provided with an engaging position 221 for engaging with the flexible substrate 200 (i.e. the engaging position 221 is not formed between the engaging portion 22 and the base body 10, but the engaging portion 22 itself forms the engaging position 221), and in other embodiments, a part of the engaging position 221 is defined between the engaging portion 22 and the base body 10, and another part is formed by the engaging portion 22 itself, which is not limited herein.
Specifically, the ascending direction of the peeling surface 211 is defined as a peeling direction in which the flexible substrate 200 is peeled, the engagement position 221 is located in the peeling direction with respect to the peeling surface 211, and the opening 222 is an opening 222 of the engagement position 221 along the peeling direction. Thus, when the flexible display panel is manufactured, under the engagement action of the engagement portion 22 and the flexible substrate 200, the flexible substrate 200 is not easy to be dislocated from the carrier substrate 100, so that the subsequent processes can be conveniently performed; since the nip position 221 is located in the peeling direction with respect to the peeling surface 211, the flexible substrate 200 is easily peeled from the nip position 221 when peeling the flexible substrate 200 in the peeling direction.
Of course, in some other embodiments, the ascending direction of the peeling surface 211 is defined as the peeling direction for peeling the flexible substrate 200, and the engaging position 221 may also be located on at least one side of the peeling surface 211 in the direction intersecting with the peeling direction (including the engaging position 221 located on one side or two sides of the peeling surface 211 in the direction intersecting with the peeling direction), and is not limited herein.
Specifically, referring to fig. 3, the engaging portion 22 protrudes from the protrusion 21 along the peeling direction, and defines an engaging position 221 for engaging with the flexible substrate 200 with the base 10, and one side of the engaging position 221 along the peeling direction is provided with an opening 222. That is, the convex portion 21 of each release structure 20 has a connecting surface attached to the surface of the substrate 10, and the projection of at least part of the engaging portion 22 of each release structure 20 toward the upper surface of the substrate 10 is staggered with the connecting surface. Thus, the engagement portion 22 and the base 10 define the engagement position 221 therebetween, and the engagement position 221 is engaged with the flexible substrate 200.
More specifically, all projections of the engaging portions 22 of each releasing structure 20 toward the upper surface of the substrate 10 are staggered with respect to the connecting surface, but in other embodiments, projections of some engaging portions 22 toward the upper surface of the substrate 10 may also be staggered with respect to the connecting surface, and this is not limited herein.
In an embodiment, from the end of the protruding portion 21 of the release structure 20 having the connection surface to the end of the protruding portion 21 of the release structure 20 far away from the connection surface, the width of the cross section of the engaging portion 22 parallel to the connection surface (the width in the first direction as indicated in fig. 1) is gradually increased, and at this time, it can be ensured that all projections of the engaging portion 22 of each release structure 20 toward the upper surface of the substrate 10 are disposed in a staggered manner with respect to the connection surface, and the processing is convenient. Of course, in some other embodiments, from the end of the protrusion 21 of the release structure 20 having the connection surface to the end of the protrusion 21 of the release structure 20 away from the connection surface, the width of the cross section of the engaging portion 22 parallel to the connection surface is not gradually increased, but is increased first and then decreased, so as to form the engaging portion 22 having a plurality of teeth, so as to improve the engaging strength between the flexible substrate 200 and the carrier substrate 100; or in the form of a width greater at the end remote from the substrate 10 than at the end near the substrate 10.
Referring to fig. 3 and 5, in an embodiment, the releasing structure 20 is a fish scale structure, the engaging portion 221 is disposed at an opening end of the fish scale structure, an opening direction of the opening end of the fish scale structure is a peeling direction of the flexible substrate 200, and when the flexible substrate 200 is peeled along the peeling direction, the flexible substrate 200 is more easily pulled out from the engaging portion 221. It is understood that in other embodiments, the shape of the release structure 20 is not limited.
Fig. 6 shows a schematic plan view of a carrier substrate 100 in another embodiment of the present application; fig. 7 shows an enlarged view of the carrier substrate 100 of fig. 6 at B; fig. 8 shows a schematic cross-sectional view (cross-sectional view of plane C-C) of the release structure 20 of the carrier substrate 100 of fig. 7 along a first direction; fig. 9 shows a schematic cross-sectional view (cross-sectional view of D-D plane) of the release structure 20 of the carrier substrate 100 of fig. 7 along a second direction.
The following embodiments describe "first direction" and "second direction" with reference to the carrier substrate 100 shown in fig. 6, that is, the first direction refers to a direction pointing from the lower left corner to the upper right corner in fig. 6, and the second direction refers to a direction pointing from the upper left corner to the lower right corner in fig. 6.
The carrier substrate 100 provided in the present embodiment is different from the carrier substrate 100 provided in the previous embodiment in that:
the ascending direction of the peeling surface 211 is defined as a peeling direction in which the flexible substrate 200 is peeled, and the bite 221 is located on at least one side of the peeling surface 211 in a direction intersecting the peeling direction. With such an arrangement, when the flexible display panel is manufactured, under the engagement action of the flexible substrate 200 and the engagement portion 22 which is positioned on at least one side of the peeling surface 211 in the direction intersecting with the peeling direction, the flexible substrate 200 is not easy to be dislocated with the carrier substrate 100, so that the subsequent processes can be facilitated; when the flexible substrate 200 needs to be peeled off from the carrier substrate 100, the flexible substrate 200 is peeled off in the ascending direction of the peeling surface 211, and the flexible substrate 200 is not easily damaged.
Specifically, the engagement portions 221 are located at both sides of the peeling surface 211 in a direction intersecting with the peeling direction, and when the flexible display panel is manufactured, since each release structure 20 has two engagement portions 22, an engagement force with the flexible substrate 200 may be increased. More specifically, the bite positions 221 are located on both sides of the peeling surface 211 in a direction perpendicular to the peeling direction.
As for other structures included in the carrier substrate 100 provided in the present embodiment, please refer to the above embodiments, and detailed descriptions thereof are omitted.
Fig. 10 shows a schematic plan view of a carrier substrate 100 in another embodiment of the present application; fig. 11 shows an enlarged view of the carrier substrate 100 of fig. 10 at C; fig. 12 shows a schematic cross-sectional view (cross-sectional view of plane E-E) of the release structure 20 of the carrier substrate 100 of fig. 11 along a first direction; fig. 13 shows a schematic cross-sectional view (cross-sectional view of F-F plane) of the release structure 20 of the carrier substrate 100 in fig. 11 along a second direction.
The following embodiments describe "first direction" and "second direction" with reference to the carrier substrate 100 shown in fig. 10, that is, the first direction refers to a direction pointing from the lower left corner to the upper right corner in fig. 10, and the second direction refers to a direction pointing from the upper left corner to the lower right corner in fig. 10.
The carrier substrate 100 provided in the present embodiment is different from the carrier substrate 100 provided in the previous embodiment in that:
from the end of the protrusion 21 of the release structure 20 having the connection surface to the end of the protrusion 21 of the release structure 20 far away from the connection surface, the width of the cross section of the engaging portion 22 parallel to the connection surface is not gradually increased, but is in a form that the width of the end far away from the base 10 is larger than the width of the end near the base 10.
As for other structures included in the carrier substrate 100 provided in the present embodiment, please refer to the above embodiments, and detailed descriptions thereof are omitted.
Fig. 14 is a schematic cross-sectional view of a release structure 20 of a carrier substrate 100 according to another embodiment of the present application along a first direction (see fig. 10 where the upper left corner refers to the lower right corner).
The carrier substrate 100 provided in the present embodiment is different from the carrier substrate 100 provided in the above-described embodiments in that:
part of the engaging position 221 is defined by the engaging portion 22 and the base body 10, and the other part of the engaging position 221 is defined by the engaging portion 22 itself. As for other structures included in the carrier substrate 100 provided in the present embodiment, please refer to the above embodiments, and detailed descriptions thereof are omitted.
Fig. 15 shows a schematic plan view of a carrier substrate 100 in an embodiment of the present application; fig. 16 shows a schematic cross-sectional view (cross-sectional view of G-G plane) of the release structure 20 of the carrier substrate 100 in fig. 15 along a first direction; fig. 17 shows a schematic cross-sectional view (cross-sectional view of H-H plane) of the release structure 20 of the carrier substrate 100 in fig. 15 along a second direction.
The "first direction" and the "second direction" described in the following embodiments are based on the carrier substrate 100 shown in fig. 15, that is, the first direction refers to the up-down direction shown in fig. 14, and the second direction refers to the left-right direction in fig. 15.
The carrier substrate 100 provided in the present embodiment differs from the carrier substrates 100 provided in the two previous embodiments in that: the peeling surface 211 has two ascending directions, and accordingly, the peeling force required for peeling the flexible substrate 200 in the two peeling directions (see arrows in fig. 16) is minimized so that the flexible substrate 200 can be peeled from the carrier substrate 100 from both ends in the up-down direction in fig. 1.
As for other structures included in the carrier substrate 100 provided in the present embodiment, please refer to the above embodiments, and detailed descriptions thereof are omitted.
The present application further provides a flexible display panel (not shown in the drawings), which includes a flexible substrate 200 and a display device stacked on the flexible substrate 200, wherein a structure of a surface of the flexible substrate 200 facing away from the display device is complementary to a structure of a surface of the carrier substrate 100 having the release structure 20. That is, the flexible substrate 200 of the flexible display panel has a concave-convex structure complementary to the release structure 20, and the concave-convex flexible substrate 200 facilitates the dispersion of stress, so that the overall stability of the flexible substrate 200 can be improved.
Fig. 18 is a flowchart illustrating a method for manufacturing a flexible display panel according to an embodiment of the present application.
The application also provides a manufacturing method of the flexible display panel, which comprises the following steps:
s110: forming a flexible substrate 200 on one side of the carrier substrate 100 having the release structure 20, wherein the carrier substrate 100 has the same structure as the carrier substrate 100 provided in the foregoing embodiment;
specifically, the flexible substrate 200 is formed on the carrier substrate 100 by a spin coating process or the like, and due to its fluidity, the lower surface of the flexible substrate 200 forms a complementary pattern with the upper surface of the carrier substrate 100 at this time.
S120: forming a display device on the flexible substrate 200;
s130: the flexible substrate 200 and the display device are peeled from the carrier substrate 100 in the peeling direction.
In the manufacturing method of the flexible display panel, when the flexible display panel is manufactured, under the engagement action of the engagement part 22 and the flexible substrate 200, the flexible substrate 200 is not easy to be dislocated with the carrier substrate 100, so that the subsequent process can be conveniently carried out; since the peeling force required to peel the flexible substrate 200 in the ascending direction of the peeling surface 211 is smaller than the peeling force required to peel the flexible substrate 200 in any other direction of the peeling surface 211, when it is necessary to peel the flexible substrate 200 from the carrier substrate 100, it is sufficient to peel the flexible substrate 200 in the ascending direction of the peeling surface 211, and damage to the flexible substrate 200 is not easily caused.
It should be noted that when an element such as a layer, film or substrate is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may also be present, unless otherwise specified, in describing the positional relationship. Further, when a layer is referred to as being "under" another layer, it can be directly under, or one or more intervening layers may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
Where the terms "comprising," "having," and "including" are used herein, another element may be added unless an explicit limitation is used, such as "only," "consisting of … …," etc. Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A carrier substrate for supporting a flexible substrate, comprising:
a base having an upper surface facing the flexible substrate; and
the release structure is formed on at least partial area of the upper surface of the substrate and is occluded with the flexible substrate; the release structure is provided with a release surface with a preset gradient, and the peeling force required for peeling the flexible substrate along the upward slope direction of the release surface is smaller than the peeling force required for peeling the flexible substrate along any other direction of the release surface;
the release structure comprises a convex part with the stripping surface and an occlusion part formed on the convex part, the occlusion part is occluded with the flexible substrate, and the direction of ascending along the stripping surface is defined as the stripping direction for stripping the flexible substrate;
the occlusion part and the base body define an occlusion position for occluding with the flexible substrate; and/or
The occlusion part is provided with an occlusion position for occluding with the flexible substrate.
2. The carrier substrate as set forth in claim 1 wherein a peeling direction in which the flexible substrate is peeled off is defined in an uphill direction of the peeling surface, the bite position being located in the peeling direction with respect to the peeling surface; or
The bite is located on at least one side of the peeling surface in a direction intersecting the peeling direction.
3. The carrier substrate as claimed in claim 1, wherein a peeling direction in which the flexible substrate is peeled is defined in an uphill direction of the peeling surface;
the occlusion part protrudes out of the convex part along the peeling direction, an occlusion position used for being occluded with the flexible substrate is defined between the occlusion part and the base body, and an opening is formed in one side, facing the peeling direction, of the occlusion position.
4. The carrier substrate according to claim 1, wherein the release structure is a fish scale structure, an engagement position for engaging with the flexible substrate is defined between an open end of the fish scale structure and the base body, and an opening direction of the open end in the fish scale structure is a peeling direction of the flexible substrate.
5. The carrier substrate as claimed in claim 1, wherein the releasing structure includes a plurality of releasing structures, and the ascending directions of the releasing surfaces of the plurality of releasing structures are the same.
6. The carrier substrate as claimed in claim 1, wherein the peeling surface has a slope height smaller than a thickness of the flexible substrate, and the slope height of the peeling surface is larger than a preset slope height of the peeling surface when a preset biting force is provided between the bite portion and the flexible substrate.
7. The carrier substrate of claim 6 wherein the release surface has a slope height of 0.1um to 5 um.
8. The carrier substrate as claimed in claim 1 or 6, characterized in that the release surface is arranged at an obtuse angle to the surface of the base body facing the release surface.
9. The carrier substrate as claimed in claim 8, wherein the angle a between the release surface and the surface of the base facing the release surface is 100 ° -170 °.
10. A flexible display panel, comprising a flexible substrate and a display device disposed on the flexible substrate, wherein a structure of a side of the flexible substrate facing away from the display device is complementary to a structure of a side of the carrier substrate having the release structure according to any one of claims 1 to 9.
11. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
forming a flexible substrate on a side of the carrier substrate having a release structure according to any one of claims 1 to 9;
manufacturing a display device on the flexible substrate;
and peeling the flexible substrate and the display device from the carrier substrate along the peeling direction.
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