KR20240037979A - 구상 실리카 분말 및 구상 실리카 분말의 제조 방법 - Google Patents

구상 실리카 분말 및 구상 실리카 분말의 제조 방법 Download PDF

Info

Publication number
KR20240037979A
KR20240037979A KR1020247002993A KR20247002993A KR20240037979A KR 20240037979 A KR20240037979 A KR 20240037979A KR 1020247002993 A KR1020247002993 A KR 1020247002993A KR 20247002993 A KR20247002993 A KR 20247002993A KR 20240037979 A KR20240037979 A KR 20240037979A
Authority
KR
South Korea
Prior art keywords
silica powder
spherical silica
mass
less
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247002993A
Other languages
English (en)
Korean (ko)
Inventor
히로미치 가모
하지메 가타야마
고타 후쿠모토
Original Assignee
에이지씨 가부시키가이샤
에이지씨 에스아이테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이지씨 가부시키가이샤, 에이지씨 에스아이테크 가부시키가이샤 filed Critical 에이지씨 가부시키가이샤
Publication of KR20240037979A publication Critical patent/KR20240037979A/ko
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28Compounds of silicon
    • C09C1/30Silicic acid
    • C09C1/3009Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
    • C09C1/3027Drying, calcination
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/80Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/14Pore volume
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/22Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/80Compositional purity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
KR1020247002993A 2021-07-28 2022-07-20 구상 실리카 분말 및 구상 실리카 분말의 제조 방법 Pending KR20240037979A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021123495 2021-07-28
JPJP-P-2021-123495 2021-07-28
JP2021194372 2021-11-30
JPJP-P-2021-194372 2021-11-30
PCT/JP2022/028277 WO2023008290A1 (ja) 2021-07-28 2022-07-20 球状シリカ粉末及び球状シリカ粉末の製造方法

Publications (1)

Publication Number Publication Date
KR20240037979A true KR20240037979A (ko) 2024-03-22

Family

ID=85086838

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002993A Pending KR20240037979A (ko) 2021-07-28 2022-07-20 구상 실리카 분말 및 구상 실리카 분말의 제조 방법

Country Status (5)

Country Link
US (1) US20240209210A1 (https=)
JP (1) JPWO2023008290A1 (https=)
KR (1) KR20240037979A (https=)
CN (1) CN117730054B (https=)
WO (1) WO2023008290A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118978164A (zh) * 2024-08-06 2024-11-19 深圳市纳氟科技有限公司 一种球形二氧化硅、聚四氟乙烯薄膜和高频覆铜板及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120731250A (zh) * 2023-02-22 2025-09-30 Agc株式会社 密封树脂组合物和电子部件装置
JPWO2024237111A1 (https=) * 2023-05-15 2024-11-21
WO2025182883A1 (ja) * 2024-02-28 2025-09-04 Agc株式会社 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493282U (https=) 1990-12-28 1992-08-13
JP2021075438A (ja) 2019-11-13 2021-05-20 日鉄ケミカル&マテリアル株式会社 中空シリカ粒子とその製造方法およびそれを用いた樹脂複合組成物並びに樹脂複合体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4428618B2 (ja) * 2003-07-01 2010-03-10 三菱レイヨン株式会社 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物
DE102008064284A1 (de) * 2008-12-20 2010-06-24 Evonik Degussa Gmbh Niedrigoberflächiges, pyrogen hergestelltes Siliciumdioxidpulver
JP5612264B2 (ja) * 2009-01-15 2014-10-22 株式会社アドマテックス 球状シリカ粉末製造用ケイ素含有合金及びその製造方法、並びに球状シリカ粉末
JP5646224B2 (ja) * 2010-06-24 2014-12-24 三井化学株式会社 多孔質無機酸化物およびその製法
JP6121845B2 (ja) * 2013-08-13 2017-04-26 デンカ株式会社 表面処理シリカ粉末、スラリー組成物及びそれを用いた樹脂組成物
CN105836795B (zh) * 2016-05-25 2017-11-21 深圳先进技术研究院 一种具有核壳结构二氧化硅无机颗粒的制备方法
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP7151140B2 (ja) * 2018-04-11 2022-10-12 Agc株式会社 フッ素樹脂シート、積層体及びそれらの製造方法
JP7529392B2 (ja) * 2019-10-29 2024-08-06 日鉄ケミカル&マテリアル株式会社 シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0493282U (https=) 1990-12-28 1992-08-13
JP2021075438A (ja) 2019-11-13 2021-05-20 日鉄ケミカル&マテリアル株式会社 中空シリカ粒子とその製造方法およびそれを用いた樹脂複合組成物並びに樹脂複合体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
이치노세 노보루,「무기 유전·절연 재료의 동향」, 전학론 A, 1993년, 113권 7호, pp. 495 ∼ 502

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118978164A (zh) * 2024-08-06 2024-11-19 深圳市纳氟科技有限公司 一种球形二氧化硅、聚四氟乙烯薄膜和高频覆铜板及其制备方法

Also Published As

Publication number Publication date
JPWO2023008290A1 (https=) 2023-02-02
TW202319345A (zh) 2023-05-16
WO2023008290A1 (ja) 2023-02-02
US20240209210A1 (en) 2024-06-27
CN117730054A (zh) 2024-03-19
CN117730054B (zh) 2026-04-14

Similar Documents

Publication Publication Date Title
US20240209210A1 (en) Spherical silica powder and method for producing spherical silica powder
KR20220144809A (ko) 중공 실리카 입자 및 그 제조 방법
WO2023100676A1 (ja) 中空シリカ粒子及びその製造方法
US20250100890A1 (en) Method for producing spherical silica powder
KR20250008053A (ko) 실리카 입자 분산액
JP2002100238A (ja) シート状成形体および積層体
CN118103329A (zh) 球状二氧化硅粒子及使用了该球状二氧化硅粒子的树脂组合物
US12305042B2 (en) Filler for electronic materials and method for producing same, slurry for electronic materials, and resin composition for electronic materials
CN118973962A (zh) 球状钛酸钙粉末及使用其的树脂组合物
US20260070795A1 (en) Spherical silica powder and method for producing spherical silica powder
KR20250008054A (ko) 실리카 입자 분산액
WO2025182883A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
TW202602787A (zh) 球狀氧化矽粒子粉體及球狀氧化矽粒子粉體之製造方法
JP2023181993A (ja) 球状シリカ粉末の製造方法
JP2023181991A (ja) 球状シリカ粉末の製造方法
WO2025182878A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
JP2023181992A (ja) 球状シリカ粉末の製造方法
CN118103328A (zh) 球状二氧化硅粒子及使用了该球状二氧化硅粒子的树脂组合物
TW202402962A (zh) 液狀組成物、預浸體、附樹脂之金屬基材、及配線板
KR20260025307A (ko) 표면 처리 구상 실리카 및 표면 처리 구상 실리카의 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20240125

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250513

Comment text: Request for Examination of Application