JPWO2023008290A1 - - Google Patents
Info
- Publication number
- JPWO2023008290A1 JPWO2023008290A1 JP2023538470A JP2023538470A JPWO2023008290A1 JP WO2023008290 A1 JPWO2023008290 A1 JP WO2023008290A1 JP 2023538470 A JP2023538470 A JP 2023538470A JP 2023538470 A JP2023538470 A JP 2023538470A JP WO2023008290 A1 JPWO2023008290 A1 JP WO2023008290A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3009—Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
- C09C1/3027—Drying, calcination
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/14—Pore volume
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021123495 | 2021-07-28 | ||
| JP2021194372 | 2021-11-30 | ||
| PCT/JP2022/028277 WO2023008290A1 (ja) | 2021-07-28 | 2022-07-20 | 球状シリカ粉末及び球状シリカ粉末の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008290A1 true JPWO2023008290A1 (https=) | 2023-02-02 |
| JPWO2023008290A5 JPWO2023008290A5 (https=) | 2024-04-22 |
Family
ID=85086838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538470A Pending JPWO2023008290A1 (https=) | 2021-07-28 | 2022-07-20 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240209210A1 (https=) |
| JP (1) | JPWO2023008290A1 (https=) |
| KR (1) | KR20240037979A (https=) |
| CN (1) | CN117730054B (https=) |
| WO (1) | WO2023008290A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120731250A (zh) * | 2023-02-22 | 2025-09-30 | Ａｇｃ株式会社 | 密封树脂组合物和电子部件装置 |
| JPWO2024237111A1 (https=) * | 2023-05-15 | 2024-11-21 | ||
| WO2025182883A1 (ja) * | 2024-02-28 | 2025-09-04 | Ａｇｃ株式会社 | 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法 |
| CN118978164B (zh) * | 2024-08-06 | 2025-09-23 | 深圳市纳氟科技有限公司 | 一种球形二氧化硅、聚四氟乙烯薄膜和高频覆铜板及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493282U (https=) | 1990-12-28 | 1992-08-13 | ||
| JP4428618B2 (ja) * | 2003-07-01 | 2010-03-10 | 三菱レイヨン株式会社 | 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物 |
| DE102008064284A1 (de) * | 2008-12-20 | 2010-06-24 | Evonik Degussa Gmbh | Niedrigoberflächiges, pyrogen hergestelltes Siliciumdioxidpulver |
| JP5612264B2 (ja) * | 2009-01-15 | 2014-10-22 | 株式会社アドマテックス | 球状シリカ粉末製造用ケイ素含有合金及びその製造方法、並びに球状シリカ粉末 |
| JP5646224B2 (ja) * | 2010-06-24 | 2014-12-24 | 三井化学株式会社 | 多孔質無機酸化物およびその製法 |
| JP6121845B2 (ja) * | 2013-08-13 | 2017-04-26 | デンカ株式会社 | 表面処理シリカ粉末、スラリー組成物及びそれを用いた樹脂組成物 |
| CN105836795B (zh) * | 2016-05-25 | 2017-11-21 | 深圳先进技术研究院 | 一种具有核壳结构二氧化硅无机颗粒的制备方法 |
| JP7076263B2 (ja) * | 2018-03-30 | 2022-05-27 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| JP7151140B2 (ja) * | 2018-04-11 | 2022-10-12 | Ａｇｃ株式会社 | フッ素樹脂シート、積層体及びそれらの製造方法 |
| JP7529392B2 (ja) * | 2019-10-29 | 2024-08-06 | 日鉄ケミカル＆マテリアル株式会社 | シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板 |
| JP7433022B2 (ja) | 2019-11-13 | 2024-02-19 | 日鉄ケミカル＆マテリアル株式会社 | 中空シリカ粒子とその製造方法およびそれを用いた樹脂複合組成物並びに樹脂複合体 |
-
2022
- 2022-07-20 KR KR1020247002993A patent/KR20240037979A/ko active Pending
- 2022-07-20 WO PCT/JP2022/028277 patent/WO2023008290A1/ja not_active Ceased
- 2022-07-20 CN CN202280052479.6A patent/CN117730054B/zh active Active
- 2022-07-20 JP JP2023538470A patent/JPWO2023008290A1/ja active Pending
-
2024
- 2024-01-24 US US18/420,860 patent/US20240209210A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202319345A (zh) | 2023-05-16 |
| WO2023008290A1 (ja) | 2023-02-02 |
| US20240209210A1 (en) | 2024-06-27 |
| KR20240037979A (ko) | 2024-03-22 |
| CN117730054A (zh) | 2024-03-19 |
| CN117730054B (zh) | 2026-04-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240109 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250304 |