CN117730054B - 球状二氧化硅粉末及球状二氧化硅粉末的制造方法 - Google Patents

球状二氧化硅粉末及球状二氧化硅粉末的制造方法

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Publication number
CN117730054B
CN117730054B CN202280052479.6A CN202280052479A CN117730054B CN 117730054 B CN117730054 B CN 117730054B CN 202280052479 A CN202280052479 A CN 202280052479A CN 117730054 B CN117730054 B CN 117730054B
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China
Prior art keywords
spherical silica
silica powder
mass
less
resin
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Chinese (zh)
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CN117730054A (zh
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加茂博道
片山肇
福本浩大
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Agc Silicon Technology Co ltd
AGC Inc
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Agc Silicon Technology Co ltd
Asahi Glass Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3009—Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
    • C09C1/3027—Drying, calcination
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/82—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by IR- or Raman-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/14—Pore volume
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
CN202280052479.6A 2021-07-28 2022-07-20 球状二氧化硅粉末及球状二氧化硅粉末的制造方法 Active CN117730054B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021-123495 2021-07-28
JP2021123495 2021-07-28
JP2021194372 2021-11-30
JP2021-194372 2021-11-30
PCT/JP2022/028277 WO2023008290A1 (ja) 2021-07-28 2022-07-20 球状シリカ粉末及び球状シリカ粉末の製造方法

Publications (2)

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CN117730054A CN117730054A (zh) 2024-03-19
CN117730054B true CN117730054B (zh) 2026-04-14

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US (1) US20240209210A1 (https=)
JP (1) JPWO2023008290A1 (https=)
KR (1) KR20240037979A (https=)
CN (1) CN117730054B (https=)
WO (1) WO2023008290A1 (https=)

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Publication number Priority date Publication date Assignee Title
CN120731250A (zh) * 2023-02-22 2025-09-30 Ａｇｃ株式会社 密封树脂组合物和电子部件装置
JPWO2024237111A1 (https=) * 2023-05-15 2024-11-21
WO2025182883A1 (ja) * 2024-02-28 2025-09-04 Ａｇｃ株式会社 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
CN118978164B (zh) * 2024-08-06 2025-09-23 深圳市纳氟科技有限公司 一种球形二氧化硅、聚四氟乙烯薄膜和高频覆铜板及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022915A (ja) * 2003-07-01 2005-01-27 Mitsubishi Rayon Co Ltd 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物
JP2010163317A (ja) * 2009-01-15 2010-07-29 Admatechs Co Ltd 球状シリカ粉末製造用ケイ素含有合金及びその製造方法、並びに球状シリカ粉末

Family Cites Families (9)

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JPH0493282U (https=) 1990-12-28 1992-08-13
DE102008064284A1 (de) * 2008-12-20 2010-06-24 Evonik Degussa Gmbh Niedrigoberflächiges, pyrogen hergestelltes Siliciumdioxidpulver
JP5646224B2 (ja) * 2010-06-24 2014-12-24 三井化学株式会社 多孔質無機酸化物およびその製法
JP6121845B2 (ja) * 2013-08-13 2017-04-26 デンカ株式会社 表面処理シリカ粉末、スラリー組成物及びそれを用いた樹脂組成物
CN105836795B (zh) * 2016-05-25 2017-11-21 深圳先进技术研究院 一种具有核壳结构二氧化硅无机颗粒的制备方法
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP7151140B2 (ja) * 2018-04-11 2022-10-12 Ａｇｃ株式会社 フッ素樹脂シート、積層体及びそれらの製造方法
JP7529392B2 (ja) * 2019-10-29 2024-08-06 日鉄ケミカル＆マテリアル株式会社 シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板
JP7433022B2 (ja) 2019-11-13 2024-02-19 日鉄ケミカル＆マテリアル株式会社 中空シリカ粒子とその製造方法およびそれを用いた樹脂複合組成物並びに樹脂複合体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005022915A (ja) * 2003-07-01 2005-01-27 Mitsubishi Rayon Co Ltd 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物
JP2010163317A (ja) * 2009-01-15 2010-07-29 Admatechs Co Ltd 球状シリカ粉末製造用ケイ素含有合金及びその製造方法、並びに球状シリカ粉末

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JPWO2023008290A1 (https=) 2023-02-02
TW202319345A (zh) 2023-05-16
WO2023008290A1 (ja) 2023-02-02
US20240209210A1 (en) 2024-06-27
KR20240037979A (ko) 2024-03-22
CN117730054A (zh) 2024-03-19

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