KR20240036145A - 가스 엔클로저 시스템 - Google Patents
가스 엔클로저 시스템 Download PDFInfo
- Publication number
- KR20240036145A KR20240036145A KR1020247007913A KR20247007913A KR20240036145A KR 20240036145 A KR20240036145 A KR 20240036145A KR 1020247007913 A KR1020247007913 A KR 1020247007913A KR 20247007913 A KR20247007913 A KR 20247007913A KR 20240036145 A KR20240036145 A KR 20240036145A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- gas enclosure
- enclosure assembly
- various embodiments
- assembly
- Prior art date
Links
- 239000007789 gas Substances 0.000 claims abstract description 674
- 239000011261 inert gas Substances 0.000 claims abstract description 133
- 238000007639 printing Methods 0.000 claims abstract description 103
- 238000000034 method Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims description 125
- 239000000463 material Substances 0.000 claims description 103
- 238000007667 floating Methods 0.000 claims description 20
- 238000007641 inkjet printing Methods 0.000 claims description 20
- 230000000712 assembly Effects 0.000 abstract description 61
- 238000000429 assembly Methods 0.000 abstract description 61
- 230000008569 process Effects 0.000 abstract description 47
- 238000012423 maintenance Methods 0.000 abstract description 24
- 238000012545 processing Methods 0.000 abstract description 12
- 125000006850 spacer group Chemical group 0.000 description 70
- 238000000746 purification Methods 0.000 description 59
- 239000012530 fluid Substances 0.000 description 56
- 238000009432 framing Methods 0.000 description 48
- 238000004891 communication Methods 0.000 description 41
- 238000001914 filtration Methods 0.000 description 36
- 238000007789 sealing Methods 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 21
- 229910052760 oxygen Inorganic materials 0.000 description 21
- 239000001301 oxygen Substances 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000002245 particle Substances 0.000 description 19
- 238000005516 engineering process Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 239000002808 molecular sieve Substances 0.000 description 16
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 16
- 239000000976 ink Substances 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 238000010276 construction Methods 0.000 description 14
- 238000005188 flotation Methods 0.000 description 14
- 239000003960 organic solvent Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 230000006835 compression Effects 0.000 description 11
- 238000007906 compression Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 229920002943 EPDM rubber Polymers 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000013618 particulate matter Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000002861 polymer material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- -1 but not limited to Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 210000001503 joint Anatomy 0.000 description 6
- 230000007306 turnover Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052756 noble gas Inorganic materials 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000009428 plumbing Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000011236 particulate material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000010079 rubber tapping Methods 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013626 chemical specie Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000010438 granite Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 231100001261 hazardous Toxicity 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 108010053481 Antifreeze Proteins Proteins 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 210000004128 D cell Anatomy 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/12—Guards, shields or dust excluders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/377—Cooling or ventilating arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161579233P | 2011-12-22 | 2011-12-22 | |
| US61/579,233 | 2011-12-22 | ||
| PCT/US2012/070717 WO2013096503A1 (en) | 2011-12-22 | 2012-12-19 | Gas enclosure assembly and system |
| KR1020237015116A KR20230069251A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237015116A Division KR20230069251A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240036145A true KR20240036145A (ko) | 2024-03-19 |
Family
ID=48669466
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247007913A KR20240036145A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020237015116A KR20230069251A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020217041139A KR102530263B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020187016567A KR102005688B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020197021637A KR20190090064A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020147020478A KR101869134B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020207032729A KR102341544B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237015116A KR20230069251A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020217041139A KR102530263B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020187016567A KR102005688B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020197021637A KR20190090064A (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020147020478A KR101869134B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
| KR1020207032729A KR102341544B1 (ko) | 2011-12-22 | 2012-12-19 | 가스 엔클로저 시스템 |
Country Status (4)
| Country | Link |
|---|---|
| JP (4) | JP6153539B2 (zh) |
| KR (7) | KR20240036145A (zh) |
| TW (2) | TWI623640B (zh) |
| WO (1) | WO2013096503A1 (zh) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| KR101878084B1 (ko) | 2013-12-26 | 2018-07-12 | 카티바, 인크. | 전자 장치의 열 처리를 위한 장치 및 기술 |
| EP3975229A1 (en) * | 2014-01-21 | 2022-03-30 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
| CN110265326B (zh) | 2014-04-30 | 2024-03-08 | 科迪华公司 | 用于衬底涂覆的气垫设备和技术 |
| US9909022B2 (en) * | 2014-07-25 | 2018-03-06 | Kateeva, Inc. | Organic thin film ink compositions and methods |
| US9753463B2 (en) | 2014-09-12 | 2017-09-05 | Applied Materials, Inc. | Increasing the gas efficiency for an electrostatic chuck |
| JP6570147B2 (ja) * | 2014-11-26 | 2019-09-04 | カティーバ， インコーポレイテッド | 環境的に制御されたコーティングシステム |
| KR20230165387A (ko) * | 2015-07-31 | 2023-12-05 | 카티바, 인크. | 잉크 전달 시스템 및 방법 |
| KR102539338B1 (ko) | 2017-09-14 | 2023-06-02 | 가부시키가이샤 세이부 기켄 | 가스 치환용 드라이룸 |
| JP7306683B2 (ja) * | 2019-05-29 | 2023-07-11 | 株式会社西部技研 | ガス置換用ドライルーム |
| JP7344450B2 (ja) * | 2020-03-05 | 2023-09-14 | トヨタ自動車株式会社 | 電池作製設備および電極スタックの作製空間形成方法 |
| KR102473786B1 (ko) | 2021-01-07 | 2022-12-06 | (주)유니젯 | 인클로저 시스템 |
| KR102279864B1 (ko) * | 2021-02-16 | 2021-07-22 | (주)삼백테크놀로지 | 이중확산 자연대류 순환형 냉각장치 및 이를 이용한 대용량 엘이디 등기구 |
| US11892382B2 (en) * | 2021-08-27 | 2024-02-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for detecting environmental parameter in semiconductor fabrication facility |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3216858A (en) * | 1963-04-26 | 1965-11-09 | Cons Edison Co New York Inc | Method of purging gas-conduit tubing in gas-filled electric cables |
| US3498343A (en) * | 1966-12-13 | 1970-03-03 | Lawrence R Sperberg | Apparatus for inflating pneumatic tires with an inert gas |
| US3885362A (en) * | 1973-04-19 | 1975-05-27 | Gordon J Pollock | Modular noise abatement enclosure and joint seal |
| US4581478A (en) * | 1982-04-07 | 1986-04-08 | Pugh Paul F | Gas pressurized cable and conduit system |
| JPH037588Y2 (zh) * | 1985-12-13 | 1991-02-25 | ||
| JP2559617B2 (ja) * | 1988-03-24 | 1996-12-04 | キヤノン株式会社 | 基板処理装置 |
| US5156894A (en) * | 1989-08-02 | 1992-10-20 | Southwall Technologies, Inc. | High performance, thermally insulating multipane glazing structure |
| US5029518A (en) * | 1989-10-16 | 1991-07-09 | Clean Air Technology, Inc. | Modular clean room structure |
| US5314377A (en) * | 1992-10-05 | 1994-05-24 | Airo Clean Inc. | Clean air isolation enclosure |
| US5344365A (en) * | 1993-09-14 | 1994-09-06 | Sematech, Inc. | Integrated building and conveying structure for manufacturing under ultraclean conditions |
| JPH09327646A (ja) * | 1996-04-10 | 1997-12-22 | Sony Corp | 粘性体滴下装置 |
| US6049167A (en) * | 1997-02-17 | 2000-04-11 | Tdk Corporation | Organic electroluminescent display device, and method and system for making the same |
| JPH10246201A (ja) * | 1997-03-03 | 1998-09-14 | Tokyo Seimitsu Sokki Kk | 空気圧供給システム |
| JPH11312640A (ja) * | 1998-02-25 | 1999-11-09 | Canon Inc | 処理装置および該処理装置を用いたデバイス製造方法 |
| US6089282A (en) * | 1998-05-08 | 2000-07-18 | Aeronex, Inc. | Method for recovery and reuse of gas |
| US6023899A (en) * | 1998-11-03 | 2000-02-15 | Climatecraft Technologies, Inc. | Wall panel assembly with airtight joint |
| JP4303811B2 (ja) * | 1998-11-11 | 2009-07-29 | 大陽日酸株式会社 | 減圧設備における不活性ガスの循環供給方法及び装置 |
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| Publication number | Publication date |
|---|---|
| KR102005688B1 (ko) | 2019-10-01 |
| TW201343948A (zh) | 2013-11-01 |
| KR102341544B1 (ko) | 2021-12-21 |
| JP2018200887A (ja) | 2018-12-20 |
| KR102530263B1 (ko) | 2023-05-08 |
| JP2019220472A (ja) | 2019-12-26 |
| KR20190090064A (ko) | 2019-07-31 |
| KR101869134B1 (ko) | 2018-06-19 |
| TW201716616A (zh) | 2017-05-16 |
| TWI568874B (zh) | 2017-02-01 |
| WO2013096503A1 (en) | 2013-06-27 |
| JP6605089B2 (ja) | 2019-11-13 |
| KR20210156856A (ko) | 2021-12-27 |
| JP6379255B2 (ja) | 2018-08-22 |
| TWI623640B (zh) | 2018-05-11 |
| KR20230069251A (ko) | 2023-05-18 |
| JP6153539B2 (ja) | 2017-06-28 |
| KR20140110967A (ko) | 2014-09-17 |
| JP2017228770A (ja) | 2017-12-28 |
| KR20200130757A (ko) | 2020-11-19 |
| KR20180069096A (ko) | 2018-06-22 |
| JP2015510254A (ja) | 2015-04-02 |
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