KR20240035472A - 페놀 혼합물, 에폭시 수지, 에폭시 수지 조성물, 경화물 및 전기·전자 부품 - Google Patents

페놀 혼합물, 에폭시 수지, 에폭시 수지 조성물, 경화물 및 전기·전자 부품 Download PDF

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Publication number
KR20240035472A
KR20240035472A KR1020247002219A KR20247002219A KR20240035472A KR 20240035472 A KR20240035472 A KR 20240035472A KR 1020247002219 A KR1020247002219 A KR 1020247002219A KR 20247002219 A KR20247002219 A KR 20247002219A KR 20240035472 A KR20240035472 A KR 20240035472A
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KR
South Korea
Prior art keywords
epoxy resin
phenol
weight
temperature
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247002219A
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English (en)
Korean (ko)
Inventor
가즈마사 오타
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미쯔비시 케미컬 주식회사
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Publication of KR20240035472A publication Critical patent/KR20240035472A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C08G65/485—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H01L23/293—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247002219A 2021-07-19 2022-07-14 페놀 혼합물, 에폭시 수지, 에폭시 수지 조성물, 경화물 및 전기·전자 부품 Pending KR20240035472A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-119171 2021-07-19
JP2021119171 2021-07-19
PCT/JP2022/027636 WO2023002902A1 (ja) 2021-07-19 2022-07-14 フェノール混合物、エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品

Publications (1)

Publication Number Publication Date
KR20240035472A true KR20240035472A (ko) 2024-03-15

Family

ID=84979174

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247002219A Pending KR20240035472A (ko) 2021-07-19 2022-07-14 페놀 혼합물, 에폭시 수지, 에폭시 수지 조성물, 경화물 및 전기·전자 부품

Country Status (7)

Country Link
US (1) US20240217907A1 (https=)
EP (1) EP4375309A4 (https=)
JP (1) JPWO2023002902A1 (https=)
KR (1) KR20240035472A (https=)
CN (1) CN117751164A (https=)
TW (1) TWI909071B (https=)
WO (1) WO2023002902A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268641A (ja) 1985-05-23 1986-11-28 Mitsubishi Petrochem Co Ltd ３，３′，５，５′−テトラメチル−４，４′−ジヒドロキシジフエニルの製造法
JP2003327554A (ja) 2002-05-09 2003-11-19 Mitsubishi Chemicals Corp ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法
JP2004002830A (ja) 2002-04-23 2004-01-08 Mitsubishi Chemicals Corp ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法ならびにエポキシ樹脂組成物の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156788A (en) * 1977-09-19 1979-05-29 Ici Americas Inc. Process for purification of tetramethylbiphenol by entrainment sublimation
JPH07107004B2 (ja) * 1986-09-16 1995-11-15 本州化学工業株式会社 ３，３▲’▼，５，５▲’▼−テトラアルキル−４，４▲’▼−ビフエノ−ル類の製造方法
JPH0819020B2 (ja) * 1986-11-18 1996-02-28 三菱化学株式会社 ３，３′，５，５′−テトラアルキル−４，４′−ビフエノ−ルの精製法
JP2861221B2 (ja) * 1990-03-22 1999-02-24 三菱化学株式会社 ３，３’，５，５’―テトラメチル―４，４’―ビフェノールの製造方法
JP2002128861A (ja) * 2000-10-23 2002-05-09 Japan Epoxy Resin Kk エポキシ樹脂組成物及びその製法
CN100339346C (zh) * 2003-10-01 2007-09-26 三菱化学株式会社 3,3′,5,5′－四烷基－4,4′－双酚的制造方法
JP3860820B2 (ja) * 2003-10-01 2006-12-20 三菱化学株式会社 ３，３’，５，５’−テトラアルキル−４，４’−ビフェノールの製造方法
JP3832837B2 (ja) * 2003-10-01 2006-10-11 三菱化学株式会社 ３，３’，５，５’−テトラアルキル−４，４’−ビフェノールの製造方法
JP5885331B2 (ja) * 2011-07-27 2016-03-15 日本化薬株式会社 エポキシ樹脂混合物、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268641A (ja) 1985-05-23 1986-11-28 Mitsubishi Petrochem Co Ltd ３，３′，５，５′−テトラメチル−４，４′−ジヒドロキシジフエニルの製造法
JP2004002830A (ja) 2002-04-23 2004-01-08 Mitsubishi Chemicals Corp ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法ならびにエポキシ樹脂組成物の製造方法
JP2003327554A (ja) 2002-05-09 2003-11-19 Mitsubishi Chemicals Corp ３，３’，５，５’−テトラメチル−４，４’−ビフェノール及びその製造方法

Also Published As

Publication number Publication date
CN117751164A (zh) 2024-03-22
WO2023002902A1 (ja) 2023-01-26
TW202313750A (zh) 2023-04-01
US20240217907A1 (en) 2024-07-04
EP4375309A1 (en) 2024-05-29
EP4375309A4 (en) 2024-12-11
JPWO2023002902A1 (https=) 2023-01-26
TWI909071B (zh) 2025-12-21

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