KR20240030154A - Oled 화소 증착을 위한 증착용 마스크 - Google Patents
Oled 화소 증착을 위한 증착용 마스크 Download PDFInfo
- Publication number
- KR20240030154A KR20240030154A KR1020220108821A KR20220108821A KR20240030154A KR 20240030154 A KR20240030154 A KR 20240030154A KR 1020220108821 A KR1020220108821 A KR 1020220108821A KR 20220108821 A KR20220108821 A KR 20220108821A KR 20240030154 A KR20240030154 A KR 20240030154A
- Authority
- KR
- South Korea
- Prior art keywords
- deposition
- protrusion
- mask
- deposition mask
- hole
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title claims abstract description 230
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 44
- 238000009960 carding Methods 0.000 claims abstract description 39
- 238000004891 communication Methods 0.000 claims abstract description 11
- 230000003746 surface roughness Effects 0.000 claims description 10
- 238000000151 deposition Methods 0.000 description 220
- 239000000758 substrate Substances 0.000 description 72
- 239000011368 organic material Substances 0.000 description 38
- 238000000034 method Methods 0.000 description 18
- 230000005611 electricity Effects 0.000 description 14
- 230000003068 static effect Effects 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 238000000926 separation method Methods 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 11
- 229910001111 Fine metal Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220108821A KR20240030154A (ko) | 2022-08-30 | 2022-08-30 | Oled 화소 증착을 위한 증착용 마스크 |
PCT/KR2023/012056 WO2024049055A1 (fr) | 2022-08-30 | 2023-08-14 | Masque de dépôt pour dépôt de pixels oled |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020220108821A KR20240030154A (ko) | 2022-08-30 | 2022-08-30 | Oled 화소 증착을 위한 증착용 마스크 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20240030154A true KR20240030154A (ko) | 2024-03-07 |
Family
ID=90098162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020220108821A KR20240030154A (ko) | 2022-08-30 | 2022-08-30 | Oled 화소 증착을 위한 증착용 마스크 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20240030154A (fr) |
WO (1) | WO2024049055A1 (fr) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3481232B2 (ja) * | 2002-03-05 | 2003-12-22 | 三洋電機株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
US8350468B2 (en) * | 2008-06-30 | 2013-01-08 | Samsung Display Co., Ltd. | Organic electroluminescence display including a spacer and method for fabricating the same |
CN110760793A (zh) * | 2015-04-24 | 2020-02-07 | Lg伊诺特有限公司 | 沉积掩膜 |
CN105655382B (zh) * | 2016-04-08 | 2019-10-18 | 京东方科技集团股份有限公司 | 显示基板制作方法、显示基板和显示装置 |
JP7232882B2 (ja) * | 2017-03-29 | 2023-03-03 | 天馬微電子有限公司 | Oled表示装置の製造方法、マスク及びマスクの設計方法 |
KR102427524B1 (ko) * | 2021-12-21 | 2022-08-01 | 주식회사 핌스 | Oled 증착용 대면적 마스크 시트 및 마스크 조립체 |
-
2022
- 2022-08-30 KR KR1020220108821A patent/KR20240030154A/ko unknown
-
2023
- 2023-08-14 WO PCT/KR2023/012056 patent/WO2024049055A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
WO2024049055A1 (fr) | 2024-03-07 |
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