KR20240004553A - Optical inspection of parts - Google Patents

Abstract

The present invention relates to a device used to optically inspect components placed in a receptacle. The receptacle receives parts at a transfer point, transports the parts along a conveyor path to a storage point, and stores the parts at the storage point. The light source delivers light to a first end face of the component positioned in the receptacle at a first acute angle to the optical side of the imaging sensor when the component is oriented with its end face at least perpendicular to the optical axis of the imaging sensor. The imaging sensor inspects an area within the part near a second of at least one side and/or end face of the part and near each side. The imaging sensor detects light emitted from the first end surface to signal the optical distribution of the emitted light to an evaluation device. Depending on the signalized intensity distribution of the emitted light, the evaluation device detects irregularities in the cross-section at least on the side of the component and/or delamination of at least a cross-section of the layer in the region of the second end face.

Description

Optical inspection of parts

In particular, inspection of parts that may be part of a part handling device is described. This part inspection is explained through interaction with the part handling device. Details thereof are defined in the claims, and the description and drawings also include relevant information about the system, modes of operation and system variations.

The component is, for example, an (electronic) semiconductor component, also referred to herein as a “chip” or “die”. These parts typically have a substantially polygonal prismatic shape, for example a rectangular (rectangular or square) cross-section, with several sides as well as a bottom and a top surface. Hereinafter, the bottom and top surfaces of the part, as well as the shell surfaces, are generally referred to as side surfaces. The bottom surface and top surface are also referred to as end surfaces. With four sides and two approximately square cross-sections, the part has a roughly rectangular shape because the height/thickness of the part is generally less than the edge length of the sides in the longitudinal/transverse direction of the part. A part may have more than four sides. Semiconductor components are manufactured in several steps from semiconductor single crystal wafers (e.g. silicon) using, for example, planar technology, with hundreds of ICs on the Si wafer at the end of the process. By scribing, breaking, or sawing (via laser or mechanical material removal), the wafer is divided into individual components, each containing one or more integrated circuits. Additionally, the component may be an optical component (prism, mirror, lens, etc.). Overall, the part can have any geometric shape.

According to the applicant's working practice, so-called pick-up and set-down devices are known, where the parts are individually picked up from the substrate using a pick tool and then placed on carriers or transport containers, etc. It comes down. Between picking up the part from the board and storing the part, inspection of the part is usually performed. To this end, images of one or more external sides of the part are recorded with one or more imaging sensors and evaluated through automated image processing.

EP 0 906 011 A2 relates to a device for removing and loading electrical components on a board. The device includes a rotatable transport device for removing the electrical component from the supply module at a pick-up position and transferring the electrical component to a suction belt for further processing at a first transport position. Via a rotatable placement head, the parts are picked up on the suction belt and conveyed to the second transport position.

WO 02/054480 A1 relates to a device for optically inspecting various surfaces of a mounted chip. The device includes a first upper transport drum arranged to remove chips from the feeding unit and transport the chips to a first transport position. The chips are held in suction holes formed in the peripheral surface of the upper transport drum and moved by rotating the upper transport disk. The device further includes a second lower transport disk formed corresponding to the upper transport disk, which receives the chip removed from the first transport position and transports the chip to the second transport position. The device can inspect the chip via cameras arranged laterally next to the transport disk, which inspect the top and bottom sides of the chip. The chips are transferred to the sorting device without being flipped against their original orientation for further processing.

US 4,619,043 discloses an apparatus and method for removing and attaching electronic components, especially chips, to printed circuit boards. The device includes transport means for picking up chips from a pickup unit and transporting the picked chips to a first transport location. The transport means includes a transport chain and a rotatable sprocket that mesh together. The device further includes a rotatable mounting tool having a placement head for picking up the chip in the first transfer position. The mounting tool is further configured to transfer the picked chip to the second transport position by a rotational movement, whereby the chip is turned over.

JP 2-193813 relates to a device for picking up and turning over electronic components inspected by an inspection device. The device includes a supply unit in which electronic components are taken by a first rotating body and arranged around its circumference. The rotational movement of the rotating body moves the part to the first transfer position and rotates it about the longitudinal or transverse axis. The device further includes a second rotating body that picks up the electronic component removed from the first transfer position and transfers it to the second transfer position. This results in additional rotation about the longitudinal or transverse axis of the electronic component. The device can inspect various aspects of a part.

The components are, among other things, housed in ceramic or plastic packages and visually inspected before external connections are made. During disassembly of the wafer into individual components, mechanical stresses are generated, especially at the lower edges of the components, i.e. within them, causing circuit layers to separate from adjacent layers. Additionally, separating the wafer into individual components introduces non-uniformities at the edges of the separated sidewalls, especially those facing away from the laser. These separation areas/edges are referred to as laser grooves (LG) when cutting wafers with a laser. Conventional imaging sensors are generally unable to detect these defects. Defects (breakouts) of components in the laser groove area must be detected through appropriate inspection. For example, by detecting the separation of semiconductor or metal layers in the silicon body, defective components can be sorted out for further processing, thus preventing a shortened product life.

At the same time, the semiconductor processing industry's need to optically detect small defects in components is increasing. Optical detection of some types of defects is possible using lenses and adjusted illumination appropriate for the part being inspected. However, available lenses reach their limits in terms of the required image sharpness and the resulting reduction in depth of field.

The quality of optical inspection is limited due to the scattered position of the parts in the holder tool and the shallow depth of field of the lens. Defects are detected with a low probability in out-of-focus parts. This means that defective parts are not incorrectly recognized as non-functional and are processed/packaged further.

Additionally, additional technical background is EP 2 075 829 B1, EP 1 470 747 B1, JP 59 75 556 B1, WO 2014 112 041 A1, WO 2015 083 211 A1, WO 2017 022 074 A1, WO 2013 108 398 No. A1, WO 2013 084 298 No. A1, WO 2012 073 285 No. A1, US 9,510,460 No. B2, JP 49 11 714 No. B2, US 7,191,511 No. B2, JP 55 10 923 No. B2, JP 57 83 652 No. B2, JP 2007 095 725 A, JP 2012 116 529 A, JP 2001-74664 A, JP 1-193630 A, US 5,750,979, DE 199 13 134 A1, JP 8 227 904 A, DE 10 2015 013 500 A1, DE 10 2017 008 869 B3, and DE 10 2019 125 1 27A1.

The solutions presented herein are intended to provide improved, safer and faster inspection of parts at higher throughput compared to prior art.

Disclosed herein are devices and methods. The device is used to optically inspect parts in a holder. The holder is designed and intended to pick up parts from a transfer point, transport the parts along a transport path to a storage point, and store the parts at the storage point. The light source is positioned on the imaging sensor at a first of the end faces of the component placed in the holder when the component is oriented with the first of its end faces at least approximately perpendicular (about 90° ± about 10°) to the optical axis of the imaging sensor. It is arranged and intended to emit light incident on the optical axis at a first acute angle. The imaging sensor is configured and intended to optically inspect at least one area of the interior of the part near each side and at least one of the sides and/or near a second of the end faces of the part being transported through the holder. The imaging sensor is configured and intended to detect light emitted from a first of the end surfaces of the component and signal the intensity distribution of the emitted light to an evaluation device. the evaluation device is configured to detect, as a function of the signal distribution of the intensity of the emitted light, irregularities in the cross section of at least the side surfaces of the component and/or delamination of at least one layer of the cross section in the region of the second of the end faces; and It is intended.

Emitting light at an acute angle to the end face of the component with respect to the optical axis of the imaging sensor means that this light has a main axis of radiation in space, along which the light has at least approximately the greatest brightness, The principal axis contains an acute angle (< 90°) with the optical axis of the imaging sensor oriented perpendicular to the first of the minor surfaces of the component.

The device disclosed herein,

(i) non-uniformity of one or more separate sidewalls of the device and/or

(ii) can be used to detect separation of a semiconductor or metal layer from a silicon body in the transfer path between the transfer point and the storage point using the same inspection location and the same imaging sensor.

Additionally, (iii) defects on the end faces of the component can be detected in this way, producing a black area in the image of the imaging sensor; Again, this is because the beams do not penetrate the part and consequently do not reflect from the sides.

In a variant of the device, the holder includes one or more deflecting and/or focusing devices arranged and intended to detect light emitted from a first of the faces of the component carried through the holder toward the imaging sensor. It is guided from the delivery point to the storage point along a conveyor path passing through an optical device.

In a variant of the above device without a fixture, the laser groove has to be detected on the part already placed in the pocket. In this variant, the entire optical assembly is oriented, for example from above, towards the pocket, and one of the end faces of the component is inspected.

In a variant of the device, the light source is arranged and intended to provide at least one light strip incident at an acute angle on an edge region of the component at a first of the end faces of the component.

In a variation of the device, the first acute angle of light directed to the component is from about -45° to about +45°, about +5°, as a function of the refractive index of the material of the component, the wavelength and/or height of the component. ° to about +45°, about +15° to about +45°, about +25° to about +45°, or about +30° to about +45°.

In a variation of the device, the light source is configured to emit infrared radiation having a wavelength of about 780 nm to about 1000 nm, wherein the component includes a silicon-containing substrate material and the temperature of the substrate material is about 300°K ± about 10°K. If , the first acute angle of light directed to the component is about 33°±about 3°. Depending on the component's substrate material, light with higher wavelengths can be used, up to about 1500 nm SWIR (Short Wave IR).

In a variation of the above device, the acute angle (alpha1) of the light directed at the part is such that when the part is inspected in sequence, the light is (i) reflected inside the part on the side of the part to be inspected, and/or (ii ) is reflected into the interior of the component in the area of the end surface of the component facing the pickup, and (iii) the holder in such a way that the size of the second acute angle (alpha2) is slightly deviated from the size of the first acute angle (alpha1). It is determined to emit outgoing light from an end surface of the component away from the towards the imaging sensor at the second acute angle alpha2 with respect to the optical axis of the imaging sensor.

In a variation of the device, the deviation from the magnitude of the first acute angle to the magnitude of the second acute angle may be slight but no greater than about ±10°.

In a variation of the device, the acute angle of the light directed to the part is such that when the part is inspected OK, the light is (i) reflected inside the part on the side of the part to be inspected, and (ii) facing the holder. is determined to reflect within the component in the area of the end face of the component, and (iii) emit exit light from the end face of the component away from the holder toward the imaging sensor at an acute angle to the optical axis of the imaging sensor.

In a variant of the device, the holder rotates about a first axis of rotation to pick up the part at a first delivery location, transfer the part to a first storage location, and place the part at the first storage location. It is part of a first rotating device arranged for storage. In a variant of the device, the holder rotates a second rotation axis and at the same time receives the component from the holder of the first rotation device at a receiving point, transfers the component to a second storage point, and is part of a second rotating device set up and intended for storage at a second storage point. In a variant of the device, the first axis of rotation and the second axis of rotation are spaced apart and offset from each other by an angle of approximately 90°. In a variant of the device, the holder of the first rotation device and the holder of the second rotation device are aligned with each other in such a way that the component is transferred from the first rotation device to the second rotation device.

In a variant of the device, the distance between the holder (having a component) passing through the optical device and the light deflecting and/or focusing device is such that the component transported by the holder is at least as large as the component along the optical axis of the imaging sensor. Between the first and second of the end surfaces the change is made (eg by a steering device or a steering drive) in a way that can be optically detected by the imaging sensor. That is, in a variant of the device, the optical device (means for redirecting and/or scattering and/or focusing and/or polarizing light) for the imaging sensor may be provided in a space near the second of the end faces of the component. It must be focused to supply an image to the imaging sensor from within. This allows layer delamination on the second of the end faces of the component to be reliably detected, indicated and evaluated.

In a variant of the device, the support unit with a through opening positioned within the support unit is provided for supporting a plurality of light deflecting devices, for example four. In one variant, the light deflection device is arranged around the through opening. The support unit is moved or adjusted along the optical axis of the imaging sensor, so that the entire plurality of light deflecting devices is displaced along the optical axis of the imaging sensor. In a variant of the device, an adjustment device for the selection of the plurality of light deflecting devices is provided for displacing the selection along the optical axis of the imaging sensor. In a variant of the device, the support unit is arranged and intended to support at least one light source for each light deflection means arranged around the through opening, the at least one light source being such that the emitted light preferably passes through the through opening. Arranged, preferably adjustable, on the support unit in such a way that as it passes the optical means through the aperture it falls on the first of the end faces of the component to be inspected.

In order to optimally focus the imaging sensor on the region of interest of the component, in one variant the support unit together with all (e.g. four) light deflecting devices (e.g. prisms or mirrors) preferably comprises a It is moved by a servo drive between the imaging sensor and the component along the optical axis. The two optical deflection devices, which are not adjustable (in distance from the part), are optimally focused by driving the transport device. In another variant, the support unit is preferably moved along the optical axis of the imaging sensor. Then, for parts that are not square in plan view (i.e., for example rectangular in plan view) and if the four sides and/or areas near the end faces located in the holder are to be intersected by the device, 2 The two opposing light deflecting devices can be readjusted in each case by means of another servo drive arranged in the support unit. Two adjustable light deflection devices (off the component) are focused by additional servo drives.

Additionally, as an optical component inspection method for inspecting components located in a holder,

- picking up the part from the discharge location, transporting the part along the transport path to a storage location and storing the part in the storage location;

- emitting light from a light source incident on a first of the end faces of the component at a first acute angle with respect to the optical axis of the imaging sensor;

- if the part is checked OK for irregularities on the side surfaces of the part and/or separation of at least one layer in the second region of the end face, the size of the second acute angle is slightly different from the size of the first acute angle. orienting the light source so that light is deflected and emitted from a first of the end surfaces of the component at the second acute angle to the optical axis of the imaging sensor;

- said imaging sensor to optically inspect at least one area inside said part near at least one of the sides and/or said end face and near each one of said sides of said part being transported through said holder. Steps to use;

- using the imaging sensor to detect light emitted from a first end surface of the component and signal the intensity distribution of the emitted light to an evaluation device; and

- said evaluation to detect, as a function of the signal distribution of the intensity of the emitted light, irregularities in the cross-section at least of the side surfaces of the component and/or delamination from at least one layer of the semiconductor structure in the component in the region of the second end face. A method of inspecting an optical component comprising using an apparatus is disclosed.

In a variation of the above method, the part conveyed through the holder passes through an optical device comprising one or more deflecting and/or focusing means for directing light from a first of the end faces of the part towards the imaging sensor. Guide the holder on a path from the delivery point to the storage point.

In a variant of the method, at least one light strip is provided from the light source, the light strip being incident on the first end face of the component at an acute angle in an edge region of the component.

In a variation of the above method, the acute angle of light directed to the component may be from about -45° to about +45°, from about +5° to about +5°, as a function of the refractive index of the material of the component, the wavelength and/or height of the component. It is determined to be about +45°, about +15° to about +45°, about +25° to about +45°, or about +30° to about +45°.

In a variation of the method, infrared radiation is emitted from the light source having a wavelength of about 780 nm to about 1000 nm (SWIR (Short Wave IR) to about 1500 nm), wherein the component comprises a silicon-containing substrate material and the temperature of the substrate material is For about 300°K ± about 10°K, the first acute angle (alpha1) of the light directed to the component is determined to be about 33° ± about 3°. This determination can be achieved by temporary, one-time or component-specific adjustments to the orientation of the light source, for example via adjustment drives or adjustment setting devices.

In a variation of the above method, the deviation from the size of the first acute angle to the size of the second acute angle may be slight but no more than about ±5°.

In a variation of the above method, the acute angle of the light directed to the part is such that, for a part inspected as “OK,” the light is (i) reflected into the part from the side of the part to be inspected, and (ii) the holder. (iii) light exiting at an acute angle to the optical axis of the imaging sensor is emitted from an end surface of the component facing away from the holder toward the imaging sensor. (The size of the second acute angle deviates only slightly from the size of the first acute angle, up to about ±5°).

In a variation of the method, the holder rotates about a first axis of rotation to pick up the part at a first delivery location, transfer the part to a first storage location, and place the part at the first storage location. store; and/or the holder rotates about a second axis of rotation in a second rotating device, to receive the part from the holder of the first rotating device at a transfer point, to transfer the part to a second storage point, and to transport the part to a second storage point. Stored at a second storage point, wherein the first rotation axis and the second rotation axis are spaced apart from each other and offset from each other by an angle of approximately 90°, and the holder of the first rotation device and the second rotation device at the transfer point. The holders are aligned with each other in such a way that the parts are transferred from the first rotation device to the second rotation device.

In a variant of the above method, the holder is configured to guide the component transported by the holder from the transfer point to the storage point along a path through the optical device and/or to redirect one or more lights of the optical device and/or /Or a focusing device directs light emitted from a first of the end faces of the component towards the imaging sensor.

In a variation of the above method, the holder and the light deflecting and/or focusing device passing through the optical device are configured such that the component transported by the holder is aligned with at least a first of the end faces of the component along the optical axis of the imaging sensor. and the second change in their distance from each other in a way that can be optically detected by the imaging sensor, at least therein.

In a variant of the above method, the support unit having a through opening positioned within the support unit supports a plurality, for example four, of light deflecting devices; the light deflection device is arranged around the through opening; the support unit is moved or adjusted along the optical axis of the imaging sensor, so that the entire plurality of light deflecting devices are displaced along the optical axis of the imaging sensor; an adjustment device displaces a selection of the plurality of light deflection devices along an optical axis of the imaging sensor; and/or the support unit supports at least one light source for each light deflection means arranged around the through opening, wherein the at least one light source allows the emitted light to preferably pass through the through opening to the optical means. It is preferably adjustable, arranged on the support unit in such a way that it falls on the first of the end faces of the component to be inspected.

At least one light source for each light redirecting device arranged around the through hole means, for example, an LED line with 1-10 (IR) LEDs. However, the light from one or several light sources ((IR) LEDs) can be directed by a light guide to a light deflection device arranged around the through hole, or by the (IR) light from the light guide to a guy part. It is also possible to shine light directly. Depending on space requirements, coaxial lighting may be used instead of LED arrays if more space is available.

Accordingly, the arrangement presented herein forms an integrated handling/inspection device. The imaging sensor inspects all or substantially all of the top and/or side(s) of the part.

The device presented here uses, for example, a fixed ejector device to pick up parts from a component supply (wafer disk) arranged horizontally in the upper region of the device. In connection with this discharge device, the component feed moves in a plane. The ejection device allows parts to be individually separated from the part supply by a needle or without contact (eg by a laser beam) and picked up by a holder. Discharged parts are put into one or more inspection processes and finally stored. In the process, defective products may be rejected. The optical inspection of the parts integrated into the transport process is divided into several inspection processes. The transfer/transportation of the parts takes place while the holder of the rotating device holds one part at a time. Stored parts undergo individual inspection during transport. The (image) data obtained from the imaging sensor can also be used to adjust the position control of the manipulator (holder) and the receiving point. The parts conveyor is configured to convey parts along its path in a substantially continuous or clockwise manner.

The arrangements and procedures presented herein functionally combine the two aspects of handling and inspection. These two functions are intertwined in time and space for a fast and accurate qualitative assessment of multiple/all aspects and/or interiors of the part, while these functions can be individually and quickly taken from the part supply and received classified as good in inspection. It is placed precisely at the point(s).

The component handling device preferably operates in a controlled manner and has two rotating devices, preferably essentially orthogonal to each other (90° ± max. 15°) and arranged approximately in the shape of a star or wheel. The rotating devices may have a rectangular shape. Each of these rotating devices carries a plurality of holders, which in some variants may also move radially about the axis of rotation, for feeding parts held in the holders by negative pressure within a pivot angle between the parts, inspecting and rejecting defective parts. and, if necessary, transferred to one or more process stations for additional stations.

In the device presented here, a star-shaped or wheel-shaped rotating device transfers the parts to radially outwardly facing holders arranged on the (virtual) circumference of one or both rotating devices. This stands in contrast to devices in which the holders of one or both rotating devices are oriented parallel to the axis of rotation.

The (top/bottom) top and/or (lateral) side(s) of the part detected by the imaging sensor in an individual inspection process may be different top and/or lateral surfaces of the part.

One aspect of the optical inspection provides for a parts conveyor with parts completing a conveyor path that is essentially stationary or nearly stationary. In this case, the imaging sensor captures the desired image while moving or with minimal downtime. These images are then evaluated using image processing methods. A variation of this optical acquisition/inspection provides for one or more color cameras or monochrome cameras to serve as imaging sensors.

The imaging sensor may have for this purpose one or more mirrors, optical prisms, lenses, polarizing filters, etc. as light deflecting and/or scattering and/or focusing and/or polarizing devices, etc.

In each case, the light source may be briefly turned on by the control device the moment an image containing the component is located in the respective detection range of the imaging sensor, so that the component is exposed to a short flash of light for detection by the respective imaging sensor. It can be. Alternatively, permanent lighting may be used.

In one variant, the device is assigned a dispensing device configured to dispense one component at a time from a structured component supply to a holder of a first rotating device positioned accordingly by the control system. This may be a component ejector that ejects the component through the wafer carrier film by a needle, or in particular, it may be a laser pulse generator that separates the component from the carrier film by reducing the adhesion of the component to the carrier film. In one variant, a position and/or characteristic sensor is assigned to the dispensing device, which detects the position of the dispensing device relative to the part to be dispensed and/or positional data of the part to be dispensed and/or characteristics of the part to be dispensed, Make the corresponding components available in the controller to operate the dispensing device.

In a variation of the device, the holders of the first and/or second rotation device extend and retract in a radially controlled manner with respect to the rotation axis or center of rotation of the respective rotation device and/or hold the part to be transported. Subjected to negative and/or positive pressure in a controlled manner for receiving and expelling, and/or moving about their respective radial movement axes, or through their respective rotation angles in a controlled manner. It is rotated around a radial movement axis.

In devices of this type, as a variant, the linear drives assigned to the holders of the first and/or second rotation device extend radially at the distribution point, i.e. the transfer point between the first and second rotation devices. /Provided for contraction. These linear drives engage the holders at the corresponding positions from the outside of each rotating device and extend and retract each holder in the radial direction. In another variant, this linear drive only extends the respective holders, while the return spring retracts the respective holders. In another variant, a bidirectional or unidirectional radial drive is assigned to each holder.

In a variant of the above part handling device, the valve performs the functions: (i) suction of the part, (ii) retention of the part, (iii) storage of the part with or without controlled blow-off impact and/or freely or under position control. In order to realize free ejection of parts, negative and positive pressure is supplied to each individual holder individually and depending on its position.

In a variant of the device, the position and characteristic sensors are in each case assigned to a first rotation device between the dispensing point and the transfer point and/or to a second rotation device between the transfer point and the storage point. These sensors are configured to record and make available to the control system the position data for position control of the manipulator (pick-up) and the receiving point and/or the properties and/or position data of the delivered part.

In a variant of the part handling device, an integer n number of holders are assigned to the first and/or second turning device. The number of holders of the first rotation device and the number of holders of the second rotation device may be the same or different.

In a variant of the component handling device, the first, second and/or third axes each comprise an angle of 90° ± at most 10° or 15° relative to the other.

The position and characteristic sensor may be an imaging sensor with a straight or curved optical axis.

In a variant of the parts handling device, the first and/or second rotating device is at least approximately star-shaped or wheel-shaped. The rotating devices can be precisely mounted and positioning along or about each axis can be accomplished via axially arranged linear or rotary actuation drives paired with high-resolution (e.g. rotary or linear) encoders. You can. Each holder may be arranged distributed around the periphery and may have suction contact points directed radially outward with respect to the part to be transported.

One advantage of the axially offset arrangement of the rotation devices with respect to each other by about 90° is that during the transfer process, when moving from one rotation device to the next, there is no need to mount the holder itself to enable rotational movement. This means that the part performs a 90° rotation around the holder axis (or rotator axis) for each plane of movement of the holder. This change in component orientation significantly simplifies inspection of the four component cutting surfaces (= component sides). For this purpose, a camera system is used, arranged at right angles to the moving plane of the fixture (i.e. axially of the rotating device) and preferably at a very short distance from the part cutting surface (=lateral surface of the part) itself.

The variants presented herein are more cost-effective than the current technology and provide higher part throughput, more inspection time, and less moving mass.

Additional features, properties, advantages and possible modifications will become apparent to those skilled in the art from the following description with reference to the appended description. Here, the drawings schematically depict an optical inspection device for parts.
Figure 1 shows a schematic side view of a device for optical inspection of parts transported by a rotating device from a delivery position to a storage position.
Figures 2 to 4 show detailed situations of Z circled in Figure 1 for variations inside the part rotated 90° counterclockwise as well as light and penetration of the part by the light path.
Figure 2a shows a detailed situation Y when the light beam enters/exits the first end surface S1 of the part B and is reflected from the second end surface S2 of the part B.

FIG. 1 shows an optical component inspection device 100 for inspecting a component B in the form of an electronic semiconductor chip located in a holder 12. The component inspection device 100 presented herein receives components B, for example wafers, from the component supply BV, which are arranged horizontally in the upper region of the component inspection device 100, not shown in more detail. does not Possible input-output materials at both locations could be tape or wafer, waffle pack, JEDEC tray, etc., or a mixture, such as wafer to tape or vice versa. Alternatively, wafer-to-wafer or roll-to-roll solutions are also possible.

Here, the discharge unit 110 operates with a needle 112 controlled by a controller or, for example, operates without contact with the laser beam to individually eject the parts B from the part supply BV and perform the first rotation. is supplied to device 130. This first rotating device 130 is in the form of a star or wheel and has on its periphery a plurality of holders 132 (eight in the example shown) for the separated parts B. Each holder 132 receives a part B from the part feeder BV at a transfer point 136 when it is closest to the discharge unit 110 at the 0° position of the first rotation device 130 and transfers the part B. It is configured to transport the part B along the path 140 to a storage point 138 and to store the part B at the storage point 138 at a position of 180° of the first rotation device 130 .

The holder 132 is arranged to face radially outward on the (virtual) circumference of the star-shaped or wheel-shaped first rotation device 130 and transports the part B. In the depicted variant, the holders 132 are suction pipettes controlled about the rotation axis 134 of the first rotation device 130 and can be extended and retracted radially. For clarity, the traverse control and vacuum lines are not shown in Figure 1. Accordingly, these holders 132 each hold a part (B) fixed to one of the holders 132 within a rotation angle between the part discharge point 136 and the part storage point 138 (here, 0° to 180°). ) can be transported.

The first rotation device 130 further rotates the component B, controlled by a control system not shown, about its axis of rotation by a first predetermined angle, here 180°, to the first transfer point. In this process, part B is rotated about its longitudinal or transverse axis.

As shown in FIG. 1, the optical component inspection device 100 for optically inspecting the component B is installed at a first rotation device 130 at an inspection position (90° of the first rotation device 130 in FIG. 1). is placed in The first imaging sensor 150, which is oriented around the first end surface S1 of the component B away from the holder 132, is directed to the component B with light from the IR light source 154 and the visible light source 152. It is used to inspect. Light from the IR light source 154 passes through the Fresnel lens assembly 156 and is deflected 90° by a translucent mirror 158 tilted 45° relative to the optical axis. Additionally, the semi-transparent mirror 158 allows visible light from the light source 152 to pass in a straight line. Both light beams (IR and visible) pass through the diffuser 160 and strike another semi-transparent mirror 162 inclined at 45° with respect to the optical axis, thereby deflecting it 90° in the direction of part B. Light deflected in the direction of the part B passes through the third semi-transparent mirror 164 inclined at 45° with respect to the optical axis OA and strikes the first end surface S1 of the part B along the optical axis OA. do. The light reflected therefrom passes through another translucent mirror 162 and a third translucent mirror 164 and is detected as an image by the imaging sensor 150.

The holder 132 is guided from the transfer point 136 to the storage point 138 along the path 140, along which the parts transported by the holder pass through the above-described optical device together with the light deflection and/or bundling device. do. This optical device directs light coming from the first end surface S1 of the component B toward the first imaging sensor 150.

The optical component inspection device 100 of FIG. 1 is configured so that the component B located in the holder 132 is at least approximately perpendicular (about 90° ± about 10°) to the optical axis OA of the imaging sensor 180. Light incident on the first (S1) of the end surfaces of the part (B) at a first acute angle (alpha1) with respect to the optical axis (OA) of the second imaging sensor 180 when oriented to the first (S1) of the side surfaces, In particular, it further includes a plurality of light sources 170 that emit IR light. Accordingly, the imaging sensor 180 is located near at least one of the side surfaces (S3, S4) and the second end surface (S2) of the part (B) transported through the holder 132 and one of the side surfaces (S3, S4). It can be used to optically inspect at least one area inside the part B near the . At least one of the sides is inspected from the inside for irregularities in the solution shown here by reflecting light rays on the inside of the side (see Figure 4). Accordingly, there is no need for a separate imaging sensor to inspect external irregularities. Therefore, all laser groove damage can be inspected using the same light beam and imaging sensor. In the variant shown herein, the two imaging sensors 150, 180 are similar or identical in design. Depending on the light used, the spectral sensitivity of the imaging sensors 150 and 180 is tailored to each light source.

As shown in Figure 1, there is a support unit 190 arranged radially outside the 90° position of the first rotation device 130. This support unit 190 has a substantially L-shaped shape, such that the legs of the L oriented towards the holder 132 are aligned approximately parallel to the component positioned on the holder 132 . In this leg of L of the support unit 190 oriented towards the holder 132 there is a through opening 194 through which the optical axis OA extends centrally. A plurality (in this case four) light deflection devices 196 in the form of prisms are arranged at the edges of the through opening 194 . The support unit 190 is moved or adjusted along the optical axis OA of the imaging sensor 150 by the driving unit 192, thereby displacing the entire optical deflection device 196 along the optical axis OA. A further adjustment device 198 is provided for selecting a plurality of light redirecting devices 196, here two out of four, to be displaced along the optical axis OA. Accordingly, in each case, two light deflecting devices 196 positioned opposite each other around the periphery of the through opening 194 must be focused together on the desired image plane in/at component B.

Accordingly, the support unit 190 supports both the light deflection device 196 and each light source 170. In each case the light from one of the light sources 170 falls (through the through opening 194) at an angle alpha1 on the first end surface S1 of the part B, penetrates into the part B through and into the part inside the corresponding side surfaces S3, S4.. to the inside of the second end face S2 and from the second end face S2 to the first end. It is reflected back to the side surface S1, provided that (i) each side has a continuous smooth cut surface, and (ii) the semiconductor structural layer of part B has an edge or edge region, especially on each side. It must not peel off from the inside of the second end surface (S2). At the first end surface S1, the light exits the part B again at angle alpha2 and onto the associated one of the light redirecting devices 196 at angle alpha2 (via through opening 194). It falls. From there, the light reaches a third translucent mirror 164 inclined at 45° about the optical axis, and a fourth light redirecting device (prism) 202 which supplies light to the imaging sensor 180 at an angle of 45° about the optical axis. Redirects light onto the image. Additionally, light from both light sources 152 and 154 passes through the through opening 194. A portion of the beam from IR light source 154 may also be co-deflected in prism 196 and serve secondarily for laser home inspection. These light rays also pass through the through opening 194. In this case, the IR light source 170 (IR ring light) is the main IR light source for laser groove inspection and is placed at an angle to better illuminate and aim the laser groove area for inspection.

In the variant shown herein, each light source 170 is adapted to detect unevenness of the side surfaces S3, S4 of the part B and/or separation of at least one layer in the region of the second of the end faces S2. When part B is inspected "in order", the size of part B at the second acute angle alpha2 is deviated slightly from the size of the first acute angle alpha2. Light must be oriented to be emitted from the first (S1) of the end surfaces toward the optical axis of the imaging sensor 180. In the variant shown in Figure 1, the two angles (alpha1, alpha2) are actually the same.

In Figure 1, the light source 170 on the support unit 190 is located on the side of the through opening 194 away from the holder 132. Accordingly, both the light from the light source 170 and the light recovered to the imaging sensor 180 pass through the through hole 194. In a further not shown variant, the light source 170 is arranged in the support unit 190 on the side of the through opening 194 facing the holder 132 . In this case, only the light returning to the imaging sensor 180 passes through the through opening 194.

The details Z, shown in circles, regarding the penetration of the part B by the light and the light path and its deformation inside the part B are shown in Figures 2 to 4 (rotated 90° counterclockwise). . Figure 2a describes the detailed situation Y when the light beam enters/exits the first end surface S1 and is reflected by the second end surface S2 of the component B.

Accordingly, Figure 2 shows a path through an intact component B, in which light from one of the light sources 170 is (b) exposed to the material of component B (e.g., silicon (Si)). Depending on the refractive index (n) of reflected into the part and on the inside of the second end surface S2, (d) reflected back from the second end surface S2 to the first end surface S1, and (e) the material of the part B. Depending on the refractive index and the temperature and wavelength of the deflected light, the light is emitted at an angle alpha2 from the first end surface S1 of the component B to one of the associated light deflection means 196 and passes its path to the imaging sensor 180. (i) each side has a continuous smooth cutting surface, and (ii) the layer of semiconductor structure in component B is formed on the inside of second end surface S2 (in particular on each side). are separated (from each other) at the edge or edge area of. As a result, the emitted light pattern is created as Light Light Light, H H H. It should be understood that this light pattern, illustrated here with only four rays, may also appear as a dark stripe in the middle for parts inspected in sequence depending on geometric conditions. If the light pattern is interrupted at individual points along the length of light strip 170v, this is indicative of local layer separation or non-uniformity.

In this case, the acute angle (alpha1) of the light directed to component B is about -45° to about +45°, depending on the refractive index (n) of the material of component B and the wavelength and/or height of the component. +5° to about +45°, about +15° to about +45°, about +25° to about +45°, or about +30° to about +45°. In the variation shown in the figures, light source 170 is configured to emit infrared light having a wavelength of about 780 nm to about 1000 nm (eg, 900 nm). Light with SWIR (shortwave IR) up to about 1500 nm can also be used. Since component B typically has a silicon-containing substrate material and the temperature of the substrate material is about 300°K±about 10°K, the acute angle alpha1 of the light transmitted to the component is about 33°±±1 in the variant illustrated herein. It is determined to be approximately 3°.

The imaging sensor 180 detects light emitted from the first end surface S1 of the component B and determines the intensity distribution of the emitted light to an evaluation device (not shown), i.e., a computer unit programmed for image data processing. send a signal In particular, depending on the intensity distribution of the signalized light emitted from the first end face S1 of the component B, the evaluation device determines at least irregularities in the cross section of the side surface of the component B and/or the second end face S2 ) to detect delamination of at least one layer of the cross section in the area of .

As shown in FIG. 2, the light source 170 is a light strip 170v incident on the first end surface S1 of the component B at a first acute angle alpha1 in the edge region of the component B to be inspected. provides.

In this configuration, light source 170 provides infrared light with a wavelength of approximately 900 nm; The component has a silicon-containing substrate material and the temperature of the substrate material is about 300°K ± about 10°K; In this case, the first acute angle alpha1 of the light directed to component B is about 33°±about 3°. Shortwave IR (SWIR) up to about 1500 nm can also be used.

The deviation between the size of the first acute angle (alpha1) and the size of the second acute angle (alpha2) is about ±5° or less.

3 shows that a flat or smooth cut surface on the side of part B is present in the light pattern detected by imaging sensor 180 in relation to delamination of the edge region between the side of part B and the second end surface S2. Show how it affects you. It is clear that the light from the smooth side is completely deflected onto the second end surface S2. However, in the delamination (SA) region of the edge region between the side of the component B and the second end surface S2, light is not reflected to the first end S1. This causes the lighting pattern to appear as Dark Dark Light Light, D D H H.

4 illustrates how an uneven cut surface on the side of part B affects the light pattern detected by imaging sensor 180 in the edge region between the side of part B and the second end surface S2. shows. Obviously, the light is completely deflected in the upper region from the smooth side to the second end surface S2 and is reflected from the second end surface S2 to the first end surface S1. However, in the edge region between the side of the component B and the second end surface S2, the light is not deflected to the second end surface S2 and consequently is not reflected to the first end surface S1. This causes the lighting pattern to appear as Dark Dark Light Light, D D H H.

In the variant shown in FIG. 1 , the holder 132 is part of a first rotation device 130 that rotates about a first rotation axis 134 . Part B is picked up at the first delivery point, transported to the first storage point, transported and stored at the first storage point. In a further not shown variant, the holder 132 rotates about the second rotation axis and picks up the part B at the holder point from the holder of the first rotation device 130 and removes the part B. It is part of a second rotating device that transports the part (B) to a second storage point and stores the part (B) in the second storage point. The first and second rotation axes are spaced apart from each other (in the Z direction) and offset from each other by an angle of approximately 90°. At the transfer point, the holder of the first rotation device and the holder of the second rotation device are aligned with each other in such a way that the part is transferred from the first rotation device to the second rotation device.

The above-described variations of the device and their construction and operational aspects are merely intended to provide a better understanding of the structure, operation and features, and do not limit the disclosure to, for example, variations. The drawings show important functions and effects, in some cases significantly enlarged, in part schematically to illustrate functions, operating principles, technical variations and features. In this regard, the operating modes, principles, technical variations and features disclosed in the drawings or specification may be freely and arbitrarily combined with all claims, features and other operating modes of the specification and other drawings. The principles, technical variations and features included in or resulting from this disclosure are meant to imply that all possible combinations result from the described approach. Combinations between all individual variations within the specification, i.e., in each section of the specification, within the claims, and combinations between different variations within the specification, within the claims, and within the drawings are included. Additionally, the claims do not limit the disclosure, and thus the possible combinations of all disclosed features are mutually limited. All disclosed features are also expressly disclosed herein individually and in combination with all other features.

Claims (22)

In the optical component inspection device (100) for inspecting the component (B) located in the holder (132),
- the holder 132 receives the part B at the transfer point 136 and transports the part B along the transport path 140 to a deposition point 138, said storage point ( 138) is set up and intended to store part (B);
- on the first of the end faces of the component when the component (B) placed in the holder is oriented with the first of its end faces at least approximately perpendicular (about 90° ± about 10°) to the optical axis of the imaging sensor. the light source is arranged and intended to emit light incident on the optical axis of the imaging sensor at a first acute angle (alpha1);
- the imaging sensor is configured to optically inspect at least one area of the interior of the part near each side and at least one of the sides and/or the second of the end faces of the part being transported through the holder 132 and is intended;
- the imaging sensor 180 is configured and intended to detect light emitted from a first of the end faces of the component and to signal the intensity distribution of the emitted light to an evaluation unit (ECU);
- The evaluation unit (ECU) determines, as a function of the signal distribution of the intensity of the emitted light, irregularities in the cross-sections of at least the side surfaces (S3, S4...) of the component and/or the second of the end surfaces (S2). set and intended to detect delamination of at least one layer of the cross section in the area of
Optical component inspection device.
According to paragraph 1,
- The pickup 132 is arranged and intended to detect light emitted from the first end surface S1 of the part B transported through the pickup 132 towards the imaging sensor 180. guided from the delivery point to the storage point along a path passing through an optical device comprising at least one deflection and/or focusing device,
Optical component inspection device.
According to claim 1 or 2,
- the light source 170 is arranged and intended to supply at least one light strip 170v incident at the first acute angle alpha1 in the edge region of the component on the first end surface S1 of the component,
Optical component inspection device.
According to any one of claims 1 to 3,
The light source 170 is,
- When the part (B) is inspected in order by determining the acute angle (alpha1) of the light directed to the part (B), the light coming from the light source is,
(a) falls at an acute angle (alpha1) on the first end surface (S1) of the component,
(b) depending on the refractive index (n) of the material of the component, the temperature and wavelength of light deflected by the first end surface (S1) penetrate into the interior of the component (B),
(c) reflected inside the part on the inside of the corresponding side on the inside of the second end surface S2,
(d) reflected from the inside of the second end surface (S2) back to the first end surface (S1),
(e) depending on the refractive index (n) of the material of the component, the temperature and wavelength of the light, the light is deflected and emitted at an angle (alpha2) from a first end face of the component to an associated end face of the light deflecting means, the imaging sensor It is oriented to take the path to (180), and the condition is,
(i) each side has an overall substantially smooth cut surface,
(ii) the layer of the semiconductor structure of the component (B) is not peeled off from the inside of the second end surface (S2),
Optical component inspection device.
According to any one of claims 1 to 4,
- The first acute angle (alpha1) of the light directed to the component B is a function of the refractive index of the material of the component, the wavelength and/or the height of the component, from about -45° to about +45°, about +5 ° to about +45°, from about +15° to about +45°, from about +25° to about +45°, or from about +30° to about +45°,
Optical component inspection device.
According to any one of claims 1 to 5,
- the light source is arranged to emit infrared radiation with a wavelength of about 780 nm to about 1000 nm (or SWIR (short wave IR) up to about 1500 nm), wherein the component (B) comprises a silicon-containing substrate material and the substrate material (Si) When the temperature is about 300°K ± about 10°K, the first acute angle (alpha1) of the light directed to component B is about 33° ± about 3°, and/or
- the imaging sensor towards the imaging sensor 180 from the first end face of the component away from the holder 132 in such a way that the size of the second acute angle alpha2 is slightly deviated from the size of the first acute angle alpha1. Incident light is emitted at the second acute angle (alpha2) with respect to the optical axis of (180),
Optical component inspection device.
According to clause 6,
- the deviation from the size of the first acute angle to the size of the second acute angle may be slight but not more than about ±10°,
Optical component inspection device.
According to any one of claims 1 to 7,
- the holder 132 rotates around a first axis of rotation to pick up the part B in a first transfer position, transfer the part B to a first storage position and place the part B in the first storage position. It is part of a first rotating device arranged for storage in a first storage position; and/or
- the holder 132 rotates on a second rotation axis and at the same time receives the part B from the holder 132 of the first rotation device at the receiving point and transfers the part B to the second storage point is part of a second rotating device set up and intended to transfer the part (B) to a second storage point,
The first rotation axis and the second rotation axis are spaced apart from each other and offset from each other by an angle of approximately 90°, and at the transfer point, the holder 132 of the first rotation device and the holder 132 of the second rotation device are the parts. (B) are aligned with each other in such a way that they are transferred from the first rotating device to the second rotating device,
Optical component inspection device.
According to any one of claims 2 to 8,
- the pickup 132 guides the part B transported by the pickup 132 from the delivery point to the storage point along the path through the optical device, and/or
- the optical device comprises one or more light redirecting and/or focusing means arranged and intended to redirect light emitted from a first of the end faces of the component towards the imaging sensor 180 Including,
Optical component inspection device.
According to any one of claims 2 to 9,
- The distance between the holder 132 passing through the optical device and the light deflection and/or focusing device is such that the part B transported by the holder 132 is at least the end face of the part along the optical axis of the imaging sensor. changed in a manner that can be optically detected by the imaging sensor between the first and second of the
Optical component inspection device.
According to any one of claims 2 to 10,
- the support unit 190 with a through opening 194 located in the support unit 190 is provided for supporting a plurality, for example four, of the light deflection devices 196,
- the light deflection device 196 is arranged around the through opening 194,
- The support unit 190 is moved or adjusted along the optical axis (OA) of the imaging sensor 180, so that the entire plurality of light deflecting devices 196 are displaced along the optical axis (OA) of the imaging sensor 180. become;
- an adjustment device (198) for the selection of the plurality of light deflecting devices (196) is arranged to displace the selection along the optical axis (OA) of the imaging sensor (180); and/or
- the support unit 190 is arranged and intended to support at least one light source 170 for each light deflection means 196 arranged around the through opening 194, at least one light source 170 is arranged, preferably adjusted, on the support unit 190 in such a way that the emitted light preferably falls on the first (S1) of the end faces of the component to be inspected as it passes through the optical means through the through opening 194. possible,
Optical component inspection device.
In an optical component inspection method for inspecting a component located in the holder 132,
- picking up the part (B) from the discharge location, transporting the part (B) along the transport path to a storage location and storing the part (B) in the storage location;
- emitting light from the light source 170 incident on the first (S1) of the end surfaces of the component at a first acute angle (alpha1) with respect to the optical axis of the imaging sensor 180;
- the size of the second acute angle (alpha2) when the component (B) is sequentially inspected for irregularities on the side surfaces of the component and/or for separation of at least one layer in the region of the second (S2) of the end faces. The light is emitted from the first (S1) of the end surfaces of the component at the second acute angle (alpha2) to the optical axis of the imaging sensor 180 so that the light is slightly deflected to the size of the first acute angle (alpha1). Orienting the light source 170;
- optically inspecting at least one area inside the part near each one of the sides and/or near at least one of the sides and/or a second of the end faces of the part being transported through the holder 132 using an imaging sensor (180);
- using the imaging sensor (180) to detect light emitted from the first end surface (S1) of the component and to signal the intensity distribution of the emitted light to an evaluation unit (ECU); and
- irregularities in the cross-section of at least the side surfaces of the component and/or from at least one layer of the semiconductor structure in the component B in the region of the second end surface S2, as a function of the signal distribution of the intensity of the emitted light. Using said evaluation unit (ECU) to detect delamination.
Including,
Optical component inspection methods.
According to clause 12,
- an optical device in which the part (B) transported through the holder (132) comprises one or more deflection and/or focusing means for directing light from a first of the end faces of the part towards the imaging sensor (180) guiding the holder 132 from the transfer point to the storage point on a path passing through
Optical component inspection methods.
According to claim 12 or 13,
- supplying at least one light strip from the light source, the light strip falling onto a first end face (S1) of the component at an acute angle (alpha1) in the edge region of the component,
Optical component inspection methods.
According to any one of claims 12 to 14,
- The first acute angle (alpha1) of the light directed to the component B is a function of the refractive index of the material of the component, the wavelength and/or the height of the component, from about -45° to about +45°, about +5 ° to about +45°, from about +15° to about +45°, from about +25° to about +45°, or from about +30° to about +45°,
Optical component inspection methods.
According to clause 15,
- emit infrared rays from said light source having a wavelength from about 780 nm to about 1000 nm or SWIR (Short Wave IR) to about 1500 nm, wherein said component (B) comprises a silicon-containing substrate material and the temperature of said substrate material is about 300° C. When °K ± about 10°K, determining that the first acute angle (alpha1) of the light directed to the component (B) is about 33° ± about 3°,
Optical component inspection methods.
According to any one of claims 12 to 16,
- The deviation from the size of the first acute angle (alpha1) to the size of the second acute angle (alpha2) may be slight but is about ±5° or less,
Optical component inspection methods.
According to any one of claims 12 to 17,
- The acute angle (alpha1) of the light directed to the component (B) is, for the component (B) inspected in sequence,
Light coming from one of the light sources 170,
(a) falls at an acute angle (alpha1) on the first end surface (S1) of the component,
(b) depending on the refractive index of the material of the component, the temperature and wavelength of light deflected by the first end surface (S1) penetrate into the interior of the component (B),
(c) reflected within the part on the inside of a corresponding side on the inside of the second end face,
(d) reflected back to the first end surface (S1) from the inside of the second end surface,
(e) depending on the refractive index of the material of the component, the temperature and wavelength of the light, it is deflected at an angle alpha2 from a first end face of the component to an associated end face of the light deflection device and takes a path to the imaging sensor 180. It is oriented to take, and the conditions are:
(i) each side has an at least approximately continuous smooth cut surface,
(ii) the layer of the semiconductor structure of the component (B) does not peel off the interior of the second end face,
Optical component inspection methods.
According to any one of claims 12 to 18,
- the holder 132 rotates about a first axis of rotation in a first transfer position to pick up the part B in the first transport position and transport the part B to a first storage position, storing part (B) in said first storage location; and/or
- the receiving means (132) rotates about a second rotation axis in the second rotating device and receives the part (B) at a transfer point from the receiving means (132) of the first rotating device, wherein the part (B) ) is transferred to a second storage point, and the part (B) is stored in the second storage point, wherein the first and second rotation axes are spaced apart from each other and offset from each other by an angle of approximately 90°, and the transfer point wherein the holder 132 of the first rotating device and the holder 132 of the second rotating device are aligned with each other in such a way that the component B is transferred from the first rotating device to the second rotating device,
Optical component inspection methods.
According to any one of claims 12 to 19,
- the pickup 132 guides the part B transported by the pickup 132 from the delivery point to the storage point along the path through the optical device, and/or
- one or more light redirecting and/or focusing devices of the optical device direct the light emitted from a first of the end faces of the component towards the imaging sensor 180,
Optical component inspection methods.
According to any one of claims 12 to 20,
- The receiving means 132 and the light deflecting and/or focusing device passing through the optical means are such that the part B transported by the receiving means 132 is at least one of the parts B along the optical axis of the imaging sensor. wherein the distance from one another between the first and second of the end surfaces changes in a manner that can be optically detected by the imaging sensor, at least therein.
Optical component inspection methods.
According to any one of claims 12 to 21,
- the support unit 190 with a through opening 194 located in the support unit 190 supports a plurality of light deflection devices, for example four,
- the light deflection device is arranged around the through opening,
- the support unit 190 is moved or adjusted along the optical axis OA of the imaging sensor 180, so that the entire plurality of light deflection devices is displaced along the optical axis of the imaging sensor 180;
- an adjustment device (198) displaces a selection of said plurality of light deflecting devices along the optical axis of said imaging sensor; and/or
- The support unit 190 supports at least one light source 170 for each light deflection means arranged around the through opening 194, wherein the at least one light source 170 preferably emits light. arranged, preferably adjustable, on the support unit 190 in such a way that it falls on the first (S1) of the end faces of the component to be inspected as it passes the optical means through the through opening.
Optical component inspection methods.