KR20230161426A - 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 - Google Patents

분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 Download PDF

Info

Publication number
KR20230161426A
KR20230161426A KR1020237028418A KR20237028418A KR20230161426A KR 20230161426 A KR20230161426 A KR 20230161426A KR 1020237028418 A KR1020237028418 A KR 1020237028418A KR 20237028418 A KR20237028418 A KR 20237028418A KR 20230161426 A KR20230161426 A KR 20230161426A
Authority
KR
South Korea
Prior art keywords
particles
powder
less
resin
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237028418A
Other languages
English (en)
Korean (ko)
Inventor
미키 에가미
마사노부 다니구치
히로타다 아라카네
료 무라구치
Original Assignee
니끼 쇼꾸바이 카세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니끼 쇼꾸바이 카세이 가부시키가이샤 filed Critical 니끼 쇼꾸바이 카세이 가부시키가이샤
Publication of KR20230161426A publication Critical patent/KR20230161426A/ko
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • C01P2004/34Spheres hollow
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
KR1020237028418A 2021-03-31 2022-03-30 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 Pending KR20230161426A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-060588 2021-03-31
JP2021060588 2021-03-31
PCT/JP2022/016128 WO2022210919A1 (ja) 2021-03-31 2022-03-30 粉体及びその製造方法、並びに樹脂組成物の製造方法

Publications (1)

Publication Number Publication Date
KR20230161426A true KR20230161426A (ko) 2023-11-27

Family

ID=83459581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237028418A Pending KR20230161426A (ko) 2021-03-31 2022-03-30 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2022210919A1 (https=)
KR (1) KR20230161426A (https=)
CN (1) CN116867738A (https=)
TW (1) TW202302744A (https=)
WO (1) WO2022210919A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
JP2006516297A (ja) 2003-01-28 2006-06-29 松下電工株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板
WO2009041137A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
JP2017057352A (ja) 2015-09-18 2017-03-23 三菱瓦斯化学株式会社 プリプレグ
JP2019172962A (ja) 2018-03-26 2019-10-10 ダイキン工業株式会社 フッ素樹脂材料、高周波伝送用フッ素樹脂材料および高周波伝送用被覆電線

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001002314A1 (fr) * 1999-06-30 2001-01-11 Asahi Glass Company, Limited Fines spheres creuses de verre et procede de preparation associe
JP2005053744A (ja) * 2003-08-05 2005-03-03 Dsl Japan Co Ltd 高吸油性非晶質シリカ粒子
JP5241199B2 (ja) * 2007-10-29 2013-07-17 日揮触媒化成株式会社 繊維状中空シリカ微粒子の製造方法および反射防止被膜付基材
CN102471590B (zh) * 2009-07-14 2015-05-20 花王株式会社 低介电树脂组合物
JP5762120B2 (ja) * 2010-05-11 2015-08-12 日揮触媒化成株式会社 シリカ系粒子の製造方法
JP5440385B2 (ja) * 2010-05-25 2014-03-12 いすゞ自動車株式会社 排ガス浄化システム
JP5822663B2 (ja) * 2011-11-11 2015-11-24 日揮触媒化成株式会社 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
JP2018083759A (ja) * 2015-03-24 2018-05-31 旭硝子株式会社 化粧料
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。
JP6255053B2 (ja) * 2016-04-20 2017-12-27 花王株式会社 中空シリカ粒子及びその製造方法
JP7311258B2 (ja) * 2018-09-28 2023-07-19 日揮触媒化成株式会社 球状粒子の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
JP2006516297A (ja) 2003-01-28 2006-06-29 松下電工株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板
WO2009041137A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
JP2017057352A (ja) 2015-09-18 2017-03-23 三菱瓦斯化学株式会社 プリプレグ
JP2019172962A (ja) 2018-03-26 2019-10-10 ダイキン工業株式会社 フッ素樹脂材料、高周波伝送用フッ素樹脂材料および高周波伝送用被覆電線

Also Published As

Publication number Publication date
TW202302744A (zh) 2023-01-16
CN116867738A (zh) 2023-10-10
WO2022210919A1 (ja) 2022-10-06
JPWO2022210919A1 (https=) 2022-10-06

Similar Documents

Publication Publication Date Title
CN116529321B (zh) 空心颗粒及其制造方法以及树脂组合物
US12441892B2 (en) Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder
JP7853955B2 (ja) 粉体及びその製造方法、並びに樹脂組成物の製造方法
CN1464863A (zh) 球状氧化物粉末的制造方法及球状粉末制造装置、复合电介质材料、基板及基板的制造方法
KR20230113158A (ko) 저유전 비정질 실리카 분체 및 그 제조 방법, 그리고 표면처리 저유전 실리카 분체, 실리카 슬러리, 실리카 함유 수지 조성물, 실리카 함유 프리프레그 및 프린트 배선판
CN114980495A (zh) 具有频率依赖性小的介电特性的树脂基板
WO2022254960A1 (ja) 低誘電損失樹脂組成物、その製造方法、高周波機器用成形体及び高周波機器
WO2023008290A1 (ja) 球状シリカ粉末及び球状シリカ粉末の製造方法
KR20230161426A (ko) 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법
JP2023150838A (ja) 粉体及びその製造方法、並びに樹脂組成物の製造方法
JP2024146810A (ja) 中空粒子を含む粉体、及びその製造方法
KR20240147553A (ko) 중공 입자를 포함하는 분체, 및 그 제조 방법
JP2023151180A (ja) シリカ系中空粒子及びその製造方法
WO2024095851A1 (ja) 中空粒子、中空粒子の製造方法、樹脂組成物及び樹脂構造体
JP2025153627A (ja) 粉体及びその製造方法、並びに樹脂組成物
CN114828394A (zh) 毫米波用高速通信低介电基板
WO2025182883A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
EP2213633B1 (en) Process for producing flaky-glass granule, flaky-glass granule, and resin composition containing the same
CN118724005A (zh) 含有中空粒子的粉体及其制造方法
WO2025182884A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
CN118146614A (zh) 用于电路板的塞孔树脂组合物及其制备方法、塞孔电路板
WO2024237111A1 (ja) 球状シリカ粉末および球状シリカ粉末の製造方法
CN107109048A (zh) 含颗粒聚(亚苯基醚)的清漆组合物、由其制备的复合物和层压体、及形成复合物的方法
JP2015174996A (ja) ポリフェニレンエーテル粉体

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902