KR20230150115A - Semiconductor strip grinding method and apparatus - Google Patents

Abstract

A semiconductor strip grinding method and an apparatus are disclosed. The semiconductor strip grinding method comprises the steps of: vacuum-adsorbing a semiconductor strip onto a chuck table; rotating a grinding wheel with grinding stones mounted on a lower surface; and grinding the surface area of the semiconductor strip to a preset roughing thickness from an edge area toward a central area by moving the chuck table horizontally until the edge of the grinding wheel is located above the center of the chuck table while rotating the chuck table. Thus, the present invention can provide the semiconductor strip grinding method that can shorten the time required for a grinding process and the semiconductor strip grinding device suitable for performing the same.

Description

Semiconductor strip grinding method and apparatus {SEMICONDUCTOR STRIP GRINDING METHOD AND APPARATUS}

Embodiments of the present invention relate to a method and apparatus for grinding a semiconductor strip. More specifically, it relates to a semiconductor strip grinding method for reducing the thickness of a semiconductor strip by grinding the protective molding layer of the semiconductor strip manufactured by a die bonding process and a molding process, and an apparatus for performing the same.

The semiconductor strip can be manufactured through a die bonding process of bonding a semiconductor die on a substrate such as a printed circuit board or lead frame and a molding process of packaging the semiconductor die using a molding resin such as an epoxy resin, and the semiconductor strip Semiconductor packages can be manufactured through a cutting and sorting process that cuts, individualizes, and sorts through pass/fail judgment.

The semiconductor strip grinding device may be used to grind and remove the surface portion of the protective molding layer made of the molding resin in order to reduce the thickness of the semiconductor strip manufactured as described above to a preset thickness. The semiconductor strip grinding device may include a chuck table for supporting the semiconductor strip and a grinding module for grinding and removing a surface portion of the semiconductor strip.

The grinding process for the semiconductor strip includes a roughing process in which the surface area of the semiconductor strip is quickly and roughly cut to a preset thickness, and after performing the roughing process, the surface area of the semiconductor strip is cut in order to process the semiconductor strip to a target thickness. It can be divided into a finishing process that involves precise cutting. However, in the case of the roughing process as well as the finishing process, grinding is mainly performed using the lower surfaces of grinding stones. Therefore, in order to cut the surface area of the semiconductor strip by the preset roughing thickness, the preset roughing thickness is divided into several times and roughing is performed. The process needs to be performed repeatedly several times, and accordingly, there is a limit to shortening the total time required for the grinding process. In addition, when the roughing step is repeatedly performed several times, wear of the lower surfaces of the grinding wheels increases and foreign matter accumulates on the lower surfaces of the grinding stones, which may deteriorate the surface quality of the semiconductor strip in the subsequent finishing process. .

Republic of Korea Patent Publication No. 10-1675271 (registration date: November 7, 2016) Republic of Korea Patent Publication No. 10-1851383 (registration date April 17, 2018)

The purpose of embodiments of the present invention is to provide a semiconductor strip grinding method that can shorten the time required for the grinding process and a semiconductor strip grinding device suitable for performing the same.

A semiconductor strip grinding method according to an aspect of the present invention for achieving the above object includes the steps of vacuum adsorbing a semiconductor strip on a chuck table, rotating a grinding wheel on which grinding stones are mounted on the lower surface of the chuck, While rotating the table, the chuck table is moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table, and the surface of the semiconductor strip is subjected to a preset roughing process from the edge to the center. It may include the step of grinding to the thickness.

A semiconductor strip grinding method according to another aspect of the present invention for achieving the above object includes vacuum adsorbing a plurality of semiconductor strips on a chuck table, rotating a grinding wheel on which grinding stones are mounted on the lower surface, While rotating the chuck table, the chuck table is moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table, so that the surface of the semiconductor strips is adjacent to the edge of the chuck table. It may include grinding a preset roughing thickness from one side toward the other side adjacent to the center of the chuck table.

According to some embodiments of the present invention, the grinding wheel may be arranged to be inclined at a predetermined angle with respect to the first horizontal direction so that grinding occurs in a front portion of the grinding wheel based on the rotation direction of the chuck table.

According to some embodiments of the present invention, the center portion of the upper surface of the chuck table is configured to be higher than the edge portion of the chuck table, and the grinding wheel is parallel to one portion of the upper surface of the chuck table in the second horizontal direction. The grinding wheel may be arranged to be inclined at a predetermined angle with respect to the second horizontal direction.

A semiconductor strip grinding device according to another aspect of the present invention for achieving the above object includes a chuck table configured to enable horizontal movement and rotation and vacuum adsorption of the semiconductor strip, and a grinding wheel equipped with a plurality of grinding stones on the lower surface. It may include a grinding module that includes a wheel and rotates the grinding wheel to remove the surface portion of the semiconductor strip vacuum adsorbed on the chuck table, and a control unit that controls operations of the chuck table and the grinding module. . At this time, the control unit rotates the grinding wheel and rotates the chuck table to grind the surface portion of the semiconductor strip from the edge portion toward the center portion to a preset roughing thickness while the edge portion of the grinding wheel is rotated by the chuck. The chuck table can be moved in the horizontal direction until it is located at the top of the center portion of the table.

A semiconductor strip grinding device according to another aspect of the present invention for achieving the above object includes a chuck table configured to enable horizontal movement and rotation and vacuum adsorption of a plurality of semiconductor strips, and a plurality of grinding stones on the lower surface. a grinding module that includes a grinding wheel mounted on the chuck table and rotates the grinding wheel to remove surface portions of the semiconductor strips vacuum-adsorbed on the chuck table; and a control unit that controls operations of the chuck table and the grinding module. It can be included. At this time, the control unit rotates the grinding wheel and grinds the surface portion of the semiconductor strips to a preset roughing thickness from one side adjacent to the edge portion of the chuck table toward the other portion adjacent to the center portion of the chuck table. To this end, while rotating the chuck table, the chuck table can be moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table.

According to some embodiments of the present invention, the grinding wheel may be configured to be inclined at a predetermined angle with respect to the first horizontal direction so that grinding occurs in a front portion of the grinding wheel based on the rotation direction of the chuck table.

According to some embodiments of the present invention, the center portion of the upper surface of the chuck table is configured to be higher than the edge portion of the chuck table, and the grinding wheel is parallel to one side of the upper surface of the chuck table in the second horizontal direction. It may be configured to be inclined at a predetermined angle with respect to the second horizontal direction.

According to some embodiments of the present invention, the grinding stones are arranged in the circumferential direction along the edge of the lower surface of the grinding wheel, and the control unit positions the center portion of the grinding stones above the center portion of the chuck table. The chuck table can be moved horizontally as much as possible.

According to some embodiments of the present invention, the semiconductor strip grinding device includes a strip supply module for supplying the semiconductor strip and recovering the semiconductor strip on which a grinding process has been performed by the grinding module, the chuck table, and the strip. A rotary transfer module disposed between supply modules and including a picker for picking up the semiconductor strip and a rotary unit for rotating the picker to transport the semiconductor strip between the chuck table and the strip supply module, the chuck table It is configured to be movable in the horizontal direction between the picker and the picker and may further include a cleaning module for removing foreign substances from the chuck table, the picker, and the semiconductor strip.

According to the embodiments of the present invention as described above, the grinding wheel is rotated and the chuck table is rotated and moved in the horizontal direction, that is, the chuck table is rotated and horizontally moved simultaneously so that the surface of the semiconductor strip The area can be removed at once by the preset roughing thickness. In particular, while performing the above steps, the surface area of the semiconductor strip can be cut not only by the lower surface of the grinding stones but also by the side surface, so compared to the prior art, the preset roughing thickness is cut through a single roughing process. Since the surface portion of the semiconductor strip can be removed, the overall time required for grinding the semiconductor strip can be greatly shortened. In addition, during the rough grinding process, wear on the lower surfaces of the grinding wheels is reduced and accumulation of foreign substances on the lower surfaces of the grinding stones is reduced, so that the surface quality of the semiconductor strip can be improved in the subsequent finishing process.

1 is a flowchart for explaining a semiconductor strip grinding method according to an embodiment of the present invention.
FIG. 2 is a schematic plan view illustrating a semiconductor strip grinding device suitable for performing the semiconductor strip grinding method shown in FIG. 1.
FIG. 3 is a schematic side view for explaining the chuck table and grinding module shown in FIG. 2.
FIGS. 4 to 7 are schematic plan views illustrating types of semiconductor strips that can be supplied onto the chuck table shown in FIG. 2.
8 to 11 are schematic plan views for explaining the semiconductor strip grinding method shown in FIG. 1.
FIG. 12 is a schematic side view for explaining the semiconductor strip grinding method shown in FIG. 1.
FIG. 13 is a schematic plan view illustrating a semiconductor strip ground by the semiconductor strip grinding method shown in FIG. 1.
FIG. 14 is a schematic front view illustrating the chuck table and grinding wheel shown in FIG. 3.
FIG. 15 is a schematic side view for explaining the chuck table and grinding wheel shown in FIG. 3.
16 to 18 are schematic plan views for explaining another example of the semiconductor strip grinding method previously described with reference to FIGS. 8 to 13.
Figure 19 is a schematic side view for explaining another example of the semiconductor strip grinding method previously described with reference to Figures 8 to 13.
Figures 20 and 21 are schematic side views for explaining the cleaning module shown in Figure 2.
FIG. 22 is a schematic plan view for explaining the strip supply module shown in FIG. 2.
FIG. 23 is a schematic side view for explaining the strip supply module shown in FIG. 22.
FIG. 24 is an enlarged side view for explaining the support rails and clamp members shown in FIGS. 22 and 23.
Figure 25 is a plan view for explaining the support rails and clamp members shown in Figures 22 and 23.
FIG. 26 is a bottom view for explaining the support rails and clamp members shown in FIGS. 22 and 23.
FIGS. 27 and 28 are schematic plan views for explaining the operation of the clamp members shown in FIGS. 24 to 26.
Figure 29 is a schematic front view for explaining the clamp members shown in Figures 24 to 26.
FIGS. 30 to 32 are schematic plan views for explaining the operation of the linear transfer unit and the fourth rotation driver shown in FIGS. 22 and 23.
Figures 33 and 34 are schematic enlarged side views for explaining the stopper shown in Figure 29.
Figure 35 is an enlarged side view showing the clamp member shown in Figures 33 and 34 in a fully open state.
Figure 36 is an enlarged plan view for explaining the support rail and clamp member shown in Figures 33 to 35.
FIG. 37 is a schematic side view for explaining the drying unit shown in FIG. 23.
FIG. 38 is a schematic plan view illustrating a state in which the rotation angle of the transfer table shown in FIG. 22 is adjusted.
FIG. 39 is a schematic plan view for explaining the lift unit shown in FIG. 37.
FIG. 40 is a schematic side view for explaining the operation of the lift unit shown in FIG. 37.
FIG. 41 is a schematic bottom view for explaining another example of the clamp driving unit shown in FIG. 26.
FIG. 42 is a schematic plan view for explaining another example of the transfer table shown in FIG. 25.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

FIG. 1 is a flowchart for explaining a semiconductor strip grinding method according to an embodiment of the present invention, and FIG. 2 is a schematic plan view for explaining a semiconductor strip grinding device suitable for performing the semiconductor strip grinding method shown in FIG. 1. .

1 and 2, the semiconductor strip grinding method according to an embodiment of the present invention can be used to grind and remove the surface portion of the semiconductor strip 10. For example, the semiconductor strip 10 may include a mold portion 10B (see FIG. 4) for protecting semiconductor elements mounted on a printed circuit board 10A (see FIG. 4) or a semiconductor wafer. A semiconductor strip grinding method may be used to remove the surface portion of the mold portion 10B so that the mold portion 10B has a preset thickness.

The semiconductor strip grinding apparatus 100 for performing the semiconductor strip grinding method includes a chuck table 110 for supporting and vacuum adsorbing the semiconductor strip 10, and the semiconductor strip loaded on the chuck table 110. A grinding module 120 for grinding and removing the surface portion of (10), for supplying the semiconductor strip 10 and for recovering the semiconductor strip 10 on which the grinding process has been performed by the grinding module 120. It may include a strip supply module 170 and a rotary transfer module 150 for transporting the semiconductor strip 10 between the chuck table 110 and the strip supply module 170. The rotary transfer module 150 may be disposed between the chuck table 110 and the strip supply module 170, and includes a picker 152 for picking up the semiconductor strip 10 and the semiconductor strip 10. A rotary unit 156 that rotates the picker 152 may be provided to transfer the picker 152 between the chuck table 110 and the strip supply module 170.

For example, the semiconductor strip grinding apparatus 100 includes a plurality of chuck tables 110 and a plurality of grinding modules for grinding the semiconductor strips 10 loaded on the chuck tables 110. It may include 120 and a plurality of strip supply modules 170 for supplying the semiconductor strips 10. In particular, the semiconductor strip grinding apparatus 100 includes a pair of chuck tables 110 arranged in the X-axis direction as shown, and a pair of chuck tables 110 arranged in the X-axis direction to correspond to the chuck tables 110. It may include grinding modules 120 and a pair of strip supply modules 170 spaced apart from the chuck tables 110 in the Y-axis direction and arranged in the X-axis direction.

The rotary transfer module 150 may be disposed between the chuck tables 110 and the strip supply modules 170, and includes a plurality of pickers 152 and a rotary for rotating the pickers 152. It may include unit 156. For example, as shown, the rotary transfer module 150 may include four pickers 152. In this case, while the semiconductor strips 10 are transferred between two of the pickers 152 and the chuck tables 110, the remaining two of the pickers 152 Transfer of the semiconductor strips 10 may be performed between pickers 152 and the strip supply modules 170 .

For example, after the two pickers 152 pick up semiconductor strips 10 from the strip supply modules 170, the rotary unit 156 moves the two pickers 152 to the chuck. The pickers 152 can be rotated so that they are positioned on top of the tables 110. At this time, the remaining two pickers 152 may be positioned above the strip supply modules 170, and the semiconductor strips 10 may be placed on the chuck tables by the two pickers 152. The remaining two pickers 152 may pick up subsequent semiconductor strips 10 from the semiconductor strip supply modules 170 while being loaded onto 110 . As a result, since the semiconductor strips 10 can be transported simultaneously using the four pickers 152 as described above, the time required to transport the semiconductor strips 10 can be greatly shortened.

Meanwhile, the method of transporting the semiconductor strips 10 as described above can be applied when the grinding process using the grinding modules 120 is the same. That is, when all of the grinding modules 120 perform a rough grinding process or all perform a finishing process, the semiconductor strips 10 can be supplied to the grinding modules 120 at the same time.

As another example, when one of the grinding modules 120 performs a roughing process and the other one performs a finishing process, the rotary transfer module 150 provides the semiconductor strips to the grinding modules 120. (10) can be supplied sequentially. In this case, one of the strip supply modules 170 functions as a loader for supplying the semiconductor strips 10, and the other functions as a loader for supplying the semiconductor strips 10 on which the roughing process and the grinding process have been performed. ) can function as an unloader to recover. Also, in this case, the supply of the semiconductor strips 10 for the roughing process and the finishing process, the supply of the semiconductor strip 10 from the loader, and the recovery of the semiconductor strip 10 to the unloader are carried out by the rotary transport. It can be performed simultaneously by the module 150.

In addition, the rotary transfer module 150 is provided with picker drivers 158 that move the pickers 152 in the vertical direction for a pick and place operation for the semiconductor strips 10. can do. For example, the rotary unit 150 may be provided with a plurality of rotary arms 160 on which the pickers 152 and the picker driving units 158 are mounted. In this case, the pickers 152 It may be disposed below the ends of the rotary arms 160, and the picker driving units 158 may be disposed on the ends of the rotary arms 160. As an example, as shown, the rotary arms 160 may be arranged to be perpendicular to each other in the vertical direction.

FIG. 3 is a schematic side view for explaining the chuck table and grinding module shown in FIG. 2.

Referring to FIG. 3, each of the grinding modules 120 includes a plurality of grinding stones 122 for grinding the surface of the semiconductor strip 10, and a grinding wheel on which the grinding stones 122 are mounted. It may include (124) and a first rotation drive unit 126 for rotating the grinding wheel 124. In particular, the grinding stones 122 may be arranged in a circumferential direction along the edge of the lower surface of the grinding wheel 124.

The semiconductor strip grinding device 100 is a device for moving the chuck tables 110 in a horizontal direction, for example, in the Y-axis direction, between the grinding modules 120 and the rotary transfer module 150. 1 may include horizontal driving units 114. Specifically, the first horizontal driving units 114 can move the chuck tables 110 below the rotational movement path of the pickers 152, and place the semiconductor strip on the chuck tables 110. After the grinding modules 10 are loaded, the chuck tables 110 may be moved below the grinding modules 120. In addition, the first horizontal drivers 114 move the chuck tables 110 to the pickers 152 after a grinding process is performed on the semiconductor strips 10 by the grinding modules 120. It can be moved under the rotational movement path.

In addition, each of the grinding modules 120 may include a first vertical driving unit 127 for adjusting the height of the grinding stones 122 and the grinding wheel 124. The first vertical driver may adjust the grinding thickness of the semiconductor strips 10 by adjusting the height of the grinding wheel 124. However, unlike the above, second vertical driving units (not shown) that move the chuck tables 110 in the vertical direction may be provided to adjust the height of the semiconductor strips 10.

The first horizontal drivers 114 may move the chuck tables 110 in a horizontal direction, for example, the Y-axis direction, while a grinding process on the semiconductor strips 10 is performed. At this time, a cleaning liquid spray nozzle 128 may be disposed on one side of the grinding modules 120 to spray a cleaning liquid onto the semiconductor strips 10 to remove foreign substances while the grinding process is performed. As an example, water may be used as the cleaning liquid.

In addition, although not shown, a cleaning liquid is sprayed at the lower part of the grinding modules 120 toward the grinding stones 122 to remove foreign substances from the grinding stones 122 while the grinding process is performed. A cleaning liquid spray nozzle (not shown) may be disposed. In addition, although not shown, on one side of the grinding modules 120 are the semiconductor strips while the grinding process of the semiconductor strips 10 is performed and after the grinding process of the semiconductor strips 10 is performed. Sensor units (not shown) for measuring the thickness of (10) may be disposed.

Referring again to FIG. 2 , a plurality of vacuum holes (not shown) may be provided on the upper portions of the chuck tables 110 to secure the semiconductor strips 10 by vacuum suction. Specifically, vacuum suction areas 112 in which the vacuum holes are formed may be provided on the upper part of the chuck tables 110, and the number and direction of the vacuum suction areas 112 are determined by each chuck table. (110) can be varied depending on the number and size of the semiconductor strips 10 placed on it. For example, as shown, two vacuum adsorption areas 112 may be provided on each chuck table 110 to vacuum adsorb two semiconductor strips 10.

According to one embodiment of the present invention, the semiconductor strip grinding apparatus 100 may include second rotation driving units 116 for rotating each of the chuck tables 110. The second rotation drivers 116 allow the chuck tables 110 to move the semiconductor strip under the rotational movement path of the pickers 152, that is, between the chuck tables 110 and the pickers 152. In the area where the suction cups 10 are delivered, the rotation angle of the chuck tables 110 can be adjusted so that the vacuum suction areas 112 correspond to the pickers 152.

For example, although not shown in detail, each of the pickers 152 may be provided with pickup tools 154 for picking up the semiconductor strips 10 by vacuum suction, and the second rotation driving units ( 116) indicates that the direction of the vacuum adsorption areas 112 of the chuck tables 110 is the pickup tools 154 of the pickers 152 or the semiconductor strips 10 picked up by the pickup tools 154. The rotation angle of the chuck tables 110 can be adjusted to match the direction of .

Additionally, the semiconductor strip grinding apparatus 100 may include dressing modules 130 for performing a dressing operation on the grinding stones 122 . As an example, the dressing modules 130 are connected to the grinding wheels 122 while transfer of the semiconductor strips 10 is performed between the chuck tables 110 and the pickers 152. Dressing work can be performed. Referring to FIG. 2, each dressing module 130 includes a dressing wheel 132 for improving the surface condition of the grinding stones 122 and removing foreign substances from the grinding stones 122, and the dressing A third rotation drive unit 134 for rotating the wheel 132, and a horizontal direction for the dressing wheel 132 such that the dressing wheel 132 is positioned below the grinding wheels 122, for example, It may include a second horizontal driving unit 136 that moves in the Y-axis direction.

FIGS. 4 to 7 are schematic plan views illustrating types of semiconductor strips that can be supplied onto the chuck table shown in FIG. 2.

Referring to FIGS. 4 to 7 , a vacuum suction area 112 for vacuum suction of the semiconductor strip 10 may be provided on the chuck table 110 . For example, when two semiconductor strips 10 are supplied as shown in Figure 4, two vacuum adsorption areas 112 may be provided, and large-area printing as shown in Figures 5 and 6 In the case of the semiconductor strips 12 and 14 in which square or circular mold parts 12B and 14B are formed on the circuit boards 12A and 14A, one vacuum suction area 112A may be provided. In addition, as shown in FIG. 7, in the case of a circular semiconductor strip 16 in which a mold portion is formed on a semiconductor wafer (not shown), a circular vacuum suction area 112B may be provided. In addition, the above has described the case where one or two semiconductor strips 10, 12, 14, and 16 are supplied, but differently from the above, three or more semiconductor strips may be loaded onto the chuck table 110. In this case, a plurality of vacuum suction areas may be provided on the chuck table 110 depending on the number of semiconductor strips 10, 12, 14, and 16 to be loaded.

Hereinafter, a semiconductor strip grinding method according to an embodiment of the present invention will be described with reference to the attached drawings. For reference, for convenience of explanation, the circular semiconductor strip 16 will be described as an example.

8 to 11 are schematic plan views for explaining the semiconductor strip grinding method shown in FIG. 1, and FIG. 12 is a schematic side view for explaining the semiconductor strip grinding method shown in FIG. 1.

Referring to FIGS. 1 and 8 to 12 , in step S100, the semiconductor strip 16 may be loaded onto the chuck table 110 and then vacuum-sucked onto the chuck table 110 . Specifically, the semiconductor strip 16 may be transferred onto the chuck table 110 by the rotary transfer module 150, and the chuck table 110 may use the vacuum suction area 112B to The semiconductor strip 16 may be vacuum adsorbed. Subsequently, the chuck table 110 may be transported below the grinding module by the first horizontal driving unit 114.

In step S110, the grinding wheel 124 may be rotated by the first rotation driving unit 126. At this time, the height of the grinding wheel 124 can be adjusted by the first vertical driving unit 127.

In step S120, the second rotation driver 116 may rotate the chuck table 110, and at the same time, the first horizontal driver 114 may rotate the edge of the grinding wheel 124 so that the chuck table 110 ) The chuck table 110 may be moved at low speed in the horizontal direction, for example, in the Y-axis direction, until it is located at the upper part of the center portion of the chuck table 110. Accordingly, as shown in FIG. 12, the surface portion of the semiconductor strip 16 may be ground from the outside to the inside, that is, the surface portion of the semiconductor strip 16 may be ground from the edge portion toward the center portion. In particular, the height of the grinding wheel 124 is such that when the edge of the grinding wheel 124 is located above the center of the chuck table 110, the surface of the semiconductor strip 16 is equal to the preset roughing thickness. It can be adjusted in advance by the first vertical driving unit 127 to be removed.

Additionally, while step S120 is performed, the surface portion of the semiconductor strip 16 may be cut by not only the lower surface but also the side portions of the grinding stones 122. In addition, the surface portion of the semiconductor strip 16 can be removed at a time by the preset roughing thickness by rotating and horizontally moving the chuck table 110, thereby reducing the amount required for grinding the semiconductor strip 16. The overall time can be greatly reduced compared to the prior art.

Meanwhile, although the grinding method for the circular semiconductor strip 16 has been described above, the grinding method can be equally applied even when the semiconductor strip 12 or 14 having a square shape is supplied. In addition, although not shown, a finishing process on the semiconductor strip 16 may be performed by finely adjusting the height of the grinding wheel 124 after the roughing process as described above is performed.

FIG. 13 is a schematic plan view for explaining a semiconductor strip ground by the semiconductor strip grinding method shown in FIG. 1, and FIG. 14 is a schematic front view for explaining the chuck table and grinding wheel shown in FIG. 3. FIG. 15 is a schematic side view for explaining the chuck table and grinding wheel shown in FIG. 3.

Referring to FIG. 13, in order to more precisely and uniformly grind the surface area of the semiconductor strip 16, while the chuck table 110 rotates, the grinding wheel ( Grinding of the surface of the semiconductor strip 16 is performed at the front part ('A'; see Figure 11) of the grinding wheel 124, and the semiconductor strip is ground at the rear part ('B'; see Figure 11) of the grinding wheel 124. It is desirable that the surface area of (16) is not ground. When grinding is performed only at the front portion (A) of the grinding wheel 124 as described above, a pinwheel-shaped pattern as shown in FIG. 13 may be formed on the surface portion of the semiconductor strip 16 after the grinding process is completed. there is.

14 and 15 show the chuck table 110 and the grinding wheel 124 in exaggerated form for convenience of explanation, and accordingly, the shapes of the chuck table 110 and the grinding wheel 124 are shown in FIGS. may differ greatly from reality.

Referring to FIG. 14, as described above, the grinding wheel 124 is positioned in a first horizontal direction, for example, in the It can be arranged to be inclined by a predetermined first angle.

In addition, referring to FIG. 15, the center portion of the upper surface of the chuck table 110 may be configured to be higher than the edge portion of the chuck table 110 so that the upper surface portion of the chuck table 110 has a cone shape. The grinding wheel 124 is aligned with respect to the second horizontal direction so that the grinding wheel 124 is parallel to one side of the upper surface of the chuck table 110 and a second horizontal direction, for example, the Y-axis direction. It can be arranged to be inclined by a predetermined second angle.

As an example, the height of the center portion of the chuck table 110 may be configured to be higher by several μm, for example, about 5 μm, than the edge portion of the chuck table 110, and the semiconductor strip 16 may be configured to be higher than the edge portion of the chuck table 110. It may be vacuum adsorbed to the upper surface of the table 110. In addition, the first angle and the second angle of the grinding wheel 124 may be appropriately adjusted according to the inclination of the upper surface of the chuck table 110.

Meanwhile, the grinding stones 122 may be arranged in the circumferential direction along the edge of the lower surface of the grinding wheel 124, and the first horizontal driving unit 114 is located at the center of the grinding stones 122. The chuck table 110 may be horizontally moved so that it is located above the center portion of the chuck table 110. That is, at this position, the grinding stones 122 may be rotated to pass through the upper part of the center portion of the chuck table 110.

On the other hand, the operations of the chuck table 110 and the grinding module 120 may be controlled by the control unit 102 (see FIG. 2). That is, the first horizontal drive unit 114 for horizontal movement of the chuck table 110, the second rotation drive unit 116 for rotation of the chuck table 110, and the height adjustment of the grinding wheel 124. The operations of the first vertical drive unit 127 for and the first rotation drive unit 126 for rotation of the grinding wheel 124 may be controlled by the control unit 102.

16 to 18 are schematic plan views for explaining another example of the semiconductor strip grinding method previously described with reference to FIGS. 8 to 13, and FIG. 19 is a schematic plan view of the semiconductor strip grinding method previously described with reference to FIGS. 8 to 13. This is a schematic side view to explain another example of the method.

Referring to FIG. 16, a plurality of semiconductor strips 10, for example, two semiconductor strips 10 as shown, may be loaded on the chuck table 110, and the semiconductor strips ( 10) may be vacuum adsorbed by vacuum adsorption areas 112 provided on the chuck table 110. Subsequently, the grinding wheel 124 may be rotated by the first rotation driving unit 126, and the height of the grinding wheel 124 may be adjusted by the first vertical driving unit 127.

17 and 18, the second rotation driver 116 can rotate the chuck table 110, and at the same time, the first horizontal driver 114 moves the edge of the grinding wheel 124. The chuck table 110 may be moved at low speed in the horizontal direction, for example, in the Y-axis direction, until it is located at the top of the center portion of the chuck table 110. Accordingly, as shown in FIG. 19, the surface area of the semiconductor strips 10 extends from one side adjacent to the edge of the chuck table 110 to the other side adjacent to the center of the chuck table 110. Can be grinded towards. In particular, the height of the grinding wheel 124 is such that when the edge portion of the grinding wheel 124 is located above the center portion of the chuck table 110, the surface portion of the semiconductor strips 10 has a preset roughing thickness. It can be adjusted in advance by the first vertical driving unit 127 to remove as much as possible.

Additionally, while the above grinding steps are performed, the surface portions of the semiconductor strips 10 may be cut by the side portions as well as the lower surfaces of the grinding stones 122. In addition, the surface portion of the semiconductor strips 10 can be removed at a time by the preset roughing thickness by rotating and horizontally moving the chuck table 110, thereby reducing the amount of time required for grinding the semiconductor strips 10. The overall time can be greatly reduced compared to the prior art.

Meanwhile, although the case where two semiconductor strips 10 are supplied has been described above, the grinding method can be equally applied even when three or more semiconductor strips are supplied. In addition, although not shown, a finishing process on the semiconductor strips 10 may be performed by finely adjusting the height of the grinding wheel 124 after the roughing process is performed.

Referring again to FIG. 2, the semiconductor strip grinding device 100 is configured to be movable in a horizontal direction, for example, in the Y-axis direction, between the chuck tables 110 and the pickers 152. It may include chuck tables 110, the pickers 152, and cleaning modules 140 for removing foreign substances from the semiconductor strips 10.

Figures 20 and 21 are schematic side views for explaining the cleaning module shown in Figure 2.

20 and 21, each of the cleaning modules 140 includes cleaning liquid spray nozzles 142 for spraying cleaning liquid upward and downward, respectively, and air spray nozzles for spraying air upward and downward, respectively. It may include a nozzle assembly 146 including elements 144, and a nozzle driver 148 for moving the nozzle assembly 146 in a horizontal direction, for example, in the Y-axis direction.

For example, as shown in FIG. 20, after the picker 152 is positioned on the upper part of the chuck table 110 to load the semiconductor strips 10 onto the chuck table 110, the The nozzle driver 148 operates the nozzle assembly 146 to clean the lower surface of the semiconductor strips 10 picked up by the picker 152 and the upper surface of the chuck table 110. 10) and the chuck table 110 can be moved in the horizontal direction.

Subsequently, as shown in FIG. 21, after the semiconductor strips 10 are placed on the chuck table 110, the nozzle driver 148 moves the semiconductor strips 10 placed on the chuck table 110. ), the nozzle assembly 146 can be moved in the horizontal direction between the semiconductor strips 10 and the picker 152 to clean the upper surface and the lower surface of the picker 152.

In particular, the nozzle driver 148 can reciprocate the nozzle assembly 146 in the horizontal direction to clean the semiconductor strips 10, the chuck table 110, and the picker 152, Even after the grinding process is performed on the semiconductor strips 10, a cleaning operation is performed on the semiconductor strips 10, the chuck table 110, and the picker 152 as shown in FIGS. 21 and 20. can be performed.

After the cleaning operation of the semiconductor strips 10 by the cleaning modules 140 is completed, the rotary transfer module 150 transfers the semiconductor strips 10 on which the grinding process has been completed to the strip supply modules ( 170).

FIG. 22 is a schematic plan view for explaining the strip supply module shown in FIG. 2, and FIG. 23 is a schematic side view for explaining the strip supply module shown in FIG. 22.

2, 22, and 23, the strip supply module 170 includes a magazine port 172 where a magazine 20 for storing the plurality of semiconductor strips 10 is placed, and the picker. A transfer table 180 disposed below the rotational movement path of the fields 152 and on which the semiconductor strips 10 are placed, and the semiconductor strips 10 between the magazine 20 and the transfer table 180. It may include a linear transfer unit 200 for transferring.

The linear transfer unit 200 includes a pusher 202 that pushes one of the semiconductor strips 10 stored in the magazine 20 to protrude from the magazine 20, and the protruding semiconductor strip 10. a gripper 204 for gripping the gripper 104, a gripper driving unit 206 for moving the gripper 104 in a horizontal direction, for example, in the It may include a pair of transfer rails 208 for guiding between the transfer tables 180. The transfer rails 208 may be arranged parallel to each other in the horizontal direction, that is, the X-axis direction, to support and guide both sides of the semiconductor strip 10. In addition, although not shown, the strip supply module 170 is configured so that the semiconductor strip 10 to be withdrawn from among the semiconductor strips 10 stored in the magazine 20 corresponds to the transfer rails 208. It may include an elevator (not shown) that adjusts the height of the magazine 20.

Support rails 184 may be disposed on the transfer table 180 to support both sides of each of the semiconductor strips 10. For example, a pair of semiconductor strips 10 may be placed on the transfer table 180, and two pairs of supports are provided to support the pair of semiconductor strips 10 on the transfer table 180. Rails 184 may be arranged parallel to each other. In addition, the strip supply module 170 may include clamp members 186 for fixing the positions of the semiconductor strips 10 placed on the support rails 184.

FIG. 24 is an enlarged side view for explaining the support rails and clamp members shown in FIGS. 22 and 23, and FIG. 25 is a plan view for explaining the support rails and clamp members shown in FIGS. 22 and 23. 26 is a bottom view for explaining the support rails and clamp members shown in FIGS. 22 and 23. FIGS. 27 and 28 are schematic plan views for explaining the operation of the clamp members shown in FIGS. 24 to 26.

Referring to FIGS. 24 to 26 , the transfer table 180 may have a substantially square shape and may be provided with openings 182 to expose lower surfaces of the semiconductor strips 10 . The support rails 184 may extend parallel to each other, and each pair of support rails 184 is disposed on an edge of the transfer table 180 and has a relatively short first support rail 184A. ) and a second support rail 184B disposed on the central portion of the transfer table 180 and having a relatively long length.

Additionally, the clamp members 186 may be provided in two pairs to correspond to each of the support rails 184. The clamp members 186 may extend in parallel along the support rails 184, and each pair of clamp members 186 corresponds to the first support rail 184A and has a relatively short length. It may include a first clamp member 186A and a second clamp member 186B that corresponds to the second support rail 184B and is relatively long.

Each of the clamp members 186 may have a cross-section in the shape of an alphabet 'L', and the horizontal portion 186D (see FIG. 16) of the clamp members 186 clamps the side portions of the semiconductor strip 10. It may be placed on the upper part of the support rails 184 to cover it, and a vertical portion may be placed adjacent to the side of the support rails 184. In particular, according to one embodiment of the present invention, each of the strip supply modules 170 may include clamp drivers 188 for operating the clamp members 186. That is, the clamp drivers 188 can move the clamp members 186 in a direction perpendicular to the transport direction of the semiconductor strip 10, and thereby move the upper part of the support rails 184. It can be opened and closed.

For example, each of the clamp driving units 188 includes push members 190 disposed on both sides of the transfer table 180, and the push members 190 are centered around the transfer table 180. Pneumatic cylinders 192 for opening the clamp members 186 by pushing them in a direction, drive shafts 194 connecting the push members 190 and the clamp members 186, and the transmission Guide members 196 are mounted on the lower part of the table 180 to guide the drive shafts 194, and are disposed between the push members 190 and the guide members 196 and include the clamp members. It may include elastic members 198 that provide elastic restoring force to close (186).

Specifically, the first push member 190A disposed on one side of the transfer table 180 is connected to the second clamp member 186B of the adjacent clamp member pair 186 and the spaced apart clamp through the first drive shaft 194A. It may be connected to the first clamp member 186A of the member pair 186. In addition, in the case of the second push member 190B disposed on the other side of the transmission table 180, it is spaced apart from the second clamp member 186B of the adjacent clamp member pair 186 through the second drive shaft 194B. It may be connected to the first clamp member 186A of the clamp member pair 186.

As a result, as shown in FIG. 27, when the first pneumatic cylinder 192A pushes the first push member 190A, the second clamp member 186B of the adjacent clamp member pair 186 is spaced apart. The first clamp member 186A of the clamp member pair 186 may be opened downward. In addition, as shown in FIG. 28, when the second pneumatic cylinder 192B pushes the second push member 190B, the second clamp member 186B of the adjacent clamp member pair 186 and the spaced apart The first clamp member 186A of the clamp member pair 186 may be opened upward.

Referring again to FIG. 26, between the guide members 196 mounted on both sides of the bottom of the delivery table 180 and the first and second push members 190A and 190B, the first and second push members 190A, 190B 2 Coil springs that function as the elastic members 198 may be mounted to surround the drive shafts 194A and 194B, and open clamp members 186 as shown in FIGS. 27 and 28 are the elastic members. It can be closed by the restoring force of (198). That is, the clamp members 186 may be opened by the first and second pneumatic cylinders 192A and 192B, and when the first and second pneumatic cylinders 192A and 192B retract, the clamp members 186 may be opened by the first and second pneumatic cylinders 192A and 192B. It can be closed by elastic members 198.

Figure 29 is a schematic front view for explaining the clamp members shown in Figures 24 to 26.

Referring to FIGS. 24 and 29, the support rails 184 have step portions 184C formed in the longitudinal direction to guide the semiconductor strip 10, and are placed on the support rails 184. Separation of the semiconductor strip 10 in the width direction of the semiconductor strip 10 may be prevented by the step portion 184C. In addition, the semiconductor strip 10 may be prevented from being separated upward when the clamp members 186 are closed.

In particular, as shown in FIG. 29, stoppers are provided on both sides of the horizontal portion 186D of the clamp member 186 to prevent the semiconductor strip 10 from being separated in the longitudinal direction of the semiconductor strip 10. (186C) may be provided, and correspondingly, the support rails 184 may be provided with grooves 184D for movement of the stoppers 186C. In particular, when the clamp members 186 are opened by the clamp drivers 188, the transfer path of the semiconductor strip 10 on the support rails 184 is opened by the stoppers 186C. It can be open, and on the contrary, when the clamp members 186 are closed by the clamp drivers 188, the transfer path of the semiconductor strip 10 on the support rails 184 is connected to the stoppers ( 186C).

Specifically, in a state in which the clamp members 186 are opened by the first and second pneumatic cylinders 192A and 192B, the semiconductor strip 10 is moved to the support rail by the linear transfer unit 200. It can be transported in the horizontal direction on the step portion 184C of the strips 184, and then when the clamp members 186 are closed by the elastic members 198, the semiconductor strip 10 is In the The position can be fixed.

Referring again to FIGS. 22 and 23, the strip supply module 170 may include a fourth rotation drive unit 210 for rotating the transfer table 180, and transfer of the linear transfer unit 200. The rails 208 may be arranged to correspond to one of the two pairs of support rails 184, that is, their ends may be arranged adjacent to each other.

FIGS. 30 to 32 are schematic plan views for explaining the operation of the linear transfer unit and the fourth rotation driver shown in FIGS. 22 and 23.

30 to 32, the semiconductor strip 10 may be transferred onto one of the support rail pairs 184 by the linear transfer unit 200. At this time, the clamp members 186 may be opened by the first and second pneumatic cylinders 192A and 192B.

Subsequently, after the clamp members 186 are closed, the transfer table 180 may be rotated 180° by the fourth rotation driver 210. Subsequently, the clamp members 186 are opened and the subsequent semiconductor strip 10 can be transferred onto the remaining one of the support rail pairs 184.

Figures 33 and 34 are schematic enlarged side views for explaining the stopper shown in Figure 29, and Figure 35 is an enlarged side view showing the clamp member shown in Figures 33 and 34 in a fully open state.

Referring to FIGS. 33 and 34 , stoppers 186C may be provided on both sides of the lower surface of the horizontal portion 186D of the clamp member 186 to prevent the semiconductor strip 10 from being separated. According to one embodiment of the present invention, the stopper 186C may have a length shorter than the width of the clamp member 186, and an end of the stopper 186C is connected to the horizontal portion 186D of the clamp member 186. ) can be located more medially than the side. That is, as shown, the horizontal portion 186D of the clamp member 186 may protrude in the direction of the semiconductor strip 10 beyond the end of the stopper 186C.

Specifically, when the clamp members 186 are completely opened, especially as shown in FIG. 35, the clamp member 186 is completely opened and the horizontal portion 186D of the clamp member 186 is When the step portion 184C of the support rail 184 (see FIG. 29) does not exist above the semiconductor strip 10, the semiconductor strip 10 is separated while being transferred onto the support rails 184. This may occur. In particular, when bending occurs in the semiconductor strip 10 transported on the support rails 184, the possibility of separation of the semiconductor strip 10 increases, and also the semiconductor strip 10 is moved from the support. Even if the semiconductor strip 184 is transported on the rails 184, a portion of the semiconductor strip 184 may be higher than the clamp members 186, which may cause the clamp members 186 to not close afterward.

According to one embodiment of the present invention, the clamp member 186 is used to transport the semiconductor strip 10 by the clamp driver 188, and the stopper member 186C is used to meet the step of the support rails 184. A state that is sufficiently removed from the portion 184C and opened so that the horizontal portion 186D of the clamp member 186 partially remains on the upper part of the stepped portion 184C of the support rails 184 (hereinafter referred to as a partially open state) It can be said). As a result, as shown in FIG. 33, both sides of the semiconductor strip 10 are separated by the stepped portion 184C of the support rails 184 and the horizontal portion 186D of the clamp members 186. It can be transported on the support rails 184 in the partially open state located in the formed channels.

Figure 36 is an enlarged plan view for explaining the support rail and clamp member shown in Figures 33 to 35.

Referring to FIG. 36, a through hole 186E may be formed in the horizontal portion 186D of the clamp member 186 to penetrate the horizontal portion 186D for checking the open/closed state of the clamp member 186. there is. Specifically, the side portion of the support rail 184 can be observed through the through hole 186E, and the support rail 184 is visible on the upper part of the transfer table 180 through the through hole 186E. A camera unit 250 (see FIG. 22) may be disposed to detect the side area.

For example, through holes 186E may be provided on both sides of the clamp member 186, and the camera unit 250 may be installed on the upper part of the transfer table 180 in a horizontal direction, for example, It can be arranged to be movable in the X-axis direction. As an example, the camera unit 250 may be mounted on the gripper driving unit 206 of the linear transfer unit 200 as shown in FIG. 22.

The camera unit 250 may acquire an image of the through hole 186E, and the image may be analyzed by a control unit (not shown). The control unit can check the open/closed state of the clamp member 184 by calculating the size or width of the portion of the support rail 184 observed through the through hole 186E from the image. Additionally, in order to facilitate image analysis, the support rail 184 may be configured in a different color from the clamp member 186.

Referring again to FIG. 23 , the strip supply module 170 may include a drying unit 220 for cleaning and drying the semiconductor strips 10 placed on the transfer table 180. For example, the drying unit 220 may supply a cleaning liquid, for example, water, to remove foreign substances onto the semiconductor strips 10 and dry the semiconductor strips 10. Air can be supplied onto the fields 10. At this time, the transfer table 180 can be rotated at high speed by the fourth rotation driver 210, and the cleaning liquid supplied to the semiconductor strips 10 is removed by rotation of the transfer table 180. It can be.

FIG. 37 is a schematic side view for explaining the drying unit shown in FIG. 23.

Referring to FIG. 37, the strip supply module 170 may include a third vertical driving unit 212 for moving the transfer table 180 in the vertical direction. The third vertical driving unit 212 has a first height at which transfer of the semiconductor strips 10 is performed between the linear transfer unit 200 and the transfer table 180, and the transfer table 180 and the transfer table 180. A height of the transfer table 180 with a second height at which transfer of the semiconductor strips 10 is performed between pickers 152 and a third height at which cleaning and drying of the semiconductor strips 10 are performed. can be adjusted. For example, the second height may be set higher than the first height, and the third height may be set lower than the first height. That is, cleaning and drying of the semiconductor strips 10 may be performed at a height lower than the height at which the semiconductor strips 10 are transferred by the linear transfer unit 200.

Specifically, the transfer table 180 is connected to the fourth rotation drive unit 210 and the third vertical drive unit 212 using a spline shaft 214 and a spline nut 216 to enable rotation and vertical movement. can be connected In addition, as an example, the fourth rotation drive unit 210 may be connected to the spline shaft 214 using a motor, a belt, a pulley, etc., and the third vertical drive unit 212 may be connected to a motor, a ball screw, and a ball. It can be connected to the spline shaft 214 using a nut or the like.

When the semiconductor strips 10 on which the grinding process has been performed are transferred onto the transfer table 180 by the rotary transfer module 150, the transfer table 180 is connected to the third vertical driving unit 212. It can be raised to the second height. At this time, the fourth rotation driver 210 adjusts the rotation angle of the transfer table 180 so that the direction of the support rails 184 is parallel to the direction of the pickup tools 154 of the pickers 152. You can.

FIG. 38 is a schematic plan view illustrating a state in which the rotation angle of the transfer table shown in FIG. 22 is adjusted.

Referring to FIG. 38, the clamp driving unit 188 may include third and fourth pneumatic cylinders 192C and 192D to open the clamp members 186 at the second height, and the first 4 The rotation driver 210 may rotate the transfer table 180 so that the push members 190A and 190B and the third and fourth pneumatic cylinders 192C and 192D face each other. Subsequently, in a state in which the clamp members 186 are completely opened by the third and fourth pneumatic cylinders 192C and 192D (see FIG. 35), the semiconductor strips 10 are connected to the support rails 184. ) can be placed on the table. Subsequently, the clamp members 186 may be closed by the elastic members 198, and the third vertical driving unit 212 may lower the transfer table 180 to the third height. At this time, at the third height, there is a cover 222 configured to surround the transfer table 180 to block the cleaning liquid supplied onto the semiconductor strips 10 and then sprayed by the rotation of the transfer table 10. can be placed. As an example, the cover 222 may have a circular ring shape and may have an inclined inner surface to guide the scattered cleaning liquid downward. That is, the cover 222 may have a circular ring shape whose inner diameter gradually increases downward.

Meanwhile, the strip supply module 170 includes an upper plate 174 on which the clamp driver 188 is mounted, a lower plate 176 on which the spline shaft 214 and the spline nut 216 are mounted, and the upper plate 176. and a side wall 178 disposed between the lower plates 174 and 176 and providing a space for cleaning and drying the semiconductor strips 10.

The drying unit 220 includes an upper cleaning liquid injection nozzle 224 for spraying cleaning liquid onto the upper portion of the semiconductor strips 10 and an upper air spraying nozzle 226 for spraying air toward the upper portion of the semiconductor strips 10. ) may include a nozzle arm 228 equipped with it. An arm driver 230 may be mounted on the inside of the side wall 178 to horizontally rotate the nozzle arm 228 in a swing manner, and the arm driver 230 may be used when the transfer table 180 moves in the vertical direction. To avoid interference, the nozzle arm 228 is rotated to be adjacent to the inner surface of the side wall 178, and the transfer table 180 is lowered to the third height and then the semiconductor strips 10 are cleaned. And for drying, the nozzle arm 228 can be rotated to the upper part of the transfer table 180.

In addition, the drying unit 220 includes a lower cleaning liquid injection nozzle 232 for spraying cleaning liquid into the lower portion of the semiconductor strips 10 and a lower air spraying nozzle 232 for spraying air into the lower portion of the semiconductor strips 10. It may include a nozzle 234. The cleaning liquid and air sprayed by the lower cleaning liquid and air spray nozzles 232 and 234 may be provided to the lower surface of the semiconductor strips 10 through the openings 182 of the delivery table 180. .

Meanwhile, when the semiconductor strips 10 are delivered to the pickers 152, the transfer table 180 may be raised to the second height by the third vertical driving unit 212, and the fourth height may be raised to the second height by the third vertical driving unit 212. The rotation angle may be adjusted by the rotation driver 210. Subsequently, the semiconductor strips 10 can be picked up by the pickers 152 in a state in which the clamp members 186 are completely opened by the third and fourth pneumatic cylinders 192C and 192D. there is.

According to one embodiment of the present invention, the strip supply module 170 supplies the semiconductor strips 10 placed on the transfer table 180 to the lower surface of the pickers 152, that is, the pick tools 154. ) may include a lift unit 240 that pushes up the semiconductor strips 10 to bring them into close contact with the lower surface.

FIG. 39 is a schematic plan view for explaining the lift unit shown in FIG. 37, and FIG. 40 is a schematic side view for explaining the operation of the lift unit shown in FIG. 37.

Referring to FIGS. 37, 39, and 40, the lift unit 240 includes a pair of contact plates 242 for attaching the semiconductor strips 10 to the lower surfaces of the pickup tools 154. It may include a support plate 244 supporting the contact plates 242, and a fourth vertical driving unit 246 for moving the support plate 244 in the vertical direction.

For example, the contact plates 242 may be configured to pass through the openings 182 of the transfer table 180, and the fourth vertical driving unit 246 may pass through the lower plate 176. Thus, it may include a plurality of drive shafts 248 extending in the vertical direction, a motor, a ball screw, a ball nut, etc. for moving the drive shafts 248 in the vertical direction.

In particular, as shown in FIG. 40, when bending occurs in the semiconductor strip 10, the lift unit 240 lifts the semiconductor strip 10 to the lower surface of the pickup tool 154 of the picker 152. The semiconductor strip 10 can be brought into close contact as a whole, and as a result, the semiconductor strip 10 can be stably vacuum-sucked to the pickup tool 154. Therefore, even when the semiconductor strip 10 is bent, pickup defects in the semiconductor strip 10 can be sufficiently prevented.

Meanwhile, the contact plates 242 will be located under the cover 222, that is, under the transfer table 180 located at the third height while cleaning and drying of the semiconductor strips 10 are performed. The lower cleaning liquid injection nozzle 232 and the lower air injection nozzle 234 may be disposed on the support plate 244.

FIG. 41 is a schematic bottom view for explaining another example of the clamp driving unit shown in FIG. 26.

Referring to FIG. 41, the clamp driver 188 includes push members 190A and 190B disposed on both sides of the transfer table 180, the push members 190A and 190B, and the clamp members ( Drive shafts (194A, 194B) connecting the drive shafts (186), guide members (196) mounted on the lower part of the transfer table (180) and guiding the drive shafts (194A, 194B), and the drive shafts (194A) , 194B), and push brackets 260A and 260B mounted on the lower part of the transfer table 180 and pushing the push brackets 260A and 260B to open the clamp members 186. Pneumatic cylinders (262A, 262B), elastic members ( 198) may be included.

When the pneumatic cylinders 262A and 262B are mounted on the lower part of the delivery table 180 as described above, although not shown, a pneumatic flow path (not shown) for providing compressed air is provided on the spline shaft 214. It may be provided in a vertical direction, and upper and lower rotary joints (not shown) connected to the pneumatic flow path may be mounted on the upper and lower portions of the spline shaft 214, respectively. In addition, between the upper rotary joint and the pneumatic cylinders 262A and 262B and between the lower rotary joint and an air supply unit (not shown) for providing the compressed air may be connected through pneumatic pipes (not shown). there is.

FIG. 42 is a schematic plan view for explaining another example of the transfer table shown in FIG. 25.

Referring to FIG. 42, when a single large-area semiconductor strip 12 is transferred onto the transfer table 270, a pair of pieces for supporting both sides of the semiconductor strip 12 are provided on the transfer table 270. Support rails 272 and a pair of clamp members 274 to prevent the semiconductor strip 12 from being separated may be disposed. Meanwhile, since the clamp driving unit for opening and closing the clamp members 274 is substantially the same as previously described, its description will be omitted.

In particular, to prevent sagging of the semiconductor strip 12 while transferring the semiconductor strip 12 on the transfer table 270 and after the semiconductor strip 12 is positioned on the support rails 272. Support rollers 276 may be disposed for. As an example, the support rollers 276 may be mounted on a mount bracket 278 extending in the transport direction of the semiconductor strip 12, while transporting the semiconductor strip 12 and the semiconductor strip ( 12) can support the central portion of the semiconductor strip 12 after being positioned at a preset position on the support rails 272.

Meanwhile, when the circular semiconductor strip 16 as shown in FIG. 7 is supplied, the linear transfer unit 200 uses a robot hand (not shown) to pick up the lower surface of the circular semiconductor strip 16 by vacuum suction. ) can be provided. In addition, on the transfer table 180, there are support rails (not shown) having an arc shape for supporting both sides of the circular semiconductor strip 16 and for fixing the position of the circular semiconductor strip 16. Clamp members (not shown) in the shape of an arc may be disposed.

According to the embodiments of the present invention as described above, the grinding wheel 124 is rotated and the chuck table 110 is moved in the horizontal direction while rotating. In other words, by simultaneously performing rotation and horizontal movement of the chuck table 110, the surface portion of the semiconductor strip 16 can be removed at once by the preset roughing thickness. In particular, while performing the above steps, the surface area of the semiconductor strip 16 can be cut not only by the lower surface of the grinding stones 122 but also by the side surface, so that compared to the prior art, cutting can be achieved through a single roughing process. Since the surface portion of the semiconductor strip 16 can be removed by the preset roughing thickness, the overall time required for grinding the semiconductor strip 16 can be greatly shortened. In addition, during the rough grinding process, the degree of wear on the lower surfaces of the grinding stones 122 is reduced and the accumulation of foreign matter on the lower surfaces of the grinding stones 122 is reduced, thereby reducing the wear of the semiconductor strip 16 in the subsequent finishing process. ) surface quality can be improved.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: semiconductor strip 20: magazine
100: Semiconductor strip grinding device 110: Chuck table
112: Vacuum adsorption area 120: Grinding module
122: grinding wheel 124: grinding wheel
130: dressing module 140: cleaning module
146: nozzle assembly 150: rotary transfer module
152: Picker 154: Pick tool
156: rotary unit 160: rotary arm
170: Strip supply module 172: Magazine port
174: upper plate 176: lower plate
178: side wall 180: delivery table
182: opening 184: support rail
186: Clamp member 188: Clamp driving unit
190: Push member 192: Pneumatic cylinder
194: Drive shaft 196: Guide member
198: elastic member 200: linear transfer unit
202: Pusher 204: Gripper
208: transfer rail 220: drying unit
228: nozzle arm 230: arm driving unit
240: Lift unit 242: Adhesion plate
244: Support plate 250: Camera unit

Claims (10)

vacuum adsorbing the semiconductor strip onto a chuck table;
rotating a grinding wheel on which grinding stones are mounted on the lower surface; and
While rotating the chuck table, the chuck table is moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table, thereby tilting the surface of the semiconductor strip from the edge toward the center. A semiconductor strip grinding method comprising the step of grinding to a set roughing thickness. vacuum adsorbing a plurality of semiconductor strips on a chuck table;
rotating a grinding wheel on which grinding stones are mounted on the lower surface; and
While rotating the chuck table, the chuck table is moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table, so that the surface of the semiconductor strips is adjacent to the edge of the chuck table. A semiconductor strip grinding method comprising grinding a preset roughing thickness from one side toward the other side adjacent to the center of the chuck table. The method of claim 1 or 2, wherein the grinding wheel is disposed to be inclined at a predetermined angle with respect to the first horizontal direction so that grinding occurs in a front portion of the grinding wheel based on the rotation direction of the chuck table. Semiconductor strip grinding method. The method of claim 1 or 2, wherein the center portion of the upper surface of the chuck table is configured to be higher than the edge portion of the chuck table,
A semiconductor strip grinding method, characterized in that the grinding wheel is arranged to be inclined at a predetermined angle with respect to the second horizontal direction so that the grinding wheel is parallel to one side of the upper surface of the chuck table in a second horizontal direction. A chuck table configured to enable horizontal movement and rotation and vacuum adsorption of the semiconductor strip;
a grinding module including a grinding wheel with a plurality of grinding stones mounted on a lower surface and rotating the grinding wheel to remove a surface portion of the semiconductor strip vacuum-adsorbed on the chuck table; and
It includes a control unit that controls the operation of the chuck table and the grinding module,
The control unit rotates the grinding wheel and rotates the chuck table to grind the surface portion of the semiconductor strip from the edge portion toward the center portion to a preset roughing thickness, so that the edge portion of the grinding wheel is of the chuck table. A semiconductor strip grinding device, characterized in that the chuck table is moved in a horizontal direction until it is located at the top of the center portion. a chuck table configured to enable horizontal movement and rotation and vacuum adsorption of a plurality of semiconductor strips;
a grinding module including a grinding wheel with a plurality of grinding stones mounted on a lower surface and rotating the grinding wheel to remove surface portions of the semiconductor strips vacuum-adsorbed on the chuck table; and
It includes a control unit that controls the operation of the chuck table and the grinding module,
The control unit rotates the grinding wheel and grinds the surface portion of the semiconductor strips to a preset roughing thickness from one side adjacent to the edge portion of the chuck table toward the other portion adjacent to the center portion of the chuck table. A semiconductor strip grinding device, characterized in that while rotating the chuck table, the chuck table is moved in the horizontal direction until the edge of the grinding wheel is located above the center of the chuck table. The method of claim 5 or 6, wherein the grinding wheel is configured to be inclined at a predetermined angle with respect to the first horizontal direction so that grinding occurs in a front portion of the grinding wheel based on the rotation direction of the chuck table. Semiconductor strip grinding device. The method of claim 5 or 6, wherein the center portion of the upper surface of the chuck table is configured to be higher than the edge portion of the chuck table,
The grinding wheel is configured to be inclined at a predetermined angle with respect to the second horizontal direction so as to be parallel to one side of the upper surface of the chuck table in the second horizontal direction. The method of claim 5 or 6, wherein the grinding stones are arranged in a circumferential direction along the edge of the lower surface of the grinding wheel,
The control unit horizontally moves the chuck table so that the center portion of the grinding stones is located above the center portion of the chuck table. The method of claim 5 or 6, further comprising: a strip supply module for supplying the semiconductor strip and recovering the semiconductor strip on which a grinding process has been performed by the grinding module;
A rotary transfer disposed between the chuck table and the strip supply module and including a picker for picking up the semiconductor strip and a rotary unit for rotating the picker to transport the semiconductor strip between the chuck table and the strip supply module. module,
A semiconductor strip grinding device configured to be horizontally movable between the chuck table and the picker and further comprising a cleaning module for removing foreign substances from the chuck table, the picker, and the semiconductor strip.

Images