CN115476214A - Semiconductor material grinding system - Google Patents

Abstract

The present invention relates to a semiconductor material polishing system for polishing a mold portion of a semiconductor material on which a mold portion is formed by a molding process, wherein a polishing head and an elevating portion for elevating and lowering the polishing head are coaxially provided, so that vibration according to a load of the polishing head can be reduced when the polishing head is elevated and lowered, and a plurality of semiconductor material polishing devices are respectively modularized and independently arranged to be spaced apart from each other, so that transmission of vibration generated in each semiconductor material polishing device to another adjacent semiconductor material polishing device can be minimized, a driving speed of each semiconductor material polishing device can be sufficiently increased to secure a polishing speed and quality, and the semiconductor material polishing devices provided in plurality are modularized to simplify and miniaturize a structure of the entire polishing system.

Description

Semiconductor material grinding system

Technical Field

The present invention relates to semiconductor material polishing systems. More particularly, the present invention relates to a semiconductor material polishing system for polishing a protective molding layer of a semiconductor material, which is packaged by mounting a semiconductor chip on a semiconductor substrate or a wafer, to reduce the thickness of the semiconductor material.

Background

Semiconductor materials are manufactured by mounting semiconductor chips on a semiconductor substrate or wafer and molding them with a resin in order to protect the semiconductor chips from the external environment. Before a dicing process is performed on each package unit, a molding portion is formed by a molding process.

Recently, for the purpose of downsizing, weight reduction, and the like of semiconductor materials, semiconductor materials are thinly processed by grinding, polishing, and the like.

For this reason, the grinding process of the mold part for grinding the semiconductor material may be rotated in a state where the grinding wheel is brought into surface contact with the upper portion of the mold part of the semiconductor material, thereby reducing the thickness of the mold part.

The grinding speed is proportional to the roughness of the grinding wheel used in such a grinding process, and the roughness of the surface of the semiconductor material molded portion that ends the grinding process should be a predetermined level or less.

Such a semiconductor material grinding apparatus may use a grinding wheel having a diameter smaller than the length of the long side of the semiconductor material, and grind the molding part of the semiconductor material by rotating the contact surface of the grinding wheel at a high speed in a state of contacting the molding part of the semiconductor material in parallel with the upper surface of the molding part of the semiconductor material, so that the grinding wheel and the long side of the semiconductor material may have surface contact at two points.

In this case, polishing marks having a two-directional circular arc form are generated on the surface of the semiconductor material, and polishing occurs more at a point where the polishing marks having a two-directional circular arc form (grinding marks) meet than at other points, so that there is a possibility that a problem of uneven polishing of the surface of the semiconductor material occurs.

In order to prevent surface contact at two points on the surface of the semiconductor material, it is conceivable to use a grinding wheel having a diameter longer than the length of the long side of the semiconductor material, but when the diameter of the grinding wheel becomes excessively large, the semiconductor material grinding apparatus generates many vibrations, it is difficult to uniformly grind the surface of the semiconductor material, and there is a problem that the size of the grinding wheel becomes large and the equipment size also becomes large.

On the other hand, a plurality of semiconductor material polishing apparatuses may be used in order to secure the polishing rate of the semiconductor material. In this case, the rotation speed of the grinding wheel should be ensured in order to achieve a good grinding quality and a desired roughness in each semiconductor material grinding apparatus. That is, even if the grinding processes are performed using the same grinding wheel, if the rotation speed of the grinding wheel is not secured, the quality of each grinding process may be degraded.

However, when a plurality of semiconductor material polishing apparatuses are arranged in series and a polishing process is performed by each semiconductor material polishing apparatus, vibrations generated by each semiconductor material polishing apparatus may affect the polishing process of an adjacent semiconductor material polishing apparatus. Such vibrations become larger as the speed of the grinding wheel becomes larger, and therefore there is a problem that the rotational speed of the semiconductor material grinding apparatus needs to be reduced in order to minimize the mutual influence.

In the conventional semiconductor material polishing system, since a plurality of semiconductor material polishing apparatuses are arranged adjacent to each other in order to prevent the system from becoming large in size, and the semiconductor material polishing apparatuses are mounted on the same rail, there is a problem that vibrations and the like generated when the semiconductor material polishing apparatuses are driven affect each other, and in order to reduce such mutual influence, only the driving speeds of the semiconductor material polishing apparatuses can be reduced, thereby causing a problem that the efficiency of the polishing process is lowered.

Further, since the polishing head and the elevating unit for elevating and lowering the polishing head in the conventional semiconductor material polishing system are eccentrically mounted, the polishing head cannot be stably supported, and vibration and chattering are likely to occur, and since two polishing heads are mounted on one structure, there is a possibility that vibration, deformation, chattering, and the like occurring in the respective polishing heads may affect each other, and it is difficult to increase the number of semiconductor material polishing apparatuses in terms of design.

Disclosure of Invention

An object of the present invention is to solve the above-described problems and to provide a semiconductor material polishing system capable of improving a polishing rate by minimizing vibration generated in a semiconductor material polishing apparatus.

Another object of the present invention is to provide a semiconductor material polishing system that uses a plurality of semiconductor material polishing apparatuses in a semiconductor material polishing process, and that is capable of simplifying and miniaturizing the structure of the polishing system by modularizing the respective semiconductor material polishing apparatuses, and that is free from difficulty in increasing and decreasing the number of semiconductor material polishing apparatuses.

Another object of the present invention is to provide a semiconductor material polishing system in which a polishing head and an elevating unit for elevating and lowering the polishing head are coaxially provided, so that vibration due to a load of the polishing head can be reduced during polishing, and grinding wheels for respective semiconductor material polishing apparatuses are arranged in order of grain size, and polishing can be performed sequentially in order of rough grinding, finish grinding, and polishing.

Further, an object of the present invention is to provide a semiconductor material polishing system which can prevent a circuit portion and the like of a material from being damaged by minimizing a polishing pressure applied to a semiconductor material at the time of polishing and can minimize a polishing mark generated on a surface of a molding portion.

Another object of the present invention is to provide a semiconductor material polishing system capable of easily adjusting the tilt angles of the polishing head in the front-back direction and the left-right direction, and capable of finely adjusting the tilt angle.

Another object of the present invention is to provide a semiconductor material polishing system capable of cleaning the upper surface and the lower surface of a semiconductor material after polishing and adjusting the number of times of cleaning and the number of times of drying.

In order to solve the above technical problem, the present invention provides a semiconductor material polishing system, comprising: a material supply portion that supplies a semiconductor material; a supply picker which picks up and transfers the semiconductor material supplied to the material supply section; one or more chuck tables disposed at a base, above which the semiconductor material picked up by the supply picker is transferred, and disposed to be movable in one direction; one or more semiconductor material polishing apparatuses comprising: a polishing head having a polishing wheel detachably provided at one end thereof for polishing the semiconductor material; a gate-shaped frame disposed on the base and on a transfer path of the chuck table, the gate-shaped frame having an opening through which the chuck table moves; an elevating unit which is attached to the gate-shaped frame and elevates the polishing head; a holder for attaching the polishing head to the lifting unit; and an angle adjusting section for adjusting an inclination angle of the polishing head; a cleaning unit configured to clean the semiconductor material polished by the semiconductor material polishing apparatus; and an output unit that carries out the semiconductor material cleaned by the cleaning unit, wherein the polishing head and the elevating unit are coaxially disposed.

The plurality of chuck tables are provided on the base, the gate frames are provided independently on the transfer path of each of the chuck tables, and the gate frames are disposed to be spaced apart from each other.

Grinding wheels having the same or different roughness are selectively detachably attached to each of the grinding heads, and when grinding wheels having different roughness are attached, the grinding wheels are arranged in order from a coarse-grained grinding wheel to a fine-grained grinding wheel.

The grinding wheel has a diameter equal to or larger than the width of the semiconductor material to be ground, and the grinding wheel is rotated while the chuck table is transferred in one direction, thereby grinding the entire upper surface of the semiconductor material.

Further, the holder is provided with a housing portion for housing the polishing head, and through holes are formed in outer walls on both sides constituting the housing portion, the semiconductor material polishing apparatus further includes a mounting member which is coupled to an outside of the polishing head to attach and detach the polishing head to and from the housing portion, and which is provided with a fitting groove at a position corresponding to the through hole, the angle adjusting portion includes: a pair of brackets that are rotatably fixed to the bracket by being fixedly attached to the fitting grooves of the attachment member through the through-holes of the bracket; a lever member that rotates one or more brackets of the pair of brackets; and a front-rear fine adjustment unit which is provided with at least one side direction of the rod member and finely adjusts the front-rear direction inclination angle of the grinding head.

Here, the rod member and the bracket may be integrally formed, or coupled to one surface of the bracket, or inserted into the bracket.

And, the front and rear fine adjustment unit includes: eccentric nuts respectively provided in both side directions of the rod member, one side of each eccentric nut contacting a side surface of the rod member and having an eccentric through hole; and the fastening bolt is in threaded connection with the through hole of the eccentric nut and the bracket, and the inclination angle of the grinding head in the front-back direction is finely adjusted by changing the fastening depth of the fastening bolt.

And, the front and rear fine adjustment unit includes: nuts respectively provided in both side directions of the rod member, one side of each nut contacting a side surface of the rod member and having a tapered through hole in an upper surface thereof; and the fastening bolt is in threaded connection with the through hole of the nut and the bracket, the through hole is larger than the diameter of the fastening bolt, and the inclination angle of the grinding head in the front-back direction is finely adjusted by changing the fastening depth of the fastening bolt.

The bracket and the mounting member of the semiconductor material polishing apparatus are provided with one or more fastening holes at positions corresponding to each other, the fastening hole formed in the bracket being larger than the fastening hole formed in the mounting member, and the semiconductor material polishing apparatus further includes a fixing bolt inserted into and coupled to the fastening hole to fix an adjusted angle by the angle adjustment part.

And, the angle adjustment part further includes a left and right fine adjustment unit which is provided with one or more in both side directions of the holder and adjusts a left and right direction inclination angle of the polishing head, the left and right fine adjustment unit including: eccentric nuts respectively arranged in the left and right directions of the bracket, one surface of each eccentric nut being in contact with the side surface of the bracket and having an eccentric through hole; and a fastening bolt which is in threaded connection with the through hole of the eccentric nut and the lifting part, and the right and left direction inclination angle of the grinding head is finely adjusted by changing the fastening depth of the fastening bolt.

Further, the angle adjusting section may further include a left-right fine adjustment unit that is provided with one or more in a left-right direction of the holder and adjusts a left-right direction inclination angle of the polishing head, the left-right fine adjustment unit including: nuts respectively arranged in the left and right directions of the bracket, one surface of each nut is in contact with the side surface of the bracket, and a conical through hole is formed in the upper surface of each nut; and a fastening bolt which is in threaded connection with the through hole of the nut and the lifting part and changes the fastening depth of the fastening bolt to finely adjust the left-right direction inclination angle of the grinding head.

Here, the fastening bolt is a flat head bolt or a flat head screw.

And, the semiconductor material polishing system further comprises: a recovery picker that picks up the semiconductor material finished being polished in the semiconductor material polishing apparatus and transfers the semiconductor material to the cleaning part, the cleaning part including: a lower surface cleaning unit which is provided on the conveyance path of the recovery picker and which is configured to clean the lower surface of the semiconductor material picked up by the recovery picker by contacting the lower surface with the semiconductor material; and a tunnel cleaning unit including: a cleaning table for placing the semiconductor material cleaned by the lower surface cleaning part on the upper side and transferring the semiconductor material in the front-back direction; a tunnel type washing chamber which is provided on a transfer path of the washing table, has an inlet formed at the front and an outlet formed at the rear, and has a washing nozzle for spraying washing water to the washing table side at an inner upper side; and a control unit that adjusts the number of times of cleaning while moving the cleaning table forward and backward by controlling the transfer direction and the number of times of transfer of the cleaning table.

And, the semiconductor material polishing system further includes an unloading section that unloads the cleaned material discharged from the outlet, the unloading section including: a support rail extending from an outer side of an outlet of the tunnel cleaning chamber to an inner side of the tunnel cleaning chamber, the support rail having a width adjustable in a left-right direction so as to support the semiconductor material, which has been cleaned, on an upper surface; and a drawing unit that moves along the support rail and draws out the semiconductor material supported above the support rail.

And the cleaning table may be arranged to be lifted, and when the cleaning by the cleaning nozzle is finished, the cleaning table may be lifted up to the height of the support rail, and in a state where the support rail is changed to have a width smaller than that of the semiconductor material, the cleaning table may be lowered to transfer the semiconductor material placed above the cleaning table to the support rail.

An air nozzle for spraying air upward is provided at one side of the cleaning table, and the air nozzle sprays air to the lower surface of the semiconductor material transferred to the support rail.

And the cleaning nozzle sprays cleaning water to the cleaning stage side to clean the cleaning stage while the cleaning stage is retreated to the inlet side after the semiconductor material after the cleaning is discharged from the outlet.

Further, the tunnel type washing unit further includes: and an air nozzle installed at an upper inner side of the tunnel type cleaning chamber and spraying air downward, wherein the air nozzle is sprayed together with the cleaning nozzle to clean the upper surface of the semiconductor material or the upper surface of the cleaning stage, or is sprayed alone to dry the upper surface of the semiconductor material or the upper surface of the cleaning stage.

And, the tunnel type washing part includes: a first air drying unit which is provided at an upper end of an outlet of the tunnel cleaning chamber and sprays air onto an upper surface of the semiconductor material; and a second air drying unit disposed at a lower end of an outlet of the tunnel cleaning chamber and spraying air to a lower surface of the semiconductor material, wherein the first air drying unit and the second air drying unit are coaxially disposed.

Further, the cleaning unit further includes: and an upper surface cleaning unit which is provided above the transfer path of each chuck table and cleans an upper surface of the semiconductor material polished by the semiconductor material polishing apparatus.

And, the semiconductor material polishing system further comprises: a recovery picker which picks up the semiconductor material polished by the semiconductor material polishing apparatus and transfers the semiconductor material to the cleaning part, the recovery picker comprising: a first reclaimer which picks up the semiconductor material which is placed above the chuck table and is finished with polishing and transfers the semiconductor material to an arbitrary chuck table or to the cleaning section; and a second reclaiming picker which delivers new semiconductor material to be processed at the chuck table from which the semiconductor material is removed.

And the supply picker is rotatably provided, the material supply part further includes: a cassette on which the semiconductor material is laminated; a drawing unit that draws out or feeds any one of the semiconductor materials laminated on the cassette; and an upper view or a lower view mounted on an upper side of the material supply part for checking a supply direction of the semiconductor material drawn from and supplied to the cassette, the lower view being mounted on a lower side of the material supply part, the drawing unit dropping the semiconductor material into the cassette when a vertical direction of the semiconductor material is wrong according to a result of checking the upper view or the lower view, and rotating in a state where the supply pickup picks up the semiconductor material when a left-right direction of the semiconductor material is wrong, thereby converting a direction of the semiconductor material.

And, the semiconductor material polishing system further comprises: a lower view installed at one side of the supply picker; and an upper view installed below a conveying path of the supply picker, the upper view checking an alignment of the semiconductor material picked up by the supply picker, the lower view checking an alignment of the chuck table to which the semiconductor material picked up by the supply picker is transferred, the supply picker transferring the semiconductor material to the chuck table according to alignment checking results of the upper view and the lower view.

And, the semiconductor material polishing system further comprises: and an inspection view which is installed above the output part and inspects the semiconductor material after polishing and cleaning.

According to the semiconductor material polishing system of the present invention, since the polishing head and the lifting portion which lifts the polishing head are coaxially provided, during polishing of the semiconductor material by the polishing head, the reaction force transmitted from the semiconductor material to the polishing head can be supported without wobbling, so that the vibration can be reduced, and the semiconductor material polishing devices are respectively modularized and separately arranged from each other independently according to the plurality of semiconductor material polishing devices, with the effect that the transmission of the vibration generated in each semiconductor material polishing device to each other can be minimized. Further, according to the semiconductor material polishing system of the present invention, the plurality of semiconductor material polishing apparatuses are arranged side by side in parallel with the conveyance direction of the chuck table, so that it is easy to increase or decrease the number of the modularized semiconductor material polishing apparatuses, and the occupied area of the semiconductor material polishing apparatus can be minimized.

Further, according to the semiconductor material polishing system of the present invention, since vibrations generated in the respective semiconductor material polishing apparatuses are not transmitted to each other, it is possible to increase the driving speed of the semiconductor material polishing apparatuses, and to achieve a high processing speed while ensuring the quality of the polished surface at a high polishing speed, thereby improving the overall productivity.

Further, according to the semiconductor material grinding system of the present invention, by installing grinding wheels having different roughness (grain size) at each semiconductor material grinding apparatus, there are effects of: the thickness can be rapidly processed to a certain level at a fast speed in a rough grinding semiconductor material grinding apparatus, the surface roughness is ensured to a certain level by processing the semiconductor material to have a lower degree than in the rough grinding semiconductor material in a fine grinding semiconductor material grinding apparatus, and the surface roughness of the material is processed to be smooth and good in a polished semiconductor material grinding apparatus. Therefore, the grinding process can be performed quickly and precisely.

Further, according to the semiconductor material grinding system of the present invention, the same or different grinding wheels may be installed at the respective semiconductor material grinding apparatuses, so that there is an effect that various types of semiconductor material grinding apparatuses can be realized according to the kind and thickness of the material or according to the necessity.

In addition, according to the semiconductor material polishing system of the present invention, the polishing head for polishing the semiconductor material is configured to have a predetermined angle inclination with respect to the upper surface of the semiconductor material, and to be capable of easily changing the angle of the inclined polishing head, thereby reducing the surface pressure applied to the semiconductor material during polishing of the semiconductor material, and preventing excessive pressure from being applied to the semiconductor material, thereby preventing damage to the semiconductor material, and having an effect of polishing with uniform roughness without generating polishing marks on the polishing surface.

In addition, according to the semiconductor material polishing apparatus of the present invention, since the tilt angle of the polishing head in the front-rear direction can be finely adjusted, the semiconductor material and the polishing wheel can be brought into line contact with each other, and the impact of the semiconductor material can be reduced, and since the tilt angle in the left-right direction can be finely adjusted, the cylindrical polishing apparatus does not deviate to a certain side, and the flatness of the processed surface of the semiconductor material can be ensured, thereby providing an effect of improving the quality.

In addition, according to the semiconductor material polishing apparatus of the present invention, since the tilt angle of the polishing head in the front-back direction and the left-right direction can be adjusted, and the rotation angle can be adjusted two-dimensionally, it is possible to perform the polishing work for semiconductor materials of various shapes and thicknesses.

In addition, according to the semiconductor material polishing apparatus of the present invention, when adjusting the tilt angle of the polishing head, the pressing force of the fine adjustment unit is adjusted by changing the fastening depth of the fastening bolt, and the tilt of the polishing apparatus can be adjusted according to the pressing force.

Further, according to the semiconductor material polishing system of the present invention, it is possible to clean all of the upper and lower surfaces of the polished semiconductor material, and to appropriately select the number of times of cleaning and the cleaning method using the tunnel cleaning unit, and to dry the upper and lower surfaces of the polished semiconductor material, and to appropriately select the number of times of drying and the drying method, thereby having an effect that various cleaning and drying methods can be adopted as necessary.

According to the semiconductor material polishing system of the present invention, cleaning is performed on the semiconductor material or the cleaning table using the cleaning water and the air, and the tunnel type cleaning chamber is used for cleaning and drying, so that dust and foreign substances can be prevented from being scattered to the outside by the cleaning water and the air during the cleaning process.

Further, according to the semiconductor material polishing system of the present invention, the semiconductor material is not only cleaned, but also the cleaned semiconductor material is carried out, and the upper surface of the cleaning table is cleaned while the cleaning table is returned to the initial position for cleaning the next semiconductor material, thereby having an effect that the cleaning can be maintained and managed.

Therefore, according to the semiconductor material polishing system of the present invention, the cleaning stage, the tunnel cleaning chamber, the support rail formed to extend inside the tunnel cleaning chamber, and the pulling part for carrying out the end cleaning are arranged in a row on the same moving path, so that the size of the semiconductor material cleaning apparatus can be minimized, thereby minimizing the occupied area of the entire system.

Drawings

Fig. 1 shows a plan view of a semiconductor material polishing system according to the present invention.

Fig. 2 shows a perspective view of a semiconductor material polishing apparatus constituting the semiconductor material polishing system according to the present invention.

Fig. 3 is a side view showing the operation state of the semiconductor material polishing apparatus constituting the semiconductor material polishing system according to the present invention.

Fig. 4 is an exploded perspective view showing a polishing head, a holder, a mounting member, and an angle adjusting section of a semiconductor material polishing apparatus constituting a semiconductor material polishing system according to the present invention.

Fig. 5 is a front view of a semiconductor material polishing apparatus constituting the semiconductor material polishing system according to the present invention, and fig. 6 is an exploded perspective view of an elevating part of the semiconductor material polishing apparatus constituting the semiconductor material polishing system according to the present invention.

Fig. 7 shows a perspective view of a tunnel cleaning section constituting the semiconductor material polishing system according to the present invention.

Fig. 8 shows a side view of a tunnel cleaning section constituting the semiconductor material polishing system according to the present invention.

Fig. 9 shows a process of cleaning the upper face of the semiconductor material using the cleaning nozzle and the air nozzle in the tunnel cleaning part of the present invention.

Fig. 10 shows a process of drying the semiconductor material after completion of cleaning in the tunnel cleaning unit of the present invention and pulling the semiconductor material by the semiconductor material pulling unit.

Description of reference numerals:

1000: semiconductor material polishing system 100: material supply part

220: the upper view 215: lower view scene

230: upper view 320: supply picker

360: the recovery picker 370: lower surface cleaning part

330: lower view 310: chuck table

400: semiconductor material polishing apparatus 420: grinding head

410: grinding wheel 431: support frame

433: mounting component 435: lifting part

461: left-right trimming unit 465: front and rear trimming unit

467: the lever member 468: bracket

470: the door-shaped frame 500: tunnel type cleaning part

501: the washing station 520: tunnel type cleaning chamber

523: cleaning nozzle 521: air nozzle

522: inlet 524: an outlet

525: air drying section 551: traction part

527: the support rail 610: inspection table

620: the transfer pickup 630: inspection of visual scenes

700: the recovery unit 800: material recovery section

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein, and may be embodied in other forms. Rather, the embodiments described herein are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art. Throughout the specification, the same reference numerals denote the same constituent elements.

The present invention relates to a semiconductor material polishing system 1000 that performs a molding process for a semiconductor material such as a semiconductor strip or a wafer, performs a polishing process to reduce the thickness of a molding portion by grinding the molding portion in order to achieve light weight and miniaturization of the semiconductor material that completes the molding process, and performs cleaning and drying of the semiconductor material that completes the polishing process.

In particular, the present invention provides a semiconductor material polishing system which can reduce vibration generated during polishing of a semiconductor material, and can minimize transmission of vibration, chatter, deformation, and the like generated in each semiconductor material polishing apparatus to another adjacent semiconductor material polishing apparatus even if a plurality of semiconductor material polishing apparatuses are provided, thereby increasing the polishing rate of the semiconductor material polishing apparatus and ensuring uniform polishing quality and roughness during polishing.

Hereinafter, the semiconductor material polishing system of the present invention will be described in more detail with reference to the accompanying drawings of the present invention.

Fig. 1 illustrates a plan view of a semiconductor material polishing system 1000 in accordance with the present invention.

The semiconductor material polishing system 1000 according to the present invention is characterized by comprising: a material supply portion 100 that supplies a semiconductor material; a supply picker 320 that picks up and transfers the semiconductor material supplied to the material supply part 100; one or more chuck tables 310 disposed on a base, above which the semiconductor material picked up by the supply picker 320 is transferred, the chuck tables being movable in one direction; one or more semiconductor material polishing apparatuses 400, including: a polishing head 420 having a polishing wheel 410 detachably provided at one end thereof for polishing the semiconductor material; a gate-shaped frame 470 which is disposed on the base, is disposed on a transfer path of the chuck table 310, and is provided with an opening through which the chuck table 310 is movable; an elevating unit 435 attached to the gate frame 470 for elevating and lowering the polishing head 420; a holder 431 for attaching the polishing head 420 to the lifting unit 435; and an angle adjusting section that adjusts an inclination angle of the polishing head; a cleaning unit 500 for cleaning the semiconductor material polished by the semiconductor material polishing apparatus 400; and an output unit 800 that outputs the semiconductor material cleaned in the cleaning unit 500, wherein the polishing head 420 and the elevating unit 435 are coaxially disposed.

The material supply portion 100 may further include: a cassette on which semiconductor materials are laminated; a drawing unit 210 that draws out or inputs any one of the semiconductor materials laminated on the cassette; an upper view 220 mounted on an upper side of the material supply part for checking a supply direction of the semiconductor material drawn out of the cassette and supplied, or a lower view 215 mounted on a lower side of the material supply part.

The material supply part stores the semiconductor material subjected to the molding process in a stacked state, and sequentially draws the semiconductor material by the drawing unit 210 to be placed on the drawing rail 250.

In the process of drawing the semiconductor material through the drawing unit 210, the identification mark provided to one surface of the semiconductor material may be checked to confirm the supply direction of the supplied semiconductor material. At this time, the identification mark of the semiconductor material is inspected with the upper view 220 or the lower view 215 along the direction of supplying the semiconductor material, and according to the inspection result, when the upper and lower directions of the semiconductor material are wrong (when supplying is inverted), the drawing unit drops the semiconductor material into the cassette. After the supply direction of the material is confirmed by the upper view or the lower view, the erroneously supplied material is directly thrown into the cassette again, so that the equipment can be prevented from being stopped or erroneously processed, and the next semiconductor material can be received and supplied.

At this time, the cassette to be reintroduced may be introduced into the cassette from which the semiconductor material is drawn out, or may be introduced into an additional cassette for output. When the semiconductor material is loaded into an additional cassette for output, a supply cassette for supplying the semiconductor material, an empty cassette for outputting all the semiconductor material, and a recovery cassette in which cassettes to be loaded again are stacked may be provided.

However, when the semiconductor materials are directly loaded into the supply cassette again, the unloading process can be made faster, and when all the semiconductor materials to be handled are unloaded subsequently, only the semiconductor materials left in the empty cassette are individually collected and subjected to direction change, and then supplied to the material supply unit.

In the present invention, the supply picker 320 is mounted at one side with a lower view 330 for inspection in a lower direction, and is provided to be rotatable on an X-Y plane, movable in an X-axis direction.

When the semiconductor material is transferred over the drawing rail 250, the supply picker 320 may pick up the semiconductor material. As described above, according to the inspection results of the upper view and the lower view, when the front-rear direction of the semiconductor material is wrong, the supply picker may be rotated 180 ° on the X-Y plane to correct the front-rear direction of the material.

Further, in order to check the alignment of the semiconductor material picked up by the supply picker 320, an upper view 230 for checking the alignment of the semiconductor material picked up by the supply picker is provided below the moving path of the supply picker, and the upper view 230 may be moved in the Y-axis direction.

The lower view 330 installed at one side of the supply picker 320 is provided to check alignment of the chuck table 310 to which the semiconductor material picked up by the supply picker is to be transferred. The material picked up by the supply picker 320 may be transferred to a prescribed position of the chuck table 310 according to the inspection results of the upper view 230 and the lower view 330.

To restate, the upper view 220 and the lower view 215 are provided to confirm the direction of the material supplied from the material supply part, and the upper view 230 and the lower view 330 are provided to check the alignment of the material picked up by the supply picker and the chuck table to which the material is transferred.

The semiconductor material to be polished is transferred to the chuck table 310 by a supply picker.

In the present invention, the chuck table 310 is disposed on a base, and the semiconductor material picked up by the supply picker is placed above and is disposed to be able to be transferred in one direction. During the polishing of semiconductor materials, the chuck table may vacuum adsorb the materials to avoid positional misalignment of the materials. Further, a dressing portion for dressing a grinding wheel mounted to the semiconductor material grinding apparatus may be provided at one side of the chuck table.

The chuck table may be provided in plurality and may be provided to be movable in a Y-axis direction, i.e., a front-rear direction, respectively, and to be positioned below the semiconductor material polishing apparatus after receiving the material from the supply picker and moving in a rear direction.

That is, the chuck table and the semiconductor material polishing apparatus may be correspondingly provided in the same number, respectively.

The semiconductor material polishing apparatus 400 can reduce the thickness or height of the semiconductor material molding portion by grinding the upper surface of the semiconductor material by rotating the grinding wheel while contacting the upper surface of the semiconductor material. Therefore, the semiconductor material polishing apparatus 400 includes a polishing head 420, a portal frame 470, an elevating unit 435, a holder 431, and an angle adjusting unit.

The polishing head 420 is detachably provided at one end with a polishing wheel for polishing a semiconductor material. Here, the grinding wheel may be removably replaced from the lower end of the polishing head, and when a plurality of semiconductor material polishing apparatuses are provided, the grinding wheels mounted on the respective semiconductor material polishing apparatuses may have the same or different roughness from each other.

When grinding wheels having different roughness from each other are mounted, it is preferable that the semiconductor material grinding apparatus be arranged in order from a coarse-grained grinding wheel to a fine-grained grinding wheel, and by this arrangement, the grinding speed and the grinding quality can be improved.

For example, as shown in fig. 1, when 3 semiconductor material grinding apparatuses 400a, 400b, 400c are provided, the grinding wheels 410 of the 3 semiconductor material grinding apparatuses 400a, 400b, 400c may be configured such that the roughness is reduced in order.

That is, the first semiconductor material grinding apparatus 400a is mounted with a grinding wheel having the largest roughness (for rough grinding), the third semiconductor material grinding apparatus 400c is mounted with a grinding wheel having the smallest roughness (for polishing), and the second semiconductor material grinding apparatus 400b is mounted with a grinding wheel having an intermediate roughness (for finish grinding).

Of course, the semiconductor material polishing apparatuses 400a, 400b, and 400c may be mounted with the polishing wheels 410 having the same roughness, or a plurality of semiconductor material polishing apparatuses may be used to polish the semiconductor material, as necessary.

A motor that provides a rotational driving force to the grinding wheel may be provided to the grinding head 420.

The gate frame 470 is disposed on the base, is disposed on the transfer path of the chuck table, and has an opening with a lower portion opened to allow movement of the chuck table. The gate frame 470 is called a gate frame since it has a similar form to a "gate".

The lifting unit 435 is attached to one surface of the door frame 470 and can lift and lower the polishing head 420.

The holder 431 is attached to the lifting unit 435, and includes a housing unit 431f for housing the polishing head 420, and through holes are formed in both outer walls 431h constituting the housing unit 431 f.

In this case, the polishing head 420 may be directly coupled to the holder and mounted, but the mounting member 433 may be provided between the polishing head 420 and the holder 431 to stably support and fix the cylindrical polishing head 420 and reduce the vibration generated in the polishing head 420.

The attachment member 433 is coupled to the outside of the polishing head so that the polishing head is detachably provided in the housing portion 431f, and has a fitting groove provided at a position corresponding to the through hole of the holder. The mounting member 433 can be coupled and fastened to and fixed to the polishing head, and the polishing head 420 can be stably fixed to the housing portion 431f, thereby minimizing vibration of the polishing head during processing.

In the present invention, the polishing head may include an angle adjusting portion to have a predetermined angle of inclination in a front-rear direction, i.e., a Y-axis direction.

In this regard, it will be described in more detail with reference to fig. 3 to 6.

Fig. 3 shows a side view of the semiconductor material polishing apparatus 400 constituting the semiconductor material polishing system 1000 according to the present invention, and fig. 4 shows an exploded perspective view of the polishing wheel 410, the polishing head 420, and the holder 431 constituting the semiconductor material polishing apparatus 400 of the semiconductor material polishing system 1000 according to the present invention.

The semiconductor material polishing apparatus 400 constituting the semiconductor material polishing system 1000 according to the present invention may be configured such that the polishing head 420 is inclined at a predetermined angle with respect to a vertical direction.

The reason why the polishing head 420 is inclined is to prevent the pressure applied to the semiconductor material by the polishing wheel 410 from becoming excessive and to minimize the polishing traces and the like remaining on the polishing surface of the semiconductor material.

When the polishing head 420 is vertically disposed, the contact area of the polishing wheel 410 and the semiconductor material st is increased, so that there may occur a problem that the load of the semiconductor material polishing apparatus is concentrated on the semiconductor material, but when the rotation axis is slightly inclined, the contact area of the polishing wheel and the semiconductor material is limited, so that the pressure applied to the semiconductor material is reduced, and the semiconductor material can be prevented from being damaged.

Further, when the polishing head 420 drives the polishing wheel in a vertical state, a polishing trace of the polishing wheel remains in a radial or circular shape near the rotation axis on the molding portion of the semiconductor material, and this becomes a problem in polishing quality in a state where the polishing process is completed. However, when the polishing head 420 is tilted and rotated obliquely, the polishing operation is performed while the grinding wheel 410 is in contact with only the limited region of the molding portion of the semiconductor material and the molding portion is rubbed in the width direction, thereby minimizing the occurrence of grinding marks of a circular shape and the like and improving the polishing quality.

To this end, the semiconductor material polishing apparatus of the present invention may include an angle adjusting unit for tilting the polishing head, and the angle adjusting unit may include: a pair of brackets 468a, 468b that are rotatably fixed to the holder 431 by being fixedly attached to the fitting groove of the attachment member through a through hole of the holder; a rod member 467 that rotates one or more brackets 468b of the pair of brackets 468a, 468 b; and a front-rear fine adjustment unit 465 that is provided with one or more members in both side directions of the lever member and that finely adjusts the angle of inclination of the polishing head in the front-rear direction.

In the bracket constituting the angle adjusting portion, if the bracket is rotated by the lever member along with the fitting groove fixed to the mounting member, the grinding head 420 fixed to the mounting member is also rotated in the front-rear direction, and the grinding wheel 410 attached to the lower end of the grinding head is also rotated in the front-rear direction together with the rotation of the grinding head 420.

Here, the rod member 467 may be formed integrally with the bracket, coupled to one surface of the bracket, or inserted into and mounted on the bracket so as to rotate the bracket, and may be formed in a predetermined longitudinal direction so as to rotate one or more brackets 468b of the pair of brackets 468a and 468 b.

Therefore, depending on the degree of rotation of the rod member that rotates the carrier, the upper surface of the semiconductor material can be processed in a state in which the grinding wheel 410 is in line contact with the upper surface of the semiconductor material while the grinding head is inclined at a predetermined angle.

When the polishing head 420 and the upper surface of the semiconductor material are vertically processed, the polishing head 420 and the semiconductor material come into surface contact with each other, and thus the surface pressure applied to the material increases. That is, the contact area between the grinding wheel 410 and the upper surface of the semiconductor material is increased, and the load of the semiconductor material grinding apparatus is concentrated on the semiconductor material, so that the impact applied to the material is large and may be damaged, but in the present invention, the grinding head performs the processing in a state of being inclined at a predetermined angle, and the contact area between the semiconductor material and the grinding wheel 410 can be restricted to minimize the surface pressure, so that the damage of the semiconductor material can be prevented.

Further, when the polishing head 420 performs a polishing process in a state of being perpendicular to the upper surface of the semiconductor material, the polishing marks of the polishing wheel 410 remain in a radial or circular shape in the vicinity of the rotation axis of the upper surface of the molding portion of the semiconductor material, thereby affecting the polishing quality.

However, according to the present invention, when the polishing head is rotated obliquely from the upper surface of the semiconductor material in a state of being inclined at a predetermined angle, the polishing wheel 410 contacts only the limited region of the upper surface of the molding portion of the semiconductor material, and performs the polishing work in a state of being rubbed against the upper surface of the molding portion in the width direction, thereby minimizing the remaining of the circular or radial polishing traces on the upper surface of the semiconductor material and improving the polishing quality.

The invention can enable the grinding head to rotate from the bracket in a state of inclining a preset angle through the angle adjusting part, thereby adjusting the inclination angle.

The state shown in fig. 3 (a) is a state in which the polishing head 420 is not tilted with respect to the vertical direction. However, the angle of inclination of the grinding head may be adjusted from the holder 431 by the angle adjusting portion. That is, the polishing head is inclined at a predetermined angle according to the degree of rotation of the lever member rotating the carrier, and can be inclined by θ degrees in the Y-axis direction as shown in fig. 3 (b), so that the pressure applied to the molding portion of the semiconductor material in the polishing process is reduced, and the polishing quality can be improved while preventing damage to the semiconductor material.

At this time, the angle adjusting part may finely adjust the inclination angle in the front-rear direction by the front-rear fine adjustment unit 465.

The front-rear fine adjustment means 465 may be formed on one or more outer walls 431h of the both side outer walls 431h of the holder constituting the housing portion 431f, and the front-rear direction inclination angle of the polishing head may be finely adjusted by nuts and fastening bolts provided on both sides of the rod member 467.

Preferably, the front-rear fine adjustment unit 465 includes: eccentric nuts which are respectively provided in both side directions of the rod member 467, are in contact with a side surface of the rod member 467, and have eccentric through holes; and the fastening bolt is in threaded connection with the through hole of the eccentric nut and the bracket.

At this time, the back-and-forth tilt angle of the polishing head (the Y-axis tilt angle of the polishing head) can be adjusted by changing the fastening depth of the fastening bolt. That is, the fastening bolt is screwed to the outer wall 431h of the bracket via the eccentric nut, and the eccentric nut can adjust the degree of pressing of the rod member contacting the eccentric nut according to the fastening depth of the fastening bolt through the eccentric through hole of the eccentric nut.

Therefore, by changing the fastening depth of the fastening bolt inserted into the eccentric nuts provided on both sides of the rod member 467, the pressing force of the rod member can be adjusted, and the degree of rotation of the bracket can be finely adjusted according to the pressing force of the rod member, whereby the back-and-forth tilt angle of the polishing head can be finely adjusted. In this case, the diameter of the through hole of the nut may be formed larger than the diameter of the fastening bolt so as to be capable of changing the position around the fastening bolt.

Further, as the fine adjustment unit, in addition to the eccentric nut, a nut having a through hole tapered on the upper surface may be used. The fine adjustment principle according to this is the same as when using an eccentric nut.

That is, the fastening depth of the nut, which is provided in both side directions of the rod member 467, is in contact with the side surface of the rod member, and has a tapered through hole on the upper surface, and the fastening bolt, which is screwed to the through hole of the nut and the outer wall 431h of the bracket, can be changed. Similarly, the pressing force of the lever member can be adjusted by changing the fastening depth of the nuts provided on both sides of the lever member and the fastening bolts fastened along the tapered nuts, and the rotation degree of the bracket can be finely adjusted according to the pressing force of the lever member, thereby finely adjusting the tilt angle of the polishing head in the front-rear direction.

In this case, the eccentric nuts or nuts may be provided to correspond to each other with reference to both side directions of the rod member 467, or may be provided at predetermined intervals, or the number of the eccentric nuts or nuts may be provided to be balanced on both sides in the up-down direction of the rod member according to the length of the rod member as shown in fig. 4.

As an example, fig. 3 and 4 show an example in which 4 eccentric nuts or the number of nuts is used, but the number may be increased or decreased as necessary.

Preferably, the fastening bolt fastened to the eccentric nut or the nut is a flat head bolt or a flat head screw, but a general bolt or screw may be used.

For reference, according to the direction of the lever member coupled to the bracket, as shown in fig. 3 and 4, when the lever member is disposed in the longitudinal direction horizontal to the polishing head, the both side directions of the lever member may be the left and right directions with respect to the lever member, and when the lever member is disposed in the direction perpendicular to the polishing head, the both side directions of the lever member may be the up and down directions with respect to the lever member.

In the embodiment of the present invention, the rod member 467 is shown to be attached to only one bracket 468b of the pair of brackets 468a, 468b, but may be attached to all brackets. In this case, the front-rear fine adjustment unit 465 may be provided on all the rod members attached to the pair of brackets, or may be provided only on any one of the rod members.

In the present invention, the grinding head 420 having the grinding wheel attached to one end thereof and the attachment member 433 are coupled, and after the front-rear direction inclination angle of the grinding head is adjusted and fixed by the angle adjusting section and the front-rear fine adjustment unit in a state where the attachment member is accommodated in the accommodating section 431f of the holder, the fixing bolts are fixed and coupled by the fastening holes formed in the holder 431 and the attachment member 433 at positions corresponding to each other, respectively, in order to fix the adjusted angle.

For this, the bracket 431 and the mounting part 433 may be provided with one or more fastening holes at positions corresponding to each other, and the fastening hole 431o formed at the bracket 431 may be larger than the fastening hole 433o formed at the mounting part 433.

That is, one or more fastening holes 431o for fastening to the mounting member 433 are provided in both outer walls of the bracket 431, and the fastening holes 433o are also formed in the mounting member 433 at positions corresponding to the fastening holes 431o of the bracket. The bracket 431 and the mounting member 433 may be coupled to each other by fixing bolts by insert-coupling the fixing bolts to the fastening holes. At this time, since the fastening position may be slightly different according to the inclination angle of the grinding head, the fastening hole 431o of the bracket may be preferably made larger than the fastening hole 433o of the mounting part.

As described above, the present invention can finely adjust the tilt angle of the polishing head in the front-back direction (Y-axis direction).

In addition, the present invention can also finely adjust the angle of inclination of the polishing head in the left-right direction (X-axis direction). That is, by finely adjusting the right-left direction inclination angle of the polishing head, the cylindrical polishing head is not deflected to either side, and the flatness of the material processing surface can be ensured.

That is, the semiconductor material is brought into line contact with the grinding wheel by adjusting the tilt angle in the front-rear direction, so that the impact of the material can be alleviated, and the lateral contact point between the chuck table and the grinding wheel can be prevented from being deviated to a certain side with the contact center as a reference by adjusting the tilt angle in the lateral direction.

Therefore, in order to fine-tune the left-right tilt angle, as shown in fig. 5, the present invention may further include a left-right fine tuning unit 461, which is provided with one or more than one in both side directions of the bracket 431, for adjusting the left-right tilt angle of the polishing head. The left and right fine adjustment means 461 may be provided at least one in the left and right direction of the holder 431, and the left and right inclination angle of the polishing head may be finely adjusted by a nut and a fastening bolt which are in contact with the side surface of the holder 431, similarly to the front and rear fine adjustment means 465 of the lever member.

Preferably, the left and right fine tuning unit 461 includes eccentric nuts respectively disposed in both side directions of the bracket 431 and contacting with side surfaces of the bracket 431 and having eccentric through holes, and fastening bolts threadedly coupled to the through holes of the eccentric nuts and the bracket 431.

At this time, the right-left direction inclination angle of the polishing head (X-axis direction inclination angle of the polishing head) can be adjusted by changing the fastening depth of the fastening bolt. That is, the fastening bolt is screwed to the elevating part 435 in a state where the eccentric nut is inserted, and the degree of pressing of the eccentric nut against the holder 431 contacting the eccentric nut can be adjusted according to the fastening depth of the fastening bolt through the eccentric through hole of the eccentric nut.

Therefore, by changing the fastening depth of the eccentric nuts and the fastening bolts respectively provided on both sides of the holder 431, the pressing force of the holder 431 can be adjusted, and the lateral position value of the holder 431 can be finely adjusted according to the pressing force of the eccentric nuts, so that the lateral inclination angle of the polishing head 420 coupled to the holder can be finely adjusted.

Further, as the fine adjustment unit, in addition to the eccentric nut, a nut having a tapered through hole thereon may be used, and the fastening bolt may be stably fixed to the eccentric nut or the nut using a flat head bolt or a flat head screw. The principle of fine adjustment of the tilt angle of the polishing head 420 in the left-right direction is the same as that of fine adjustment of the tilt angle of the polishing head 420 in the front-back direction, and therefore, is omitted.

For reference, when adjusting the tilt angle of the polishing head, the horizontal parallelism of the polishing head is first aligned by adjusting the tilt angle in the left-right direction, and then the inclination of the polishing head with respect to the upper surface of the semiconductor material is adjusted by adjusting the tilt angle in the front-back direction.

The semiconductor material polishing system according to the present invention can mount the polishing head obliquely, and can adjust the tilt angles of the polishing head in the front-rear direction (Y-axis direction) and the left-right direction (X-axis direction), thereby enabling two-dimensional adjustment of the rotation angle, and thus can perform polishing work for semiconductor materials of various shapes and thicknesses.

In addition, since the semiconductor material is processed in line contact with the upper surface of the semiconductor material in a state of being inclined at a predetermined angle at the time of the polishing process, excessive pressure is not transmitted to the semiconductor material, so that damage of a circuit portion and the like of the material can be prevented, generation of polishing marks on a polished surface can be minimized, and processing to have uniform roughness can be performed.

On the other hand, the semiconductor material polishing apparatuses 400a, 400b, and 400c constituting the semiconductor material polishing system 1000 according to the present invention are characterized in that each of the polishing wheels 410 is rotated at a high speed, and the semiconductor material polishing apparatuses 400 are physically separated and modularly constructed in order to minimize transmission of vibration generated when the polishing wheel 410 is rotated to other adjacent semiconductor material polishing apparatuses 400.

That is, the structures to which the semiconductor material polishing apparatus 400 is attached are also provided independently of each other, and thus mutual influences of deformation, chatter, vibration, and the like of the structures can be prevented.

Since the grinding wheel 410 and the chuck table 310 of the semiconductor material polishing apparatus to which the vibration is transmitted may be finely changed in height by the vibration if the vibration generated at the grinding head 420 of the semiconductor material polishing apparatus 400 or the like is transmitted to the adjacent semiconductor material polishing apparatus, and thus the polishing quality may be deteriorated, the semiconductor material polishing system 1000 according to the present invention may minimize a transfer path of the semiconductor material for sequentially performing the polishing work by adjacently disposing a plurality of semiconductor material polishing apparatuses 400, minimize a mutual influence due to the vibration of the semiconductor material polishing apparatus, and the like, and thus may improve the efficiency and quality of the polishing process.

For this reason, the semiconductor material polishing apparatus 400 constituting the semiconductor material polishing system 1000 according to the present invention may be respectively constructed in a modular or separated manner in order to minimize an influence generated when the polishing head 420 is driven.

For this purpose, the semiconductor material polishing apparatus 400 includes: a polishing head 420 having a polishing wheel 410 for polishing the semiconductor material removably provided at one end; a gate-shaped frame 470 which is disposed on the base and on the transfer path of the chuck table 310, and has an opening through which the chuck table 310 can move; an elevating unit 435 which is attached to the gate frame 470 and elevates the polishing head 420; and a holder for attaching the polishing head 420 to the lifting unit 435.

Further, the semiconductor material to be polished by the semiconductor material polishing apparatus is provided to be capable of being transferred in one direction by a chuck table, which is disposed on the base table in the same manner as the semiconductor material polishing apparatus.

Here, the base may be a casting of the semiconductor material polishing system, or may be a frame placed on the casting.

The semiconductor material polishing system of the present invention has a plurality of chuck tables 310 on a base, and gate frames 470 are provided independently on transfer paths of the chuck tables 310a, 310b, and 310 c. The chuck table is movable through an opening formed in the gate frame. Such gate frames are provided independently of each other and are arranged at a distance from each other, so that vibrations, chatter vibrations, and the like generated in the respective semiconductor material polishing apparatuses do not affect the semiconductor material polishing apparatuses.

In addition, since the polishing head 420 and the elevating unit 435 are coaxially disposed, adverse conditions due to external cutting force can be minimized, and the polishing head can be stably supported while being elevated.

To explain the semiconductor material polishing system according to the present invention in more detail with reference to fig. 2, each of the semiconductor material polishing apparatuses 400a, 400b, 400c includes: a polishing head 420 having a polishing wheel 410 detachably provided at one end thereof on an upper surface of a molding portion for polishing a semiconductor material; a gate-shaped frame 470 which is disposed on the base and on the transfer path of the chuck table 310, and which has an opening through which the chuck table can move; an elevating unit 435 which is attached to the frame and elevates the polishing head; the holder 431 includes a housing portion 431f for housing the polishing head 420, and the polishing head is attached to the elevating portion.

The roughness of the grinding wheels constituting the first to third semiconductor material grinding apparatuses 400a to 400c is sequentially reduced, so that the surface roughness of the molded portion of the semiconductor material at the end of the final grinding process can be within a preset target roughness.

Furthermore, the first to third semiconductor material polishing apparatuses 400a to 400c may be each equipped with a grinding wheel for finish grinding or polishing having the same roughness, or may be configured by mixing 1 grinding wheel for rough grinding having a coarse grain size with a relatively high grinding speed and 2 grinding wheels for polishing which are slow but capable of fine grinding. This enables appropriate replacement and installation according to the kind of the semiconductor material to be polished or the need for the working environment.

A grinding head 420 may be disposed above the grinding wheel 410, and the grinding head 420 may include a drive motor for rotating the grinding wheel. The polishing head 420 may be accommodated in an accommodating portion 431f of a holder 431, and the holder 431 may be attached to the elevating portion and provided to the gate frame 470.

The gate frames 470 constituting the respective semiconductor material polishing apparatuses 400a, 400b, and 400c are separated from each other and made of a casting material having a sufficient load, so that transmission of vibration and chatter generated in the respective polishing heads 420 can be blocked.

The chuck table on which the semiconductor material to be polished is placed may be transferred to a position below the polishing wheel 410 through the opening of the gate frame 470. Each chuck table 310 may be transferred in the Y-axis direction to below the grinding wheel 410 by each chuck table transfer line 403.

The polishing head and the lifting unit constituting the gate frame 470 of each semiconductor material polishing apparatus are coaxially disposed so as to be independently spaced apart in the Y-axis direction, so that interference with the gate frames of the adjacent semiconductor material polishing apparatuses is avoided, and the size of the system can be minimized. In addition, the number of modular semiconductor material polishing apparatuses can be easily increased or decreased as necessary.

The holder 431 is configured to be able to be lifted from the gate frame 470, and has a structure that can be adjusted in height or lifted by a rail attached to the gate frame. Therefore, the elevating height can be adjusted according to the kind or thickness of the semiconductor material. At this time, the guide rail is disposed coaxially with the grinding head mounted with the grinding wheel, and thus adverse effects due to external cutting force can be minimized.

In the conventional polishing system, since the polishing head and the guide rail for moving the polishing head up and down are eccentric, and the semiconductor material polishing apparatuses are connected to each other, and a plurality of semiconductor material polishing apparatuses are mounted on one structure, even if there are a plurality of semiconductor material polishing apparatuses, the drive motor of each semiconductor material polishing apparatus cannot be driven at a sufficient target speed due to the influence of mutual vibration, and there is a problem that both the polishing speed and the quality are reduced.

In particular, although a high driving speed of a driving motor of a semiconductor material polishing apparatus is required to improve polishing quality, when the driving speed of the driving motor is increased in a configuration in which a plurality of semiconductor material polishing apparatuses are connected to each other, large vibration is generated in each semiconductor material polishing apparatus, and the driving motor is limited to increase in driving speed due to a problem of vibration of the entire system because of a configuration that is susceptible to vibration.

Therefore, in the present invention, since the semiconductor material polishing apparatuses 400a, 400b, and 400c are respectively provided with the gate frames 470 independently, are arranged apart from each other, and are not shared but individually configured, it is possible to prevent the transmission of vibrations and the like of the polishing heads 420 of the semiconductor material polishing apparatuses 400a, 400b, and 400c to the peripheral semiconductor material polishing apparatuses, and to block vibrations generated in the different semiconductor material polishing apparatuses, by providing the polishing heads 420 of the respective semiconductor material polishing apparatuses with the respective independent high-rigidity casting structures, and to drive the respective drive motors at the target drive speeds, thereby improving the polishing speed or the polishing quality. In addition, the invention can simplify the structure of the whole grinding system through the modularization of the semiconductor material grinding device and can be miniaturized.

On the other hand, the grinding wheel mounted on the semiconductor material grinding apparatus may have the same width as the semiconductor material to be ground or a diameter larger than the width, and the grinding wheel may be rotated while transferring the chuck table in a direction so that the upper surface of the semiconductor material transferred above the chuck table may be sequentially ground.

That is, the upper surface of the semiconductor material transferred above the transferable chuck table is ground by contacting the grinding wheel, and has a diameter equal to or larger than the width of the semiconductor material, so that no grinding mark is generated during the grinding process, thereby processing the entire width of the semiconductor material at one time. At this time, since the chuck table can be moved in one direction, the upper surface of the semiconductor material is sequentially polished while the chuck table is moved, so that the entire upper surface can be polished.

That is, since the grinding work is performed by the grinding wheel rubbing while contacting the upper surface of the semiconductor material in the width direction in a state in which the upper surface is inclined obliquely, it is possible to improve the grinding quality while minimizing the generation of round grinding marks.

When the upper surface of the semiconductor material is ground, the grinding wheel is rotated and rubbed in contact with the upper surface of the semiconductor material to perform grinding, and the grinding may be performed by spraying water or a cleaning agent while performing wet grinding. After polishing of the entire upper surface of the semiconductor material is completed, the thickness of the upper surface of the semiconductor material may be measured by a thickness measuring unit (not shown) provided separately to the semiconductor material polishing apparatus. At this time, the thickness measuring section is movably provided in the X-axis direction, and whether or not grinding to a target thickness is confirmed by measuring the thickness at a preset point in the upper surface for the semiconductor material.

The thickness measuring unit may use a displacement sensor or a probe that optically measures a distance.

For reference, the semiconductor material polishing system of the present invention measures the thickness of the peripheral strip of the semiconductor material on which the molding portion is not formed with the thickness measuring portion provided above the drawing rail, and measures the entire thickness of the material with the thickness measuring portion provided separately to the semiconductor material polishing apparatus, so that the thickness of the molding portion can be calculated by the difference between the thickness measured above the drawing rail and the entire thickness measured above the chuck table.

In the present invention, after the polishing process of the upper surface of the semiconductor material by the semiconductor material polishing apparatus is completed, burrs (burr) or dust may be generated and remain on the surface of the semiconductor material during the polishing process, and therefore, a cleaning process for removing the burrs or dust is required.

To this end, the semiconductor material polishing system of the present invention includes an upper surface cleaning section which is provided above the conveyance path of the chuck table and cleans the upper surface of the semiconductor material polished by the semiconductor material polishing apparatus.

The upper surface cleaning unit is provided with a cleaning member that is installed above the transfer path of the chuck table so as to be movable up and down, and performs upper surface cleaning while contacting the upper surface of the semiconductor material in a process of returning to the initial position after polishing. The cleaning member is a contact cleaning member such as PVA, sponge, brush, or the like, and pre-cleans the upper surface of the chuck table in the process of moving the chuck table back to the initial position in a state of being lowered so as to contact the upper surface of the chuck table.

In the present invention, the upper surface cleaning unit may clean the upper surface of the polished semiconductor material, but may pre-clean the upper surface before transferring the semiconductor material to the polishing apparatus in order to remove foreign matter and the like adhering to the surface of the semiconductor material before polishing.

The semiconductor material finished being polished and the upper surface being pre-cleaned may be picked up by the recovery picker and transferred to a chuck table of another semiconductor material polishing apparatus to be polished in the other semiconductor material polishing apparatus, or moved to a cleaning section.

That is, when the grinding wheels provided to the semiconductor material grinding apparatus are the same grinding wheel, the final grinding may be completed and the grinding wheel may be moved to the cleaning part, but when the grinding wheels are grinding wheels having different roughness from each other, additional grinding work may be performed in an additional semiconductor material grinding apparatus until a desired roughness and thickness are achieved.

For example, after finishing the primary grinding with the grinding wheel for rough grinding in such a manner that the semiconductor material becomes a predetermined thickness in the first semiconductor material grinding apparatus 400a, the secondary grinding is performed with the grinding wheel for finish grinding in the second semiconductor material grinding apparatus 400b until the semiconductor material reaches a desired predetermined thickness and a desired roughness, and thereafter the tertiary grinding is performed with the grinding wheel for polishing in the third semiconductor material grinding apparatus 400c until the semiconductor material reaches a target thickness and a target roughness.

The polishing process in each of the semiconductor material polishing apparatuses 400a, 400b, and 400c may be performed in a state where the semiconductor material is placed on the chuck table 310 which is transferred in the Y-axis direction, and the semiconductor material in each of the semiconductor material polishing apparatuses, which has finished the polishing process in accordance with the procedure, may be conveyed by the recovery picker 360 which is provided so as to be transferred in the X-axis direction.

The recovery picker 360 recovers the polished semiconductor material from the chuck table and performs a function of transferring the semiconductor material to another chuck table or a cleaning table of a cleaning unit.

That is, the recovery pickers 360a and 360b may include: a first recovery picker 360a which picks up the polished semiconductor material from the chuck table and transfers the semiconductor material to another chuck table or a cleaning table of a cleaning section; a second reclaiming picker 360b for transferring new semiconductor material to be worked to the chuck table from which the semiconductor material is removed.

In the present invention, when the semiconductor material grinding apparatuses are all installed with the same grinding wheel, it is also possible that the supply picker 320 performs a function of supplying the semiconductor material and the recovery picker 360 performs a function of recovering the semiconductor material finished being ground. Therefore, the recycle picker 360 may be provided with 1 or 2 in consideration of the number of semiconductor material polishing apparatuses and the work performed in each semiconductor material polishing apparatus, but the number thereof may be changed.

The pair of first and second recovery pickers 360a and 360b may be mounted on the same drive unit and may be transferred together in the X-axis direction.

Among the recovery pickers, the second recovery picker 360b may perform an operation of transferring the semiconductor material polished in the first or second chuck table 310a or 310b to the second or third chuck table 310b or 310c, and the first recovery picker 360a may perform an operation of transferring the semiconductor material polished in the second or third chuck table 310b or 310c to the third chuck table 310c or 501.

In this case, the first recovery picker 360a and the second recovery picker 360b are named only for differentiating functions, and a picker which picks up the polished semiconductor material from the chuck stage and transfers the semiconductor material to another chuck stage or a cleaning stage of the cleaning part may be the second recovery picker 360b, and a picker which transfers a new semiconductor material to be worked to the chuck stage from which the semiconductor material is removed may be the first recovery picker 360a.

Although functionally divided into the second semiconductor material polishing apparatus 400b, the third semiconductor material polishing apparatus 400c, the second chuck table 310b, and the third chuck table 310c, respectively, the polishing method and each configuration performed at this time are the same, and thus a repetitive description thereof will be omitted.

The semiconductor material polishing system 1000 according to the present invention can perform cleaning of semiconductor materials sequentially polished by the plurality of semiconductor material polishing apparatuses 400a, 400b, 400 c.

As described above, although the upper surface cleaning portion is in contact with the upper surface of the semiconductor material and the upper surface cleaning is performed once, foreign matters, small dust, and the like possibly remaining on the upper surface of the semiconductor material also affect the roughness of the final material and the product performance, and therefore, the upper surface and the lower surface of the material should be cleaned cleanly.

Therefore, the polishing system of the present invention includes a cleaning unit capable of cleaning the upper surface and the lower surface.

The cleaning part of the present invention may include: a lower surface cleaning unit 370 that is provided on the conveyance path of the recovery picker 360 and is configured to clean the lower surface of the semiconductor material picked up by the recovery picker 360 by contacting the semiconductor material; the tunnel cleaning unit 500 includes: a cleaning table 501 on which the semiconductor material cleaned by the lower surface cleaning section 370 is placed and which is configured to be conveyed in the front-rear direction; the tunnel-type washing chamber 520 is provided in the conveying path of the washing table 501, and has an inlet 522 formed in the front, an outlet 524 formed in the rear, and a washing nozzle 523 for spraying washing water to the washing table side provided above the inner side.

First, the lower surface cleaning part 370 is provided on a moving path of the recovery picker so that cleaning can be performed in contact with the lower surface of the semiconductor material picked up by the recovery picker 360 while the recovery picker 360 picks up the semiconductor material finished being polished from the chuck table and moves to the cleaning part side. Lower surface cleaning the lower surface cleaning part 370 performs lower surface cleaning while contacting with the lower surface of the semiconductor material in a state of being picked up by the recovery picker 360, and the cleaning member may be a contact type cleaning member of PVA, sponge, brush, or the like.

During the execution of the lower surface cleaning, the recycle picker 360 may be stopped or moved while being in contact with the lower surface of the semiconductor material to perform the pre-cleaning. After the lower surface cleaning by the lower surface cleaning section 370 is finished, the recovery picker 360 transfers the semiconductor material st of the lower surface cleaning to above the cleaning stage 501 of the tunnel cleaning section 500.

Hereinafter, the tunnel type cleaning part 500 of the present invention will be described in more detail with reference to fig. 7 to 10.

Fig. 7 shows a perspective view of the tunnel cleaning section 500 constituting the semiconductor material polishing system 1000 according to the present invention, and fig. 8 shows a side view of the tunnel cleaning section 500 constituting the semiconductor material polishing system 1000 according to the present invention.

As shown in fig. 7 to 10, the tunnel type cleaning part 500 of the present invention includes: a cleaning stage 501 that places the semiconductor material st conveyed by the recovery picker 360 above and is provided so as to be movable in the front-rear direction; a tunnel-type washing chamber 520 provided on a transfer path of the washing table 501, having an inlet 522 formed at the front and an outlet 524 formed at the rear, and having a washing nozzle 523 for spraying washing water to the washing table side provided at the upper inner side; an unloading unit 540 for unloading the cleaned material discharged from the outlet 524; and a control unit for controlling the transfer direction and the number of times of transfer of the wash table 501.

Here, the unloading section 540 further includes: a support rail 527 extending from the outside of the outlet 524 of the tunnel cleaning chamber to the inside of the tunnel cleaning chamber 520, and provided to be adjustable in width in the left-right direction so as to support the semiconductor material, the cleaning of which has been completed, on the upper surface; and a drawing portion 551 which is provided to be movable along a support rail 527 and draws out the semiconductor material supported above the support rail.

The cleaning stage 501 receives the polished semiconductor material st picked up by the recovery picker 360, is disposed to be capable of moving forward and backward, and adjusts the number of times of cleaning by changing the transfer direction and the number of times of transfer of the cleaning stage 501. The cleaning table 501 is provided to be movable in the Y-axis direction and to be movable up and down.

Further, an air nozzle 503 for jetting air upward may be provided on one side of the cleaning table 501. At this time, the air nozzle 503 may be disposed at the entire upper surface, but may be preferably disposed at the rear of the cleaning stage 501, i.e., above the side adjacent to the tunnel cleaning chamber 520.

The tunnel cleaning chamber 520 may be a chamber in which a region capable of transferring the cleaning stage 501 is formed as an outer casing for preventing scattering of cleaning water, foreign materials, and the like during the semiconductor material cleaning process.

The tunnel-type cleaning chamber 520 is provided on a transfer path of the cleaning stage 501, and has an inlet 522 at the front for allowing the cleaning stage 501 to enter, and an outlet 524 at the rear for discharging the semiconductor material st after the cleaning is completed. Further, a washing nozzle 523 for spraying washing water to the washing table side is provided above the inner side. In this case, the cleaning nozzle 523 may be a nozzle for supplying cleaning water or a two-fluid nozzle for injecting cleaning water and air (or compressed air) together.

Further, an air nozzle 521 for injecting air toward the cleaning stage 501 may be provided above the inside of the tunnel cleaning chamber 520.

When the cleaning nozzle 523 disposed above the inside of the tunnel type cleaning chamber 520 is a two-fluid nozzle, cleaning may be performed by supplying cleaning water and air together when cleaning the upper surface of the semiconductor material. In the case of a nozzle to which only cleaning water is supplied, the cleaning nozzle 523 and the air nozzle 521 may be applied together when cleaning the upper surface of the semiconductor material, thereby further improving the cleaning efficiency.

That is, the cleaning water may be sprayed alone or together with the air nozzle to perform the cleaning with the cleaning water and the air when cleaning the upper surface of the semiconductor material. After the cleaning is finished, the ejection of the cleaning nozzle 523 is finished and only the air nozzle 521 is ejected, so that the upper surface of the semiconductor material can be dried.

That is, the tunnel cleaning chamber of the present invention may also perform drying together with upper surface cleaning of the semiconductor material.

For reference, when the tunnel cleaning part 500 performs cleaning, the cleaning stage 501 on which the semiconductor material entered the inside of the tunnel cleaning chamber 520 is placed reciprocally moves the inside of the tunnel cleaning chamber 520 in the Y-axis direction and performs cleaning on the upper surface of the semiconductor material.

At this time, the control section may adjust the number of times of cleaning by adjusting the moving direction and the number of times of movement of the cleaning stage 501. That is, while the cleaning of the upper surface of the semiconductor material is performed, the cleaning may be performed while moving the cleaning stage 501 backward or forward, or the number of times of cleaning may be adjusted while moving the cleaning stage back and forth.

The number of times of movement of the cleaning stage 501 and the number of times of cleaning may be controlled differently according to the state of the semiconductor material, respectively. Therefore, the present invention can not only finish the cleaning in one time in the tunnel cleaning chamber 520, but also perform the cleaning in multiple times by moving the cleaning table 501 forward and backward, thereby further improving the cleaning efficiency.

Further, air drying parts 525 spraying air may be provided at upper and lower ends of the outlet 524 of the tunnel type washing chamber 520, respectively.

The air drying unit 525 is configured to dry the upper surface and the lower surface of the semiconductor material in the process of discharging the semiconductor material after completion of cleaning. To this end, the air drying part 525 may include: a first air drying unit 525u disposed at an upper end of the outlet 524 of the tunnel cleaning chamber 520 and spraying air onto the semiconductor material st; and a second air drying part 525l disposed at a lower end of the outlet 524 of the tunnel type cleaning chamber 520 and spraying air toward a lower surface of the semiconductor material, wherein the first air drying part 525u and the second air drying part 525l may be coaxially disposed.

By the first air drying part 525u and the second air drying part 525l which are coaxially disposed, the air sprayed on the upper surface and the air sprayed on the lower surface form an air curtain, the drying efficiency can be further increased, and the washing water can be prevented from being discharged to the outside of the tunnel type washing chamber 520.

After the cleaning of the upper surface of the semiconductor material is finished, it is transferred to an unloading part 540 where the semiconductor material is unloaded for the cleaning of the lower surface of the semiconductor material and the discharge of the semiconductor material.

The unloading unit 540 of the present invention includes: a support rail 527 formed to extend from the outside of the outlet 524 of the tunnel cleaning chamber to the inside of the tunnel cleaning chamber 520, provided to be adjustable in width in the left-right direction, and supporting the semiconductor material, on which cleaning is completed; and a drawing portion 551 which is movable along a support rail 527 and draws out the semiconductor material supported above the support rail.

Fig. 10 illustrates a process in which the semiconductor material having finished the cleaning process is dried and drawn to the unloading section 540 in the tunnel cleaning section 500 of the present invention.

When the cleaning of the upper surface of the semiconductor material is completed by the forward and backward movement of the cleaning table, the cleaning table is raised to deliver the semiconductor material above the pair of support rails 527.

In order to deliver the semiconductor material to the upper side of the support rails 527, the pair of support rails 527 may be configured to be adjustable in width so as to receive the semiconductor material closer to the lower side of the peripheral edges of the both side surfaces of the semiconductor material in a state where the cleaning table 501 is raised.

At this time, the pair of support rails 527 may be formed to extend from the outside of the tunnel type washing chamber 520, preferably, the outside of the outlet 524 of the tunnel type washing chamber 520 to the inside of the tunnel type washing chamber, and a driving part for left and right driving may be provided outside the tunnel type washing chamber 520 for width adjustment of the pair of support rails 527, thereby protecting the driving part from washing water, moisture, or the like.

On the other hand, in a state where the cleaning table 501 is raised to the height of the support rails 527, the width of the support rails 527 is changed to be narrower than the width of the semiconductor material, and when the cleaning table is lowered, the semiconductor material placed above the cleaning table can be transferred to above the support rails.

In a state where the semiconductor material is transferred to the upper side of the support rail 527, air is sprayed to the upper side of the semiconductor material by the air nozzle 521, and the air nozzle 503 provided at one side of the cleaning stage sprays air to the lower surface of the semiconductor material, thereby performing lower surface drying of the semiconductor material in a state where the semiconductor material is placed on the support rail 527.

Of course, at the same time, the upper surface drying of the semiconductor material is performed by ejecting air from the air nozzle 521 provided above the inside of the tunnel cleaning chamber.

At this time, the cleaning stage 501 may dry the lower surface of the semiconductor material by spraying air across the entire lower surface of the semiconductor material while moving forward and backward, or may dry the lower surface of the semiconductor material by spraying air across the entire lower surface of the semiconductor material while drawing the semiconductor material st placed above the support rail 527 by the drawing portion 551 while spraying air toward the upper side in a state where the cleaning stage is stopped.

After the primary drying of the semiconductor material is performed inside the tunnel cleaning chamber 520, the remaining moisture remaining in the semiconductor material is completely dried by the air drying parts 525 disposed above and below the outlet from which the semiconductor material is discharged.

At this time, the semiconductor material placed above the support rail 527 may be drawn out to the unloading section 540 side by the drawing section 551.

The pulling portion 551 may be a pulling device such as a gripper or pusher as a structure for pulling the semiconductor material.

When using the gripper as the traction part 551, the gripper may be provided to be capable of being transferred in a direction by the gripper transfer unit 550. After the end of the semiconductor material st is grasped at the outlet 524 of the tunnel-type cleaning chamber 520, the semiconductor material is pulled outward from the tunnel-type cleaning chamber 520.

First and second air drying units 525u and 525l may be provided above and below the outlet of the tunnel cleaning chamber 520, respectively, so that cleaning water or foreign substances remaining on the semiconductor material may be removed by spraying air onto the upper surface and the lower surface of the semiconductor material in the process of pulling the semiconductor material by the pulling unit 551 and transferring the semiconductor material, and the upper surface and the lower surface of the semiconductor material may be completely dried by the first and second air drying units 525u and 525l, respectively.

On the other hand, in the process of discharging the semiconductor material st, which has been cleaned and dried, through the outlet, the tunnel cleaning part 500 not only cleans the upper surface of the semiconductor material but also performs cleaning with respect to the empty cleaning stage to which the semiconductor material is transferred.

The cleaning nozzle 523 and the air nozzle 521 can spray cleaning water and air toward the cleaning stage, and can clean the upper surface of the semiconductor material in a state where the semiconductor material is placed above the cleaning stage, and can clean the upper surface of the cleaning stage when the semiconductor material is removed from above the cleaning stage.

At this time, the cleaning nozzle may spray cleaning water to the side of the cleaning stage to clean the cleaning stage during a process of discharging the semiconductor material after the cleaning and drying is finished from the outlet 524 or while the cleaning stage is retreated to the inlet side after the semiconductor material is discharged from the outlet.

In addition, even if the washing water is sprayed at a time point when the semiconductor material is not affected during the discharge of the semiconductor material from the outlet 524, the washing water may be sprayed to the upper side of the washing table positioned below the support rail 527.

Of course, when the cleaning table is cleaned, the cleaning nozzle and the air nozzle may be used together to spray the cleaning table 501, or only the air nozzle may be used to remove the residual foreign matter and the like remaining on the cleaning table with air.

That is, the tunnel type washing unit according to the present invention can variously adjust the number of washing times or the number of drying times as needed by freely controlling the reciprocating movement such as the forward movement or the backward movement of the washing table.

The tunnel cleaning unit according to the present invention can clean not only the upper surface of the semiconductor material but also the lower surface of the semiconductor material, and can spray the semiconductor material independently from the cleaning nozzle 523 and the air nozzle 521, and can variously change the cleaning condition and the air condition to select the surface width. Further, the tunnel cleaning part 500 performs cleaning in the inside of the tunnel cleaning chamber, so that it is possible to prevent cleaning water sprayed at the time of cleaning from scattering to the outside to protect equipment, and to prevent foreign substances and the like separated and discharged from semiconductor materials during cleaning, thereby having an advantage of easy cleaning maintenance management.

In addition, the tunnel type cleaning part of the present invention performs the cleaning and drying processes in the tunnel type cleaning chamber, and continuously performs the automatic cleaning by controlling the transfer direction and the transfer frequency of the cleaning table, thereby simplifying the system, preventing the air and the cleaning water used in the cleaning process from being scattered together with dust, foreign substances, etc., and improving the efficiency of the malfunction prevention and maintenance of the system.

On the other hand, the semiconductor material is transferred in a state where it is placed on the cleaning table 501, cleaned by air blowing and cleaning water, and the semiconductor material, which has been subjected to the cleaning and drying process in the tunnel cleaning unit 500, is drawn to the drawing unit 551 in a state where it is placed on the support rail 527, transferred to the outside of the tunnel cleaning chamber 520 of the tunnel cleaning unit 500, and transferred to the semiconductor material pickup position by the transfer pickup 620. A support 543 is also provided below the support rail 527 to be ascendable and descendable in the process of transferring the material to the transfer picker 620, so as to prevent the semiconductor material from drooping.

The transfer picker 620 picks up the semiconductor material drawn out by the drawing part 551, is provided to be movable in the X-axis direction, and transfers the semiconductor material to the inspection stage 610 after picking up the semiconductor material.

The inspection stage 610 may be moved in the Y-axis direction in a state where the semiconductor material is conveyed thereon. In a state where the semiconductor material is conveyed above the inspection stage 610, an upper face of the semiconductor material, that is, an upper face of the polished semiconductor material, may be inspected with an inspection view 630.

The inspection view 630 may be installed above the output part and inspect the polished state of the semiconductor material after the cleaning and drying are finished. For example, scratches, cracks, contamination, ball indentations, crevice balls and voids may be detected.

The inspection view 630 of the present invention can inspect the upper surface of the semiconductor material immediately after polishing and cleaning, and can inspect the polishing state and the cleaning state immediately by the inspection state, thereby minimizing the occurrence of defects.

After the inspection of the mold part is completed, the inspection stage 610 returns to the initial position, and the transfer picker 620 provided above the inspection stage 610 picks up the semiconductor material again and carries it out to the output part.

The above describes the case where the inspection view 630 is performed in a state of being mounted above an additional inspection table, but may be performed during the process of being carried out to the output unit. Further, an area where inspection is performed in the inspection table 610 may be included in the output section.

The output unit of the present invention may include a recovery unit 700 and a material recovery unit 800, and the semiconductor material whose inspection is completed in the output unit is placed in the recovery unit 700 that can be transferred in the Y-axis direction and recovered in the material recovery unit 800.

The recovery unit 700 may include a recovery rail 750 on which the semiconductor material is placed, a pusher 710 for pushing the semiconductor material placed on the recovery rail 750 into the material recovery unit 800, and the like.

The material recovery unit 800 may store the semiconductor material layers after the polishing process, the cleaning process, and the inspection process in a stacked manner in the same manner as the semiconductor material supply unit 100.

For reference, the material collecting unit 800 may be a magazine in which semiconductor materials are stacked, and may be loaded and unloaded in each magazine in accordance with good or defective products based on the inspection result of the inspection view 630.

As described above, although the present invention has been described with reference to the preferred embodiments, a person skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention as set forth in the following claims.

Claims (24)

1. A semiconductor material polishing system, comprising:

a material supply section that supplies a semiconductor material;

a supply picker which picks up and transfers the semiconductor material supplied to the material supply section;

one or more chuck tables disposed on a base, above which the semiconductor material picked up by the supply picker is transferred, and disposed to be movable in one direction;

one or more semiconductor material polishing apparatuses comprising: a polishing head having a polishing wheel detachably provided at one end thereof for polishing the semiconductor material; a gate-shaped frame disposed on the base and on a transfer path of the chuck table, the gate-shaped frame having an opening through which the chuck table moves; an elevating unit which is attached to the gate-shaped frame and elevates the polishing head; a holder for attaching the polishing head to the lifting unit; and an angle adjusting section for adjusting an inclination angle of the polishing head;

a cleaning unit configured to clean the semiconductor material polished by the semiconductor material polishing apparatus; and

an output section for carrying out the semiconductor material cleaned by the cleaning section,

the grinding head and the lifting part are coaxially arranged.

2. The semiconductor material polishing system according to claim 1,

the chuck table is provided with a plurality of chuck tables on the base table,

the gate-shaped frames are independently provided on the transfer path of each chuck table,

the gate frames are spaced apart from each other.

3. The semiconductor material polishing system according to claim 2,

grinding wheels having the same or different roughness are selectively and detachably mounted on the respective grinding heads,

when the grinding wheels having different roughness from each other are mounted,

the grinding wheels are arranged in sequence from coarse grain grinding wheels to fine grain grinding wheels.

4. The semiconductor material polishing system according to claim 1,

the grinding wheel has a diameter that is the same as or greater than the width of the semiconductor material to be ground,

the grinding wheel is rotated while the chuck table is transferred in a direction, thereby grinding the entire upper surface of the semiconductor material.

5. The semiconductor material polishing system according to claim 1,

the bracket is provided with an accommodating part for accommodating the grinding head, and through holes are formed on the outer walls of two sides of the accommodating part,

the semiconductor material polishing apparatus further includes a mounting member coupled to an outside of the polishing head to attach and detach the polishing head to and from the housing portion, the mounting member being provided with a fitting groove at a position corresponding to the through hole,

the angle adjusting part includes:

a pair of brackets that are rotatably fixed to the bracket by being fixedly attached to the fitting grooves of the attachment member through the through-holes of the bracket;

a lever member that rotates one or more brackets of the pair of brackets; and

and a front-rear fine adjustment unit that is provided with one or more members on both sides of the lever member and that finely adjusts a front-rear direction inclination angle of the polishing head.

6. The semiconductor material polishing system according to claim 5,

the rod member is formed integrally with the bracket, or coupled to one surface of the bracket, or inserted into the bracket.

7. The semiconductor material polishing system of claim 5, wherein the front-to-back trim unit comprises:

eccentric nuts respectively provided in both side directions of the rod member, one side of each eccentric nut contacting a side surface of the rod member and having an eccentric through hole; and

a fastening bolt threadedly coupled to the through-hole of the eccentric nut and the bracket,

and the inclination angle of the grinding head in the front-back direction is finely adjusted by changing the fastening depth of the fastening bolt.

8. The semiconductor material grinding system of claim 5, wherein the front and back trimming unit comprises:

nuts respectively provided in both side directions of the rod member, one side of each nut contacting a side surface of the rod member and having a tapered through hole in an upper surface thereof; and

a fastening bolt threadedly coupled to the through-hole of the nut and the bracket,

the through hole is larger than the diameter of the fastening bolt, and the inclination angle of the grinding head in the front-back direction can be finely adjusted by changing the fastening depth of the fastening bolt.

9. The semiconductor material polishing system according to claim 5,

the bracket and the mounting part of the semiconductor material grinding device are provided with more than one fastening hole at positions corresponding to each other, the fastening hole formed in the bracket is larger than the fastening hole formed in the mounting part,

the semiconductor material grinding device further comprises a fixing bolt which is inserted into and combined with the fastening hole so as to fix the adjusted angle through the angle adjusting part.

10. The semiconductor material polishing system according to claim 5, wherein the angle adjusting section further includes a left-right fine adjustment unit that is provided with one or more in both side directions of the holder and adjusts a left-right direction inclination angle of the polishing head,

the left and right trimming unit includes:

eccentric nuts respectively arranged in the left and right directions of the bracket, one surface of each eccentric nut being in contact with the side surface of the bracket and having an eccentric through hole; and

a fastening bolt threadedly coupled to the through hole of the eccentric nut and the elevating part,

and the right and left inclination angles of the grinding head are finely adjusted by changing the fastening depth of the fastening bolt.

11. The semiconductor material polishing system according to claim 5,

the angle adjusting part further comprises

A left-right fine adjustment unit which is provided with more than one in the left-right direction of the bracket and adjusts the left-right direction inclination angle of the grinding head,

the left and right trimming unit includes:

nuts respectively arranged in the left and right directions of the bracket, one surface of each nut is in contact with the side surface of the bracket, and a conical through hole is formed in the upper surface of each nut; and

a fastening bolt screwed to the through hole of the nut and the elevating portion,

and the right and left inclination angles of the grinding head are finely adjusted by changing the fastening depth of the fastening bolt.

12. The semiconductor material polishing system according to any one of claims 7, 8, 10 and 11,

the fastening bolt is a flat head bolt or a flat head screw.

13. The semiconductor material polishing system of claim 1, further comprising:

a recovery picker which picks up the semiconductor material finished being polished in the semiconductor material polishing apparatus and transfers the semiconductor material to the cleaning part,

the cleaning part includes:

a lower surface cleaning unit which is provided on the conveyance path of the recovery picker and which is configured to clean the lower surface of the semiconductor material picked up by the recovery picker by contacting the lower surface with the semiconductor material; and

the tunnel type cleaning unit includes: a cleaning table for placing the semiconductor material cleaned by the lower surface cleaning part on the upper side and transferring the semiconductor material in the front-back direction; a tunnel-type washing chamber provided on a transfer path of the washing table, having an inlet formed at a front side and an outlet formed at a rear side, and having a washing nozzle for spraying washing water to the washing table side at an inner upper side; and a control unit that adjusts the number of times of cleaning while moving the cleaning table forward and backward by controlling the transfer direction and the number of times of transfer of the cleaning table.

14. The semiconductor material grinding system of claim 13,

the semiconductor material polishing system further comprises:

an unloading section that unloads the material discharged from the outlet and finished being washed,

the unloading section includes:

a support rail extending from an outer side of an outlet of the tunnel cleaning chamber to an inner side of the tunnel cleaning chamber, the support rail having a width adjustable in a left-right direction so as to support the semiconductor material, which has been cleaned, on an upper surface; and

and a drawing unit that moves along the support rail and draws out the semiconductor material supported above the support rail.

15. The semiconductor material polishing system according to claim 14,

the cleaning table can be arranged in a lifting way,

when the cleaning by the cleaning nozzle is finished, the cleaning stage is raised to the height of the support rail, and in a state where the support rail is changed to have a width smaller than that of the semiconductor material, the cleaning stage is lowered to transfer the semiconductor material placed above the cleaning stage to the support rail.

16. The semiconductor material polishing system of claim 14,

an air nozzle for jetting air upwards is arranged at one side of the cleaning table,

the air nozzle sprays air to the lower surface of the semiconductor material transferred to the support rail.

17. The semiconductor material polishing system according to claim 14,

the cleaning nozzle sprays cleaning water to the cleaning stage side to clean the cleaning stage while the cleaning stage is retreated to the inlet side after the semiconductor material after cleaning is discharged from the outlet.

18. The semiconductor material polishing system according to claim 14,

the tunnel type cleaning part further comprises:

an air nozzle installed at an upper portion of an inner side of the tunnel type cleaning chamber and spraying air downward,

the air nozzle is ejected together with the cleaning nozzle to clean the upper surface of the semiconductor material or the upper surface of the cleaning table, or

Separately spraying and drying an upper face of the semiconductor material or an upper face of the cleaning stage.

19. The semiconductor material polishing system according to claim 13,

the tunnel type cleaning part comprises:

a first air drying unit disposed at an upper end of an outlet of the tunnel cleaning chamber and spraying air onto an upper surface of the semiconductor material; and

a second air drying part which is arranged at the lower end of the outlet of the tunnel type cleaning chamber and sprays air to the lower surface of the semiconductor material,

the first air dryer section and the second air dryer section are coaxially arranged.

20. The semiconductor material polishing system according to claim 13,

the washing part further includes:

and an upper surface cleaning unit which is provided above the transfer path of each chuck table and cleans an upper surface of the semiconductor material polished by the semiconductor material polishing apparatus.

21. The semiconductor material polishing system according to claim 1,

the semiconductor material polishing system further comprises:

a recovery picker which picks up the semiconductor material polished by the semiconductor material polishing apparatus and transfers the semiconductor material to the cleaning part,

the recovery picker includes:

a first reclaimer picking up the semiconductor material finished being polished placed above the chuck table and transferring the semiconductor material to an arbitrary chuck table or to the cleaning part; and

a second reclaim picker that delivers new semiconductor material to be processed at the chuck station where the semiconductor material is removed.

22. The semiconductor material polishing system according to claim 1,

the supply picker is rotatably provided,

the material supply further comprises:

a cassette on which the semiconductor material is laminated;

a drawing unit that draws out or feeds any one of the semiconductor materials laminated on the cassette; and

an upper view installed at an upper side of the material supply part for checking a supply direction of the semiconductor material drawn out of the cassette and supplied, or a lower view installed at a lower side of the material supply part,

the drawing unit feeds the semiconductor material into the cassette when the vertical direction of the semiconductor material is wrong according to the inspection result of the upper view or the lower view,

when the left-right direction of the semiconductor material is wrong, the supply picker rotates in a state of picking up the semiconductor material, thereby converting the direction of the semiconductor material.

23. The semiconductor material polishing system of claim 1,

the semiconductor material polishing system further comprises:

a lower view installed at one side of the supply picker; and

an upper view installed below a conveying path of the supply picker,

the upper view checks alignment of the semiconductor material picked up by the supply picker,

the lower view checks alignment of the chuck table to which the semiconductor material picked up by the supply picker is transferred,

the supply picker delivers the semiconductor material to the chuck table according to the alignment check result of the upper view and the lower view.

24. The semiconductor material polishing system according to claim 1,

the semiconductor material polishing system further comprises:

and an inspection view which is installed above the output part and inspects the semiconductor material after polishing and cleaning.

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