TW202301521A - Semiconductor materials polishing system - Google Patents

Abstract

The present invention relates to a semiconductor materials polishing system for polishing a molding part of a semiconductor material in which a molding part is formed through a molding process, which is characterized by having the followings: as a polishing head and a lifting part for lifting the polishing head are coaxially provided, vibration in accordance with the load of the polishing head during the polishing head being raised and lowered can be reduced; and as a plurality of semiconductor material polishing apparatuses are each modularized and independently spaced apart from each other, vibration generated in each semiconductor material polishing apparatus is minimized from being transmitted to other adjacent semiconductor material polishing apparatuses, respectively. Therefore, the present invention is characterized in that the driving speed of the semiconductor material polishing apparatus is sufficiently increased to secure the polishing speed and quality, and the structure of the entire polishing system is simplified and miniaturized by modularizing a semiconductor material polishing apparatus into a plurality of semiconductor material molding units.

Description

Semiconductor Material Grinding System

The present invention relates to semiconductor material grinding systems. In more detail, it relates to a semiconductor material grinding system for reducing the thickness of the semiconductor material by grinding the protective mold layer of the semiconductor material in which the semiconductor chip is mounted on a semiconductor substrate or wafer and packaged.

The semiconductor material is manufactured by mounting a semiconductor chip on a semiconductor substrate or wafer, and molding it with a resin in order to protect the semiconductor chip from the external environment. Before the semiconductor package is subjected to an individualized cutting process for each package unit, a molded portion is formed through a molding process.

Recently, for the purpose of miniaturization and weight reduction of semiconductor materials, thin processing of semiconductor materials by methods such as grinding and lapping is emerging.

For this, the grinding process for grinding the molded part of the semiconductor material may be rotated in a state where the grinding wheel is in surface contact with the upper part of the molded part of the semiconductor material, thereby reducing the thickness of the molded part.

The grinding speed is proportional to the roughness of the grinding wheel used in this grinding process, and the roughness of the surface of the molded part of semiconductor material at the end of the grinding process should be below a predetermined level.

This semiconductor material grinding device can use a grinding wheel having a diameter smaller than the length of the long side of the semiconductor material, by making the contact surface of the grinding wheel contact the upper surface of the molded part of the semiconductor material at a high speed in parallel with the molded part of the semiconductor material. The molding is ground by rotation so that the grinding wheel has surface contact with the long side of the semiconductor material at two points.

In this case, grinding marks having a circular arc shape in two directions are generated on the surface of the semiconductor material, and it occurs at a point where the grinding marks (grinding marks) having a circular arc shape in two directions meet than at other points More grinding, so the problem of uneven grinding on the surface of semiconductor materials may occur.

In order not to produce surface contact at two points on the surface of the semiconductor material, it may be considered to use a grinding wheel with a diameter longer than the length of the long side of the semiconductor material, but when the diameter of the grinding wheel becomes excessively large, the semiconductor material grinding device will produce A lot of vibration makes it difficult to uniformly grind the surface of the semiconductor material, and there is a problem that the size of the grinding wheel increases and the size of the equipment also increases.

On the other hand, in order to ensure the polishing rate of the semiconductor material, a plurality of semiconductor material polishing devices may be used. At this time, in order to achieve good grinding quality and desired roughness in each semiconductor material grinding device, the rotational speed of the grinding wheel should be ensured. That is, even if the grinding process is performed using the same grinding wheel, if the rotational speed of the grinding wheel is not ensured, the quality of each grinding process may be degraded.

However, when a plurality of semiconductor material grinding devices are arranged continuously and the grinding process is performed by each semiconductor material grinding device, the vibration generated by each semiconductor material grinding device will affect the grinding process of the adjacent semiconductor material grinding device. Such vibrations become larger as the speed of the grinding wheel increases, so there is a problem that the rotational speed of the semiconductor material grinding device needs to be reduced in order to minimize the mutual influence.

As far as the conventional semiconductor material grinding system is concerned, in order to prevent the size of the system from becoming larger, a plurality of semiconductor material grinding devices are arranged adjacent to each other. In order to reduce the mutual influence caused by the vibration generated during the installation, the driving speed of each semiconductor material grinding device can only be reduced, thereby reducing the efficiency of the grinding process.

In addition, the grinding head and the lifting part used to lift the grinding head in the conventional semiconductor material grinding system are installed eccentrically, so that the grinding head cannot be stably supported, and vibration and vibration are prone to occur. Two grinding heads are installed in one structure, so in Vibration, deformation, vibration, etc. generated in each polishing head may affect each other, and there is a problem that it is difficult to increase the number of semiconductor material polishing devices and also in terms of its design.

An object of the present invention is to provide a semiconductor material grinding system capable of increasing the grinding speed by minimizing the vibration generated in the semiconductor material grinding apparatus in order to solve the aforementioned problems.

In addition, the object of the present invention is to provide a semiconductor material grinding system, which uses a plurality of semiconductor material grinding devices in the semiconductor material grinding process, and simplifies and miniaturizes the structure of the grinding system by modularizing each semiconductor material grinding device , There is no difficulty in increasing or decreasing the number of semiconductor material grinding devices.

In addition, the purpose of the present invention is to provide a semiconductor material grinding system, which coaxially arranges the grinding head and the lifting part of the lifting grinding head, so that the vibration caused by the load of the grinding head can be reduced during the grinding process, and it will be used for each semiconductor material. The grinding wheels of the grinding device are arranged in order of fineness, and can be ground sequentially in the order of rough grinding, fine grinding, and polishing.

In addition, the object of the present invention is to provide a semiconductor material grinding system that can prevent damage to the circuit part of the material by minimizing the grinding pressure applied to the semiconductor material during grinding, and can minimize the damage generated on the surface of the molded part. Grinding marks.

Another object of the present invention is to provide a semiconductor material polishing system that can easily adjust the inclination angles of the polishing head in the front-rear direction and the left-right direction, and can finely adjust the inclination angles.

Another object of the present invention is to provide a semiconductor material polishing system capable of cleaning the upper and lower surfaces of the polished semiconductor material and adjusting the number of times of cleaning and drying.

In order to solve the above technical problems, the present invention provides a semiconductor material grinding system, which is characterized in that it includes: a material supply part, which supplies semiconductor materials; a supply picker, which picks up the semiconductor material supplied to the material supply part and transmits it; More than one chuck table, which is arranged on the base table, the semiconductor material picked up by the supply picker is conveyed above the chuck table, and is arranged to be transportable in one direction; more than one semiconductor material grinding device , including: a grinding head, which is detachably provided with a grinding wheel for grinding the semiconductor material at one end; a gate-shaped frame, which is configured on the base platform and arranged on the transfer path of the chuck table, the The gate-shaped frame has an opening for the movement of the chuck table; the lifting part is installed on the gate-shaped frame and lifts the grinding head; the bracket is used to install the grinding head on the lifting part and, an angle adjustment unit, which is used to adjust the inclination angle of the grinding head; a cleaning unit, which cleans the semiconductor material that has been ground in the semiconductor material grinding device; and, an output unit, which is carried out in the cleaning unit For cleaning the semiconductor material, the grinding head and the lifting part are arranged coaxially.

In addition, a plurality of the chuck tables are provided on the base, the gate-shaped frames are independently provided on the transfer paths of the respective chuck tables, and the gate-shaped frames are spaced apart from each other.

And, the grinding wheels with the same or different roughness are selectively and detachably installed on each of the grinding heads. The grinding wheels are arranged sequentially in order from the grinding wheel to the fine grinding wheel.

Furthermore, the grinding wheel has a diameter equal to or greater than the width of the semiconductor material to be ground, and the entire upper surface of the semiconductor material is ground by rotating the grinding wheel while moving the chuck table in one direction.

Moreover, the bracket is provided with a housing part for housing the grinding head, and through holes are formed on the outer walls of both sides constituting the housing part. The semiconductor material grinding device also includes a mounting part, and the mounting part is combined with the The outside of the grinding head is used to disassemble the grinding head in the accommodating part, and a fitting groove is provided at a position corresponding to the through hole, and the angle adjusting part includes: a pair of brackets, which pass through The through hole of the bracket is fixedly installed in the fitting groove of the mounting part, so that the grinding head is fixed on the bracket and can be rotated; the rod part makes one or more of the pair of brackets The bracket rotates; and, there are at least one front-back fine-tuning unit on both sides of the rod member, and fine-tunes the tilt angle of the grinding head in the front-back direction.

Here, the rod member is integrally formed with the bracket, or combined with one side of the bracket, or inserted and installed in the bracket.

In addition, the front and rear fine-tuning unit includes: eccentric nuts, which are respectively arranged in the direction of both sides of the rod member, one side of which is in contact with the side of the rod member and has an eccentric through hole; and a fastening bolt whose thread The through hole connected to the eccentric nut and the bracket can be used to fine-tune the inclination angle of the grinding head in the front-back direction by changing the fastening depth of the fastening bolt.

Moreover, the front and rear fine-tuning unit includes: nuts, which are respectively arranged on both sides of the rod member, one side is in contact with the side of the rod member and has a tapered through hole on the upper surface; and, fastening bolts, It is threadedly connected to the through hole of the nut and the bracket, the through hole is larger than the diameter of the fastening bolt, and by changing the fastening depth of the fastening bolt, the inclination of the front and rear directions of the grinding head can be fine-tuned angle.

In addition, the bracket and the mounting part of the semiconductor material grinding device are provided with more than one fastening hole at positions corresponding to each other, and the fastening hole formed in the bracket is larger than the fastening hole formed in the mounting part. The semiconductor material grinding device further includes a fixing bolt inserted into the fastening hole so as to fix the adjusted angle through the angle adjusting part.

Moreover, the angle adjustment part also includes a left-right fine-tuning unit, which is provided with more than one on both sides of the support, and adjusts the left-right inclination angle of the grinding head, and the left-right fine-tuning unit includes: an eccentric nut , which are respectively arranged in the left and right directions of the bracket, one side is in contact with the side of the bracket and has an eccentric through hole; and a fastening bolt is threadedly connected to the through hole of the eccentric nut and the lifting part, By changing the fastening depth of the fastening bolts, the left-right inclination angle of the grinding head can be fine-tuned.

And, the angle adjustment part also includes a left and right fine adjustment unit, which is provided with more than one in the left and right direction of the support, and adjusts the inclination angle of the grinding head in the left and right direction, and the left and right fine adjustment unit includes: a nut, which They are respectively arranged in the left and right directions of the bracket, one side is in contact with the side of the bracket and has a tapered through hole on the top; Change the fastening depth of the fastening bolts to fine-tune the inclination angle of the grinding head in the left-right direction.

Here, the fastening bolts are flat-head bolts or flat-head screws.

Moreover, the semiconductor material grinding system further includes: a recovery picker, which picks up the semiconductor material that has been ground in the semiconductor material grinding device and transfers it to the cleaning section, and the cleaning section includes: lower surface cleaning and lower surface cleaning a section, which is arranged on the conveying path of the recovery picker, and is used for cleaning by contacting the lower surface of the semiconductor material picked up by the recovery picker; The semiconductor material cleaned by the lower surface cleaning part is placed above and can be transferred in the front and rear directions; the tunnel type cleaning chamber is arranged on the transfer path of the cleaning table, and an entrance is formed in the front and An outlet is formed at the rear, and a cleaning nozzle that sprays cleaning water toward the cleaning table side is provided on the inner upper side; and a control unit that moves the cleaning table forward and backward by controlling the transfer direction and the number of times of transfer of the cleaning table. While adjusting the number of washes.

In addition, the semiconductor material grinding system further includes an unloading part, which unloads the cleaned materials discharged from the outlet, and the unloading part includes: supporting rails, which extend outward from the outlet of the tunnel-type cleaning chamber. The inner side of the tunnel-type cleaning chamber is extended, and the width can be adjusted in the left and right directions, so that the semiconductor material that has been cleaned is supported on the upper surface; and the traction part moves along the support rail and draws out The semiconductor material is supported above the support rail.

In addition, the cleaning table can be set up and down. When the cleaning by the cleaning nozzle is completed, the cleaning table rises to the height of the support rail, and the support rail changes to a state where the width is smaller than the width of the semiconductor material. Next, the cleaning table descends to transfer the semiconductor material placed above the cleaning table to the support rail.

In addition, an air nozzle for injecting air upward is provided on one side of the cleaning table, and the air nozzle injects air toward the lower surface of the semiconductor material transferred to the support rail.

In addition, the cleaning nozzle cleans the cleaning table by spraying cleaning water toward the cleaning table while the cleaning table is retreating toward the inlet after the semiconductor material that has been cleaned is discharged from the outlet.

In addition, the tunnel-type cleaning part further includes: an air nozzle installed above the inner side of the tunnel-type cleaning chamber, and sprays air downward, and the air nozzle is sprayed together with the cleaning nozzle to clean the semiconductor. The upper surface of the material or the upper surface of the cleaning table, or spray alone to dry the upper surface of the semiconductor material or the upper surface of the cleaning table.

Moreover, the tunnel-type cleaning part includes: a first air drying part, which is arranged at the upper end of the outlet of the tunnel-type cleaning chamber, and sprays air to the upper surface of the semiconductor material; and, a second air drying part, It is arranged at the lower end of the outlet of the tunnel-type cleaning chamber, and sprays air to the lower surface of the semiconductor material, and the first air drying part and the second air drying part are arranged coaxially.

In addition, the cleaning unit further includes an upper surface cleaning unit disposed above the transfer path of each of the chuck tables, and cleaning the upper surface of the semiconductor material polished by the semiconductor material grinding device.

Moreover, the semiconductor material grinding system further includes: a recovery picker, which picks up the semiconductor material that has been ground in the semiconductor material grinding device and sends it to the cleaning part, and the recovery picker includes: a first recovery picker , which picks up the finished grinding semiconductor material placed above the chuck table and transfers it to any chuck table or to the cleaning section; and, a second recovery picker, which removes the semiconductor material from the The tray delivers the new semiconductor material to be processed.

In addition, the supply picker is rotatably provided, and the material supply part further includes: a cassette on which the semiconductor material is stacked; an extraction unit that extracts or injects any of the semiconductor materials stacked on the cassette. a material; and, an upper view or a lower view, the upper view is installed on the upper side of the material supply part for checking the supply direction of the semiconductor material drawn and supplied from the cassette, the lower view The view is installed on the lower side of the material supply part, and when the vertical direction of the semiconductor material is wrong according to the inspection results of the upper view or the lower view, the extraction unit puts the semiconductor material into the The cassette rotates in a state where the supply picker picks up the semiconductor material when the right-left direction of the semiconductor material is wrong, thereby switching the direction of the semiconductor material.

Moreover, the semiconductor material grinding system further includes: a lower view, which is installed on one side of the supply picker; and an upper view, which is installed below the conveying path of the supply picker, and the upper view is the lower view inspects the alignment of the semiconductor material picked up by the supply picker, the lower view inspects the alignment of the chuck table to which the semiconductor material picked up by the supply picker is to be transferred, the A supply picker transfers the semiconductor material to the chuck station based on the alignment check results of the upper view and the lower view.

Moreover, the semiconductor material grinding system further includes: an inspection view, which is installed above the output part, and inspects the semiconductor material that has been ground and cleaned.

According to the semiconductor material grinding system of the present invention, since the grinding head and the lifting portion that lifts the grinding head are coaxially arranged, during the grinding of the semiconductor material by the grinding head, the reaction force transmitted from the semiconductor material to the grinding head can be supported without shaking, thereby enabling Vibration is reduced, and a plurality of semiconductor material grinding devices are separately modularized and arranged separately from each other, thereby minimizing the transmission of vibrations generated in each semiconductor material grinding device to each other. In addition, according to the semiconductor material grinding system of the present invention, a plurality of semiconductor material grinding devices are arranged side by side in parallel with the conveying direction of the chuck table, so that it is easy to increase or decrease the number of modularized semiconductor material grinding devices, and can minimize The effect of the footprint occupied by the semiconductor material grinding device.

In addition, according to the semiconductor material grinding system of the present invention, since the vibrations generated in each semiconductor material grinding device are not transmitted to each other, the driving speed of the semiconductor material grinding device can be increased, and the grinding surface can be secured at a high grinding speed. High quality and fast processing, so that the overall productivity becomes better.

In addition, according to the semiconductor material grinding system of the present invention, by installing grinding wheels with different roughness (fineness) in each semiconductor material grinding device, there is an effect that the rough grinding semiconductor material grinding device can be quickly ground at a high speed. When the processing thickness reaches a certain level, the semiconductor material is processed in the fine grinding semiconductor material grinding device to have a lower surface roughness than that in the rough grinding semiconductor material, and the surface roughness is secured at a certain level, and the material is polished in the semiconductor material grinding device The surface roughness is processed to be smooth and good. Therefore, there is an effect that quick and precise grinding can be performed.

In addition, according to the semiconductor material grinding system of the present invention, the same or different grinding wheels can be attached to each semiconductor material grinding device, so that various types of semiconductor material grinding devices can be realized according to the type and thickness of the material or as needed.

In addition, according to the semiconductor material grinding system of the present invention, the grinding head for grinding the semiconductor material is configured to have a predetermined angle inclination with respect to the upper surface of the semiconductor material, and is configured to be able to easily change the angle of the inclined grinding head, thereby reducing the amount of damage to the semiconductor material. The surface pressure applied to the semiconductor material during grinding can avoid excessive pressure on the semiconductor material, thereby preventing damage to the semiconductor material, and has the effect of grinding with uniform roughness without grinding marks on the grinding surface.

In addition, according to the semiconductor material grinding device of the present invention, the inclination angle of the front and rear directions of the grinding head can be finely adjusted, thereby making the semiconductor material contact with the grinding wheel line, and reducing the impact of the semiconductor material. Since the inclination angle of the left and right directions can be finely adjusted, the cylindrical grinding device does not It will be biased to one side, which can ensure the flatness of the semiconductor material processing surface, thereby improving the quality.

In addition, the semiconductor material grinding device according to the present invention can adjust the inclination angle of the grinding head in the front-back direction and the left-right direction, so that the rotation angle can be adjusted two-dimensionally, so it has the effect of grinding semiconductor materials of various shapes and thicknesses.

In addition, according to the semiconductor material grinding device of the present invention, when adjusting the inclination angle of the grinding head, the pressing force of the fine-tuning unit is adjusted by changing the tightening depth of the fastening bolt, and the inclination of the grinding device can be adjusted according to the pressing force. Effect.

In addition, according to the semiconductor material grinding system of the present invention, it is possible to clean both the upper and lower surfaces of the semiconductor material that has been polished, and the tunnel type cleaning unit can be used to appropriately select the number of times of cleaning and the cleaning method, and the upper and lower surfaces of the semiconductor material that have been cleaned can be dried. Furthermore, by properly selecting the number of times of drying and the drying method, various cleaning and drying methods can be adopted as required.

According to the semiconductor material grinding system of the present invention, cleaning is performed using cleaning water and air for semiconductor materials or cleaning stations, and a tunnel-type cleaning chamber is used during cleaning and drying, thereby preventing dust and foreign matter from being caused by cleaning water during cleaning. And the effect of air scattering to the outside.

In addition, according to the semiconductor material polishing system of the present invention, not only the semiconductor material is cleaned, but also the upper surface of the cleaning table is cleaned during the period when the cleaned semiconductor material is carried out and the cleaning table is returned to the initial position for cleaning the next semiconductor material. The effect of clean maintenance and management is possible.

Therefore, according to the semiconductor material polishing system of the present invention, the cleaning table, the tunnel-type cleaning chamber, the support rail extended and formed inside the tunnel-type cleaning chamber, and the pulling part for carrying out and cleaning are arranged in a row on the same moving path. , so the size of the semiconductor material cleaning device can be minimized, thereby minimizing the footprint of the entire system.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described here, and may be embodied in other forms. Rather, the embodiments described herein are provided so that the disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art. Throughout the specification, the same reference numerals denote the same constituent elements.

The present invention relates to a semiconductor material grinding system 1000. The semiconductor material grinding system 1000 performs a molding process for semiconductor materials such as semiconductor strips or wafers, and is performed in order to realize the weight reduction and miniaturization of semiconductor materials that complete the molding process. The grinding process to reduce the thickness of the molded part by grinding the molded part, and performing cleaning and drying of the semiconductor material completing the grinding process.

In particular, the present invention provides a semiconductor material grinding system that can reduce vibration generated during grinding of semiconductor materials, and can minimize the vibration of each semiconductor material grinding device even if a plurality of semiconductor material grinding devices are provided. The vibration, vibration, deformation, etc. generated in the process are transmitted to other adjacent semiconductor material grinding devices, thereby increasing the grinding speed of the semiconductor material grinding device, and ensuring uniform grinding quality and roughness during grinding.

Hereinafter, the semiconductor material grinding system of the present invention will be described in more detail with reference to the accompanying drawings of the present invention.

Figure 1 shows a plan view of a semiconductor material grinding system 1000 according to the present invention.

The semiconductor material grinding system 1000 according to the present invention is characterized in that it includes: a material supply part 100, which supplies semiconductor materials; a supply picker 320, which picks up and transfers the semiconductor materials supplied to the material supply part 100; more than one card Disk table 310, which is arranged on the base table, the semiconductor material picked up by the supply picker 320 is sent to the top of the disk opening table, and the chuck table can be moved in one direction; more than one semiconductor material grinding device 400, which has: a grinding head 420, which is detachably provided with a grinding wheel 410 for grinding the semiconductor material at one end; On the transfer path, the movable opening of the chuck table 310 is provided; the lifting part 435 is installed on the glyph frame 470 and is used for lifting the grinding head 420; the support 431 is used for the grinding The head 420 is installed on the lifting part 435; and the angle adjustment part, which adjusts the inclination angle of the grinding head; the cleaning part 500, which cleans the semiconductor material that has been ground in the semiconductor material grinding device 400; and the output part 800 , the semiconductor material cleaned in the cleaning part 500 is output, and the grinding head 420 and the lifting part 435 are arranged coaxially.

The material supply part 100 may also include: a cassette, stacked with semiconductor materials; an extraction unit 210, which extracts or injects any one of the semiconductor materials stacked on the cassette; an upper view 220 or a lower view 215, the upper The sight 220 is installed on the upper side of the material supply part for checking the supply direction of the semiconductor material drawn and supplied from the cassette, and the lower sight 215 is installed on the lower side of the material supply part.

The material supply part stores semiconductor materials that have completed the molding process in stacks, and is sequentially extracted by the extraction unit 210 and placed on the extraction track 250 .

In the process of extracting the semiconductor material through the extracting unit 210, the identification mark provided on one side of the semiconductor material may be checked, thereby confirming the supply direction of the supplied semiconductor material. At this time, along the direction of supplying the semiconductor material, use the upper view 220 or the lower view 215 to check the identification mark of the semiconductor material. According to the inspection result, when the upper and lower directions of the semiconductor material are wrong (when the supply is inverted), the lead-out unit will The semiconductor material is put into the cassette. After confirming the supply direction of the material with the upper view or the lower view, the wrongly supplied material is directly re-introduced into the cassette, so that the next semiconductor material can be received and supplied without equipment shutdown or misprocessing.

At this time, the reloaded cassette may be loaded into the cassette for extracting the semiconductor material, or may be loaded into an additional output cassette. When inputting into an additional output cassette, there may be provided a supply cassette for supplying semiconductor materials, an empty cassette in which all semiconductor materials are output, and a recycling cassette stacked with re-introduced cassettes.

However, when the corresponding semiconductor material is directly re-introduced into the cassette for supply, the output process can be made faster, and if the subsequent operation object semiconductor material is all output, only the semiconductor material left in the empty cassette is recovered separately and processed After the direction is changed, it is supplied to the material supply department.

In the present invention, the supply picker 320 is equipped with a lower viewer 330 for inspection in the lower direction on one side, and is configured to be rotatable on the X-Y plane and movable in the X-axis direction.

When the semiconductor material is conveyed above the lead-out track 250 , the supply picker 320 can pick up the semiconductor material. As mentioned above, according to the inspection results of the upper view and the lower view, when the front-back direction of the semiconductor material is wrong, the supply picker can be rotated 180° on the X-Y plane to correct the front-back direction of the material.

In addition, in order to check the alignment of the semiconductor material picked up by the supply picker 320, an upper view 230 for checking the alignment of the semiconductor material picked up by the supply picker is provided below the moving path of the supply picker, and the upper view 230 can be in Move in the Y-axis direction.

The lower view 330 installed on one side of the supply picker 320 is provided for checking the alignment of the chuck table 310 to transfer the semiconductor material picked up by the supply picker. According to the inspection results of the upper view 230 and the lower view 330 , the material picked up by the supply picker 320 may be transferred to a prescribed position of the chuck table 310 .

To reorganize the description, the upper view 220 and the lower view 215 are set up to confirm the direction of the material supplied from the material supply part, and the upper view 230 and the lower view 330 are for checking the materials picked up by the supply picker and the requirements. Set for the alignment of the chuck table that transfers the material.

The semiconductor material to be ground is delivered to the chuck table 310 by a supply picker.

In the present invention, the chuck table 310 is arranged on the base, the semiconductor material picked up by the supply picker is placed thereon, and is provided so as to be able to be transferred in one direction. In the process of grinding semiconductor materials, the chuck table can vacuum absorb materials to avoid misalignment of materials. In addition, a dressing part may be provided on one side of the chuck table, and the dressing part is used for dressing the grinding wheel installed in the semiconductor material grinding device.

There may be a plurality of chuck stages, and they are arranged to be movable in the Y-axis direction, that is, in the front-rear direction, and after receiving the material from the supply picker, move in the rear direction and be located below the semiconductor material grinding device.

That is, the chuck table and the semiconductor material grinding device may be correspondingly provided in the same number, respectively.

The semiconductor material grinding apparatus 400 can grind the upper surface of the semiconductor material by grinding while rotating the grinding wheel in contact with the upper surface of the semiconductor material, thereby reducing the thickness or height of the semiconductor material molding part. To this end, the semiconductor material polishing device 400 includes a polishing head 420, a gate-shaped frame 470, a lifting part 435, a bracket 431, and an angle adjusting part.

The grinding head 420 is detachably provided with a grinding wheel for grinding semiconductor material at one end. Here, the grinding wheel can be detachably replaced from the lower end of the grinding head. When multiple semiconductor material grinding devices are provided, the grinding wheels installed in each semiconductor material grinding device may have the same or different roughness.

When grinding wheels having different roughnesses are installed, it is preferable that the semiconductor material grinding device is sequentially arranged in order from coarse and fine grinding wheels to fine and fine grinding wheels, and by this arrangement, the grinding speed and grinding quality.

For example, as shown in FIG. 1, when three semiconductor material grinding devices 400a, 400b, 400c are provided, the grinding wheels 410 of the three semiconductor material grinding devices 400a, 400b, 400c can be configured such that the roughness decreases in sequence.

That is, the first semiconductor material grinding device 400a is equipped with a grinding wheel with the largest roughness (for rough grinding), the third semiconductor material grinding device 400c is equipped with a grinding wheel with the smallest roughness (polishing), and the second semiconductor material grinding device 400c is equipped with a grinding wheel with the smallest roughness (polishing). The 400b is fitted with a grinding wheel with intermediate roughness (for fine grinding).

Certainly, as required, the semiconductor material grinding devices 400a, 400b, 400c may be equipped with grinding wheels 410 having the same roughness, or multiple semiconductor material grinding devices may be used to grind semiconductor materials.

The grinding head 420 may be provided with a motor that provides rotational driving force to the grinding wheel.

The gate-shaped frame 470 is disposed on the base, and is provided on the transfer path of the chuck table, and has an opening whose lower part is opened to allow the chuck table to move. The gate-shaped frame 470 is called a gate-shaped frame because it has a shape similar to a "door".

The lifting part 435 is mounted on one side of the door-shaped frame 470 and can lift the grinding head 420 up and down.

The holder 431 is attached to the lifting part 435, and has the accommodation part 431f which accommodates the polishing head 420, and the through-hole is formed in the both side outer walls 431h which comprise the accommodation part 431f.

At this time, the grinding head 420 can also be directly combined with the bracket and installed, but the mounting part 433 can also be set between the grinding head 420 and the bracket 431 to stably support and fix the cylindrical grinding head 420 to lower the grinding head. 420 generated vibrations.

The mounting member 433 is coupled to the outside of the polishing head so that the polishing head can be detachably installed in the housing portion 431f, and has fitting grooves at positions corresponding to the through holes of the holder. The mounting part 433 can be fastened and fixed with the grinding head to stably fix the grinding head 420 to the receiving portion 431f, so as to minimize the vibration of the grinding head during processing.

In the present invention, the grinding head may include an angle adjustment part to have a predetermined angle of inclination in a front-rear direction, that is, a Y-axis direction.

Regarding this, it will be described in more detail with reference to FIGS. 3 to 6 .

Fig. 3 shows the working state view of the side direction of the semiconductor material grinding device 400 that constitutes the semiconductor material grinding system 1000 according to the present invention, and Fig. 4 shows the grinding wheel 410 that constitutes the semiconductor material grinding device 400 of the semiconductor material grinding system 1000 according to the present invention , an exploded perspective view of the grinding head 420 and the bracket 431 .

The semiconductor material grinding device 400 constituting the semiconductor material grinding system 1000 according to the present invention may be configured such that the grinding head 420 is inclined at a predetermined angle with respect to the vertical direction.

The reason why the grinding head 420 is inclined is to prevent excessive pressure applied to the semiconductor material by the grinding wheel 410 and to minimize grinding marks remaining on the grinding surface of the semiconductor material.

When the grinding head 420 is arranged vertically, the contact area between the grinding wheel 410 and the semiconductor material st increases, so that the problem that the load of the semiconductor material grinding device may be concentrated on the semiconductor material may occur, but when the rotation axis is slightly inclined, the grinding wheel and the semiconductor material The contact area of the material is limited, so that the pressure applied to the semiconductor material is reduced, which can prevent the semiconductor material from being damaged.

In addition, when the grinding head 420 drives the grinding wheel in a vertical state, the grinding marks of the grinding wheel remain in a radial or circular shape near the rotation axis on the molded part of the semiconductor material, so that at the end of the grinding process, the Grinding quality becomes a problem. However, if the grinding head 420 is tilted and rotated obliquely, the grinding wheel 410 only comes into contact with the limited area of the molded part of the semiconductor material, and performs the grinding operation while rubbing the molded part in the width direction, so that the grinding wheel 410 can be minimized. Reduce the occurrence of circular grinding marks, etc., and improve the grinding quality.

For this reason, the semiconductor material grinding device of the present invention is equipped with an angle adjustment part in order to make the grinding head tilt, and the angle adjustment part may include: a pair of brackets 468a, 468b, and the pair of brackets are fixedly installed on the through holes of the brackets. The fitting groove of the mounting part, so that the grinding head is fixed to the bracket 431, and can rotate; the rod part 467, which makes more than one bracket 468b of the pair of brackets 468a, 468b rotate; And front and rear fine adjustment unit 465, which is provided with more than one in the direction of both sides of the rod member, and fine adjusts the inclination angle of the front and rear direction of the grinding head.

With respect to the bracket constituting the angle adjustment part, along with being fixed to the fitting groove of the mounting part, if the lever member rotates the bracket, the grinding head 420 fixed to the mounting part also rotates in the front-rear direction, and is mounted on the grinding wheel. The grinding wheel 410 at the lower end of the head also rotates in the front-rear direction together with the rotation of the grinding head 420 .

Here, the lever member 467 is characterized in that, in order to rotate the bracket, the lever member may be formed in a predetermined length direction, and in order to rotate one or more brackets 468b of the pair of brackets 468a, 468b, the lever member It can also be integrated with the bracket, combined with one side of the bracket or inserted into the bracket.

Therefore, depending on the degree of rotation of the lever member that rotates the carriage, the upper surface of the semiconductor material and the grinding wheel 410 can be processed in a state of line contact with the grinding head tilted at a predetermined angle.

When polishing is performed in a state where the polishing head 420 is perpendicular to the upper surface of the semiconductor material, the polishing head 420 and the semiconductor material come into face-to-face contact, and thus the surface pressure applied to the material increases. That is, the contact area between the grinding wheel 410 and the upper surface of the semiconductor material is increased, and the load of the semiconductor material grinding device is concentrated on the semiconductor material, so that the impact applied to the material is large and may be damaged. Performing the machining in a state inclined at a predetermined angle can limit the contact area of the semiconductor material and the grinding wheel 410 to minimize the surface pressure, thereby preventing damage to the semiconductor material.

In addition, when the grinding head 420 performs grinding processing in a state perpendicular to the upper surface of the semiconductor material, the grinding marks of the grinding wheel 410 remain in a radial or circular shape near the rotation axis of the upper surface of the molded part of the semiconductor material. Grinding quality is affected.

However, as in the present invention, if the grinding head is rotated obliquely from the upper surface of the semiconductor material at a predetermined angle, the grinding wheel 410 only contacts in a limited area of the upper surface of the molded part of the semiconductor material, and is in the width direction by The grinding operation is carried out in the state of friction with the upper surface of the molding part, so that the circular or radial grinding marks remaining on the semiconductor material can be minimized, and the grinding quality can be improved.

In the present invention, the angle adjustment part enables the grinding head to rotate from the support at a predetermined angle, so that the angle of inclination can be adjusted.

The state shown in FIG. 3( a ) is a state where the grinding head 420 is not inclined relative to the vertical direction. However, the inclination angle of the polishing head can be adjusted from the bracket 431 through the angle adjustment unit. That is, according to the degree of rotation of the rod member that rotates the carriage, the grinding head is tilted at a predetermined angle, as shown in FIG. The pressure of the molded part of the material can prevent damage to the semiconductor material and improve the grinding quality.

At this time, the angle adjustment unit can fine-adjust the inclination angle in the front-back direction through the front-back fine-tuning unit 465 .

The front and rear fine adjustment unit 465 can be formed on more than one outer wall 431h of the two side outer walls 431h of the bracket constituting the receiving portion 431f, and the front and rear direction of the grinding head can be finely adjusted by the nuts and fastening bolts respectively arranged on both sides of the rod member 467. slope.

Preferably, the front and rear fine-tuning unit 465 has: eccentric nuts, which are respectively arranged on both sides of the rod part 467, and contact with the side of the rod part 467 and have eccentric through holes; fastening bolts, which are threadedly connected to the eccentric nuts through-holes and standoffs.

At this time, the tightening depth of the fastening bolts can be changed to adjust the inclination angle of the grinding head in the front-back direction (the inclination angle of the grinding head in the Y-axis direction). That is, the fastening bolt is threadedly connected to the outer wall 431h of the bracket through the eccentric nut, and through the eccentric through hole of the eccentric nut, according to the fastening depth of the fastening bolt, the eccentric nut can adjust the pressurization degree of the rod member in contact with the eccentric nut. .

Therefore, by changing the tightening depth of the fastening bolts inserted into the eccentric nuts provided on both sides of the rod member 467, the pressing force of the rod member can be adjusted, and the degree of rotation of the bracket can be finely adjusted according to the pressing force of the rod member. Adjustment, thereby fine-tuning the inclination angle of the grinding head in the front-back direction. In this case, the diameter of the through hole of the nut may be larger than the diameter of the fastening bolt so that the position can be changed around the fastening bolt.

Furthermore, as fine adjustment unit, besides the eccentric nut, it is also possible to use a nut with a conical through hole therein. The fine-tuning principle based on this is the same as when using an eccentric nut.

That is, it is possible to change the nuts that are respectively provided on both sides of the rod member 467 in contact with the side surfaces of the rod member and have tapered through holes on the upper surface, and the fastening bolts that are screwed to the through holes of the nuts and the outer wall 431h of the bracket. the fastening depth. Similarly, the pressing force of the rod member can be adjusted by changing the tightening depth of the nuts respectively arranged on both sides of the rod member and the fastening bolts tightened along the tapered nut, and fine-tuning the bracket according to the pressing force of the rod member. The rotation degree of the frame can be fine-tuned to the front and rear direction inclination angle of the grinding head.

At this time, the eccentric nuts or nuts can be arranged corresponding to each other based on the direction of both sides of the rod member 467, or can be spaced apart from each other at a predetermined distance. The length of the rod member is set to form a balance on both sides in the up-down direction of the rod member.

As an example, an example using four eccentric nuts or the number of nuts is shown in FIG. 3 and FIG. 4 , but the number can be appropriately increased or decreased as needed.

Preferably, the fastening bolts fastened to the eccentric nuts or nuts are flat-head bolts or flat-head screws, but general bolts or screws are also acceptable.

For reference, according to the direction of the rod part combined with the bracket, as shown in Figure 3 and Figure 4, when the rod part is set in the length direction horizontal to the grinding head, the direction of both sides of the rod part can be based on the rod part The left-right direction, and when the rod member is provided in a direction perpendicular to the polishing head, the directions on both sides of the rod member may be up-down directions based on the rod member.

In the embodiment of the present invention, the rod member 467 is shown attached to only one bracket 468b of the pair of brackets 468a, 468b, but it may be attached to all the brackets. Of course, in this case, the front-back fine adjustment unit 465 may be provided on all the rod members mounted on the pair of brackets, or may be provided only on the rod members on either side.

In the present invention, the grinding head 420 with the grinding wheel installed at one end is combined with the mounting member 433, and the grinding head is adjusted and fixed by the angle adjustment part and the front and rear fine adjustment unit in the state where the mounting member is accommodated in the housing part 431f of the bracket. After tilting the angle in the front-rear direction, in order to fix the adjusted angle, fastening bolts are fixed through fastening holes respectively formed at positions corresponding to each other of the bracket 431 and the mounting part 433 .

To this end, the bracket 431 and the mounting part 433 may be provided with more than one fastening hole at positions corresponding to each other, and the fastening hole 431 o formed in the bracket 431 may be larger than the fastening hole 433 o formed in the mounting part 433 .

That is, one or more fastening holes 431o for fastening to the mounting member 433 are provided on both side outer walls of the bracket 431, and fastening holes 433o are also formed in positions of the mounting member 433 corresponding to the fastening holes 431o of the bracket. The bracket 431 and the mounting part 433 may be combined with each other through the fixing bolts by being inserted into the fastening holes. At this time, since the fastening position may be slightly different according to the inclination angle of the grinding head, preferably, the fastening hole 431 o of the bracket may be larger than the fastening hole 433 o of the mounting part.

As mentioned above, the present invention can fine-tune the inclination angle of the grinding head in the front-back direction (Y-axis direction).

In addition, the present invention can also fine-tune the inclination angle of the grinding head in the left-right direction (X-axis direction). That is, by finely adjusting the inclination angle of the grinding head in the left-right direction, the cylindrical grinding head does not deviate to one side, thereby ensuring the flatness of the material processing surface.

That is, by adjusting the inclination angle of the front and rear directions, the semiconductor material and the grinding wheel line contact can be relieved, and by adjusting the inclination angle of the left and right directions, the left and right contact points of the chuck table and the grinding wheel can be prevented from being biased to a certain position based on the contact center. side.

Therefore, in order to fine-tune the inclination angle in the left-right direction, as shown in FIG. 5 , the present invention may further include a left-right fine-tuning unit 461, which is provided with more than one on both sides of the bracket 431 for adjusting the inclination angle in the left-right direction of the grinding head. One or more left and right fine adjustment units 461 can be respectively provided in the left and right directions of the bracket 431. Like the front and rear fine adjustment units 465 of the rod member, the left and right directions of the grinding head can be finely adjusted by the nuts and fastening bolts in contact with the side of the bracket 431. slope.

Preferably, the left and right fine-tuning units 461 are equipped with eccentric nuts that are respectively arranged on both sides of the bracket 431 and are in contact with the sides of the bracket 431 and have eccentric through holes and fastening bolts that are threadedly connected with the through holes of the eccentric nuts and the bracket 431 .

At this time, the inclination angle of the grinding head in the left and right directions (inclination angle of the grinding head in the X-axis direction) can be adjusted by changing the tightening depth of the fastening bolts. That is, the fastening bolt is threadedly connected to the lifting part 435 in the state of inserting the eccentric nut, and through the eccentric through hole of the eccentric nut, according to the fastening depth of the fastening bolt, the acceleration of the eccentric nut to the support 431 in contact with the eccentric nut can be adjusted. degree of pressure.

Therefore, by changing the fastening depths of the eccentric nuts and fastening bolts respectively arranged on both sides of the bracket 431, the pressing force of the bracket 431 can be adjusted, and the left-right direction position value of the bracket 431 can be fine-tuned according to the pressing force of the eccentric nut, thereby The left-right inclination angle of the grinding head 420 combined with the bracket can be finely adjusted.

In addition, as the fine-tuning unit, besides the eccentric nut, a nut having a tapered through hole can also be used, and the fastening bolt can be stably fixed to the eccentric nut or the nut by using a flat-head bolt or a flat-head screw. The fine-tuning principle of the inclination angle of the grinding head 420 in the left-right direction is the same as the fine-tuning principle of the inclination angle of the grinding head 420 in the front-back direction, so it is omitted.

As a reference, when adjusting the inclination angle of the grinding head, first align the horizontal parallelism of the grinding head by adjusting the inclination angle in the left and right directions, and then adjust the inclination of the grinding head relative to the upper surface of the semiconductor material by adjusting the inclination angle in the front and rear directions .

According to the semiconductor material grinding system of the present invention, the grinding head can be installed obliquely, and the inclination angle of the grinding head in the front-back direction (Y-axis direction) and the left-right direction (X-axis direction) can be adjusted, so that the rotation angle can be adjusted two-dimensionally, so it can be Perform grinding operations on semiconductor materials of various shapes and thicknesses.

In addition, during the grinding process, the semiconductor material is processed while being in contact with the upper surface of the semiconductor material in a state inclined at a predetermined angle, so that excessive pressure is not transmitted to the semiconductor material, thereby preventing damage to the circuit part of the material, etc. Grinding marks on the grinding surface can be minimized, and it can be processed to have a uniform roughness.

On the other hand, the semiconductor material grinding device 400a, 400b, 400c constituting the semiconductor material grinding system 1000 according to the present invention is characterized in that each grinding wheel 410 is rotated at a high speed, in order to minimize the vibration generated when the grinding wheel 410 rotates to the adjacent Other semiconductor material polishing devices 400 are constructed by physically separating the semiconductor material polishing devices 400 into modules.

That is, since the structures on which the semiconductor material polishing apparatus 400 is installed are also independently installed, the mutual influence of deformation, chatter, vibration, etc. of the structures can be blocked.

If the vibration generated by the grinding head 420 of the semiconductor material grinding device 400 is transmitted to the adjacent semiconductor material grinding device, the grinding wheel 410 and the chuck table 310 of the semiconductor material grinding device to which the vibration is transmitted may have a slight height due to the vibration. Therefore, according to the semiconductor material grinding system 1000 of the present invention, a plurality of semiconductor material grinding devices 400 are arranged adjacent to each other to minimize the transfer path of the semiconductor material for sequentially grinding operations, and minimize The interaction caused by the vibration of the material grinding device can improve the efficiency and quality of the grinding process.

For this reason, the semiconductor material grinding apparatus 400 constituting the semiconductor material grinding system 1000 according to the present invention may be separately modularized or separately configured in order to minimize the impact of driving the grinding head 420 .

For this reason, the semiconductor material grinding device 400 has: a grinding head 420, which is detachably provided with a grinding wheel 410 for grinding the semiconductor material at one end; a gate-shaped frame 470, which is configured on the base and is arranged on the chuck On the transfer path of the table 310, there is an opening where the chuck table 310 can move; the lifting part 435, which is installed on the gate frame 470 and lifts the grinding head 420; the bracket, which lifts the grinding head 420 The head 420 is attached to the lifting part 435 .

In addition, the semiconductor material to be polished by the semiconductor material polishing apparatus is provided so as to be transportable in one direction by the chuck table arranged on the base in the same manner as the semiconductor material polishing apparatus.

Here, the abutment can be a casting of the semiconductor material grinding system, or a frame placed on the casting.

The semiconductor material grinding system of the present invention is provided with a plurality of chuck tables 310 on the base, and a gate-shaped frame 470 is independently provided on the transfer path of each chuck table 310a, 310b, 310c. The chuck table can be moved through the opening formed in the gable frame. Such gate-shaped frames are provided independently of each other and spaced apart from each other so that vibration, vibration, etc. generated in each semiconductor material grinding device will not affect each other's semiconductor material grinding device.

In addition, according to the coaxial arrangement of the grinding head 420 and the lifting part 435, the unfavorable conditions caused by the external force of cutting can be minimized, and the grinding head can be stably supported when the grinding head is raised and lowered.

If the semiconductor material grinding system according to the present invention will be described in more detail with reference to FIG. The grinding wheel 410 on the upper surface of the molding part; the gate-shaped frame 470, which is arranged on the base and is arranged on the transfer path of the chuck table 310, and has an opening that the chuck table can move; the lifting part 435 is installed on the gate-shaped The frame lifts the grinding head; the bracket 431 has a receiving portion 431f for accommodating the grinding head 420, and mounts the grinding head on the lifting portion.

The roughness of the grinding wheels constituting the first semiconductor material grinding device 400a to the third semiconductor material grinding device 400c decreases sequentially, so that the surface roughness of the molding part of the semiconductor material after the final grinding process can reach within the preset target roughness.

Not only that, the first semiconductor material grinding device 400a to the third semiconductor material grinding device 400c can be equipped with grinding wheels for fine grinding or polishing with the same roughness, or a grinding wheel with a relatively fast grinding speed can be mixed and configured. There are coarse and fine grinding wheels for rough grinding and two slow but fine polishing wheels for polishing. This can be appropriately replaced and installed according to the needs of the type of semiconductor material to be ground or the working environment.

A grinding head 420 may be provided above the grinding wheel 410, and the grinding head 420 may be provided with a driving motor for rotating the grinding wheel. In addition, the grinding head 420 can be accommodated in the accommodation portion 431f of the bracket 431 , and the bracket 431 is installed on the lifting portion and disposed on the gable frame 470 .

The gate frame 470 constituting each semiconductor material grinding device 400 a , 400 b , 400 c is separated from each other and made of cast material with sufficient load to block the transmission of vibration and chatter generated in each grinding head 420 .

The chuck table on which the semiconductor material of the grinding object rests can pass through the opening of the gate-shaped frame 470 and be moved below the grinding wheel 410 . Each chuck table 310 can be transferred to the lower side of the grinding wheel 410 in the Y-axis direction through each chuck table conveying line 403 .

The grinding head and the lifting part of the gate-shaped frame 470 constituting each semiconductor material grinding device are coaxially arranged, thereby independently spaced apart from each other in the Y-axis direction, so as to avoid interference with the gate-shaped frame of the adjacent semiconductor material grinding device, thereby The size of the system can be minimized. In addition, it is easy to increase or decrease the number of modularized semiconductor material grinding devices as needed.

In addition, the bracket 431 is configured to be able to lift from the gate frame 470, and has a structure that can be adjusted in height or lifted by a guide rail installed on the gate frame. Therefore, the lifting height can be adjusted according to the kind or thickness of the semiconductor material. At this time, the guide rail is arranged coaxially with the grinding head on which the grinding wheel is installed, so that adverse effects due to cutting external force can be minimized.

In the conventional grinding system, the grinding head and the guide rail for raising and lowering the grinding head have an eccentric structure, and the semiconductor material grinding devices are connected to each other and multiple semiconductor material grinding devices are installed in one structure, so even if the semiconductor material grinding device If there are many, the driving motors of the respective semiconductor material polishing devices cannot be driven at a sufficient target speed due to the influence of mutual vibration, and there is a problem that both the polishing speed and the quality are lowered.

Especially, in order to improve the grinding quality, although a high driving speed of the drive motor of the semiconductor material grinding device is required, when the driving speed of the driving motor is increased in a structure in which a plurality of semiconductor material grinding devices are connected to each other, in each semiconductor material grinding device A large vibration is generated, and since it has a structure susceptible to vibration, there is a limit in increasing the driving speed of the drive motor due to vibration problems of the entire system.

Therefore, in the present invention, each semiconductor material grinding device 400a, 400b, 400c is equipped with a gate-shaped frame 470 independently, and is spaced apart from each other, and is separately configured. Therefore, each semiconductor material grinding device 400a, 400c can be avoided. The vibration of the grinding head 420 of 400b, 400c is transmitted to the peripheral semiconductor material grinding device, and each grinding device is set by an independent high-rigidity casting structure, which can block the vibration generated in different semiconductor material grinding devices. The grinding head 420 of the material grinding device can drive each driving motor at a target driving speed, so that the grinding speed or the grinding quality can be improved. In addition, the present invention can simplify the structure of the entire grinding system through the modularization of the semiconductor material grinding device, and can be miniaturized.

On the other hand, the grinding wheel installed in the semiconductor material grinding device may have the same width as the semiconductor material to be ground, or have a diameter larger than the width, and the grinding wheel may be rotated while moving the chuck table in one direction, so that grinding can be sequentially transmitted to the chuck. The upper face of the semiconductor material above the disc table.

That is, the upper surface of the semiconductor material conveyed to the upper side of the transportable chuck table is ground in contact with the grinding wheel by making it have a diameter equal to or greater than the width of the semiconductor material so that no grinding marks are generated during the grinding process. , thereby processing the entirety of the width direction of the semiconductor material at one time. At this time, since the chuck table can move in one direction, the upper surface of the semiconductor material is sequentially polished while the chuck table is moving, and the entire upper surface can be polished.

That is, the grinding operation is performed by rubbing the upper surface of the semiconductor material with the grinding wheel in contact with the upper surface of the material in the width direction in a state inclined obliquely, so it is possible to minimize the occurrence of circular grinding marks and improve the grinding efficiency. quality.

When grinding the upper surface of the semiconductor material, the circular grinding wheel is rotated while rubbing against the upper surface of the semiconductor material to perform grinding. During grinding, wet grinding can be performed while spraying water or cleaning agent. After the entire upper surface of the semiconductor material is polished, the thickness of the upper surface of the semiconductor material can be measured by a thickness measuring unit (not shown) separately provided in the semiconductor material polishing device. At this time, the thickness measuring unit is provided so as to be movable in the X-axis direction, and it is confirmed whether the polishing has reached the target thickness by measuring the thickness at predetermined points on the upper surface of the semiconductor material.

As the thickness measuring unit, a displacement sensor, a probe, or the like that optically measures a distance can be used.

As a reference, the semiconductor material grinding system of the present invention uses the thickness measuring part arranged above the lead-out rail to measure the thickness measuring part of the peripheral strip of the semiconductor material that is not formed with the molded part. The thickness measurement part measures the overall thickness of the material. In this way, the thickness of the molding part can be calculated by calculating the difference between the thickness measured above the lead-out rail and the overall thickness measured above the chuck table.

In the present invention, after the grinding process of the upper surface of the semiconductor material by the semiconductor material grinding device is completed, burrs or dust may be generated during the grinding process and remain on the surface of the semiconductor material, so it is necessary to perform a cleaning process to remove them .

For this reason, the semiconductor material grinding system of the present invention includes an upper surface cleaning part, which is arranged above the transport path of the chuck table, and cleans the upper surface of the semiconductor material ground by the semiconductor material grinding device.

The upper surface cleaning unit is equipped with a cleaning member that can be raised and lowered above the transfer path of the chuck table, and cleans the upper surface while contacting the upper surface of the semiconductor material while returning to the initial position after polishing. The cleaning part is a contact cleaning part such as PVA, sponge, brush, etc., and pre-cleans the chuck table during the movement of the chuck table back to the initial position in the state of descending in such a way as to contact the upper surface of the chuck table upper face.

In the present invention, the upper surface cleaning unit may also clean the upper surface of the polished semiconductor material, but may also pre-clean the upper surface before transferring to the polishing device in order to remove foreign matter adhering to the surface of the semiconductor material before grinding.

The semiconductor material finished grinding and pre-cleaned on the upper surface can be picked up by the recovery picker and transferred to the chuck table of other semiconductor material grinding equipment for grinding in other semiconductor material grinding equipment, or moved to the cleaning part.

That is, when the grinding wheels installed in the semiconductor material grinding device are the same grinding wheel, the grinding can be finally finished and moved to the cleaning section, but when the grinding wheels are grinding wheels with different roughness from each other, it can be used in an additional semiconductor material grinding device. Perform additional grinding operations until the desired roughness and thickness are achieved.

For example, in the first semiconductor material grinding apparatus 400a, after finishing primary grinding with a rough grinding wheel in the first semiconductor material grinding apparatus 400a so that the semiconductor material becomes a predetermined thickness, the second semiconductor material grinding apparatus 400b performs secondary grinding with a fine grinding wheel until The semiconductor material reaches the desired predetermined thickness and desired roughness, and then performs grinding three times with the polishing grinding wheel in the third semiconductor material grinding device 400c until the semiconductor material reaches the target thickness and target roughness.

The grinding process in each semiconductor material grinding device 400a, 400b, 400c can be performed in the state where the semiconductor material is placed on the chuck table 310 moving in the Y-axis direction, and the semiconductor material of the grinding process is completed step by step in each semiconductor material grinding device , can be transported by the recovery picker 360 provided to be transportable in the X-axis direction.

The recovery picker 360 recovers the polished semiconductor material from the chuck table and performs a function of transferring it to another chuck table or a cleaning table of the cleaning unit.

That is, the recovery pickers 360a, 360b may include: a first recovery picker 360a that picks up the semiconductor material that has been ground from the chuck table and transfers it to another chuck table or a cleaning table of the cleaning section; a second recovery picker 360b that It is used to transfer new semiconductor material to be worked on to the chuck station where the semiconductor material is removed.

In the present invention, when the same grinding wheel is installed in the semiconductor material grinding devices, the supply picker 320 may perform the function of supplying the semiconductor material, and the recovery picker 360 may perform the function of recovering the finished semiconductor material. Therefore, considering the number of semiconductor material grinding devices and the work performed in each semiconductor material grinding device, one or two recovery pickers 360 may be provided, but the number thereof may be changed.

A pair of said 1st collection picker 360a and the 2nd collection picker 360b can be attached to the same drive part, and can move together in the X-axis direction.

The second recovery picker 360b among the recovery pickers can transfer the semiconductor material ground in the first chuck table 310a or the second chuck table 310b to the second chuck table 310b or the third chuck table 310c. The first recovery picker 360a can perform the operation of transferring the semiconductor material ground in the second chuck table 310b or the third chuck table 310c to the third chuck table 310c or the cleaning table 501 .

Of course, at this time, the first recovery picker 360a and the second recovery picker 360b are named only for distinguishing functions. They pick up the semiconductor material that has been ground from the chuck table and transfer it to other chuck tables or the cleaning table of the cleaning section. The picker may also be the second recovery picker 360b, and the picker that transfers the new semiconductor material to be worked to the chuck table from which the semiconductor material is removed may also be the first recovery picker 360a.

Functionally, it is divided into the second semiconductor material grinding device 400b, the third semiconductor material grinding device 400c, the second chuck table 310b, and the third chuck table 310c, but the grinding method and each configuration performed at this time are the same, so Repeated explanations for this will be omitted.

The semiconductor material grinding system 1000 according to the present invention can clean the semiconductor material sequentially ground by the plurality of semiconductor material grinding devices 400a, 400b, 400c.

As mentioned above, although the upper surface cleaning part is in contact with the upper surface of the semiconductor material and the upper surface cleaning is performed once, foreign matter or small dust that may remain on the upper surface of the semiconductor material will also affect the roughness of the final material. Since it affects the degree and performance of the product, the upper and lower surfaces of the material should be cleaned cleanly.

Therefore, the polishing system of the present invention includes a cleaning unit capable of cleaning the upper surface and the lower surface.

The cleaning part of the present invention may include: a lower surface cleaning lower surface cleaning part 370, which is arranged on the conveying path of the recycling picker 360, and is used for cleaning by contacting the underside of the semiconductor material picked up by the recycling picker 360; The type cleaning part 500 is equipped with: a cleaning table 501, which places the semiconductor material cleaned by the lower surface of the lower surface cleaning part 370 on the upper side, and is set so as to be transportable in the front-back direction; the tunnel type cleaning chamber 520, It is installed on the conveyance path of the cleaning table 501 , and has an inlet 522 at the front and an outlet 524 at the rear, and a cleaning nozzle 523 that sprays cleaning water toward the cleaning table side is provided at the upper inner side.

First, the lower surface cleaning lower surface cleaning part 370 is arranged on the moving path of the recovery picker, so that when the recovery picker 360 picks up the semiconductor material that has finished grinding from the chuck table and moves to the cleaning part side, it can be picked up with the collected material. Cleaning is performed by contacting the underside of the semiconductor material picked up by the device 360 . Lower Surface Cleaning The lower surface cleaning part 370 performs lower surface cleaning while being picked up by the recovery picker 360 in contact with the underside of the semiconductor material, and the cleaning member may be a contact cleaning member such as PVA, sponge, brush, or the like.

During the execution of the underside cleaning, the recovery picker 360 may stop or move while contacting the underside of the semiconductor material for pre-cleaning. After finishing the lower surface cleaning by the lower surface cleaning part 370 , the recovery picker 360 transfers the semiconductor material st cleaned from the lower surface to above the cleaning table 501 of the tunnel type cleaning part 500 .

Hereinafter, the tunnel cleaning unit 500 of the present invention will be described in more detail with reference to FIGS. 7 to 10 .

7 shows a perspective view of the tunnel cleaning unit 500 constituting the semiconductor material grinding system 1000 according to the present invention, and FIG. 8 shows a side view of the tunnel cleaning unit 500 constituting the semiconductor material grinding system 1000 according to the present invention.

As shown in Fig. 7 to Fig. 10, the tunnel-type cleaning part 500 of the present invention includes: a cleaning table 501, which places the semiconductor material st conveyed by the recovery picker 360 on the top, and is arranged to be able to be transferred in the front-back direction; A type cleaning chamber 520, which is arranged on the transfer path of the cleaning table 501, is formed with an inlet 522 at the front and an outlet 524 at the rear, and is provided with a cleaning nozzle 523 spraying cleaning water to the side of the cleaning table above the inner side; The unloading part 540 unloads the cleaned materials discharged from the outlet 524 ; the control part controls the transfer direction and the transfer times of the cleaning table 501 .

Here, the unloading part 540 further includes: a support rail 527, which extends from the outside of the outlet 524 of the tunnel-type cleaning chamber to the inside of the tunnel-type cleaning chamber 520, and is arranged to be able to move in the left-right direction. The width is adjusted so that the cleaned semiconductor material is supported on the upper surface; the pulling part 551 is provided to be movable along the support rail 527, and draws out the semiconductor material supported above the support rail.

The cleaning table 501 receives the polished semiconductor material st picked up by the recovery picker 360, and is configured to move forward and backward, and the number of cleaning times is adjusted by changing the transfer direction and the number of transfers of the cleaning table 501. The cleaning table 501 is provided so as to be movable in the Y-axis direction and to be movable up and down.

In addition, an air nozzle 503 that sprays air upward may be provided on one side of the cleaning table 501 . At this time, the position of the air nozzle 503 may be set on the entire upper surface, but preferably, it may be set behind the cleaning table 501 , that is, above the side adjacent to the tunnel type cleaning chamber 520 .

The tunnel type cleaning chamber 520 is used as an outer casing for preventing cleaning water and foreign matter from scattering during the semiconductor material cleaning process, and may be in the form of a cavity. area of station 501.

The tunnel-type cleaning chamber 520 is arranged on the transfer path of the cleaning table 501, and an entrance 522 for entering the cleaning table 501 is formed at the front, and an outlet 524 for discharging the cleaned semiconductor material st is formed at the rear. In addition, a cleaning nozzle 523 that sprays cleaning water toward the cleaning table side is provided on the inner upper side. At this time, as the washing nozzle 523 , a nozzle that supplies washing water, or a two-fluid nozzle that sprays washing water and air (or compressed air) together may be used.

In addition, an air nozzle 521 for spraying air toward the cleaning table 501 side may be included above the inner side of the tunnel type cleaning chamber 520 .

When the cleaning nozzle 523 provided above the inner side of the tunnel type cleaning chamber 520 is a two-fluid nozzle, cleaning may be performed by supplying cleaning water and air together when cleaning the upper surface of the semiconductor material. In the case of a nozzle that supplies only cleaning water, the cleaning nozzle 523 and the air nozzle 521 may be applied together when cleaning the upper surface of the semiconductor material to further improve the cleaning efficiency.

That is, when cleaning the upper surface of the semiconductor material, the cleaning water may be sprayed alone, or may be sprayed together with the air nozzle to perform cleaning with the cleaning water and air. In addition, after the cleaning is completed, the spraying of the cleaning nozzle 523 is terminated, and only the air nozzle 521 is sprayed, so that the upper surface of the semiconductor material can be dried.

That is, the tunnel type cleaning chamber of the present invention may also perform drying together with upper surface cleaning of semiconductor materials.

For reference, when the tunnel-type cleaning unit 500 performs cleaning, the cleaning table 501 on which the semiconductor material entering the tunnel-type cleaning chamber 520 is placed reciprocally moves the inside of the tunnel-type cleaning chamber 520 in the Y-axis direction and performs semiconductor cleaning. Cleaning on top of the material.

At this time, the control unit can adjust the cleaning times by adjusting the moving direction and the moving times of the cleaning table 501 . That is, during cleaning of the upper surface of the semiconductor material, cleaning may be performed while moving the cleaning table 501 backward or forward, or the number of times of cleaning may be adjusted while moving the cleaning table back and forth.

The number of times of movement of the cleaning table 501 and the number of times of cleaning can be controlled differently depending on the state of the semiconductor material. Therefore, in the present invention, the tunnel-type cleaning chamber 520 is not only finished with one cleaning, but also allows the cleaning platform 501 to move forward and backward to perform multiple cleanings, thereby further improving the cleaning efficiency.

In addition, an air drying part 525 for spraying air may be respectively provided at the upper end and the lower end of the outlet 524 of the tunnel type cleaning chamber 520 .

The air drying unit 525 is configured to dry the upper surface and the lower surface of the semiconductor material while discharging the cleaned semiconductor material. For this reason, the air drying part 525 may include: a first air drying part 525u, which is arranged on the upper end of the outlet 524 of the tunnel-type cleaning chamber 520, and sprays air on the top of the semiconductor material st; a second air drying part 525l, which is set At the lower end of the outlet 524 of the tunnel-type cleaning chamber 520 and spray air toward the lower surface of the semiconductor material, the first air drying part 525u and the second air drying part 525l may be coaxially arranged.

Through the first air drying part 525u and the second air drying part 525l arranged coaxially, the air sprayed on the upper surface and the air sprayed on the lower surface form an air curtain, which can further increase the drying efficiency and prevent the tunnel type cleaning chamber from The 520 drains the wash water externally.

After cleaning the upper surface of the semiconductor material, it is transferred to the unloading unit 540 for unloading the semiconductor material for cleaning the lower surface of the semiconductor material and discharging the semiconductor material.

The unloading part 540 of the present invention is provided with: a support rail 527, which extends from the outside of the outlet 524 of the tunnel-type cleaning chamber to the inside of the tunnel-type cleaning chamber 520, and is arranged to be adjustable in the left-right direction. width, and support the semiconductor material that has been cleaned on it; the pulling part 551 can move along the support rail 527, and draw out the semiconductor material supported above the support rail.

FIG. 10 shows a process in which the semiconductor material after the cleaning process is dried and pulled to the unloading part 540 in the tunnel cleaning part 500 of the present invention.

When the cleaning of the upper surface of the semiconductor material is completed by the forward and backward movement of the cleaning table, the cleaning table rises to transfer the semiconductor material above the pair of support rails 527 .

In order to deliver the semiconductor material above the supporting rails 527, the pair of supporting rails 527 can be configured to be adjustable in width, and receive the semiconductor material close to the lower sides of the peripheral edges of the semiconductor material when the cleaning table 501 is raised.

At this time, a pair of support rails 527 can be formed from the outside of the tunnel-type cleaning chamber 520, preferably, the outside of the outlet 524 of the tunnel-type cleaning chamber 520 extends to the inside of the tunnel-type cleaning chamber. The width of the track 527 is adjusted, and the driving part for left and right driving is arranged outside the tunnel-type cleaning chamber 520, so as to protect the driving part from the influence of cleaning water or moisture.

On the other hand, when the cleaning table 501 rises to the height of the support rail 527, the width of the support rail 527 changes to be narrower than the width of the semiconductor material. If the cleaning table is lowered, the semiconductor material placed on the top of the cleaning table can be transferred. to the top of the support rail.

In the state where the semiconductor material is conveyed to the top of the support rail 527, air is sprayed from the air nozzle 521 above the semiconductor material, and the air nozzle 503 provided on one side of the cleaning table sprays air to the lower surface of the semiconductor material, thereby placing it on the surface of the semiconductor material. The lower surface drying of the semiconductor material is carried out in the state of the support rail 527 .

Of course, at the same time, the upper surface drying of the semiconductor material is performed by jetting air from the air nozzle 521 provided above the inner side of the tunnel-type cleaning chamber.

At this time, the cleaning table 501 advances and retreats while spraying air across the entire lower part of the semiconductor material to dry the lower surface of the semiconductor material. Alternatively, the cleaning table 501 may spray air to the upper side while the cleaning table is stopped, and draw it out through the pulling part 551. Drying is performed while spraying air across the entire lower surface of the semiconductor material st placed on the support rail 527 .

After primary drying of the semiconductor material is performed inside the tunnel type cleaning chamber 520 , residual moisture remaining in the semiconductor material is completely dried using the air drying part 525 provided above and below an outlet from which the semiconductor material is discharged.

At this time, the semiconductor material placed above the support rail 527 may be pulled out to the side of the unloading part 540 by the pulling part 551 .

As a structure for pulling the semiconductor material, the pulling part 551 may be a pulling device such as a gripper or a pusher.

When a gripper is used as the pulling part 551 , the gripper may be provided to be able to be transferred in one direction by the gripper conveying unit 550 . After gripping the end of the semiconductor material st at the outlet 524 of the tunnel cleaning chamber 520 , the semiconductor material is drawn from the tunnel cleaning chamber 520 to the outside.

First and second air drying parts 525u and 525l may be provided above and below the exit of the tunnel-type cleaning chamber 520, respectively, so that when the semiconductor material is pulled and transferred by the pulling part 551, the upper part of the semiconductor material The surface and lower surface spray air to remove cleaning water or foreign matter remaining on the semiconductor material, and the upper and lower surfaces of the semiconductor material can be completely dried by the respective first and second air drying units 525u and 525l.

On the other hand, in the process of discharging the cleaned and dried semiconductor material st through the outlet, the tunnel type cleaning unit 500 not only cleans the upper surface of the semiconductor material, but also cleans the empty cleaning station where the semiconductor material is transferred.

The cleaning nozzle 523 and the air nozzle 521 can spray cleaning water and air to the side of the cleaning table, and the upper surface of the semiconductor material can be cleaned when the semiconductor material is placed above the cleaning table. If the semiconductor material is removed from the cleaning table, it can be cleaned. the upper face of the platform.

At this time, when the cleaned and dried semiconductor material is discharged from the outlet 524 or when the cleaning table moves back toward the inlet after the semiconductor material is discharged from the outlet, the cleaning nozzle may spray cleaning water toward the cleaning table to clean the cleaning table.

In addition, in the process of discharging the semiconductor material from the outlet 524, even if the cleaning water is sprayed, if the cleaning water is sprayed at a time point that does not affect the semiconductor material, the cleaning water can also be sprayed to the upper side of the cleaning table located below the support rail 527. .

Of course, when cleaning the cleaning table, the cleaning nozzle and the air nozzle can also be used to spray to the cleaning table 501 side, and only the air nozzle can be used to spray and remove residual foreign matter remaining on the cleaning table with air.

That is, the tunnel-type cleaning unit according to the present invention can freely control the reciprocating movement of the cleaning table such as forward or backward, and variously adjust the number of times of cleaning or drying according to needs.

The tunnel type cleaning part of the present invention can not only clean the upper surface of the semiconductor material, but also clean the lower surface of the semiconductor material. According to the independent spraying of the cleaning nozzle 523 and the air nozzle 521, various cleaning conditions and air conditions can be changed, thereby Choose a facet width. In addition, the tunnel-type cleaning part 500 performs cleaning inside the tunnel-type cleaning chamber, so that cleaning water sprayed during cleaning can be prevented from being scattered to the outside to protect equipment, and foreign matter, etc., which are separated and discharged from semiconductor materials during cleaning can be prevented. , thus having the advantage of being easy to clean and maintain.

In addition, the tunnel-type cleaning unit of the present invention performs cleaning and drying processes inside the tunnel-type cleaning chamber, and continuously performs automatic cleaning by controlling the transfer direction and the number of transfers of the cleaning table, thereby simplifying the system and preventing The used air and cleaning water are scattered together with dust, foreign matter, etc., so that the efficiency of system failure prevention and maintenance can be improved.

On the other hand, the semiconductor material is transferred in the state placed on the cleaning table 501, cleaned by blowing air and cleaning water, and the semiconductor material after the cleaning and drying process is completed in the tunnel cleaning unit 500 is placed on the support rail 527. The state is pulled to the pulling part 551 and transferred to the outside of the tunnel cleaning chamber 520 of the tunnel cleaning part 500 , and transferred to the semiconductor material picking position by the transfer picker 620 . During the process of transferring the material to the transfer picker 620 , a support frame 543 is also liftably arranged below the support rail 527 to prevent the semiconductor material from sagging.

The transfer picker 620 picks up the semiconductor material pulled out by the pulling part 551 and is configured to be movable in the X-axis direction, and transfers the semiconductor material to the inspection table 610 after picking up the semiconductor material.

The inspection table 610 can be transported in the Y-axis direction with the semiconductor material being transported thereon. In a state where the semiconductor material is conveyed above the inspection table 610 , the upper face of the semiconductor material, ie the upper face of the ground semiconductor material, can be inspected with the inspection view 630 .

The inspection view 630 may be installed above the output part, and inspect the grinding state of the cleaned and dried semiconductor material. For example, scratches, cracks, contamination, ball dents, gap balls and voids can be detected.

The inspection view 630 of the present invention can inspect the upper surface of the semiconductor material immediately after grinding and cleaning, and can immediately inspect the grinding state and cleaning state through the inspection state, thereby minimizing the occurrence of defects.

After the mold part inspection is completed, after the inspection table 610 returns to the initial position, the transfer picker 620 provided above the inspection table 610 picks up the semiconductor material again and carries it out to the output section.

In the above, the case where the inspection is performed while the inspection view 630 is mounted on an additional inspection table has been described, but it may be carried out while being carried out to the output unit. In addition, an area where inspection is performed in the inspection table 610 may also be included in the output section.

The output unit of the present invention may include a recovery unit 700 and a material recovery unit 800 . In the output unit, semiconductor materials that have been inspected are placed in the recovery unit 700 that can be transferred in the Y-axis direction and recovered to the material recovery unit 800 .

The recovery unit 700 may include a recovery track 750 for placing semiconductor materials, a pusher 710 for pushing the semiconductor materials placed on the recovery track 750 into the material recovery unit 800 , and the like.

The material recycling unit 800 may stack and store the semiconductor materials that have completed the polishing process, the cleaning process, and the inspection process in the same manner as the semiconductor material supply unit 100 .

For reference, the material recovery unit 800 may be a cassette stacked with semiconductor materials, and according to the inspection results of the inspection view 630 , it may be loaded into each cassette according to good products and defective products and carried out.

As mentioned above, it has been described with reference to the preferred embodiments of the present invention, but those skilled in the art can make various implementations within the scope of the concept and field of the present invention described in the scope of patent application below. Modification or deformation to implement.

1000: Semiconductor material grinding system 100:Material Supply Department 210: Lead-out unit 215: Bottom view 220: upper view 230: View from above 250: lead out track 310, 310a, 310b, 310c: chuck table 320: Supply Pickup 330: Bottom view 360, 360a, 360b: Recycling Pickup 370: lower surface cleaning part 400, 400a, 400b, 400c: semiconductor material grinding device 403: Chuck Table Conveyor Line 410: grinding wheel 420: grinding head 431: Bracket 431f: Housing 431h: outer wall 431o: fastening hole 433: Install parts 433o: fastening hole 435: Lifting Department 461: left and right fine adjustment unit 465:Front and rear fine-tuning unit 467: Rod parts 468, 468a, 468b: Brackets 470:Gate frame 500: Tunnel cleaning department 501: washing table 503: Air nozzle 520: Tunnel cleaning chamber 521: Air nozzle 522:Entrance 523: cleaning nozzle 524: export 525: Air drying department 525l: the second air drying section 525u: The first air drying section 527: Support track 540: unloading department 543: support frame 550: Gripper delivery unit 551: traction department 610: Examination table 620: pass picker 630: Check the view 700: Recovery unit 710: Pusher 750:Recover Orbit 800: Materials Recovery Department st: semiconductor material

Fig. 1 shows a plan view of a semiconductor material grinding system according to the present invention. Fig. 2 shows a perspective view of a semiconductor material grinding device constituting the semiconductor material grinding system according to the present invention. Fig. 3 is a side view showing the operation state of the semiconductor material grinding device constituting the semiconductor material grinding system according to the present invention. 4 is an exploded perspective view showing a grinding head, a bracket, a mounting part, and an angle adjustment part of a semiconductor material grinding device constituting a semiconductor material grinding system according to the present invention. Fig. 5 shows a front view of a semiconductor material grinding device constituting the semiconductor material grinding system according to the present invention. Fig. 6 is an exploded perspective view showing a disassembled lifting part of the semiconductor material grinding device constituting the semiconductor material grinding system according to the present invention. Fig. 7 shows a perspective view of a tunnel cleaning section constituting the semiconductor material grinding system according to the present invention. Fig. 8 shows a side view of a tunnel cleaning section constituting the semiconductor material grinding system according to the present invention. FIG. 9 shows the process of cleaning the upper surface of the semiconductor material using the cleaning nozzle and the air nozzle in the tunnel cleaning part of the present invention. Fig. 10 shows the process of drying the cleaned semiconductor material in the tunnel cleaning section of the present invention and pulling it with the semiconductor material pulling section.

310: chuck table

400: Semiconductor material grinding device

403: Chuck Table Conveyor Line

410: grinding wheel

420: grinding head

431: Bracket

435: Lifting Department

470:Gate frame

st: semiconductor material

Claims (24)

A semiconductor material grinding system, comprising: Materials Supply Division, which supplies semiconductor materials; a supply picker that picks up and transfers the semiconductor material supplied to the material supply part; more than one chuck table, which is arranged on the base table, and the semiconductor material picked up by the supply picker is conveyed above the chuck table, and is arranged to be transportable in one direction; More than one semiconductor material grinding device, including: a grinding head, which is detachably provided with a grinding wheel for grinding the semiconductor material at one end; a gate-shaped frame, which is configured on the base and is arranged on the chuck table On the transfer path, the gate-shaped frame has an opening for the movement of the chuck table; a lifting part, which is installed on the gate-shaped frame, and lifts the grinding head; a bracket, which is used to move the grinding head Installed on the lifting part; and, an angle adjustment part, which is used to adjust the inclination angle of the grinding head; a cleaning section that cleans the semiconductor material that has been ground in the semiconductor material grinding device; and an output section that unloads the semiconductor material cleaned in said cleaning section, The grinding head and the lifting part are arranged coaxially. The semiconductor material grinding system according to claim 1, wherein, The chuck table is provided with a plurality of on the base table, The glyph frame is independently set on the transfer path of each chuck table, Each of the gate-shaped frames is spaced apart from each other. The semiconductor material grinding system according to claim 2, wherein, Grinding wheels with the same or different roughness are selectively detachably mounted on each of the grinding heads, When grinding wheels having roughnesses different from each other are installed, The grinding wheels are arranged sequentially from coarse and fine grinding wheels to fine and fine grinding wheels. The semiconductor material grinding system according to claim 1, wherein, the grinding wheel has a diameter equal to or greater than the width of the semiconductor material to be ground, The entire upper surface of the semiconductor material is ground by rotating the grinding wheel while moving the chuck table in one direction. The semiconductor material grinding system according to claim 1, wherein, The bracket is provided with an accommodation portion for accommodating the grinding head, and through holes are formed on the outer walls of both sides constituting the accommodation portion, The semiconductor material grinding device also includes a mounting part, the mounting part is combined with the outside of the grinding head, so that the grinding head can be detached from the accommodating part, and the position corresponding to the through hole is provided with fitting groove, The angle adjustment part includes: A pair of brackets, which are fixedly installed in the fitting groove of the mounting part through the through hole of the bracket, so that the grinding head is fixed on the bracket and can rotate; a lever member that rotates one or more of the pair of brackets; and One or more front and rear fine adjustment units are provided on both sides of the rod member, and finely adjust the front and rear inclination angle of the grinding head. The semiconductor material grinding system according to claim 5, wherein, The rod member is integrally formed with the bracket, or combined with one side of the bracket, or inserted and installed in the bracket. The semiconductor material grinding system according to claim 5, wherein the front and rear fine-tuning units include: Eccentric nuts, which are respectively arranged in the direction of both sides of the rod part, one side is in contact with the side of the rod part and has an eccentric through hole; and a fastening bolt, which is threadedly connected to the through hole of the eccentric nut and the bracket, By changing the fastening depth of the fastening bolts, the front-back inclination angle of the grinding head can be fine-tuned. The semiconductor material grinding system according to claim 5, wherein the front and rear fine-tuning units include: Nuts, which are respectively provided on both sides of the rod member, one side is in contact with the side surface of the rod member and has a tapered through hole on the upper surface; and fastening bolts, which are threadedly connected to the through-holes of the nuts and the brackets, The through hole is larger than the diameter of the fastening bolt, and by changing the fastening depth of the fastening bolt, the front-back inclination angle of the grinding head can be fine-tuned. The semiconductor material grinding system according to claim 5, wherein, The bracket and the mounting part of the semiconductor material grinding device are provided with more than one fastening hole at positions corresponding to each other, the fastening hole formed in the bracket is larger than the fastening hole formed in the mounting part, The semiconductor material grinding device further includes a fixing bolt inserted into the fastening hole to fix an adjusted angle through the angle adjusting part. According to the semiconductor material grinding system according to claim 5, wherein, the angle adjustment part further includes a left and right fine adjustment unit, which is provided with more than one left and right fine adjustment unit on both sides of the support, and adjusts the left and right direction inclination of the grinding head angle, The left and right fine-tuning unit includes: Eccentric nuts, which are respectively arranged in the left and right directions of the bracket, one side is in contact with the side of the bracket and has an eccentric through hole; and a fastening bolt, which is threadedly connected to the through hole of the eccentric nut and the lifting part, By changing the fastening depth of the fastening bolts, the left-right inclination angle of the grinding head can be fine-tuned. The semiconductor material grinding system according to claim 5, wherein, The angle adjustment part also includes: Left and right fine-tuning units, which are provided with more than one in the left and right directions of the support, and adjust the inclination angle of the grinding head in the left and right directions, The left and right fine-tuning unit includes: nuts, which are respectively arranged in the left and right directions of the bracket, one side is in contact with the side of the bracket and has a tapered through hole; and a fastening bolt, which is threadedly connected to the through hole of the nut and the lifting portion, By changing the fastening depth of the fastening bolts, the left-right inclination angle of the grinding head can be fine-tuned. The semiconductor material grinding system according to any one of claims 7, 8, 10 and 11, wherein, The fastening bolts are flat-head bolts or flat-head screws. The semiconductor material grinding system according to claim 1, wherein the semiconductor material grinding system further comprises: a recovery picker that picks up the semiconductor material that has been ground in the semiconductor material grinding device and transfers it to the cleaning section, The cleaning unit includes: a lower surface cleaning unit, which is provided on the conveyance path of the recovery picker, and is used for cleaning by contacting the lower surface of the semiconductor material picked up by the recovery picker; and The tunnel-type cleaning part is provided with: a cleaning table, which places the semiconductor material cleaned by the lower surface of the cleaning part on the upper side, and can be transferred in the front and rear directions; a tunnel-type cleaning chamber, which is installed in the On the transfer path of the cleaning table, an inlet is formed at the front and an outlet is formed at the rear, and a cleaning nozzle that sprays cleaning water to the side of the cleaning table is provided on the inner upper side; and a control unit controls the transfer of the cleaning table. The direction and the number of transfers are used to adjust the number of times of cleaning while making the cleaning table move forward and backward. The semiconductor material grinding system according to claim 13, wherein, The semiconductor material grinding system also includes: an unloading section that unloads the cleaned-finished material discharged from the outlet, The unloading unit includes: The support rail is formed extending from the outside of the exit of the tunnel-type cleaning chamber to the inside of the tunnel-type cleaning chamber, and its width can be adjusted in the left and right directions, so as to support the semiconductor material after cleaning on the upper surface ;as well as The pulling part moves along the support rail and draws out the semiconductor material supported above the support rail. The semiconductor material grinding system according to claim 14, wherein, The cleaning table can be set up and down, When the cleaning by the cleaning nozzle is completed, the cleaning table rises to the height of the support rail, and when the support rail changes to a width smaller than the width of the semiconductor material, the cleaning table descends to place Semiconductor material above the cleaning station is conveyed to the support rails. The semiconductor material grinding system according to claim 14, wherein, One side of the cleaning table is provided with an air nozzle for spraying air upwards, The air nozzles inject air towards the lower face of the semiconductor material delivered to the support rail. The semiconductor material grinding system according to claim 14, wherein, The cleaning nozzle sprays cleaning water toward the cleaning table side to clean the cleaning table while the cleaning table is retreating toward the inlet after the cleaned semiconductor material is discharged from the outlet. The semiconductor material grinding system according to claim 14, wherein, The tunnel type cleaning part also includes: an air nozzle installed above the inner side of the tunnel-type cleaning chamber and sprays air downward, The air nozzle is sprayed together with the cleaning nozzle to clean the upper surface of the semiconductor material or the upper surface of the cleaning table, or The upper surface of the semiconductor material or the upper surface of the cleaning table is dried by spraying alone. The semiconductor material grinding system according to claim 13, wherein, The tunnel cleaning section includes: a first air drying unit, which is arranged at the upper end of the outlet of the tunnel-type cleaning chamber, and sprays air to the upper surface of the semiconductor material; and a second air drying unit, which is arranged at the lower end of the outlet of the tunnel-type cleaning chamber, and sprays air to the lower surface of the semiconductor material, The first air dryer and the second air dryer are arranged coaxially. The semiconductor material grinding system according to claim 13, wherein, The cleaning unit also includes: An upper surface cleaning unit is provided above the transfer path of each of the chuck tables, and cleans the upper surface of the semiconductor material polished by the semiconductor material polishing device. The semiconductor material grinding system according to claim 1, wherein, The semiconductor material grinding system also includes: a recovery picker that picks up the semiconductor material that has been ground by the semiconductor material grinding device and transfers it to the cleaning section, The recycling picker includes: a first recovery picker, which picks up the finished semiconductor material placed above the chuck table and transfers it to any chuck table or to the cleaning part; and A second recycling picker that delivers new semiconductor material to be processed at the chuck station where the semiconductor material was removed. The semiconductor material grinding system according to claim 1, wherein, said supply picker is rotatably disposed, The material supply department also includes: a cassette laminated with the semiconductor material; an extraction unit that extracts or injects any one of the semiconductor materials laminated on the cassette; and An upper viewing scene or a lower viewing scene, the upper viewing scene is installed on the upper side of the material supply part for checking the supply direction of the semiconductor material drawn and supplied from the cassette, the lower viewing scene is installed on the The underside of the material supply section, When the vertical direction of the semiconductor material is wrong according to the inspection result of the upper view or the lower view, the extraction unit puts the semiconductor material into the cassette, When the left-right direction of the semiconductor material is wrong, the supply picker is rotated in a state where the semiconductor material is picked up, thereby switching the direction of the semiconductor material. The semiconductor material grinding system according to claim 1, wherein, The semiconductor material grinding system also includes: a lower view mounted to one side of the supply picker; and an upper view mounted below the delivery path of the supply picker, said upper vision inspects the alignment of said semiconductor material picked up by said supply picker, said down sight checking alignment of said chuck table to which said semiconductor material picked up by said supply picker is to be delivered, The supply picker transfers the semiconductor material to the chuck station according to the alignment check results of the upper view and the lower view. The semiconductor material grinding system according to claim 1, wherein, The semiconductor material grinding system also includes: An inspection view, installed above the output, inspects the finished grinding and cleaning of the semiconductor material.

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