CN210528781U

CN210528781U - Full-automatic cutting equipment of glass substrate

Info

Publication number: CN210528781U
Application number: CN201920143907.1U
Authority: CN
Inventors: 丁力; 程常宝
Original assignee: Jiangsu Tunghsu Yitai Intelligent Equipment Co ltd; Dongxu Optoelectronic Technology Co Ltd
Current assignee: Jiangsu Hongxin Yitai Intelligent Equipment Co ltd; Dongxu Optoelectronic Technology Co Ltd
Priority date: 2019-01-28
Filing date: 2019-01-28
Publication date: 2020-05-15
Anticipated expiration: 2029-01-28

Abstract

The utility model discloses a full automatic cutout equipment of glass substrate, include: the device comprises a cutting platform, a lifting device, a cutting device and an adsorption transplanting device, wherein the cutting platform is used for bearing a glass substrate to be cut; the lifting device is used for transporting the glass substrate and can be butted with the cutting platform, so that the glass substrate is moved to fall onto the cutting platform and the glass is received by the cutting platform; the cutting device is used for cutting the glass substrate on the cutting platform; the adsorption transplanting device is used for adsorbing the cut glass substrates and then moving the cut glass substrates out of the cutting platform according to a preset sequence. Through the utility model discloses a full automatic cutout equipment of glass substrate and method can realize receiving the glass substrate automatically, get the piece automatically and scrap, clear up the piece automatically.

Description

Full-automatic cutting equipment of glass substrate

Technical Field

The utility model relates to a liquid crystal display panel makes the field, and more specifically the utility model relates to a full automatic cutout equipment of glass substrate.

Background

Currently, for OLED, Array, TSP & BP segment glass substrates, they are cut, sampled, and discarded. During the cutting process, the cutting effect may be poor due to the possible thickness difference between each glass substrate to be cut. And along with the piece in the cutting process, if the foreign matter on the cutting platform is not cleared away totally, when carrying out the cutting process to the flat board on the cutting platform, the part of glass substrate corresponding to the foreign matter can the perk make the base plate place unevenly, leads to the base plate to fix a position inaccurate in the cutting process or even produces the piece breakage, and the sample causes inconvenience after the cutting, consequently to current cutting platform, need clear away the piece on the platform after it carries out the cutting process. Although the device for removing the chips is arranged in the current carrier structure, the removing capability of the chips on the carrier is limited, so that the cutting yield of the product is difficult to improve, and the automation capability of the current carrier is limited due to the complex design structure of the carrier, and the productivity is influenced. Moreover, the glass substrate to be cut is carried to the cutting platform manually, and sampling is carried out manually after cutting, so that the working efficiency is greatly reduced, the time for processing the relevant glass substrate by the process section is too long, and the production requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve among the prior art because the cutting effect that the thickness difference between the glass substrate caused is not good, the cutting platform piece is clear away the work efficiency that the non-automation that does not thoroughly, receive glass and sample caused and reduces the scheduling problem, provide an automatic receive glass substrate, get the piece automatically and scrap, clear up clastic full automatic cutout equipment.

1. The utility model provides a full automatic cutout equipment of glass substrate which includes: a cutting platform, a lifting device, a cutting device and an adsorption transplanting device, wherein,

the cutting platform is used for bearing the glass substrate to be cut;

the lifting device is used for transporting the glass substrate and can be butted with the cutting platform, so that the glass substrate is moved to fall onto the cutting platform and the glass is received by the cutting platform;

the cutting device is used for cutting the glass substrate on the cutting platform;

the adsorption transplanting device is used for adsorbing the cut glass substrates and then moving the cut glass substrates out of the cutting platform according to a preset sequence.

2. The glass substrate full automatic cutting apparatus according to item 1, wherein,

the top surface of the cutting platform is rectangular, the cutting platform is provided with a plurality of areas corresponding to the cutting track of the cutting device, and each area can independently control the adsorption force applied to the received glass substrate, so that when the adsorption transplanting device absorbs glass, the cut glass is further cracked along the cutting track by controlling the adsorption force difference between each glass substrate lobe cut along the cutting track and the cutting platform.

3. The glass substrate full automatic cutting apparatus according to

item

1 or 2, wherein,

elevating gear is the servo elevating gear who is located cutting platform below, and it includes:

the servo motor drives the ball screw and drives the load workbench to move up and down in a matched mode through the linear bearing.

4. The glass substrate full-automatic cutting apparatus according to

item

2 or 3, wherein,

the butt joint of the cutting platform and the lifting device is realized by pins positioned on a load workbench of the lifting device and pin holes of the cutting platform,

preferably the pins are evenly distributed over the load table,

the material constituting the pin is preferably an antistatic material, and more preferably PEEK.

5. The glass substrate full automatic cutting apparatus according to item 4, wherein,

each zone is capable of independently controlling the suction force applied to the received glass substrate to vary the pressure differential experienced between the individual glass substrate fragments cut along the cutting path, such that further cleaving of the cut glass along the cutting path is achieved by controlling the vacuum between the cutting platform and the suctioned glass fragments at each zone.

6. The glass substrate full automatic cutting apparatus according to item 5, wherein,

each area is provided with an independent air path control system and at least one adsorption hole which is arranged to avoid the pin hole,

and the gas path control systems are used for performing gas suction or air exhaust on the connection of the adsorption holes of each area to realize the difference between the vacuum degrees of the cutting platform and the adsorbed glass splinters on each area, so that the stress of the splinters is different.

7. The full-automatic glass substrate cutting equipment according to any one of items 1 to 6, wherein the cutting device comprises a cutting assembly and a module for sliding the cutting assembly, and the module for sliding the cutting assembly can control the cutting assembly to move along a cutting track so as to cut glass to be cut;

preferably, the module is a two-axis gantry-type module.

8. The glass substrate full-automatic cutting apparatus according to item 7, wherein the cutting assembly comprises:

a cylinder, an air path system and a cutter head,

the air path system comprises a positive pressure air path system, a negative pressure air path system and a pneumatic pressure control unit,

the positive pressure gas path system is connected with the pneumatic pressure control unit,

the positive pressure gas circuit system is connected with the cylinder, and the cutter head is connected to the lower part of the cylinder;

preferably the cylinder is a low friction cylinder,

preferably, the pneumatic pressure control unit comprises a proportional valve.

9. The glass substrate full-automatic cutting apparatus according to item 8, wherein the cutting assembly further comprises:

the servo control system, the speed reducer, the synchronous belt and the synchronous belt pulley are combined;

the synchronous belt and synchronous pulley combination comprises: the synchronous belt is connected with the driving wheel and the driven wheel;

the lower portion of the servo control system is connected with a speed reducer, the lower portion of the speed reducer is connected with a driving wheel, the driven wheel is connected with the upper portion of the air cylinder, the cutter head is located on the axis of the driven wheel, the driving wheel is controlled by the servo control system to rotate, the driving wheel drives the driven wheel to rotate, and then the air cylinder and the cutter head are driven to rotate synchronously.

10. The full-automatic glass substrate cutting device according to item 9, wherein the cutting assembly is further provided with a synchronous belt tensioning mechanism acting on the synchronous belt;

preferably, the gas circuit system is connected with a manual lifting displacement table, and a locking hand wheel is arranged on the manual lifting displacement table;

more preferably, a sensor is further installed on the upper portion of the air path system, and is used for confirming the rotation of the cutter head;

most preferably, the cutting assembly is further provided with a filter connected to the negative pressure air path system, and a suction tube connected to a lower end of the filter, the lower end of the suction tube being disposed adjacent to the cutter head.

11. The full-automatic cutting equipment for glass substrates according to any one of items 1 to 10, wherein the cutting device further comprises:

the cleaning component is arranged on the base plate,

the sweeping assembly comprises a brush, a brush lifting mechanism and a debris collecting box.

12. The full-automatic cutting equipment of glass substrate of any one of items 6 ~ 11, wherein, adsorb transplanting device includes:

an adsorption component, a lifting component connected with the upper part of the adsorption component, a transplanting component,

the suction assembly comprises at least one suction cup,

the distribution of the suckers is consistent with the distribution of the adsorption holes on the cutting platform.

13. The full-automatic cutting equipment for glass substrates according to any one of items 1 to 12, wherein the device further comprises:

and the waste material vehicle is positioned below the tail end of the transplanting assembly.

14. The full-automatic cutting equipment for glass substrates according to any one of items 1 to 13, wherein the device further comprises:

and a mechanical arm for conveying the glass substrate to be cut to the upper part of the cutting platform.

15. The full-automatic cutting equipment for glass substrates according to any one of items 1 to 14, wherein the glass substrates to be cut are scrapped glass substrates.

16. A method of cutting a glass substrate, comprising:

the glass substrate to be cut is placed on the cutting platform by using the lifting device,

moving a cutting device along a cutting track to cut the glass substrate according to the cutting track,

the adsorption transplanting device adsorbs the cut glass substrates, then the cut glass substrates are moved out from the cutting platform according to a preset sequence,

the cutting platform is used for bearing a glass substrate to be cut; the lifting device is used for transporting the glass substrate and can be butted with the cutting platform, so that the glass substrate is moved to fall onto the cutting platform and the glass is received by the cutting platform; the cutting device is used for cutting the glass substrate on the cutting platform; the adsorption transplanting device is used for adsorbing the cut glass substrates and then moving the cut glass substrates out of the cutting platform according to a preset sequence.

17. The method of item 16, wherein the method further comprises:

after moving the cutting device along the cutting trace to cut the glass substrate according to the cutting trace,

each area of the plurality of areas of the cutting platform independently controls the adsorption force applied to the received glass substrate, so that when the adsorption transplanting device adsorbs the glass, the cut glass is further cracked along the cutting track by controlling the difference of the adsorption force between each glass substrate lobe cut along the cutting track and the cutting platform,

then the adsorption and transplanting device is used for adsorbing the further cracked and cut glass substrate, and then the cut glass substrate is moved out from the cutting platform according to a preset sequence, wherein,

the cutting platform is rectangular in top surface and is provided with a plurality of areas corresponding to the cutting track of the cutting device.

18. The method of

item

16 or 17, further comprising:

and transferring the cut glass splinters removed from the cutting platform to a waste material vehicle.

19. The method of any of items 16-18, further comprising:

when the glass substrate is cut, the cutting platform is cleaned by a cleaning assembly comprising a brush, a brush lifting mechanism and a scrap collecting box.

20. The method of any one of claims 16 to 19, wherein the glass is cut using the apparatus of any one of claims 1 to 15.

Preferably, the glass substrate full-automatic cutting equipment further comprises a PLC, and all operations are completed according to a preset program of the PLC, so that the operation accuracy and effectiveness can be guaranteed.

A PLC Controller, i.e. a Programmable Logic Controller (PLC), a digital electronic device with a microprocessor, a digital Logic Controller for automation control, which can load control instructions into a memory at any time for storage and execution. Programmable CPU, instruction and data memory, input/output unit, power module, and digital/analog unit.

Effect of the utility model

Use the utility model discloses an equipment and method, cutting platform set up the pin hole, and the elevating gear of below sets up corresponding pin for cutting device and elevating gear butt joint, thereby can receive the glass substrate that waits to cut automatically, make the glass substrate steadily fall on cutting platform, saved the cost of artifical transport. In addition, the pins are made of antistatic materials, so that static electricity can be effectively prevented from being generated between the glass substrate and the pins.

Preferably, the utility model discloses a full-automatic method of glass substrate still includes, after the cutting platform received the glass substrate of waiting to cut, adsorbs the glass substrate, and then cutting device cuts glass. Keep glass absorption on cutting platform when cutting glass for glass substrate is fixed during the cutting, avoids cutting assembly to drive the cutting orbit skew that glass substrate removed the cause.

The utility model discloses in, every region by cutting the orbit and dividing can its adsorption affinity of giving the glass substrate who receives to the realization changes along the pressure differential of bearing between each glass substrate lobe after the cutting orbit cutting, when adsorbing transplanting device absorption glass substrate lobe, reaches the purpose of following the further lobe of a leaf of cutting orbit. Finally, the glass substrate splinters after cutting are moved away by the adsorption transplanting device, so that the labor input is saved, the working efficiency is greatly improved, and the time for processing the glass substrate in the whole process section is ensured by controlling the speed of each operation, and the production requirement is met.

The utility model discloses in, arranging of the last absorption hole of cutting platform is unanimous with the sucking disc position that adsorbs transplanting device, if the glass substrate is by before the cutting, the glass substrate optional position has a breach, when adsorbing transplanting device and adsorbing the cutting and scrapping the glass substrate, probably the sucking disc just in time with the breach coincidence, if adsorb hole and sucking disc position nonconformity, the sucking disc just holds cutting platform, damage the sucking disc very easily or can not successfully adsorb the glass substrate of transplanting, if adsorb the hole and the sucking disc position is unanimous, it is broken vacuous to adsorb the hole, make this department sucking disc play adsorption, can not cause the harm to cutting platform, can normally adsorb the glass substrate of transplanting.

Use the utility model discloses an equipment, before cutting the big glass substrate of thickness change, adjust manual displacement platform earlier, twist the handle of locking wheel soon and fix cutting device on the vertical direction, again through PLC controller control proportional valve, drive actuating cylinder decline, accomplish the trial cut of glass substrate, this step mainly is to find best cutting pressure, it is best to reach the cutting effect to also can protect good cutter head, increase its life-span.

During the cutting process, dust can be generated, and by using the equipment provided by the invention, a suction pipe and a filter are additionally arranged on the cutting mechanism, and a dust absorption effect is achieved by a gas circuit system; in addition, a cleaning assembly is additionally arranged below the cutting mechanism, the cleaning of the scraps is completed by two operations together, and finally the cleaning efficiency can reach 95%.

Use the utility model discloses an equipment, at the in-process of cutting, can also rotate the tool bit to nimble transform cutting orbit reaches different cutting purposes. And a sensor for monitoring the rotation angle of the cutter head is also arranged, an alarm is preferably arranged on the sensor, if the actual rotation angle of the cutter head does not reach the angle preset by the PLC due to the loosening of the synchronous belt in the actual processing process, an alarm device arranged on the sensor gives an alarm, and the cutting process is strictly monitored, so that the cutting track cannot deviate.

Drawings

FIG. 1a is a perspective view of a cutting platform, a lifting device, and a two-axis module assembly according to an embodiment of the present invention (without a glass substrate)

FIG. 1b is a perspective view of a cutting platform, a lifting device, and a two-axis module assembly according to an embodiment of the present invention (with a glass substrate placed thereon)

Fig. 2 is a front view of a lifting device in an operating state according to an embodiment of the present invention

FIG. 3a is a front view of a cutting assembly according to an embodiment of the present invention

FIG. 3b is a perspective view of a cutting assembly according to an embodiment of the present invention

FIG. 4 is a top view of a cutting platform according to an embodiment of the present invention

FIG. 5 is a front view of an adsorption transplanting device according to an embodiment of the present invention

FIG. 6 is a rear view of a cutting device according to an embodiment of the present invention

FIG. 7 is a front view of a sweeping assembly according to one embodiment of the present invention

FIG. 8 is a schematic view of the position of the chip collecting box according to an embodiment of the present invention

Fig. 9 a waste material car according to an embodiment of the present invention

FIG. 10a is a front view of a full-automatic cutting apparatus for glass substrates according to an embodiment of the present invention

FIG. 10b is a top view of a full-automatic cutting apparatus for glass substrates according to an embodiment of the present invention

Description of the symbols

1 pin 2 cutting platform 3 mechanical arm

4 glass substrate 5 linear bearing 6 ball screw

7 servo motor 8 cutter head 9 suction tube

10 filter 11 servo control system 12 gas circuit system

13 pneumatic pressure control unit 14 synchronous belt and synchronous belt wheel combination 15 cylinder

16 speed reducer 17 synchronous belt tensioning mechanism 18 manual displacement platform

19 proportional valve 20 sensor 21 adsorption component

22 lifting assembly 23 transplanting assembly 24 cleaning assembly

25 module 26 load table 27 pin holes

28 suction hole 29 cutting assembly 30 brush

31 brush lifting component 32 adsorbs transplanting device 33 cutting device

34 lifting device 35 waste material vehicle 36 positive pressure gas path system

37 negative pressure air path system 38 debris collecting box

Detailed Description

The present invention will be described in further detail with reference to the following embodiments illustrated in the accompanying drawings, wherein like numerals denote like features throughout the drawings. While specific embodiments of the invention are shown in the drawings, it will be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

It should be noted that certain terms are used throughout the description and claims to refer to particular components. As one skilled in the art will appreciate, various names may be used to refer to a component. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The following description is of the preferred embodiment of the invention, and is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the invention. The protection scope of the present invention is subject to the limitations defined by the appended claims.

The utility model provides a full automatic cutout equipment of glass substrate, in a specific embodiment, it includes: cutting platform 2, lifting device 34, cutting device 33 and suction transplanting device 32 (shown in fig. 10a and 10 b), wherein,

as shown in fig. 1a and 1b, the cutting platform 2 is used for bearing the glass substrate 4 to be cut, and is made of a material with high hardness, strong wear resistance and difficult deformation, the cutting platform 2 can be in any shape, the size depends on the size of the glass substrate 4, and the cutting platform 2 is provided with a pin hole 27 in butt joint with the cutting device 33;

the lifting device 34 is used for transporting the glass substrate 4, and it can be butted against the cutting table 2 so as to move the glass substrate 4 to fall onto the cutting table 2 and receive the glass by the cutting table 2. In the present invention, the docking may be achieved by any means known to those skilled in the art. In a specific embodiment of the present invention, the butt joint is realized by the pin 1 located on the load table 26 of the lifting device 34 and the pin hole 27 of the cutting platform 2, in which the cutting platform 2 is butted against the lifting device 34.

For example, as shown in fig. 2, in the working state, the lifting device 34 is driven by the servo motor 7 to ascend, the pins 1 on the load table 26 of the lifting device 34 ascend to the cutting platform 2 through the pin holes 27 of the cutting platform 2, the glass substrate 4 first falls on the pins 1, and then the lifting device 34 drives the glass substrate 4 to descend until the glass substrate 4 falls on the cutting platform 2. The pin 1 is a link fixed on the load table 26 and is in point contact with the glass substrate 4 to be cut. The distribution of the pin holes 27 on the cutting platform 2 corresponds to the pins 1, and the size of the pin holes 27 is set according to the cross-sectional area of the connecting rod of the pins 1.

In a specific embodiment, as shown in fig. 6, the cutting device 33 is implemented by the cutting assembly 29 cooperating with the module 25 for sliding the cutting assembly 29 to cut the glass substrate 4 on the cutting platform 2 according to a predetermined cutting track;

the adsorption and transfer device 32 is used for adsorbing the cut glass substrate 4, and includes: a suction unit 21, a lifting unit 22 connected to an upper portion of the suction unit 21, and a transplanting unit 23 (shown in fig. 5). The suction assembly 21 includes a plurality of suction cups; the lifting assembly 22 is driven by the servo motor 7; the transplanting assembly 23 comprises a transplanting machine and a guide rail, the transplanting machine is used for controlling the lifting assembly 22 to move horizontally, and the guide rail is used for receiving and transporting the glass substrate 4 splinters adsorbed by the adsorption assembly 21. In a working state, for each glass substrate 4 splinter, the adsorption and transplanting device 32 drives the adsorption component 21 to descend to the glass substrate 4 splinter to be adsorbed by the lifting component 22 according to a preset sequence, after the glass substrate 4 splinter is adsorbed, the lifting component 22 drives the glass substrate 4 splinter to vertically move upwards, and then the transplanting component 23 controls the glass substrate 4 splinter to be placed on the guide rail to be moved away.

In a specific embodiment, as shown in fig. 4, the cutting platform 2 has an adsorption hole 28 disposed to avoid the pin hole 27, and the adsorption hole 28 may be connected to an air path control system to control the electromagnetic valve to perform vacuum pumping and breaking operations to control the adsorption force between the cutting platform 2 and the glass substrate 4.

In a specific embodiment, the top surface of the cutting platform 2 is rectangular, and the cutting platform 2 has several regions corresponding to the cutting track of the cutting device 33, the regions are not necessarily divided equally, each region can independently control the adsorption force between the region and the received glass substrate 4, that is, when one glass substrate 4 is sucked, the adsorption force between the glass substrate 4 and the cutting platform 2 is smaller than that between the other glass substrate 4 and the cutting platform 2, so that the cut glass substrate 4 is further cracked along the cutting track while sucking the glass substrate 4. For example, the glass substrate 4 to be cut can be equally divided into 2, 4, and 6 pieces by such a cutting device 33.

In a specific embodiment, each area has an independent air path control system and at least one suction hole 28 is arranged on each area to avoid the pin holes 27, and each area is connected with the air path control system of the area through the suction hole 28 to control the suction force between the cutting platform 2 and the glass substrate 4.

In a specific embodiment, as shown in fig. 2, the lifting device 34 is a servo lifting device located below the cutting platform 2, and includes: load work platform 26, ball 6, linear bearing 5 and servo motor 7, servo motor 7 drive ball 6 to cooperate linear bearing 5 to drive load work platform 26 and make elevating movement. Wherein, the servo lifting device is a lifting device driven by a servo motor 7; the load table 26 is a platform having a certain load-bearing function; the ball screw 6 is a transmission element for converting rotary motion into linear motion or converting linear motion into rotary motion; the linear bearing 5 is a linear motion system; the servo motor 7 is an engine for controlling mechanical elements to operate in a servo system, is an auxiliary motor indirect speed changing device, can control speed and position accuracy accurately by the servo motor 7, and can convert voltage signals into torque and rotating speed to drive a control object.

In a particular embodiment, as shown in fig. 3a and 3b, the cutting assembly 29 comprises: cylinder 15, gas circuit system 12, tool bit 8, servo control system 11, speed reducer 16 and hold-in range and synchronous pulley combination 14, gas circuit system 12 includes positive pressure gas circuit system 36, negative pressure gas circuit system 37 and pneumatic pressure control unit 13, hold-in range and synchronous pulley combination 14 include: the driving wheel, follow driving wheel and connect the driving wheel and follow the hold-in range of driving wheel, servo control system 11 sub-unit connection speed reducer 16, speed reducer 16 sub-unit connection driving wheel, follow driving wheel and cylinder 15 upper portion and be connected, tool bit 8 is located the axis from the driving wheel, the rotation of driving wheel is controlled by servo control system 11, the driving wheel drives from the driving wheel rotation, and then drives cylinder 15 and tool bit 8 synchronous revolution. The pneumatic pressure control element is connected with the positive pressure air path system 36, the positive pressure air path system 36 is connected with the air cylinder 15, and the cutter head 8 is connected with the lower part of the air cylinder 15. The pneumatic pressure control unit 13 controls and adjusts the gas pressure so that the cylinder 15 or the air motor operates according to a set program, and the pneumatic pressure control unit 13 generally controls the pressure by a pressure increasing valve, a pressure reducing valve, a safety valve, a sequence valve, a proportional valve 19, or the like. In an alternative embodiment, the cylinder 15 is a low friction cylinder, and the cylinder 15 is a cylindrical metal member for guiding the piston to perform linear reciprocating motion in the cylinder, and the low friction cylinder is the cylinder 15 with small sliding resistance of the piston. In another alternative embodiment, the pneumatic pressure control unit 13 includes a proportional valve 19, and the proportional valve 19 can continuously control the input quantity, wherein the output quantity is changed along with the change of the input quantity (current value or voltage value), and a certain proportional relation exists between the output quantity and the input quantity.

In a specific embodiment, as shown in fig. 3a and 3b, a timing belt tensioning mechanism 17 acting on the timing belt is further installed to play a role of tensioning the timing belt and preventing the timing belt from loosening, and the timing belt tensioning mechanism 17 includes a tension pulley installed near a smaller one of the driving pulley and the driven pulley.

In a specific embodiment, as shown in fig. 3a and 3b, the gas circuit system 12 is connected to a manual displacement table 18 for adjusting the cutting assembly 29 in the vertical direction, the manual displacement table 18 is provided with a locking handwheel, and when the cutting assembly 29 is adjusted to a proper position, the locking handwheel is tightened to fix the cutting assembly 29; the upper part of the gas path system 12 is also provided with a sensor 20 for confirming the rotation of the cutter head 8; the cutting assembly 29 is further provided with a filter 10 connected with a negative pressure air path system 37, and a suction pipe 9 connected with the lower end of the filter 10, wherein the lower end of the suction pipe 9 is arranged close to the cutter head 8.

In one embodiment, as shown in fig. 1a and 1b, the module 25 for sliding the cutting assembly 29 is a two-axis gantry-type module. In an alternative embodiment, the module 25 may also be a two-axis cantilever-type module, a three-axis gantry-type module, or a three-axis cantilever-type module. The module 25 is a manipulator module, and is divided into a single-axis module and a multi-axis module realized by a plurality of single-axis modules through different combination patterns, and the multi-axis module is a displacement that can be subjected to plane or spatial coordinates. X, Y the axis direction is as shown in fig. 1b, the displacement of XY axis can be realized to the diaxon module, the diaxon module is divided into diaxon planer-type module and diaxon cantilever type module, the X axis of diaxon planer-type module is set up on two parallel Y axes (or auxiliary guide rail), the X axis cantilever arm of diaxon cantilever type module stretches out, the X axis is installed on Y axis slider. The displacement of XYZ axle can be realized to the triaxial module, and the triaxial module divide into triaxial portal type module and triaxial cantilever type module, and the X axle of triaxial portal type module erects on two parallel Y axles (or supplementary guide rail), and the Z axle erects on the X axle, and the X axle cantilever arm of triaxial cantilever type module stretches out, and the X axle is installed on the Y axle slider, and the Z axle erects on the X axle. (please see if the worker can confirm that the several modules we expand here can achieve the purpose of the invention)

In a specific embodiment, the suction cups are vacuum suction cups, and the distribution of the suction cups is consistent with the distribution of the suction holes 28 on the cutting platform 2. The vacuum sucker is communicated with vacuum equipment such as a vacuum generator, when the sucker is contacted with an object to be lifted such as glass, the vacuum equipment is started to suck, negative air pressure is generated in the sucker, and therefore the object to be lifted is firmly adsorbed and can be conveyed. When the object to be lifted is conveyed to a destination, the air is stably inflated into the vacuum chuck, so that the negative air pressure in the vacuum chuck is changed into zero air pressure or slightly positive air pressure, the vacuum chuck is separated from the object to be lifted, and the task of lifting and conveying the object is completed.

In a specific embodiment, as shown in fig. 7, the cutting device 33 further includes: a sweeper assembly 24. The sweeping assembly 24 includes a sweeping unit for sweeping dust generated during cutting and a collecting unit for collecting dust debris of the sweeping. The cleaning unit may be a brush 30, and specifically may be a roll brush, a single-sided brush, a double-sided brush, a scrubber brush, or the like. The collection unit may be a chip collection box 38, the chip collection box 38 is located at one edge of the cutting platform 2, and the top edge of the chip collection box 38 is not higher than the top surface of the cutting platform 2, and the position thereof can be adjusted according to the cutting track (as shown in fig. 8). In an alternative embodiment, sweeping assembly 24 may further include an elevating unit, specifically a brush elevating assembly 31. Wherein, the lifting unit controls the lifting of the cleaning unit.

In a specific embodiment, a glass debris collecting unit for collecting the split glass substrates 4 is provided below the end of the rail of the transplanting assembly 23, and there is no limitation on such a glass debris collecting unit, such as a container, a collecting tank, etc. provided below the end of the rail, and in a specific embodiment, it is preferable that the glass debris collecting unit is movable so that after the collection is completed, the glass debris collecting unit can be moved to carry out the glass debris collected therein, and in particular, the waste material cart 35.

In a particular embodiment, the glass substrate 4 to be cut is transported above the cutting platform 2 by a robotic arm 3, said robotic arm 3 may be a robot fork on which the glass substrate 4 is placed for transportation. The robot crotch is formed by connecting a connecting plate and more than two rectangular pipe columns, and the extension direction from the fixed end to the free end of each rectangular pipe column is the same.

In a specific embodiment, the glass substrate 4 to be cut is a glass substrate 4 that is scrapped during the production process.

The utility model also provides a full automatic cutout method of glass substrate, wherein the description that above-mentioned full automatic cutout equipment of glass substrate can be referred to the equipment that involves.

In one embodiment, the method for fully automatically cutting a glass substrate of the present invention comprises:

the glass substrate 4 to be cut is brought and finally dropped onto the cutting platform 2 by means of the lifting device 34 abutting against the cutting platform 2, which in the present invention can be achieved in any way known to the skilled person. In a particular embodiment of the invention, the docking is achieved by pins 1 located on the elevator load table 26 and pin holes 27 provided in the cutting platform 2.

The cutting device 33 is moved along a predetermined cutting trajectory, thereby cutting the glass substrate 4 according to the cutting trajectory,

the adsorption transplanting device 32 adsorbs the cut glass substrate 4, each of the plurality of areas of the cutting platform 2 divided by the cutting track can independently control the adsorption force applied to the received glass substrate 4, when the adsorption transplanting device 32 adsorbs the glass, the cut glass substrate 4 is further cracked along the cutting track by controlling the difference of the adsorption force between the cracks of each glass substrate 4 cut along the cutting track and the cutting platform 2,

the cut glass substrates 4 are then removed from the cutting platform 2 in a predetermined order via the guide rails of the transplanting assembly 23.

In a particular embodiment, the method further comprises: after the glass substrate 4 to be cut is dropped on the cutting stage 2, the cutting stage 2 adsorbs the glass substrate 4.

In a specific embodiment, the plurality of regions divided by the cutting track on the cutting platform 2 are respectively provided with the adsorption holes 28 avoiding the pin holes 27, each region can be connected with an independent air path control system through the adsorption holes 28 of the region, and the electromagnetic valve is controlled to perform the operations of vacuumizing and breaking vacuum to control the adsorption force between each region of the cutting platform 2 and the glass substrate 4.

In a particular embodiment, the method further comprises: the cut glass fragments removed from the cutting platform 2 are transferred to a glass fragment collecting unit.

In a particular embodiment, the method further comprises: the cutting table 2 is cleaned by a cleaning assembly 24 including a cleaning unit and a collecting unit while the glass substrate 4 is cut. In an alternative embodiment, sweeper assembly 24 may also include a lift unit that controls the raising and lowering of sweeper assembly 24.

The following further describes the glass substrate full-automatic cutting device according to the utility model with reference to the attached drawings.

Referring to fig. 1a and 1b, which are schematic combined views of the cutting platform 2, the lifting device 34, and the module 25 for sliding the cutting assembly 29, the lifting device 34 is in an operating state, the pins 1 are lifted out of the cutting platform 2 through the pin holes 27 of the cutting platform 2, the glass substrate 4 to be cut is conveyed by the robot arm 3 to the pins 1 lifted above the cutting platform 2, after the glass substrate 4 is placed stably, the robot arm 3 is removed, then the lifting device 34 is lowered to be lower than the cutting platform 2, and the glass substrate 4 falls onto the cutting platform 2.

Fig. 2 is a schematic diagram of the lifting device 34, and the lifting device 34 is a servo lifting device located below the cutting platform 2, and includes: the device comprises a load workbench 26, a ball screw 6, a linear bearing 5 and a servo motor 7, wherein the ball screw 6 is connected above the servo motor 7, and the top of the ball screw 6 is fixed at the bottom of the load workbench 26 through a nut; around ball 6, still fix a plurality of linear bearing 5 at load workstation 26 bottom edge, servo motor 7 drive ball 6 and cooperate linear bearing 5 to drive load workstation 26 and make elevating movement. Pins 1 are evenly distributed on the load table 26.

Fig. 3a and 3b are schematic views of a cutting assembly in the cutting device, the cutting assembly 29 comprising: the pneumatic control device comprises an air cylinder 15, an air path system 12, a pneumatic pressure control unit 13, a tool bit 8, a servo control system 11, a speed reducer 16, a synchronous belt and synchronous belt wheel combination 14, a synchronous belt tensioning mechanism 17, a manual displacement table 18, a sensor 20 and a filter 10, wherein the air path system 12 comprises a positive pressure air path system 36, a negative pressure air path system 37 and the pneumatic pressure control unit 13.

The pneumatic pressure control element 13 is connected with a positive pressure air path system 36, the positive pressure air path system 36 is connected with the air cylinder 15, and the cutter head 8 is connected with the lower part of the air cylinder 15. The timing belt and timing pulley assembly 14 includes: the synchronous belt comprises a driving wheel, a driven wheel and a synchronous belt connecting the driving wheel and the driven wheel. The synchronous belt tensioning mechanism 17 acts on the synchronous belt to prevent the synchronous belt from loosening. The lower part of the servo control system 11 is connected with a speed reducer 16, the lower part of the speed reducer 16 is connected with a driving wheel, a driven wheel is connected with the upper part of a cylinder 15, and a cutter head 8 is positioned on the axis of the driven wheel. A manual displacement table 18 is mounted on the gas circuit system 12. The sensor 20 is mounted on the upper portion of the air path system 12. The suction pipe 9 is arranged close to the cutter head 8, the upper part of the suction pipe is connected with the filter 10, and the upper part of the filter 10 is connected with the positive pressure air path system 36.

Fig. 4 is a schematic diagram of the area on the cutting platform 2 divided by the cutting track. The cutting platform 2 is equally divided into four equal areas, a plurality of adsorption holes 28 are distributed on each area, and each area can independently control the adsorption force applied to the received glass substrate 4 through the adsorption holes 28, so that the pressure difference born by the splinters of the glass substrates 4 cut along the cutting track is changed, and the cut glass substrates 4 are further split along the cutting track.

Fig. 5 is a schematic view of an adsorption transplanting device, comprising: the sucking disc subassembly of below, connect the lifting unit 22, transplant subassembly 23 above the sucking disc subassembly. The sucking disc subassembly includes the several sucking disc, and the sucking disc corresponds the distribution with absorption hole 28 on the cutting platform 2. After the sucker component sucks the splinters of the glass substrate 4, the lifting component 22 drives the sucker component and the splinters of the glass substrate 4 to move upwards and move to the transplanting component 23, and the splinters of the glass substrate 4 are placed on the transplanting component 23 and conveyed by the transplanting component 23.

FIG. 6 is a rear view of the cutting device with sweeper assembly 24 mounted thereto, with sweeper assembly 24 mounted at a position below the rear of the cutting device.

Fig. 7 is a schematic view of sweeping assembly 24, which includes a brush 30 located under the edge of sweeping assembly 24, a brush lifting assembly 31 for controlling the lifting of brush 30, and a debris collecting box.

Fig. 8 is a schematic view of the position of the chip collecting box, which is connected to one edge of the cutting platform 2, has a top edge not higher than the top surface of the cutting platform 2, has a length direction parallel to the X-axis, and is located at the opposite end of the sweeping assembly 24 in the initial state.

Fig. 9 is a schematic view of a waste material cart, and when the glass substrate 4 to be cut is waste material, the transplanting assembly 23 transports the splinters of the glass substrate 4 to the waste material cart for scrap collection.

Fig. 10a and 10b are schematic views of a full-automatic cutting apparatus for a glass substrate, which further includes an integral frame for supporting each device in the present embodiment. The glass substrate 4 is conveyed to the pins 1 which are lifted above the cutting platform 2 by the mechanical arm 3, the servo motor 7 controls the lifting device 34 to descend below the cutting platform 2, the glass substrate 4 falls on the cutting platform 2, the glass substrate 4 is cut into a plurality of equal parts by the cutting device, and finally, the split pieces of the cut glass substrate 4 are sent to a waste material vehicle by the adsorption transplanting device.

Examples

By adopting the full-automatic cutting equipment for glass substrates shown in fig. 1-9, the glass substrate 4 to be cut is a scrapped rectangular glass substrate.

The cutting platform 2 is a rectangular marble platform, the size of the cutting platform 2 is slightly larger than that of a glass substrate 4 to be cut, the cutting track is cross-shaped, the cutting platform 2 is divided into four equal parts, namely ABCD, according to the cutting track, pin holes 27 are distributed in rows on the cutting platform 2 and parallel to one side of the marble platform, the pin holes 27 in every two adjacent areas are symmetrically distributed relative to the cutting track in the middle of the two areas, and pins 1 of the lifting device 34 are arranged corresponding to the pin holes 27 in the cutting platform 2, so that the glass substrate 4 is uniformly stressed at all positions when falling on the lifting pins 1. The suction holes 28 are formed so as to avoid the pin holes 27, and the suction holes 28 in each region are uniformly distributed at the edge of the region and are scattered around the center of the region. An independent air path control system is arranged below each area, and vacuum breaking and suction operations are performed by controlling all the adsorption holes 28 on the areas through electromagnetic valves.

Elevating gear 34 is located cutting platform 2 under, ball 6 is connected to servo motor 7 top, ball 6 is fixed in load work platform 26 bottom center through the nut, 4 linear bearing 5 are installed perpendicularly to load work platform 26 bottom edge, and load work platform 26 bottom center equals to 4 linear bearing 5's vertical distance, 4 linear bearing 5 constitute the box structure, make servo motor 7 drive ball 6 cooperation linear bearing 5 drive load work platform 26 jointly and make steady elevating movement. The pins 1 are made of antistatic polyether-ether-ketone resin.

The suction cups of the suction transplanting device 32 are distributed in accordance with the suction holes 28 of each area on the cutting platform 2. The lifting assembly 22 is driven by a servo motor 7, and a waste material vehicle is connected below the tail end of the transplanting assembly 23.

The cutting device 33 is composed of a cutting assembly 29, a module 25 for the cutting assembly 29 to slide, and a cleaning assembly 24, wherein the module 25 is a two-axis gantry-type module, which is composed of a slide rail parallel to the X-axis direction and two auxiliary slide rails parallel to the Y-axis, the two auxiliary slide rails parallel to the Y-axis are respectively installed on two opposite side surfaces of the cutting platform 2, and the cutting assembly 29 is located on the slide rail in the X-axis direction and can freely move on the slide rail. The cutting assembly 29 consists of an air cylinder 15, an air path system 12, a cutter head 8, a servo control system 11, a speed reducer 16, a synchronous belt and synchronous belt wheel combination 14, a synchronous belt tensioning mechanism 17, a manual displacement table 18, a sensor 20 and a filter 10. In this embodiment, the air path system 12 includes a positive pressure air path system 36, a negative pressure air path system 37 and a pneumatic pressure control unit 13, the air cylinder 15 is a low friction cylinder, the pneumatic pressure control element 13 controls pressure through a proportional valve 19, the proportional valve 19 is connected to the positive pressure air path system 36, the positive pressure air path system 36 is connected to the low friction cylinder, and the tool bit 8 is connected to the lower portion of the low friction cylinder. The timing belt and timing pulley assembly 14 includes: the synchronous belt comprises a driving wheel, a driven wheel and a synchronous belt connecting the driving wheel and the driven wheel. The synchronous belt tensioning mechanism 17 acts on the synchronous belt to prevent the synchronous belt from loosening. The lower part of the servo control system 11 is connected with a speed reducer 16, the lower part of the speed reducer 16 is connected with a driving wheel, the driven wheel is connected with the upper part of the air cylinder 15, the cutter head 8 is positioned on the axis of the driven wheel, the rotation of the driving wheel is controlled by the servo control system 11, the driving wheel drives the driven wheel to rotate, and further the air cylinder 15 and the cutter head 8 are driven to synchronously rotate. The gas circuit system 12 is provided with a manual displacement table 18, the manual displacement table 18 is provided with a locking hand wheel, before the glass substrate 4 with large thickness change is cut, the manual displacement table 18 is adjusted, a handle of the locking hand wheel is quickly screwed to fix the cutting device in the vertical direction, then the PLC controller controls the pneumatic pressure control element 13 to drive the air cylinder 15 to descend, and trial cutting of the glass substrate 4 is completed. The sensor 20 is a psd position sensor, is arranged on the upper part of the gas circuit system 12 and is used for confirming whether the rotation angle of the cutter head 8 reaches 90 degrees, the sensor 20 is also provided with an alarm system, and if the rotation angle of the cutter head 8 does not reach 90 degrees, the alarm gives an alarm. The suction pipe 9 is arranged close to the cutter head 8, the upper part of the suction pipe is connected with the filter 10, and the upper part of the filter 10 is connected with the negative pressure air path system 37 to finish the dust collection effect. The cleaning assembly 24 is installed at a position lower than the rear of the cutting device, and includes a brush 30 located below the edge of the cleaning assembly 24, a brush lifting device 31 for controlling the lifting of the brush 30, and a debris collecting box 38, wherein the debris collecting box 38 is connected to an edge of the cutting platform 2, the top edge of the debris collecting box is not higher than the top surface of the cutting platform 2, the length direction of the debris collecting box is parallel to the X axis, i.e. the X axis of the module 25, and the debris collecting box is located at the opposite end of the cleaning assembly 24 in the initial state. The position of which can be adjusted according to the position of the cutting device 33.

When the glass substrate full-automatic cutting equipment of the embodiment is adopted to automatically cut the scrapped glass substrate 4, firstly, the glass substrate 4 is conveyed to the pins 1 which are lifted above the cutting platform 2 by the fork of the robot, the servo motor 7 controls the lifting device 34 to descend below the cutting platform 2, the glass substrate 4 falls on the cutting platform 2, then the vacuum pumping is carried out by the independent air path control system below each area of the cutting platform 2, so that the glass substrate 4 to be cut is adsorbed on the cutting platform 2, then the cutting device 33 cuts four equal parts of the glass substrate 4, the adsorption component 21 descends to the surface of the glass substrate 4, when the adsorption component 21 adsorbs the glass substrate 4 in one area, the area is broken in vacuum by positive pressure, the other areas are vacuumized by negative pressure, and pressure difference is generated between the splinters of the adsorbed glass substrate 4 and the splinters of the other scrapped glass substrates 4 which are not taken away, further, the adsorption means 21 sucks the glass substrate 4 and further cracks the glass substrate. The adsorption and transfer device 32 sends the split pieces of the cut glass substrates 4 one by one to the waste cart 35 in accordance with a preset sequence ABCD. In other embodiments, the pieces of the glass substrate 4 may be removed in any order, which is preset by the PLC control system according to the number and position of the pieces of the glass substrate 4 cut by the cutting trajectory.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments and application fields, and the above-described embodiments are illustrative, instructive, and not restrictive. Those skilled in the art, having the benefit of this disclosure, may effect numerous modifications thereto without departing from the scope of the invention as defined by the appended claims.

Claims

the cutting platform is used for bearing the glass substrate to be cut;

2. The glass substrate full-automatic cutting apparatus according to claim 1,

3. The glass substrate full-automatic cutting apparatus according to claim 1,

4. The glass substrate full-automatic cutting apparatus according to claim 3,

the butt joint of the cutting platform and the lifting device is realized through pins on a load workbench of the lifting device and pin holes of the cutting platform.

5. The glass substrate full-automatic cutting device according to claim 4, wherein the pins are uniformly distributed on the load table.

6. The glass substrate full-automatic cutting device according to claim 4, wherein the material constituting the pins is an antistatic material.

7. The glass substrate full-automatic cutting device according to claim 4, wherein the material constituting the pins is PEEK.

8. The glass substrate full-automatic cutting apparatus according to claim 4,

9. The glass substrate full-automatic cutting apparatus according to claim 8,

10. The glass substrate full-automatic cutting equipment according to any one of claims 1 to 9, wherein the cutting device comprises a cutting assembly and a module for sliding the cutting assembly, and the module for sliding the cutting assembly can control the cutting assembly to move along a cutting track so as to cut the glass to be cut.

11. The glass substrate full-automatic cutting apparatus according to claim 10, wherein the module is a two-axis gantry-type module.

12. The glass substrate full-automatic cutting apparatus according to claim 10, wherein the cutting assembly comprises:

a cylinder, an air path system and a cutter head,

the positive pressure air circuit system is connected with the air cylinder, and the cutter head is connected with the lower part of the air cylinder.

13. The glass substrate full-automatic cutting apparatus according to claim 12, wherein the air cylinder is a low friction cylinder.

14. The glass substrate full-automatic cutting apparatus according to claim 12, wherein the pneumatic pressure control unit is mounted with a proportional valve.

15. The glass substrate full-automatic cutting device according to any one of claims 12 to 14, wherein the cutting assembly further comprises:

16. The glass substrate full-automatic cutting device according to claim 15, wherein the cutting assembly is further provided with a synchronous belt tensioning mechanism acting on the synchronous belt.

17. The glass substrate full-automatic cutting equipment according to claim 12, wherein a manual lifting displacement table is connected to the gas circuit system, and a locking hand wheel is arranged on the manual lifting displacement table.

18. The glass substrate full-automatic cutting device according to claim 12, wherein a sensor is further installed on the upper portion of the air path system for confirming the rotation of the cutter head.

19. The glass substrate full-automatic cutting device according to claim 15, wherein the cutting assembly is further provided with a filter connected with a negative pressure air path system, and a suction pipe connected with the lower end of the filter, and the lower end of the suction pipe is arranged close to the cutter head.

20. The glass substrate full-automatic cutting device according to any one of claims 1 to 9, wherein the cutting device further comprises:

the cleaning component is arranged on the base plate,

21. The glass substrate full-automatic cutting equipment according to claim 9, wherein the adsorption and transplantation device comprises:

the suction assembly comprises at least one suction cup,

22. The glass substrate full-automatic cutting apparatus according to claim 21, wherein the device further comprises:

23. The glass substrate full-automatic cutting device according to any one of claims 1 to 9, wherein the apparatus further comprises:

24. The glass substrate full-automatic cutting equipment according to any one of claims 1 to 9, wherein the glass substrate to be cut is a scrapped glass substrate.