KR20230125230A - 회로 접속용 접착제 필름, 및, 회로 접속 구조체 및그 제조 방법 - Google Patents

회로 접속용 접착제 필름, 및, 회로 접속 구조체 및그 제조 방법 Download PDF

Info

Publication number
KR20230125230A
KR20230125230A KR1020237023899A KR20237023899A KR20230125230A KR 20230125230 A KR20230125230 A KR 20230125230A KR 1020237023899 A KR1020237023899 A KR 1020237023899A KR 20237023899 A KR20237023899 A KR 20237023899A KR 20230125230 A KR20230125230 A KR 20230125230A
Authority
KR
South Korea
Prior art keywords
adhesive layer
adhesive
electrode
circuit
component
Prior art date
Application number
KR1020237023899A
Other languages
English (en)
Korean (ko)
Inventor
도모하루 야마자키
다카유키 이치무라
료타 고바야시
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20230125230A publication Critical patent/KR20230125230A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020237023899A 2020-12-25 2021-12-22 회로 접속용 접착제 필름, 및, 회로 접속 구조체 및그 제조 방법 KR20230125230A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020216997 2020-12-25
JPJP-P-2020-216997 2020-12-25
PCT/JP2021/047653 WO2022138747A1 (ja) 2020-12-25 2021-12-22 回路接続用接着剤フィルム、並びに、回路接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
KR20230125230A true KR20230125230A (ko) 2023-08-29

Family

ID=82159825

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237023899A KR20230125230A (ko) 2020-12-25 2021-12-22 회로 접속용 접착제 필름, 및, 회로 접속 구조체 및그 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2022138747A1 (zh)
KR (1) KR20230125230A (zh)
CN (1) CN116601250A (zh)
TW (1) TW202244219A (zh)
WO (1) WO2022138747A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08279371A (ja) 1995-02-07 1996-10-22 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003187885A (ja) * 2001-12-20 2003-07-04 Sony Corp 異方性導電フィルムおよび異方性導電フィルムの製造方法ならびに電子部品の実装体
KR102631317B1 (ko) * 2017-09-11 2024-02-01 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08279371A (ja) 1995-02-07 1996-10-22 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法

Also Published As

Publication number Publication date
TW202244219A (zh) 2022-11-16
CN116601250A (zh) 2023-08-15
JPWO2022138747A1 (zh) 2022-06-30
WO2022138747A1 (ja) 2022-06-30

Similar Documents

Publication Publication Date Title
JP2020074267A (ja) 異方性導電フィルムの製造方法及び異方性導電フィルム
KR102631317B1 (ko) 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
JP2006199778A (ja) 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
WO2022102573A1 (ja) 回路接続用接着剤フィルム及びその製造方法、並びに回路接続構造体及びその製造方法
WO2022009846A1 (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
WO2022102672A1 (ja) 回路接続用接着剤フィルム及びその製造方法、並びに、接続構造体及びその製造方法
US20230234333A1 (en) Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor
KR102533475B1 (ko) 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
KR102569980B1 (ko) 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
KR20230125230A (ko) 회로 접속용 접착제 필름, 및, 회로 접속 구조체 및그 제조 방법
KR20230043894A (ko) 회로 접속용 접착제 필름, 회로 접속용 접착제 조성물, 및 회로 접속 구조체 및 그 제조 방법
JP2015149128A (ja) 異方性導電フィルム及びその製造方法
JP2012046757A (ja) 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
WO2023106400A1 (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
JP5392333B2 (ja) 回路接続用接着剤及びこれらを用いた回路接続方法、接続体
WO2022075370A1 (ja) 回路接続用接着剤フィルム、回路接続用材料、並びに回路接続構造体及びその製造方法
WO2023106410A1 (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
JP2022112210A (ja) 回路接続用接着剤及び接続構造体の製造方法
KR20230075473A (ko) 회로 접속용 접착제 필름, 무기 필러 함유 조성물, 및, 회로 접속 구조체 및 그 제조 방법
JP2023063770A (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
JP2022061623A (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
JP2022158554A (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
JP2024025090A (ja) 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法
KR20210141954A (ko) 회로 접속용 접착제 필름 및 그 제조 방법, 회로 접속 구조체의 제조 방법, 및, 접착제 필름 수용 세트