KR20230103547A - 적층형 전자 부품 - Google Patents
적층형 전자 부품 Download PDFInfo
- Publication number
- KR20230103547A KR20230103547A KR1020210194498A KR20210194498A KR20230103547A KR 20230103547 A KR20230103547 A KR 20230103547A KR 1020210194498 A KR1020210194498 A KR 1020210194498A KR 20210194498 A KR20210194498 A KR 20210194498A KR 20230103547 A KR20230103547 A KR 20230103547A
- Authority
- KR
- South Korea
- Prior art keywords
- disposed
- electronic components
- stacked electronic
- insulating layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210194498A KR20230103547A (ko) | 2021-12-31 | 2021-12-31 | 적층형 전자 부품 |
| JP2022148804A JP2023099432A (ja) | 2021-12-31 | 2022-09-20 | 積層型電子部品 |
| US17/948,499 US12255022B2 (en) | 2021-12-31 | 2022-09-20 | Multilayer electronic component having insulating layer which includes fluorine-based organic material |
| CN202211565983.4A CN116387032A (zh) | 2021-12-31 | 2022-12-07 | 多层电子组件 |
| KR1020250001924A KR20250009003A (ko) | 2021-12-31 | 2025-01-07 | 적층형 전자 부품 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210194498A KR20230103547A (ko) | 2021-12-31 | 2021-12-31 | 적층형 전자 부품 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020250001924A Division KR20250009003A (ko) | 2021-12-31 | 2025-01-07 | 적층형 전자 부품 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230103547A true KR20230103547A (ko) | 2023-07-07 |
Family
ID=86975588
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210194498A Pending KR20230103547A (ko) | 2021-12-31 | 2021-12-31 | 적층형 전자 부품 |
| KR1020250001924A Pending KR20250009003A (ko) | 2021-12-31 | 2025-01-07 | 적층형 전자 부품 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020250001924A Pending KR20250009003A (ko) | 2021-12-31 | 2025-01-07 | 적층형 전자 부품 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12255022B2 (https=) |
| JP (1) | JP2023099432A (https=) |
| KR (2) | KR20230103547A (https=) |
| CN (1) | CN116387032A (https=) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4093188B2 (ja) | 2003-05-27 | 2008-06-04 | 株式会社村田製作所 | 積層セラミック電子部品とその実装構造および実装方法 |
| JP5768471B2 (ja) * | 2010-05-19 | 2015-08-26 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
| JP5375877B2 (ja) * | 2011-05-25 | 2013-12-25 | Tdk株式会社 | 積層コンデンサ及び積層コンデンサの製造方法 |
| JP2013026392A (ja) * | 2011-07-20 | 2013-02-04 | Tdk Corp | 電子部品及び電子部品の製造方法 |
| KR101462757B1 (ko) * | 2013-01-29 | 2014-11-17 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 내장된 인쇄회로기판 |
| JP5920304B2 (ja) * | 2013-09-25 | 2016-05-18 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| JP5920303B2 (ja) * | 2013-09-25 | 2016-05-18 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| US9390858B2 (en) * | 2014-04-03 | 2016-07-12 | Murata Manufacturing Co., Ltd. | Electronic component, method of manufacturing the same, and mount structure of electronic component |
| US20150364253A1 (en) * | 2014-06-12 | 2015-12-17 | Apple Inc. | Heel fillet capacitor with noise reduction |
| JP6156345B2 (ja) | 2014-12-10 | 2017-07-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP6592923B2 (ja) | 2015-03-20 | 2019-10-23 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| JP6395322B2 (ja) * | 2015-12-01 | 2018-09-26 | 太陽誘電株式会社 | 電子部品及びその製造方法、並びに回路基板 |
| JP6405329B2 (ja) * | 2016-02-26 | 2018-10-17 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP6512139B2 (ja) * | 2016-03-04 | 2019-05-15 | 株式会社村田製作所 | 電子部品の実装構造及びその電子部品の製造方法 |
| KR101823246B1 (ko) | 2016-06-21 | 2018-01-29 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
| JP7017893B2 (ja) * | 2017-09-25 | 2022-02-09 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR102620541B1 (ko) * | 2018-08-22 | 2024-01-03 | 삼성전기주식회사 | 커패시터 부품 |
| JP7247740B2 (ja) * | 2019-05-15 | 2023-03-29 | 株式会社村田製作所 | 電子部品の実装構造体及びその製造方法 |
| JP2022142213A (ja) * | 2021-03-16 | 2022-09-30 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
-
2021
- 2021-12-31 KR KR1020210194498A patent/KR20230103547A/ko active Pending
-
2022
- 2022-09-20 JP JP2022148804A patent/JP2023099432A/ja active Pending
- 2022-09-20 US US17/948,499 patent/US12255022B2/en active Active
- 2022-12-07 CN CN202211565983.4A patent/CN116387032A/zh active Pending
-
2025
- 2025-01-07 KR KR1020250001924A patent/KR20250009003A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116387032A (zh) | 2023-07-04 |
| US12255022B2 (en) | 2025-03-18 |
| KR20250009003A (ko) | 2025-01-16 |
| US20230215646A1 (en) | 2023-07-06 |
| JP2023099432A (ja) | 2023-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20211231 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20241126 Comment text: Request for Examination of Application |
|
| A107 | Divisional application of patent | ||
| PA0107 | Divisional application |
Comment text: Divisional Application of Patent Patent event date: 20250107 Patent event code: PA01071R01D |