KR20230103097A - 적층형 전자 부품 - Google Patents

적층형 전자 부품 Download PDF

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Publication number
KR20230103097A
KR20230103097A KR1020210193708A KR20210193708A KR20230103097A KR 20230103097 A KR20230103097 A KR 20230103097A KR 1020210193708 A KR1020210193708 A KR 1020210193708A KR 20210193708 A KR20210193708 A KR 20210193708A KR 20230103097 A KR20230103097 A KR 20230103097A
Authority
KR
South Korea
Prior art keywords
disposed
electronic components
stacked electronic
insulating layer
average size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020210193708A
Other languages
English (en)
Korean (ko)
Inventor
이충열
이유정
최형종
원광연
안소정
성우경
이강하
박명준
이종호
김준형
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020210193708A priority Critical patent/KR20230103097A/ko
Priority to US17/973,132 priority patent/US12224127B2/en
Priority to JP2022176172A priority patent/JP2023099456A/ja
Priority to CN202211706782.1A priority patent/CN116387028A/zh
Publication of KR20230103097A publication Critical patent/KR20230103097A/ko
Priority to KR1020250006196A priority patent/KR20250012185A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020210193708A 2021-12-31 2021-12-31 적층형 전자 부품 Withdrawn KR20230103097A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020210193708A KR20230103097A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
US17/973,132 US12224127B2 (en) 2021-12-31 2022-10-25 Multilayer electronic component
JP2022176172A JP2023099456A (ja) 2021-12-31 2022-11-02 積層型電子部品
CN202211706782.1A CN116387028A (zh) 2021-12-31 2022-12-29 多层电子组件
KR1020250006196A KR20250012185A (ko) 2021-12-31 2025-01-15 적층형 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020210193708A KR20230103097A (ko) 2021-12-31 2021-12-31 적층형 전자 부품

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020250006196A Division KR20250012185A (ko) 2021-12-31 2025-01-15 적층형 전자 부품

Publications (1)

Publication Number Publication Date
KR20230103097A true KR20230103097A (ko) 2023-07-07

Family

ID=86963847

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020210193708A Withdrawn KR20230103097A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
KR1020250006196A Pending KR20250012185A (ko) 2021-12-31 2025-01-15 적층형 전자 부품

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020250006196A Pending KR20250012185A (ko) 2021-12-31 2025-01-15 적층형 전자 부품

Country Status (4)

Country Link
US (1) US12224127B2 (enExample)
JP (1) JP2023099456A (enExample)
KR (2) KR20230103097A (enExample)
CN (1) CN116387028A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250035736A (ko) * 2023-09-06 2025-03-13 삼성전기주식회사 적층형 전자 부품

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178219A (ja) 2015-03-20 2016-10-06 株式会社村田製作所 電子部品およびその製造方法

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JPH07240302A (ja) 1994-02-25 1995-09-12 Hokuriku Electric Ind Co Ltd チップ状電子部品とその製造方法
JP5211970B2 (ja) 2008-09-17 2013-06-12 株式会社村田製作所 セラミック電子部品の製造方法
JP2013026392A (ja) * 2011-07-20 2013-02-04 Tdk Corp 電子部品及び電子部品の製造方法
JP2013058558A (ja) * 2011-09-07 2013-03-28 Tdk Corp 電子部品
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
JP5920303B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
KR101641574B1 (ko) * 2014-02-03 2016-07-22 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
US9390858B2 (en) * 2014-04-03 2016-07-12 Murata Manufacturing Co., Ltd. Electronic component, method of manufacturing the same, and mount structure of electronic component
JP6405329B2 (ja) * 2016-02-26 2018-10-17 太陽誘電株式会社 積層セラミックコンデンサ
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
KR102653205B1 (ko) * 2016-11-23 2024-04-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102789018B1 (ko) * 2016-12-22 2025-04-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR101901704B1 (ko) * 2017-02-22 2018-09-27 삼성전기 주식회사 적층 세라믹 전자 부품 및 그 실장 기판
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
JP6806035B2 (ja) * 2017-10-31 2021-01-06 株式会社村田製作所 積層セラミックコンデンサ
JP7241472B2 (ja) * 2018-06-01 2023-03-17 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7247740B2 (ja) * 2019-05-15 2023-03-29 株式会社村田製作所 電子部品の実装構造体及びその製造方法
JP7234974B2 (ja) * 2020-02-27 2023-03-08 株式会社村田製作所 積層セラミック電子部品
JP2022134972A (ja) * 2021-03-04 2022-09-15 株式会社村田製作所 積層セラミック電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178219A (ja) 2015-03-20 2016-10-06 株式会社村田製作所 電子部品およびその製造方法

Also Published As

Publication number Publication date
US12224127B2 (en) 2025-02-11
JP2023099456A (ja) 2023-07-13
KR20250012185A (ko) 2025-01-23
US20230215643A1 (en) 2023-07-06
CN116387028A (zh) 2023-07-04

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St.27 status event code: N-1-6-B10-B11-nap-PC1202