KR20230102937A - Test socket - Google Patents

Abstract

The present invention relates to a test socket, and more particularly, to a test socket for performing an electrical test by electrically connecting a device under test to a test apparatus, wherein an accommodation space for accommodating the device under test is provided therein, and a bottom A housing having an open hole in the center of the face; An anisotropic conductive sheet coupled to the housing to close the open hole of the housing, a conductive part in which a plurality of conductive particles are distributed in an elastic material at positions corresponding to the terminals of the device under test, and an insulating part supporting and insulating the conductive part. and an anisotropic conductive sheet comprising a frame plate supporting an edge of the insulating portion and contacting the bottom surface of the housing around the open hole; and a pusher cover coupled to the housing, and a first pressurizing portion extending downward from the pusher cover and pressing the device under test disposed on the anisotropic conductive sheet toward the anisotropic conductive sheet, downwardly from the pusher cover. It relates to a test socket including a pusher extending and having a second pressurizing part for pressurizing and contacting the frame plate of the anisotropic conductive sheet with the bottom surface of the housing so as to be airtight.

Description

Test socket {Test socket}

The present invention relates to a test socket electrically connecting a testing apparatus and a device under test.

In a semiconductor device inspection process, a test socket electrically connecting the semiconductor device and the inspection device is used in the related art. The test socket is mounted on the testing device and accommodates the semiconductor device to be tested. The test socket is in contact with the semiconductor device and the inspection device. The test socket transmits a test signal of the test device to the semiconductor device and a response signal of the semiconductor device to the test device.

In the process of performing such an electrical test, the upper device is accommodated in the upper socket, and the lower device is attached to the lower side of the upper socket, and moved to the test device to perform a predetermined electrical test.

After the pusher is airtightly coupled to the upper socket, a vacuum is applied through the pusher to move while adsorbing the lower device. However, since it is not easy to seal the lower device for adsorption, problems may occur in device pick-up.

In particular, not only is it not easy to control the air for adsorption, but also there is a problem that it is not easy to respond even when the semiconductor to be inspected is changed.

The present invention has been created to solve the above-described problems, and more particularly, has a technical object of providing a test socket that can be used universally for various devices without deteriorating vacuum suction power.

The test socket of the present invention for achieving the above object is a test socket for performing an electrical test by electrically connecting a device under test to a test device,

a housing having an accommodation space for accommodating a device under test therein and an open hole formed in the center of a bottom surface;

An anisotropic conductive sheet coupled to the housing to close the open hole of the housing,

A conductive part in which a plurality of conductive particles are distributed in an elastic material at each position corresponding to the terminal of the device under test, an insulating part supporting and insulating the conductive part, and supporting the edge of the insulating part on the bottom surface of the housing around the open hole. An anisotropic conductive sheet made of a frame plate in contact with; and

A pusher cover coupled to the housing;

a first pressing portion that extends downward from the pusher cover and presses a device to be inspected disposed on an upper portion of the anisotropic conductive sheet toward the anisotropic conductive sheet;

and a pusher extending downward from the pusher cover and including a second pressing portion for pressurizing and contacting the frame plate of the anisotropic conductive sheet with the bottom surface of the housing to ensure airtightness.

In the test socket, the frame plate may be in close contact with the bottom surface of the housing to ensure airtightness by means of an adhesive member.

In the test socket,

The second pressing part,

It may be disposed outside the first pressing part.

In the test socket,

The second pressing part,

It may protrude lower than the first pressing part.

In the test socket,

The frame plate may be made of a harder material than the insulator.

In the test socket,

A suction hole extending upward and downward to receive vacuum pressure may be formed at the center of the pressing unit.

In the test socket,

A suction groove concave upward may be formed on a bottom surface of the pressing portion extending from the suction hole to an edge of the first pressing portion.

The test socket,

An airtight pad for ensuring airtightness of the accommodation space may be disposed on a lower surface of the pusher cover that comes into contact with the upper surface of the housing.

In the test socket,

The anisotropic conductive sheet may be provided with a suction pad having an air circulation hole formed at a position corresponding to the suction hole.

In the test socket,

A position alignment protrusion protruding upward from the bottom surface is formed around the open hole of the housing,

A positioning hole fitted to the positioning alignment protrusion may be formed in the frame plate.

In the test socket, the anisotropic conductive sheet may be inserted into the accommodation space of the housing so that the lower surface of the frame plate may come into close contact with the upper surface of the housing.

The test socket of the present invention for achieving the above object,

As a test socket for performing an electrical test by electrically connecting the upper device to the test device,

A housing having an accommodation space for accommodating an upper device therein, a lower device disposed therein, and an open hole formed in the center of a bottom surface;

It is coupled to the housing to close the open hole of the housing,

a test connector electrically connecting the test device and the upper device, and having a frame plate provided at an edge and in close contact with a bottom surface around the open hole; and

and a pusher including a pusher cover coupled to the housing and a pressing means extending downward from the pusher cover and pressing the frame plate of the upper device and the test connector downward.

In the test socket,

The frame plate,

The pressing means includes a first pressing part in contact with the upper surface of the upper device and a second pressing part in contact with the upper surface of the frame plate,

The second pressing part may be disposed around the first pressing part.

In the test socket,

A step may be formed between the first pressing part and the second pressing part.

In the test socket,

A suction hole through which air is circulated is formed in the pusher,

A central hole may be formed at a position corresponding to the suction hole in the test connector.

In the test socket,

A suction pad surrounding the central hole is attached to the lower surface of the test connector, and the suction pad may come into contact with the upper surface of the lower device.

The test socket of the present invention for achieving the above object,

A test socket for performing an electrical test by electrically connecting a device under test to a test device,

a housing having an accommodation space for accommodating a device under test therein and an open hole formed in the center of a bottom surface;

A test connector coupled to the housing to close the open hole of the housing,

A conductive functional region in which a conductive portion extending in the thickness direction at a position corresponding to the terminal of the device under test is disposed in a state insulated from each other by an insulating portion, and a conductive functional region located around the conductive functional region and formed on the bottom surface around the open hole of the housing. a test connector consisting of an insulative peripheral area in contact; and

and a pusher including a pusher cover coupled to the housing and a pressing means extending downward from the pusher cover and pressurizing the outer edges of the device under test and the test connector downward.

In the test socket,

The test connector may be inserted into the accommodation space of the housing and adhered to the bottom surface of the housing.

In the test socket,

At least a portion of the insulating peripheral region may be made of the same silicone rubber as that of the insulating portion.

In the test socket,

At least one of the insulating portion and the insulating peripheral region of the conductive functional region may be made of polyimide resin or FR4.

In the test socket,

The pressure means,

A first pressing part in contact with the upper surface of the device under test and a second pressing part in contact with the upper surface of the insulating peripheral region,

The second pressing part may be disposed around the first pressing part.

The test socket of the present invention has an advantage in that airtightness is improved because the pusher presses and adheres the frame plate of the anisotropic conductive sheet to the bottom surface of the housing.

In the test socket of the present invention, since the frame plate of the anisotropic conductive sheet is in close contact with the bottom surface of the housing, airtightness is improved, and thus the lower device can be stably picked up.

The test socket of the present invention has the advantage of improving airtightness since the gap between the housing and the pusher can be blocked by the airtight pad.

In the test socket of the present invention, since the pusher simultaneously presses the device to be tested and the anisotropic conductive sheet, airtightness is improved.

The test socket of the present invention has the advantage of being able to prevent back push of the conductive rubber sheet in advance by using a pusher even when a conductive rubber sheet is applied to the lower socket.

1 is a perspective view from above of a test socket according to an exemplary embodiment;
2 is a perspective view of the test socket of FIG. 1 viewed from below;
3 is an exploded perspective view of the test socket of FIG. 1 viewed from above;
4 is an exploded perspective view of the test socket of FIG. 1 viewed from below;
5 is a perspective view of the anisotropic conductive sheet of the test socket according to the present embodiment.
6 is a perspective view showing a coupled state of an anisotropic conductive sheet and a housing of a test socket according to the present embodiment;
Figure 7 is a combined perspective view of Figure 6;
8 is a perspective view showing a contact state between a pusher of a test socket and an anisotropic conductive sheet according to the present embodiment;
9 is a view showing an internal view of a test socket in a state in which a device under test is not accommodated;
10 is a diagram illustrating an internal view of a test socket in a state in which a device under test is demanded;
11 to 16 are views sequentially showing how a test socket adsorbs a lower device and moves to a testing device;
17 is an exploded perspective view of a test socket according to a second embodiment of the present invention;
18 is a view showing the inside of FIG. 17;
19 is a cross-sectional view of a test socket according to a third embodiment of the present invention.
20 is a cross-sectional view of a test socket according to a fourth embodiment of the present invention.
21 is a partially exploded perspective view of a test socket according to a fifth embodiment of the present invention;
22 is a combined perspective view of FIG. 21;

Embodiments of the present disclosure are illustrated for the purpose of explaining the technical idea of the present disclosure. The scope of rights according to the present disclosure is not limited to the specific description of the embodiments or these embodiments presented below.

All technical terms and scientific terms used in this disclosure have meanings commonly understood by those of ordinary skill in the art to which this disclosure belongs, unless otherwise defined. All terms used in this disclosure are selected for the purpose of more clearly describing the disclosure and are not selected to limit the scope of rights according to the disclosure.

Expressions such as "comprising", "including", "having", etc. used in this disclosure are open-ended terms that imply the possibility of including other embodiments, unless otherwise stated in the phrase or sentence in which the expression is included. (open-ended terms).

Expressions in the singular form described in this disclosure may include plural meanings unless otherwise stated, and this applies equally to expressions in the singular form described in the claims.

Expressions such as "first" and "second" used in the present disclosure are used to distinguish a plurality of elements from each other, and do not limit the order or importance of the elements.

In the present disclosure, when an element is referred to as being “connected” or “connected” to another element, that element is directly connectable or connectable to the other element, or a new It should be understood that it can be connected or connected via other components.

The direction indicator of “upward” used in the present disclosure is based on the direction in which the test socket is located relative to the testing device, and the direction indicator of “downward” means the opposite direction of the upward direction. It should be understood that the direction designator of “vertical direction” used in the present disclosure includes an upward direction and a downward direction, but does not mean a specific one of the upward and downward directions.

As used in the present disclosure, "device under test" means a semiconductor device for testing, "upper device" means a device under test disposed in the test socket of the present invention, and "lower device" means a device under test. It means that it is adsorbed to the test socket and transported to the test device.

Embodiments are described with reference to examples shown in the accompanying drawings. In the accompanying drawings, identical or corresponding elements are given the same reference numerals. In addition, in the description of the following embodiments, overlapping descriptions of the same or corresponding components may be omitted. However, omission of a description of a component does not intend that such a component is not included in an embodiment.

Embodiments described below and examples shown in the accompanying drawings relate to test sockets for electrical connection between a testing apparatus and a device under test. The test socket of the embodiments may be used for electrical connection between a test device and a device under test when testing a device under test. For example, the test socket of the embodiments is used to electrically test a plurality of devices simultaneously in a later process during the manufacturing process of the device under test, one device under test is installed with a pusher in the test socket, , another device to be tested is mounted and placed on the side of the testing device at the lower side of the test socket.

Since an electrical test can be performed on a plurality of devices under test using one test socket, the number of electrical tests can be reduced. However, an example of a test to which the test socket of the embodiments is applied is not limited to the aforementioned POP test.

1 to 16 illustrate examples in which a test socket according to an exemplary embodiment is applied. 1 to 16 schematically show a test socket, a test device, and a device under test in contact with the test socket, and their shapes shown in FIG. 1 are merely exemplary.

A test socket according to an embodiment electrically connects a device under test to a test device. For testing of the device under test, the test socket is brought into contact with the testing device and the device under test, respectively, to electrically connect the testing device and the device under test with each other. The test socket accommodates one of the devices under test therein, and the other device under test moves to the test apparatus in a state of adsorption. The inspection of the device to be tested is performed by the inspection device via the test socket.

The device under test may be a semiconductor package, but is not limited thereto. A semiconductor package is a semiconductor device in which a semiconductor IC chip, a plurality of lead frames, and a plurality of terminals are packaged in a hexahedral shape using a resin material. The semiconductor IC chip may be a memory IC chip or a non-memory IC chip. As the terminal, a pin, a solder ball or the like can be used. In this embodiment, a device under test placed in a test socket among devices under test may be a memory chip, and such a memory chip may be provided for electrical testing together with a PCB substrate. In addition, the device to be tested attached to the outside of the test socket may be a non-memory chip such as an AP, and the memory chip and the non-memory chip may be vertically stacked after an electrical test is performed to implement a 3D package.

In one embodiment, a PCB board is provided on the lower side of the upper device disposed inside the housing. The PCB substrate has predetermined conductive patterns formed on upper and lower surfaces, and is interposed between the upper device and the anisotropic conductive sheet to electrically connect the terminal of the upper device and the conductive portion of the anisotropic conductive sheet to each other. An air hole is formed in the center of the PCB board to form an air passage between the pusher and the suction pad.

The testing apparatus may be configured to perform a test of a device under test. The test device has a test board on which a test socket is mounted. The test board may have a plurality of terminals capable of outputting electrical test signals and receiving response signals. A terminal of the device under test is electrically connected to a terminal of a corresponding test board through a test socket. That is, the test socket electrically connects the terminal of the device under test and the terminal of the test board corresponding thereto in the vertical direction (VD), and transmits an electrical test signal and a response signal between the terminal and the test board.

A test socket according to an embodiment of the present invention includes a housing, an anisotropic conductive sheet, and a pusher. Hereinafter, for convenience, among the devices under test, a device under test disposed inside the test socket is referred to as an "upper device", and a device to be tested adsorbed by the test socket is referred to as a "lower device".

The housing 20 has an accommodation space 20a for accommodating the upper device 60 therein, and an open hole 223a is formed in the center of the bottom surface 223. The housing 20 includes an upper body 21 having a square frame shape and a lower body 22 extending downward from the upper plate and having an open hole 223a formed in the bottom surface 223.

The central hole 211 formed in the center of the upper body 21 has a square shape having the corresponding square size and shape of the upper device 60. In the upper body 21, a seating groove 212 recessed from the upper surface is formed around the center hole 211. The seating hole is a portion where an airtight pad 23 for maintaining airtightness between the pusher 40 and the housing 20 is seated when the pusher 40 is coupled to the housing 20 . When the pusher 40 is coupled to the housing 20 in a state in which the airtight pad 23 has a rectangular edge shape and a shape corresponding to the seating groove 212, the airtight pad 23 is seated thereon. In the housing 20 and the pusher 40 can be coupled to ensure airtightness.

The lower body 22 includes a first body portion 221 having a rectangular border shape extending downward from the bottom surface 223 of the upper body 21 in a state of entering the inside, and the first body portion 221 It consists of a second body portion 222 protruding outward from the center of.

The accommodation space is formed by combining the inner spaces of the upper body 21 and the lower body 22, and has a size capable of accommodating the upper device 60. In the inner wall of the housing 20, a concave space extending in the first horizontal direction HD1 and the second horizontal direction HD2 is provided in the middle, and the second pressing part 43 is guided into the concave space. It is movable in the vertical direction (VD) direction.

The bottom surface 223 of the lower body 22 as a periphery of the open hole has a shape corresponding to the frame plate 33 of the anisotropic conductive sheet 30, so that the frame plate 33 of the anisotropic conductive sheet 30 It is configured to be seated on the bottom surface 223 of the housing 20. Alignment protrusions 2231 fitted into alignment holes 331 of the frame plate 33 protrude from the bottom surface 223 of the housing 20 .

When the anisotropic conductive sheet 30 is seated on the bottom surface 223 of the housing 20, the alignment holes 331 of the frame plate 33 are alignment protrusions on the bottom surface 223 of the housing 20. 2231, the anisotropic conductive sheet 30 can be seated in an accurate position inside the housing 20, the terminal of the PCB substrate 61 disposed below the upper device 60, and the anisotropic conductive sheet It allows the conductive parts 31 of (30) to be in precise contact with each other.

The anisotropic conductive sheet 30 is coupled to the housing 20 to close the open hole of the housing 20 . The anisotropic conductive sheet 30 supports and insulates the conductive portion 31 in which a plurality of conductive particles are distributed in an elastic material at each position corresponding to the terminal of the upper device 60, and the conductive portion 31. It consists of a portion 32 and a frame plate 33 that supports the edge of the insulating portion 32 and contacts the bottom surface 223 of the housing 20 around the open hole.

Most of the anisotropic conductive sheet 30 may be made of an elastic polymer material, and the anisotropic conductive sheet 30 may have elasticity in the vertical direction (VD) and the horizontal direction (HD). When an external force is applied to the anisotropic conductive sheet 30 downward in the vertical direction VD, the anisotropic conductive sheet 30 may be elastically deformed in the downward direction and the horizontal direction HD. The external force may be generated by pushing the upper device 60 toward the anisotropic conductive sheet 30 by the pusher 40 . Due to this external force, the terminal of the upper device 60 and the anisotropic conductive sheet 30 may contact each other in a vertical direction. When the external force is removed, the anisotropic conductive sheet 30 can be restored to its original shape.

The anisotropic conductive sheet 30 includes a plurality of conductive parts 31 , and the conductive parts 31 contact an electrode of a PCB disposed inside the housing 20 in a vertical direction (VD) to electrically connect them. The conductive part 31 contacts the lower terminal of the PCB disposed inside the housing 20 at its upper end and contacts the upper terminal of the lower device 62 disposed outside the housing 20 at its lower end.

Accordingly, the conductive section 31 conducts conduction in the vertical direction between terminals corresponding thereto. Therefore, the test signal of the test device can be transferred to the upper device 60 via the PCB substrate 61 through the conductive portion 31, and the response signal of the upper device 60 can be transmitted from the terminal to the PCB substrate 61, It can be transferred to the test board via the conductive part 31, the lower device 62 and the lower socket 63.

The conductive part 31 may have a cylindrical shape extending in the vertical direction VD. For such a cylindrical shape, the diameter at the middle may be smaller than the diameters at the top and bottom. The planar arrangement of the conductive parts 31 may vary according to the planar arrangement of the terminals of the PCB substrate 61 and the terminals of the upper device 60 . In one embodiment, the conductive parts 31 may be arranged in a pair of matrix form, but is not limited to such an arrangement form.

In one embodiment, the anisotropic conductive sheet 30 includes an insulating part 32 that separates and insulates the plurality of conductive parts 31 in the horizontal direction HD. In addition, the anisotropic conductive sheet 30 is coupled to the insulating portion 32 along the circumference of the insulating portion 32 and includes a frame plate 33 supporting the insulating portion 32 .

The insulating portion 32 may form a rectangular elastic region of the anisotropic conductive sheet 30 . The plurality of conductive parts 31 are spaced apart and insulated from each other at equal or unequal intervals in the horizontal direction HD by the insulating part 32 . The insulating portion 32 is formed as one elastic body, and a plurality of conductive portions 31 are embedded in the insulating portion 32 in the thickness direction of the insulating portion 32 (vertical direction VD). The insulating portion 32 made of an elastic body maintains the conductive portion 31 in its shape. The insulating part 32 is made of an elastic polymer material and has elasticity in the vertical direction (VD) and the horizontal direction (HD).

In detail, the insulating portion 32 may be made of a hardened silicone rubber material. For example, the insulating portion 32 may be formed by injecting liquid silicone rubber into a molding mold for molding the anisotropic conductive sheet 30 and curing it. As the liquid silicone rubber material for forming the insulating portion 32, addition-type liquid silicone rubber, condensation-type liquid silicone rubber, liquid silicone rubber containing a vinyl group or a hydroxyl group, or the like can be used. As a specific example, the liquid silicone rubber material may include dimethyl silicone raw rubber, methylvinyl silicone raw rubber, methylphenylvinyl silicone raw rubber, and the like. In addition, as a silicone rubber material constituting the insulating part 32, a silicone rubber material having excellent heat resistance may be used so that the test socket 10 according to an embodiment may be applied to a POP test.

The conductive part 31 includes a plurality of conductive particles that are conductively contacted in the vertical direction (VD). The conductive particles may be formed by coating the surface of the core particles with a highly conductive metal. The core particles may be made of a metal material such as iron, nickel, or cobalt, or a resin material having elasticity. As the highly conductive metal coated on the surface of the core particle, gold, silver, rhodium, platinum, chromium or the like can be used. Conductive particles that are conductively contacted in the vertical direction form a conductive path of the conductive part 31 . For example, the conductive particles may be maintained in the shape of the conductive portion 31 by the elastic polymer material constituting the insulating portion 32 .

The frame plate 33 has a square frame shape and is formed by being connected along the circumference of the insulating part 32 . The frame plate 33 may be made of a harder material than the insulating part 32 .

By using such a hard material, the obtained frame plate 33 does not deform following the deformation of the conductive portion 31 in the plane direction, and as a result, the deformation of the conductive portion 31 in the plane direction is reliably prevented. can be suppressed.

Specific examples of the hard material constituting the frame plate 33 include stainless, iron, copper, nickel, chromium, cobalt, manganese, molybdenum, indium, lead, titanium, tungsten, aluminum, gold, silver, or two or more of these. Metal materials such as alloys, resin materials such as polyimide, polyester, and polyamide, composite resin materials such as glass fiber-reinforced epoxy resins, glass fiber-reinforced polyester resins, and glass fiber-reinforced polyimide resins, polyphenylene sulphate Feed, polyether ether ketone, aramid fiber, fluorine fiber, etc. are mentioned.

In one embodiment, the anisotropic conductive sheet 30 is detachably mounted on the top of the bottom surface 223 of the housing 20 . According to one embodiment, mating elements having complementary shapes are provided to them, respectively, so that positioning between the anisotropic conductive sheet 30 and the housing 20 can be easily performed.

That is, according to one embodiment, in the anisotropic conductive sheet 30, the frame plate 33 is provided with alignment holes 331, and the bottom surface 223 of the housing 20 is provided with alignment holes 331 and complements. It has a shape and is provided with a position alignment protrusion 2231 that can be matched with the alignment hole 331. Due to the matching between the alignment hole 331 and the alignment protrusion 2231, the anisotropic conductive sheet 30 can be detachably coupled to the bottom surface 223 of the housing 20, and the anisotropic conductive sheet Alignment between the conductive portion 31 of (30) and the terminal of the upper device 60 can be made easily and precisely. The matching element between the anisotropic conductive sheet 30 and the housing 20 is not limited to the alignment hole 331 and the alignment protrusion, and it is also possible that the frame has protrusions and the housing 20 has grooves.

An adhesive member 50 is attached to the lower surface of the frame plate 33 to be in close contact with the bottom surface 223 of the housing 20 to ensure airtightness. When vacuum pressure is applied to the inside of the accommodation space, the adhesive member 50 passes through the open hole on the bottom of the housing 20 and prevents air from leaking. That is, even if vacuum pressure is applied through the pusher 40, when air leaks through the gap between the bottom surface 223 of the housing 20 and the anisotropic conductive sheet 30, the vacuum pressure does not work reliably. Due to this, there is room for problems in pickup of the lower device 62 that is vacuum-adsorbed on the lower side of the housing 20, and the adhesive member 50 is provided to prevent such air leakage. Although an adhesive tape may be used as the adhesive member 50, it is not limited thereto and various materials may be used as long as they can attach two objects airtightly.

As the center of the anisotropic conductive sheet 30, a central hole 34 is formed at a position corresponding to the suction hole 44 of the pusher 40. Around the center hole 34, ring-shaped suction pads 35 made of a soft material are provided on the upper and lower surfaces of the anisotropic conductive sheet 30, respectively. An air distribution hole 351 is formed in the center of the suction pad 35, and the air distribution hole 351 functions as an air passage for vacuum adsorption of the lower device 62.

The suction pad 35 may be made of a silicone rubber material or a combination of silicon rubber and a film, and the suction pad 35 is attached to the periphery of the central hole 34 by double-sided tape or other member having adhesive power. it becomes The suction pad 35 attached to the upper surface of the anisotropic conductive sheet 30 is in contact with the PCB substrate 61 installed at the bottom of the upper device 60, and the suction pad 35 attached to the lower surface of the anisotropic conductive wire sheet It is configured to make close contact with the upper surface of the lower device 62 disposed on the lower side of the housing 20.

The pusher 40 is in contact with the upper surface of the upper device 60, which is the upper device 60 inside the housing 20, and presses the upper device 60 downward to form an upper device 60 and a lower device ( 62) is to be in close contact with the terminals of the test socket 10 and the pads of the test device 70 to improve electrical contact performance.

The pusher 40 includes a pusher cover 41 coupled to the housing 20, a first pressing portion 42 extending downward from the pusher cover 41 and contacting the upper device 60, It is configured to include a second pressing portion 43 extending downward from the pusher cover 41 and pressing the frame plate 33 of the anisotropic conductive sheet 30 .

The pusher cover 41 is formed in the shape of a square plate as a whole, and a suction hole 44 to which an air hose for applying vacuum pressure is connected is formed in the center. An O-ring 411 is installed around the suction hole 44 so that the air hose and the pusher cover 41 can be airtightly connected to prevent air leakage.

The first pressing portion 42 extends downward from the pusher cover 41 and has a substantially hexahedral shape. The first pressing part 42 may be coupled to the pusher cover 41 by bolts or the like. A suction hole 44 is formed in the center of the first pressurizing part 42 to apply vacuum pressure, and air passes through the suction hole 44 to escape to the outside.

The lower surface of the first pressing part 42 may have a flat planar shape so as to be in surface contact with the upper surface of the upper device 60 . A suction groove 421 extending in the first horizontal direction HD1 and the second horizontal direction HD2 and having a downward concave shape is formed around the suction hole 44 on the lower surface of the first pressing part 42. And the suction groove 421 performs the function of an air passage through which air flows when the pressing part contacts the upper surface of the upper device 60. The air is movable along the suction hole 44 and the suction groove 421 .

The second pressing part 43 protrudes from the center of the side surface of the first pressing part 42 in the first horizontal direction HD1 and the second horizontal direction HD2, and is formed on the lower side of the pusher cover 41. It extends in the vertical direction (VD) to have a bar column shape. The second pressing portion 43 extends downward and protrudes from the first pressing portion 42, passes through the upper device 60, and contacts the frame plate 33 of the anisotropic conductive sheet 30 to contact the frame plate. (33) has a shape that can be brought into contact with the bottom surface 223 of the housing 20 by pressing.

Although airtightness of the anisotropic conductive sheet 30 is secured on the bottom surface 223 of the housing 20 by the adhesive member 50, the second pressing part 43 additionally secures the frame of the anisotropic conductive sheet 30. By pressing toward the bottom surface 223 of the housing 20, airtightness can be additionally secured, and even when the adhesive strength of the adhesive member 50 is weakened due to long-time use, the anisotropic conductive sheet 30 and the housing 20 It can also prevent the deterioration of the sealing ability between them. In addition, even when the area of the upper device 60 is large and a large vacuum pressure is required, since the sealing force is improved by the pressing force of the second pressing unit 43, air leakage is prevented.

The operation of the test socket 10 according to the present invention will be described with reference to FIGS. 11 to 16 .

An air hose (not shown) is connected to the top of the pusher 40 in a state where the upper device 60 and the PCB board 61 are installed in the test socket 10 where the pusher 40 and the housing 20 are combined. When pneumatic pressure is applied after that, as shown in FIG. 11 , the vacuum pressure first acts on the suction hole 44 and the suction groove 421 of the pusher 40 . (The area marked in black is the space where the vacuum pressure acts) If the air pressure is applied additionally thereafter, as shown in FIG. 12, the vacuum pressure is applied to the peripheral space of the upper device 60. After that, the vacuum pressure is also applied to the space between the terminal of the upper device 60 and the PCB substrate 61, and the vacuum pressure is applied to the suction pad. After that, as shown in FIG. 14 , the suction pad comes into contact with the upper surface of the lower device 62 to be sucked, and the lower device 62 is sucked. At this time, since terminals are disposed on the upper surface of the lower device 62, the terminals constitute a state in contact with the conductive portion 31 of the anisotropic conductive sheet 30.

Subsequently, as shown in FIG. 15 , the test socket 10 moves toward the testing device 70 . At this time, a lower socket 63 is disposed on the upper part of the inspection device 70, and a connector 631 for inspection is disposed on the lower socket 63. After that, as shown in FIG. 16, after the test socket 10 descends and electrically connects the lower terminal of the lower device 62 to the test connector, a predetermined electrical test is performed.

The test socket of the present invention has the following advantages.

First, since an anisotropic conductive sheet is inserted into the test socket instead of a pogo pin, there is no fear of air leakage, enabling a stable pick-up operation.

In addition, since the frame of the anisotropic conductive sheet is adhered to the bottom surface of the housing in an airtight manner by an adhesive member, the sealing performance is improved with a simple structure, thereby reducing manufacturing costs.

In addition, since the pusher presses the frame of the anisotropic conductive sheet in addition to the upper device so that the frame of the anisotropic conductive sheet is pressed against the bottom surface of the housing, air leakage through the gap between the anisotropic conductive sheet and the housing is prevented and the pick-up ability is lowered prevent that

The test socket of the present invention can also be implemented as follows.

In the above embodiment, the installation of the PCB board between the upper device and the anisotropic conductive sheet has been exemplified in the test socket, but it is not limited thereto, and the test socket of the second embodiment shown in FIGS. 17 and 18 does not have a PCB board. In this state, the pick-up operation is possible even in a state where the upper device is in direct contact with the anisotropic conductive sheet.

In a conventional test socket, an electrical test is performed with a device under test and a PCB board coupled to each other. In some cases, when testing an object with only a device without a PCB, the conventional technology structure is airflow A problem occurred in controlling.

In contrast, the test socket 10' according to the second embodiment of the present invention has a structure capable of reliably preventing air leakage by using a pusher 40', thereby preventing air leakage even in the absence of a PCB board. There is no problem, regardless of the package type, the length of the first pressing part 42' and the second pressing part 43' of the pusher 40' in the vertical direction (VD) is lengthened, enabling pickup operation even without a PCB. There is an advantage of doing so, and accordingly, there is an advantage of being able to use the test socket universally regardless of the type of device.

In particular, since the first pressing part 42' and the second pressing part 43' of the pusher 40' are detachably installed with respect to the pusher cover 41', the first pressing part 42' and the second pressing part 43' are installed according to the type of the device under test. There is an advantage in that only the length or size of the second pressing part and the second pressing part can be used in combination with the pusher cover to respond to various devices.

19 illustrates a test socket according to a third embodiment of the present invention. The test socket 10″ according to the third embodiment is different from the above-described embodiment in the shape of the test connector. In the third embodiment, in the test connector 10″, the conductive portion 31″ extending in the thickness direction is disposed in a state insulated from each other by the insulating portion 32″ at a position corresponding to the terminal of the device under test. It consists of a conductive functional region 30a″, which is located around the conductive functional region 30a″, and an insulating peripheral region 30b″ that is in contact with the bottom surface around the open hole of the housing 20″.

The conductive functional region 30a″ serves as a conductive path for receiving an electrical signal from the inspection device and transferring it to the upper device, and is disposed to cross the open hole. In the conductive functional region 30a'', a plurality of conductive parts 31'' exhibiting conductivity in the thickness direction are separated from each other by an insulating part 32'' and insulated and supported. The conductive functional region 30a″ is formed in the form of a single square sheet.

The insulating peripheral region 30b" is located around the conductive functional region 30a" and connected to the conductive functional region 30a", and has a conductive function so that the conductive functional region 30a" can be located in an open hole. It performs the function of supporting the area 30a″.

In the test socket according to the third embodiment, the insulating peripheral region 30b″ is made of any material selected from silicone rubber, polyimide resin, or FR4, and is integrally connected to the conductive functional region to form one sheet body. . That is, the insulating portion 32″ of the conductive functional area and the insulating peripheral area 30b″ may be composed of a single sheet made of one material. At this time, the insulating peripheral region 30b″ is pressed by the second pressing portion 43″ of the pusher and comes into close contact with the bottom surface of the housing 20″.

20 shows a test socket according to the fourth embodiment. In the test socket 10''' according to the fourth embodiment, the test connector 30''' has an insulating peripheral region 30b''' made of silicone rubber sheet 34, unlike the third embodiment. ''') is reinforced with a film 35''' made of polyimide resin or FR4.

On the other hand, it is not limited thereto, and it is possible that the insulating peripheral region is made of only polyimide resin or FR4 without a sheet made of silicone rubber. In addition, the material of the insulating peripheral region 30b″ is polyimide or FR4, which is only an example, and any insulating material capable of supporting the conductive functional region 30a″″ can be used.

The insulating peripheral region 30b''' reinforced by the film 35''' can firmly support the conductive functional region 30a'''.

21 and 22 show a test socket according to a fifth embodiment. In the test socket according to the first embodiment, the alignment of the test connector and the housing is exemplified by the alignment protrusion and the alignment hole, but is not limited thereto.

That is, in the test connector 30'''', when the insulating functional area and the conductive functional area are integrally composed of a single sheet, there are no separate alignment holes, and protrusions protrude outward from the four side surfaces of the insulating functional area. It is also possible to form and align the protrusions with the guide grooves 21a'''' formed on the inner surface of the upper body 21'''' of the housing 20''''. In addition, position alignment of the connector for inspection and the housing may be implemented in various forms.

Although the present invention has been described in detail with preferred embodiments above, the present invention is not necessarily limited to these embodiments and modifications, and can be variously modified without departing from the technical spirit of the present invention.

10...test socket 20...housing
21 ... upper body 211 ... center hole
212... seating groove 22... lower body
221... first body 222... second body
223... bottom surface 2231... position alignment protrusion
23 ... airtight pad 30 ... anisotropic conductive sheet
31 ... conductive part 32 ... insulated part
33 ... frame plate 331 ... alignment hole
34 ... Central hole 35 ... Suction pad
351 ... air distribution hole 40 ... pusher
41... pusher cover 42... first pressing part
421 ... suction groove 43 ... second pressing part
44 ... suction hole 50 ... adhesive member
60 ... upper device 61 ... PCB board
62 ... Lower device 70 ... Inspection device

Claims (21)

A test socket for performing an electrical test by electrically connecting a device under test to a test device,
a housing having an accommodation space for accommodating a device under test therein and an open hole formed in the center of a bottom surface;
An anisotropic conductive sheet coupled to the housing to close the open hole of the housing,
A conductive part in which a plurality of conductive particles are distributed in an elastic material at each position corresponding to the terminal of the device under test, an insulating part supporting and insulating the conductive part, and supporting the edge of the insulating part and extending to the bottom surface of the housing around the open hole. An anisotropic conductive sheet made of a frame plate in contact with; and
A pusher cover coupled to the housing;
a first pressing portion that extends downward from the pusher cover and presses a device to be inspected disposed on an upper portion of the anisotropic conductive sheet toward the anisotropic conductive sheet;
and a pusher extending downward from the pusher cover and including a second pressing portion pressurizing and contacting the frame plate of the anisotropic conductive sheet with the bottom surface of the housing to ensure airtightness. According to claim 1,
The test socket, characterized in that the frame plate is in close contact with the bottom surface of the housing to ensure airtightness by an adhesive member. According to claim 1,
The second pressing part,
A test socket, characterized in that disposed outside the first pressing part. According to claim 1 or 3,
The second pressing part,
A test socket, characterized in that protrudes downward from the first pressing portion. According to claim 1,
The test socket, characterized in that the frame plate is made of a harder material than the insulator. According to claim 1,
A test socket, characterized in that a suction hole extending in the vertical direction to receive a vacuum pressure is formed at the center of the first pressurizing part. According to claim 6,
A test socket, characterized in that a suction groove concave upward is formed on the bottom surface of the first pressing part to extend from the suction hole to an edge of the first pressing part. According to claim 1,
A test socket, characterized in that an airtight pad for securing airtightness of the receiving space is disposed on a lower surface of the pusher cover in contact with the upper surface of the housing. According to claim 6,
A test socket, characterized in that the anisotropic conductive sheet is provided with a suction pad having an air circulation hole formed at a position corresponding to the suction hole. According to claim 1,
A position alignment protrusion protruding upward from the bottom surface is formed around the open hole of the housing,
The test socket, characterized in that the frame plate is formed with alignment holes fitted to the alignment protrusions. According to claim 1,
The test socket, characterized in that the anisotropic conductive sheet is inserted into the receiving space of the housing and the lower surface of the frame plate is in close contact with the upper surface of the housing. As a test socket for performing an electrical test by electrically connecting the upper device to the test device,
A housing having an accommodation space for accommodating an upper device therein and an open hole formed in the center of the bottom surface;
It is coupled to the housing to close the open hole of the housing,
a test connector electrically connecting the test device and the upper device, and having a frame plate provided at an edge and in close contact with a bottom surface around the open hole; and
and a pusher including a pusher cover coupled to the housing and a pressing means extending downward from the pusher cover and pressurizing the frame plate of the upper device and the test connector downward. According to claim 12,
The pressing means includes a first pressing part in contact with the upper surface of the upper device and a second pressing part in contact with the upper surface of the frame plate,
The test socket, characterized in that the second pressing portion is disposed around the first pressing portion. According to claim 13,
A test socket, characterized in that a step is formed between the first pressing part and the second pressing part. According to claim 12,
A suction hole through which air is circulated is formed in the pusher,
A test socket, characterized in that a central hole is formed at a position corresponding to the suction hole in the test connector. According to claim 15,
A test socket, characterized in that a suction pad surrounding the central hole is attached to the lower surface of the test connector, and the suction pad contacts the upper surface of the lower device. A test socket for performing an electrical test by electrically connecting a device under test to a test device,
a housing having an accommodation space for accommodating a device under test therein and an open hole formed in the center of a bottom surface;
A test connector coupled to the housing to close the open hole of the housing,
A conductive functional region in which a conductive portion extending in the thickness direction at a position corresponding to the terminal of the device under test is disposed in a state insulated from each other by an insulating portion, and a conductive functional region located around the conductive functional region and formed on the bottom surface around the open hole of the housing. a test connector consisting of an insulative peripheral area in contact; and
A test socket comprising: a pusher including a pusher cover coupled to the housing and a pressurizing means extending downward from the pusher cover and pressurizing the outer edges of the device under test and the test connector downward. According to claim 17,
The test socket, characterized in that the test connector is inserted into the receiving space of the housing and in close contact with the bottom surface of the housing. According to claim 17,
The test socket according to claim 1 , wherein at least a portion of the insulating peripheral region is made of the same silicone rubber as that of the insulating portion. According to claim 17,
At least one of the insulation portion and the insulating peripheral area of the conductive functional area is made of polyimide resin or FR4. According to claim 17,
The pressure means,
A first pressing part in contact with the upper surface of the device under test and a second pressing part in contact with the upper surface of the insulating peripheral region,
The test socket, characterized in that the second pressing portion is disposed around the first pressing portion.

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