KR20230085203A - 처리액 순환 방법, 및 기판 처리 방법 - Google Patents

처리액 순환 방법, 및 기판 처리 방법 Download PDF

Info

Publication number
KR20230085203A
KR20230085203A KR1020237016562A KR20237016562A KR20230085203A KR 20230085203 A KR20230085203 A KR 20230085203A KR 1020237016562 A KR1020237016562 A KR 1020237016562A KR 20237016562 A KR20237016562 A KR 20237016562A KR 20230085203 A KR20230085203 A KR 20230085203A
Authority
KR
South Korea
Prior art keywords
treatment liquid
pressure
circulation
pipe
processing liquid
Prior art date
Application number
KR1020237016562A
Other languages
English (en)
Korean (ko)
Inventor
도모미 히구치
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20230085203A publication Critical patent/KR20230085203A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
KR1020237016562A 2021-02-26 2021-10-22 처리액 순환 방법, 및 기판 처리 방법 KR20230085203A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021031079A JP2022131885A (ja) 2021-02-26 2021-02-26 処理液循環方法、及び、基板処理方法
JPJP-P-2021-031079 2021-02-26
PCT/JP2021/039088 WO2022180928A1 (ja) 2021-02-26 2021-10-22 処理液循環方法、及び、基板処理方法

Publications (1)

Publication Number Publication Date
KR20230085203A true KR20230085203A (ko) 2023-06-13

Family

ID=83047932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237016562A KR20230085203A (ko) 2021-02-26 2021-10-22 처리액 순환 방법, 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP2022131885A (zh)
KR (1) KR20230085203A (zh)
CN (1) CN116868315A (zh)
TW (1) TWI797826B (zh)
WO (1) WO2022180928A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024042242A (ja) * 2022-09-15 2024-03-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、フィルタの気泡除去方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041039A (ja) 2017-08-28 2019-03-14 東京エレクトロン株式会社 液処理装置および液処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6605394B2 (ja) * 2016-05-17 2019-11-13 東京エレクトロン株式会社 基板液処理装置、タンク洗浄方法及び記憶媒体
JP6762184B2 (ja) * 2016-09-26 2020-09-30 株式会社Ｓｃｒｅｅｎホールディングス 回収配管洗浄方法および基板処理装置
JP6916633B2 (ja) * 2017-02-24 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041039A (ja) 2017-08-28 2019-03-14 東京エレクトロン株式会社 液処理装置および液処理方法

Also Published As

Publication number Publication date
TW202234496A (zh) 2022-09-01
JP2022131885A (ja) 2022-09-07
WO2022180928A1 (ja) 2022-09-01
CN116868315A (zh) 2023-10-10
TWI797826B (zh) 2023-04-01

Similar Documents

Publication Publication Date Title
US10504718B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
TWI553888B (zh) 基板處理裝置及基板處理方法
US10658203B2 (en) Substrate processing apparatus and processing cup cleaning method
KR102057383B1 (ko) 처리액 공급 장치, 기판 처리 장치, 및 처리액 공급 방법
US20180138058A1 (en) Substrate processing apparatus, substrate processing method, and storage medium
KR102591343B1 (ko) 액처리 장치 및 액처리 방법
JP2007123393A (ja) 基板処理装置
KR20230085203A (ko) 처리액 순환 방법, 및 기판 처리 방법
JP2013207076A (ja) 処理液供給装置および処理液供給方法
JP6497587B2 (ja) 基板処理装置および基板処理方法
JP6909620B2 (ja) 基板処理方法
US20080163900A1 (en) Ipa delivery system for drying
US20050271985A1 (en) Method, apparatus and system for rinsing substrate with pH-adjusted rinse solution
WO2022215497A1 (ja) 処理液流通方法、及び、処理液供給装置
KR102684367B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR102001735B1 (ko) 기판 처리 방법 및 기판 처리 장치
TWI845886B (zh) 基板處理裝置及基板處理方法
CN115116891A (zh) 基板处理装置及基板处理方法
WO2023282064A1 (ja) 基板処理システム、及び基板処理方法
KR20230133231A (ko) 기판 처리 방법 및 기판 처리 시스템
KR20060136028A (ko) 케미컬 순환시스템