KR20230062541A - 잉크젯 도포용 및 led 보호용 경화성 조성물, led 모듈, led 모듈의 제조 방법 및 led 표시 장치 - Google Patents

잉크젯 도포용 및 led 보호용 경화성 조성물, led 모듈, led 모듈의 제조 방법 및 led 표시 장치 Download PDF

Info

Publication number
KR20230062541A
KR20230062541A KR1020237003533A KR20237003533A KR20230062541A KR 20230062541 A KR20230062541 A KR 20230062541A KR 1020237003533 A KR1020237003533 A KR 1020237003533A KR 20237003533 A KR20237003533 A KR 20237003533A KR 20230062541 A KR20230062541 A KR 20230062541A
Authority
KR
South Korea
Prior art keywords
led
curable composition
meth
acrylate compound
polyfunctional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020237003533A
Other languages
English (en)
Korean (ko)
Inventor
미츠루 다니카와
다카시 와타나베
미치히사 우에다
다카노리 이노우에
미츠호 구로스
요시토 후지타
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20230062541A publication Critical patent/KR20230062541A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/40—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
    • H01L25/0753—
    • H01L33/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
KR1020237003533A 2020-09-07 2021-09-07 잉크젯 도포용 및 led 보호용 경화성 조성물, led 모듈, led 모듈의 제조 방법 및 led 표시 장치 Withdrawn KR20230062541A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020149958 2020-09-07
JPJP-P-2020-149958 2020-09-07
PCT/JP2021/032806 WO2022050421A1 (ja) 2020-09-07 2021-09-07 インクジェット塗布用及びｌｅｄ保護用硬化性組成物、ｌｅｄモジュール、ｌｅｄモジュールの製造方法及びｌｅｄ表示装置

Publications (1)

Publication Number Publication Date
KR20230062541A true KR20230062541A (ko) 2023-05-09

Family

ID=80491141

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237003533A Withdrawn KR20230062541A (ko) 2020-09-07 2021-09-07 잉크젯 도포용 및 led 보호용 경화성 조성물, led 모듈, led 모듈의 제조 방법 및 led 표시 장치

Country Status (5)

Country Link
JP (1) JPWO2022050421A1 (https=)
KR (1) KR20230062541A (https=)
CN (1) CN116018693A (https=)
TW (1) TW202219203A (https=)
WO (1) WO2022050421A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849401B2 (ja) * 2024-02-19 2026-04-21 デンカ株式会社 組成物、硬化体、および、表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068280A (ja) 2003-08-22 2005-03-17 Taiyo Ink Mfg Ltd インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
JP2016191038A (ja) 2015-03-30 2016-11-10 東レ・ダウコーニング株式会社 シリコーン材料、硬化性シリコーン組成物、および光デバイス

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328188A (ja) * 2005-05-25 2006-12-07 Kyocera Chemical Corp 光半導体用樹脂組成物および光半導体装置
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
JP6094886B2 (ja) * 2013-07-12 2017-03-15 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物
KR20170061227A (ko) * 2015-11-25 2017-06-05 삼성디스플레이 주식회사 유기막 형성용 조성물 및 이의 경화물을 포함한 전자 장치
JP6410158B2 (ja) * 2016-10-07 2018-10-24 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP6474432B2 (ja) * 2017-01-11 2019-02-27 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
JP6573089B1 (ja) * 2018-05-31 2019-09-11 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置
JP2019108548A (ja) * 2019-02-06 2019-07-04 日立化成株式会社 アクリル樹脂組成物及び電子部品
JP7165865B2 (ja) * 2019-02-21 2022-11-07 パナソニックＩｐマネジメント株式会社 封止用材料、積層シート、硬化物、半導体装置、及び半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068280A (ja) 2003-08-22 2005-03-17 Taiyo Ink Mfg Ltd インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
JP2016191038A (ja) 2015-03-30 2016-11-10 東レ・ダウコーニング株式会社 シリコーン材料、硬化性シリコーン組成物、および光デバイス

Also Published As

Publication number Publication date
TW202219203A (zh) 2022-05-16
WO2022050421A1 (ja) 2022-03-10
JPWO2022050421A1 (https=) 2022-03-10
CN116018693A (zh) 2023-04-25

Similar Documents

Publication Publication Date Title
US8349538B2 (en) Photo-curable and thermo-curable resin composition, and a dry film solder resist
WO2008050768A1 (en) Photocurable/thermocurable solder resist composition, and printed circuit board using the same
KR101487789B1 (ko) 잉크젯용 잉크
TW200830047A (en) Photocurable thermosetting resin composition and printed wiring board using the same
JP7227016B2 (ja) 電子デバイス用光硬化性樹脂組成物
KR102067857B1 (ko) 잉크젯 프린팅을 이용한 베젤 패턴의 형성 방법
KR20140130040A (ko) 수지 적층체
JP2021177506A (ja) マイクロｌｅｄチップ搬送用フィルム及びマイクロｌｅｄチップの搬送方法
KR20230062541A (ko) 잉크젯 도포용 및 led 보호용 경화성 조성물, led 모듈, led 모듈의 제조 방법 및 led 표시 장치
JP2022135603A (ja) インクジェット塗布用及びｌｅｄ用硬化性組成物、ｌｅｄモジュール、ｌｅｄモジュールの製造方法及びｌｅｄ表示装置
CN111837457B (zh) 有机el显示元件用密封剂
CN115804245B (zh) 显示元件用密封剂、其固化物和显示装置
KR20250151355A (ko) 잉크젯용 경화성 조성물 및 전자 부품
JP7847351B2 (ja) 紫外線硬化性樹脂組成物、発光装置及び発光装置の製造方法
CN113166306B (zh) 固化性树脂组合物、固化物及有机el显示元件
JP6365917B1 (ja) インクジェットインク組成物
JP6965188B2 (ja) 活性エネルギー線硬化性組成物
CN115038728A (zh) 光硬化性组合物
KR102863309B1 (ko) 자외선 경화성 수지 조성물
KR102743666B1 (ko) 표시 소자용 봉지제, 그의 경화물 및 표시 장치
KR102877397B1 (ko) 광경화성 투명 수지 조성물 및 이로부터 유도된 각종 물품
KR20250105602A (ko) 잉크젯용 경화성 조성물, led 모듈 및 led 모듈의 제조 방법
CN114286832B (zh) 电子器件用光固化性树脂组合物
JP2024070162A (ja) インクジェット用及びｌｅｄ保護用硬化性組成物、ｌｅｄモジュール、ｌｅｄモジュールの製造方法、及びｌｅｄ表示装置
KR20250136229A (ko) 광경화성 수지 조성물, 경화물, 전자부품 및 가요성 디스플레이

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000