KR20230052226A - Device for connecting film - Google Patents

Abstract

The present application relates to a film connecting device and a film connecting method using the same. According to the film connecting device and the film connecting method using the same of the present application, the efficiency of removing foreign substances generated on the cut surface of a film when cutting the film is excellent, and the generation of air bubbles between an attachment member and a joint area can be improved when connecting films.

Description

Film connecting device {DEVICE FOR CONNECTING FILM}

This application relates to a film connection device and a film connection method using the same.

Conventional connections between films were made by unwinding each film through an unwinder, cutting it using a cutter, and then attaching each film to each other using a tape.

When cutting the unwound film, burrs are generated on the cut surface of the film or foreign matter is generated due to film pieces. Due to this, adhesion is made in a state where foreign matter is attached to the cut surface of the film, and a problem occurs in that air bubbles are generated between the bonding area of the tape and the film.

In addition, after the first film and the second film are connected, in the process of coating the first film and the second film, an attachment part connecting the first film and the second film to each other, specifically, a tape passes through the coating part When the tape was unable to pass through the coating nozzle due to the thickness of the tape, a process of jumping the coating nozzle was required. At this time, since the stabilization time of the coating solution after jumping the coating nozzle is required for the jumping operation of the coating nozzle, the connected first film and the second film are treated as defective, resulting in fabric loss.

Therefore, there is a need for a film connection device to solve these problems.

The object of the present application is a film connection device capable of improving the removal efficiency of foreign substances generated on the film cut surface during film cutting and improving the generation of air bubbles generated between the bonding member and the bonding area during film connection, and a film connection method using the same is to provide

In order to solve the above problems, the film connection device of the present application is a film supply unit for supplying a first film and a second film, respectively; a work plate having a cutting area in which the second film is seated on the first film through the film supply unit in a laminated state and an attachment area spaced apart from the cutting area; a cutting unit movably disposed above the working plate and cutting a bonding area between the first film and the second film; a lower suction part having a plurality of suction areas, the work plate being fixed to the upper part and movably disposed below the work plate; an upper suction unit movably disposed above the work plate and having a plurality of suction areas; an attachment portion movably disposed on an upper portion of the work plate and connecting bonding regions of the first film and the second film with an attachment member; and a cutting mode for controlling the upper and lower suction parts, the cutting part, and the attaching part, and performing cutting in the cutting area, a transport mode for transferring the first film and the second film from the cutting area to the attaching area, and the first film and the second film in the attaching area. and a control unit having an attachment mode for attaching the second film.

The control unit, in the cutting mode, sucks the first film by the lower suction part, lowers the upper suction part and sucks the second film by the upper suction part, and the first film through the cutting part. And cutting the second film, it is possible to perform the suction of foreign substances generated during the cutting through the lower suction part.

Also, in the cutting mode, the lower suction unit may be provided to suck the first film through at least one suction area and to suck foreign substances through another suction area.

In addition, the lower film connection device is disposed on one side of the lower suction part, and includes a lower removal part for removing a removal area of the first film cut through the cutting part; and an upper suction unit having a first area and a second area movable up and down with respect to the first area, wherein the control unit places the bonding area of the first film and the second film to be bonded on the cutting area in a transfer mode, , The removal area of the first film to be removed other than the bonding area is removed through the lower removal part, the removal area of the second film to be removed other than the bonding area is wound up to the film supply unit and removed, and the first film to be bonded is removed through the upper suction part. The bonding area of the film and the second film may be sucked, and the working plate, the lower intake unit and the lower removal unit, or the cutting unit, the upper intake unit, and the attachment unit may be moved so that the attachment area is located corresponding to the upper intake unit.

In addition, the control unit rotates the lower removal unit in the transfer mode to remove the first film removal area, raises the upper intake unit's second area, and then winds the second film removal area to the film supply unit to remove the first film. 2 The removal area of the film can be removed.

Also, in the transfer mode, the lower suction unit may suck the first film and the second film through at least two suction areas when the bonding areas of the first and second films to be bonded are seated in the bonding area.

In addition, the control unit may connect the first film and the second film by moving the attaching unit and attaching the attaching member to the bonding area of the first and second films in the attaching mode.

In addition, the control unit may connect the first film and the second film by lowering the attaching unit to the bonding area of the first film and the second film and then rotating the attaching unit in the attaching mode.

Also, the attaching unit may include an attaching roll having a plurality of holes for suctioning and fixing the attaching member.

In addition, the cutting unit may include a cutting member made of a circular wheel-shaped or stick-shaped knife.

In addition, the upper suction part may have a plurality of holes having a diameter of 2 mm to 6 mm.

In addition, an upper attachment layer containing foamed silicone may be provided at the lower part of the upper suction part.

In addition, the upper adhesive layer may have a plurality of holes having a diameter of 2 mm to 6 mm.

In addition, the working plate may have a plurality of holes having a diameter of 2 mm to 6 mm in the attachment area.

In addition, a lower attachment layer including a mixture of foamed silicone and nickel mesh or a mixture of foamed silicone and ceramic may be provided on the top of the attachment area.

In addition, the lower adhesive layer may have a plurality of holes having a diameter of 2 mm to 6 mm.

In addition, the film connection device may be provided with a mesh layer stacked on top of the lower adhesive layer.

In addition, the mesh layer may have a plurality of holes of 100 mesh to 150 mesh.

In addition, the attachment member may be a single-sided tape having an attachment surface in a direction facing the first film and the second film.

In addition, the film connection method of the present application relates to a method of connecting films using the film connection device, a cutting step of performing cutting of the first film and the second film; a transfer step of controlling the movement of the cut first and second films from the cutting area to the attaching area; and an attaching step of connecting the first film and the second film moved to the attaching area.

According to the film connection device and the film connection method using the same of the present application, the removal efficiency of foreign substances generated on the film cut surface when the film is cut is excellent, and the generation of air bubbles generated between the adhesive member and the bonding area when the films are connected can be improved. .

1 is a side view exemplarily showing a film connection device according to an embodiment of the present application.
2 is a top view exemplarily showing a work plate according to an embodiment of the present application.
3 is a side view exemplarily illustrating an attachment region, a lower attachment layer, and a mesh layer according to an embodiment of the present application.
4 is a side view illustratively showing an upper suction part and an upper attachment layer according to an embodiment of the present application.
5 is a schematic diagram showing a part controlled by a control unit according to an embodiment of the present application by way of example.
6 is an enlarged side view of a film connecting device to explain a cutting mode of a control unit according to an embodiment of the present application.
7 is a side view exemplarily showing a film connection device to explain a cutting mode of a control unit according to an embodiment of the present application.
8 and 9 are side views illustratively showing a film connection device to explain a transfer mode of a control unit according to an embodiment of the present application.
10 and 11 are enlarged side views of a film connecting device to explain a transfer mode of a control unit according to an embodiment of the present application.
12 is a side view exemplarily showing a film connection device to explain a transfer mode of a control unit according to an embodiment of the present application.
13 to 16 are side views illustratively illustrating a film connection device to explain an attachment mode of a control unit according to an embodiment of the present application.
17 is an enlarged side view of a film connection device to explain an attachment mode of a controller according to an embodiment of the present application.
18 is a view exemplarily shown to explain a first film and a second film connected by a film connecting device according to an embodiment of the present application.

Hereinafter, the film connection device of the present application will be described with reference to the accompanying drawings, and the attached drawings are exemplary, and the film connection device of the present application is not limited to the accompanying drawings.

1 is a side view exemplarily showing a film connection device according to an embodiment of the present application. As shown in FIG. 1, the film connection device according to an embodiment of the present application includes a film supply unit (not shown), a working plate 200, a cutting unit 300, a lower intake unit 400, and an upper intake unit 600. , and includes an attaching unit 700 and a control unit (not shown). In addition, the work plate 200 has a cutting area (A) and an attachment area (B). In addition, the attachment part 700 has an attachment member 710 . The film connecting device of the present application has excellent removal efficiency of foreign substances generated on the cut surface of the film when the film is cut, and can improve the generation of air bubbles between the bonding member and the bonding area when the films are connected. In this specification, the term "foreign material" means a material that is different from the desired material in shape, property, and characteristics. In one embodiment, the foreign matter may be film fragments generated when the film is cut.

The film supply unit (not shown) is a portion to which a first film and a second film for connection are supplied. In one example, the first film is supplied by a first film supply unit, and the second film is supplied by a second film supply unit. The first film supply unit and the second film supply unit supply the first film and the second film in a first direction, respectively. In this specification, the term "first direction" means a direction opposite to the operating direction in which the film connection device operates, and may be, for example, a backward direction (←). At this time, the operating direction in which the film connecting device operates may be a second direction, for example, may be a forward direction (→). Also, in the present specification, the term “first film” refers to a roll-type film that needs to be newly connected to the second film, and the term “second film” in the present specification refers to a roll-type film that is currently being mass-produced. For example, the first film and the second film may be unwound and supplied from each of the first film supply unit and the second film supply unit.

In one example, the first film may be a Tri Acetyl Cellulose (TAC) based film or a Polyethylene terephtalate (PET) based film, and the second film may be a Tri Acetyl Cellulose (TAC) based film or a Polyethylene terephtalate (PET) based film. may be a film.

2 is a top view exemplarily showing a work plate according to an embodiment of the present application. As shown in FIG. 2, the working plate 200 is a plate that cuts and connects (= bonds) the first and second films supplied through the film supply unit, and cuts the first and second films. It has a cutting area (A) and an attachment area (B) spaced apart from the cutting area (A) and connecting the cut first and second films.

In one example, the work plate 200 may be a flat plate. Since the work plate 200 is a flat plate, air bubbles generated between the attachment member and the bonding area when the first film and the second film are connected can be reduced. The bonding area (B) means a surface to which the attachment member 710 of the attachment part 700 is attached to connect the cut surfaces of the first film and the second film.

The working plate 200 may be an aluminum plate, a STS304 stainless steel plate or an SS41 steel plate. By using the above-described plate as the work plate 200, it is light in weight compared to the SUS-based stainless steel plate, and the design load can be reduced, and thus, it can be advantageous in vertical or forward movement and motion control.

In addition, the work plate 200 may have a plurality of holes having a diameter of 2 mm to 6 mm. Specifically, the plurality of holes may have a diameter of 3 mm to 5 mm. Since the work plate 200 has a plurality of holes having the above-described diameter, defects may not be caused, and suction force for the cut first and second films may be excellent. In addition, when the hole of the work plate 200 exceeds the aforementioned diameter, the hole mark may be present when adsorbing the cut first film and the second film, which may cause a defect. In addition, when the hole of the work plate 200 is smaller than the above-mentioned diameter, the first film and the second film may be separated without being sucked because the suction pressure of the film is small.

A second film is placed in the cutting area A of the work plate 200 in a laminated state on the first film supplied through the film supply unit. By inserting the first film and the second film into the cutting area A so as to be seated in the above-described form, the same portion of the first film and the second film may be cut by the cutting part 300. .

In one example, the cutting area (A) may be provided with a cutting groove 210 formed in a direction perpendicular to the supply direction of the first film and the second film. The cutting groove 210 is a hole formed so as not to damage the working plate by the cutting member when the first film and the second film are cut by the cutting member described later. Since the cutting groove 210 is provided in the cutting area A, the first film and the second film may be cut without damaging the working plate 200 .

The attachment area B of the work plate 200 is a plate for connecting the first film and the second film, and is spaced apart from the cutting area A forward or backward. That is, the cutting area A and the attachment area B may be spaced apart from each other on the lower suction part 400 . In this specification, the term "front" means the direction in which the first and second films are supplied, that is, the first direction (←), and the term "rear" in this specification means the opposite direction to the front, that is, the second direction. It means direction (→).

3 is a side view exemplarily illustrating an attachment region, a lower attachment layer, and a mesh layer according to an embodiment of the present application. As shown in FIG. 3 , a lower attachment layer 1000 may be provided on an upper portion of the attachment region B of the work plate. The lower adhesion layer 1000 may include a mixture of foamed silicon and nickel mesh, or a mixture of foamed silicone and ceramic. The attachment region B may further include the lower attachment layer 1000 containing the above-described material, thereby preventing damage to the film.

For example, the lower adhesive layer 1000 may have a thickness of 3 mm to 8 mm. Specifically, the thickness of the lower adhesive layer may be 4 mm to 7 mm or 4 mm to 6 mm. When the lower adhesive layer has the aforementioned thickness, it is easy to process, has excellent adhesion, and can serve as a cushion to prevent damage to the film. In addition, when the thickness of the lower adhesive layer 1000 exceeds the aforementioned range, the material itself is deformed, making processing difficult and reducing adhesive strength. In addition, when the thickness of the lower attachment layer 1000 is less than the aforementioned range, it may be difficult to cause damage to the film or perform a cushioning role when the attachment process is repeated.

In addition, the lower attachment layer 1000 may have a plurality of holes having a diameter of 2 mm to 6 mm. Specifically, the plurality of holes may have a diameter of 3 mm to 5 mm. Since the lower adhesive layer 1000 has a plurality of holes having the aforementioned diameter, defects are not caused and excellent suction power can be exhibited through the lower suction part. In addition, when the hole of the lower adhesive layer 1000 exceeds the above-mentioned diameter, a defect may occur due to the presence of a hole mark during adsorption of the film. In addition, when the hole of the lower adhesive layer 1000 is less than the aforementioned diameter, the suction power of the film is small and the film may fall without being sucked.

In another example, the lower attachment layer 1000 may further include a mesh layer 1100 thereon. By further including the mesh layer 1100 on the lower adhesive layer 1000, it is possible to prevent hole marks generated in the process of sucking the first film and the second film, thereby suppressing the defect rate.

For example, the mesh layer 1100 may have a plurality of holes of 100 mesh to 150 mesh. Specifically, the mesh layer 1100 may have a plurality of holes of 110 mesh to 140 mesh or 120 mesh to 130 mesh. Since the mesh layer 1100 has a plurality of holes of the above-mentioned size, it is possible to prevent hole scars generated in the process of sucking the first film and the second film using the lower suction part, thereby suppressing the defect rate. .

In addition, as shown in FIG. 1, the cutting part 300 is a part for cutting the first film and the second film in order to join the first film and the second film, and moves to the upper part of the work plate 200. It is movably disposed, specifically, between the center of the inside of the upper suction part 600, specifically, between the first area 610 and the second area 620 to be described later.

In one example, the cutting unit 300 may cut the same portion of the first film and the second film in a direction perpendicular to the supply direction of the first film or the second film. Specifically, the cutting unit 300 may simultaneously cut the aforementioned portions of the first film and the second film. The cutting part 300 is disposed at the above-mentioned position and cuts the same part of the first film and the second film in the above-mentioned direction, thereby forming the cut formed bonding regions 112 and 121 of the first film and the second film. ) can be connected to each other. Thereafter, in the cut first film, the part where the first film is supplied from the first film supply unit based on the cut cross section, that is, the bonding area 112 is seated in the cutting area A, and the bonding area A part to be removed other than 112, that is, the removal area 111 may be separated from the cutting area A through the lower removal part 500 and removed. In addition, in the cut second film, based on the cut cross section, a portion opposite to the portion to which the second film is supplied from the second film supply unit, that is, the bonding area 121 is seated in the cutting area A, and the bonding A portion to be removed other than the area 121, that is, the removal area 122 may be separated from the cutting area A by being wound around the film supply unit and removed.

While defining an angle in this specification, when terms such as vertical, parallel, orthogonal or horizontal are used, this means a substantial vertical, parallel, orthogonal or horizontal within a range that does not impair the desired effect, for example , including errors taking into account manufacturing errors or variations. For example, each of the above cases may include an error within about ±15°, an error within about ±10°, or an error within about ±5°.

In one example, the cutting part 300 may include a cutting member (not shown) made of a knife in the form of a circular wheel or stick. The cutting part 300 may improve the cutting quality of the cutting surface of each of the first film and the second film by including the above-described cutting member.

The circular wheel-shaped knife may be driven by a single-axis robot and a servo motor. Specifically, the circular wheel-shaped knife may be driven by the single-axis robot to linearly move in a single axis, specifically, a height direction, and may be driven to rotate at a constant speed by using a servo motor. The circular wheel-shaped knife is driven by the above-described single-axis robot and servo motor, so that the cutting quality of the cutting surfaces of the first film and the second film may be improved.

Also, the stick-shaped knife may be driven by a two-axis robot. Specifically, the stick-shaped knife may be driven by the two-axis robot to linearly move in a specific height direction and then linearly move in a direction on a plane perpendicular to a direction in which the first film or the second film is supplied. . Since the stick-type knife is driven by the above-described twin-axis robot, cutting quality of the cutting surfaces of each of the first film and the second film may be improved.

The lower suction part 400 is a suction for fixing the first film when cutting the first film and the second film, suction of foreign substances generated on the cut surfaces of the first film and the second film, and the first and second films. When connecting the two films, as a part that performs suction for fixing the first film and the second film to be bonded, the work plate 200 is fixed to the top and movably disposed below the work plate 200, and a plurality of It has a dog suction area. Since the lower suction part 400 is disposed at the above-described position, it can indirectly move the work plate, fix the first film when cutting the film, and separate the first and second films. The removal efficiency of foreign substances generated on the cut surface may be excellent, and the first film and the second film to be bonded may be fixed when the films are connected, thereby preventing the generation of air bubbles between the bonding member and the bonding area when the films are connected. can be improved

In addition, the lower suction part 400 may be provided to suck the first film through at least one suction area and to suck foreign substances through another suction area. At this time, the at least one suction area may be provided at a position corresponding to the first film, and another suction area may be provided at a position not corresponding to the first film. The lower suction part 400 includes the above-mentioned suction area at the above-mentioned position, so that the first film and the second film are suctioned and fixed when the first film and the second film are cut, and foreign substances generated on the cut surface of the film during cutting are removed. It can perform the function of inhalation.

The film connecting device may further include a lower removal part 500 . The lower removal part 500 is a part for removing the removal area 111 of the first film cut through the cutting part 300 and may be disposed on one side of the lower suction part 400 . Specifically, the lower removal unit 500 may remove the removal area 111 of the cut first film through rotation. At this time, the rotation of the lower removal part 500 may be performed by the movement of the upper back and forth adjusting part 810 to be described later. In addition, the rotation direction of the lower removal part 500 may have a counterclockwise direction based on the right side of the film connecting device.

The upper suction unit 600 is used to attach the first and second films when the first and second films are cut, sucked for fixing the second film, and moved when the cut first and second films are moved. As a part that performs suction for fixation, it is movably disposed on the top of the work plate 200 and has a plurality of suction areas. The second film may be cut while being fixed to the upper suction part 600, and the junction area of the cut first film and the second film is fixed to the upper suction part 600. It can be moved to a position corresponding to the attachment part 700 .

In one example, the upper intake part 600 may further include a first area 610 and a second area 620 .

The first region 610 is a region that sucks the bonding region of the second film cut through the cutting part 300 when the first film and the second film are cut and the removal region of the second film is removed after the cutting. . Specifically, when cutting the first film and the second film, and removing the removal area of the second film after cutting, the bonding area of the second film may be fixed to the upper suction part through the first area 610. there is.

In addition, the second area 620 is an area for removing the removal area of the second film cut through the cutting part 300 when the first film and the second film are cut, and the first area 610 It is an area that can move up and down with respect to . Specifically, the removal area of the second film is formed by raising the second area 620 relative to the first area 610 when the first film and the second film are cut, and then the film supply unit, specifically, the first area 610 is removed. 2 It can be rolled up to the film supply unit and removed. At this time, the raising or lowering of the second area may be performed by the up/down adjusting unit 621 of the second area. For example, a cylinder may be used as the up/down adjusting part 621 of the second region.

The upper intake part 600 may be an aluminum plate. By using the above-described plate as the upper suction part 600, it is lighter in weight than the SUS-based stainless steel plate, and the design load can be reduced, and as a result, it can be advantageous for vertical or forward movement and motion control.

In addition, the upper suction part 600 may have a suction area having a plurality of holes having a diameter of 2 mm to 6 mm. Specifically, the plurality of holes may have a diameter of 3 mm to 5 mm. Since the upper intake part has the above-described intake area, defects are not caused, and excellent suction power to the second film when cut and excellent suction power to the first and second films cut during movement can be exhibited. In addition, when the hole of the upper suction part exceeds the aforementioned diameter, hole marks may be present in the second film when cut and in the first film and the second film when adsorbed, causing defects. In addition, when the hole of the upper suction part is less than the above-described diameter, the suction pressure of the film is small, so that the second film may not be fixed during the cutting, and the cut first and second films may fall apart without being fixed. . In this specification, the term "plural number" means two or more, and the upper limit thereof is not particularly limited.

4 is a side view illustratively showing an upper suction part and an upper attachment layer according to an embodiment of the present application. As shown in FIG. 4 , an upper attachment layer 900 may be provided at a lower portion of the upper suction part 600 . The upper attachment layer 900 may include foamed silicone. The upper suction unit 600 may further include an upper attachment layer 900 containing the above-described material, thereby serving as a cushion to prevent damage to the film.

For example, the upper attachment layer 900 may have a thickness of 3 mm to 8 mm. Specifically, the thickness of the upper attachment layer 900 may be 4 mm to 7 mm or 4 mm to 6 mm. When the upper adhesion layer 900 has the above-described thickness, it is easy to process, has excellent adhesion, and can perform a cushion role of preventing damage to the film. In addition, when the thickness of the upper adhesive layer 900 exceeds the above-described range, the material itself is deformed, making it difficult to process and the adhesive force may be lowered. In addition, when the thickness of the upper attachment layer 900 is less than the aforementioned range, it may be difficult to cause damage to the film or perform a cushion role when the attachment process is repeated.

In addition, the upper attachment layer 900 may have a plurality of holes having a diameter of 2 mm to 6 mm. Specifically, the plurality of holes may have a diameter of 3 mm to 5 mm. The upper attachment layer may have excellent suction power by configuring a vacuum by having a plurality of holes having the aforementioned diameter.

As shown in FIG. 1, the attachment part 700 is a part for connecting the bonding areas 112 and 121 of the first film and the second film seated on the attachment area B with an attachment member 710. , It is movably disposed on the top of the work plate 200.

In one example, the attachment part 700 includes an attachment roll 720 having a plurality of holes for suctioning and fixing the attachment member 710 . For example, the attaching part 700 is capable of moving an upper back-and-forth adjusting part 810, which will be described later, in a state in which the attaching member 710 is in contact with the bonding areas 112 and 121 of the first and second films. rotation can be driven by Due to this, it may be possible to connect the first film and the second film.

In one example, the attachment member 710 may be a single-sided tape having an attachment surface in a direction facing the first film and the second film. Specifically, the attachment member 710 may have an attachment surface on one surface in a direction facing the bonding regions 112 and 121 of the first film and the second film, and may not have an attachment surface on one surface in the opposite direction. can By using a single-sided tape having an attachment surface in the aforementioned direction as the attachment member 710 , coating may be performed on the first film and the second film connected by the attachment member 710 . At this time, the attachment force of the attachment member 710 is not particularly limited as long as it can be attached to the junction area of the first film and the second film despite suction of the attachment roll 720 .

The attachment roll 720 is a tool for improving the attachment force of the attachment member 710 attached to connect the bonding areas 112 and 121 of the first film and the second film to each other, and the attachment member 710 ) can be absorbed and fixed in some areas. By connecting the bonding areas 112 and 121 of the first film and the second film, respectively, through the adhesive roll 720, air bubbles generated between the bonding member and the bonding area may be reduced. At this time, the attachment roll 720 is driven by rotation of the attachment part 700 described above, and the rotation direction may have a counterclockwise direction based on the right side of the film connecting device.

In one example, the attachment roll 720 includes a plurality of holes to suck the attachment member 710 . For example, the attachment roll 720 may have a plurality of holes having a diameter of 2 mm to 6 mm. Specifically, the plurality of holes may have a diameter of 3 mm to 5 mm. Since the attachment roll 720 has a plurality of holes having the aforementioned diameter, the attachment member 710 may be suctioned and fixed.

In one example, the attachment roll 720 may be a roll-shaped aluminum plate. By using the above-described plate as the attaching roll 720, it is lighter in weight than the SUS-based stainless steel plate, and thus the design load can be reduced, which can be advantageous for vertical or forward movement and motion control.

In another example, the attaching unit 700 may further include a mesh layer (not shown) on the attaching roll 720 . By further including a mesh layer on the attaching roll 720, it is possible to prevent hole scars generated during the sucking process of the attaching member 710, thereby suppressing the defect rate.

For example, the mesh layer may have a plurality of holes of 100 mesh to 150 mesh. Specifically, the mesh layer may have a plurality of holes of 110 mesh to 140 mesh or 120 mesh to 130 mesh. Since the mesh layer has a plurality of holes having the size described above, it is possible to prevent hole scars generated in the process of sucking the attachment member 710 using the attachment roll 720, thereby suppressing the defect rate.

In one example, the film connecting device may further include a movement control unit 800, specifically, an upper up and down control unit 820, an upper back and forth control unit 810, a lower up and down control unit 840, and A lower back and forth adjustment unit 830 may be further included.

The upper up and down control unit 820 is a part that controls the rise or fall of the components disposed on the upper part of the film connecting device, and is a first part that controls the rise or fall of the cutting part 300 and the upper suction part 600. An upper upper and lower adjustment unit 821 and a second upper upper and lower adjustment unit 822 that control the elevation or descent of the attaching unit 700 may be included. For example, the upper up/down adjusting unit 820 may control the cutting part 300, the upper suction part 600, and the attaching part 700 disposed above the film connecting device to be simultaneously raised or lowered. In addition, the upper up and down adjusting unit 820 controls the first upper up and down adjusting unit 821 and the second upper up and down adjusting unit 822 to be individually driven, so that the first upper up and down adjusting unit 821 The cutting part 300 and the upper suction part 600 controlled by the control are controlled to be raised or lowered simultaneously, or the attachment part 700 controlled by the second upper up and down adjusting part 822 is controlled to be raised or lowered. can The film connection device further includes the upper upper and lower control unit 820, so that the first film and the second film are lowered and raised by the upper suction unit 600 for suctioning and fixing the first film when the first film and the second film are cut, and It is possible to control the lowering and rising of the cutting part 300 for cutting the first film and the second film, and the upper suction part 600 for suctioning and fixing the bonding area of the cut first and second films. It is possible to control the lowering and rising of and the lowering and rising of the attachment part 700 for connecting the junction areas of the cut first and second films. At this time, a cylinder may be used as the upper up/down adjusting unit 820 .

In addition, the upper front and rear control unit 810 is a part that controls the forward or backward movement of the components disposed on the upper part of the film connecting device, and the cutting part 300, the upper suction part 600, and the attachment part 700 forward or backward can be controlled. For example, the upper front/rear control unit 810 may control the cutting part 300, the upper suction part 600, and the attaching part 700 disposed above the film connecting device to move forward or backward simultaneously. The film connecting device further includes the upper back and forth adjusting part 810, so that the cutting part 300, the upper suction part 600 and the attachment part 700 connect the cut first film and the second film. forward or backward can be controlled. At this time, a cylinder may be used as the upper back and forth adjustment unit 810.

The lower upper and lower control unit 840 is a part that controls the elevation or lowering of the components disposed below the film connecting device, and includes the work plate 200, the lower intake unit 400, and the lower removal unit 500. The rise or fall of can be controlled. For example, the lower up/down adjusting unit may control the work plate 200, the lower intake unit 400, and the lower removal unit 500 disposed below the film connection device to be raised or lowered simultaneously. The film connection device further includes the lower up and down adjusting part 840, so that the first film and the second film fixed to the upper suction part 600 are moved to the attachment area B after cutting. The elevation or descent of the plate 200, the lower suction unit 400, and the lower removal unit 500 may be controlled. At this time, a cylinder may be used as the lower up/down adjusting unit 840 .

In addition, the lower front and rear control unit 830 is a part that controls the forward or backward movement of the components disposed below the film connecting device, and includes the work plate 200, the lower intake unit 400, and the lower removal unit ( 500) can be controlled to move forward or backward. For example, the lower front and rear adjusting part 830 is connected to the lower end of the lower up and down adjusting part 840 and includes the work plate 200, the lower suction part 400, and the lower part disposed below the film connecting device. The rejection 500 can be controlled to move forward or backward at the same time. The film connection device further includes the lower front and rear adjusting unit 830, so that the attachment area B is located at the lower portion corresponding to the first film and the second film fixed to the upper intake unit 600 after the cutting. Forward or backward movements of the work plate 200, the lower suction part 400, and the lower removal part 500 may be controlled so as to be positioned. At this time, a cylinder may be used as the lower front/rear adjustment unit 830 .

5 is a schematic diagram showing a part controlled by a control unit according to an embodiment of the present application by way of example. As shown in FIG. 5, the controller is a part that performs a cutting mode, a transport mode, and an attaching mode, and includes a film supply unit, a cutting unit, a lower intake unit, an upper intake unit, an attachment unit, an upper up and down control unit, an upper back and forth control unit, It controls the lower up and down adjustment unit and the lower front and rear adjustment unit. Specifically, the control unit may further control the lower removal unit. The control unit may be electrically connected to the film supply unit, the cutting unit, the lower intake unit, the upper intake unit, the attachment unit, the upper up and down control unit, the upper front and rear control unit, the lower up and down control unit, and the lower front and rear control unit. Specifically, the control unit may be further electrically connected to the lower removal unit.

The cutting mode is a mode for performing cutting of the first film and the second film in the cutting area.

6 is an enlarged side view of a film connecting device to explain a cutting mode of a control unit according to an embodiment of the present application. 7 is a side view exemplarily showing a film connection device to explain a cutting mode of a control unit according to an embodiment of the present application. As shown in Figures 6 and 7, the control unit (not shown) is seated in the cutting area (A) in a form in which the second film 120 is laminated on the first film 110 in the cutting mode, The first film 110 is sucked by the lower suction part 400, and the upper suction part 600, specifically, the upper suction part 600 by using the first upper up and down adjusting part 821 And the work plate 200 and the lower suction part 400, specifically, the work plate 200, the lower suction part by lowering the cutting part 300 or using the lower up and down adjusting part 840 at the same time. 400 and the lower removal part 500 are raised to suck in the second film 120 by the upper suction part 600, and the first film 110 and the second film 120 through the cutting part 300. The film 120 is cut, and foreign substances generated during the cutting can be sucked through the lower suction part 400 . At this time, the cut portion of the first film 110 and the second film 120 may be the center of each film. For example, the cut parts of the first film 110 and the second film 120 are the center of the upper suction part 600 where the cut part 300 is located, that is, the first area 610 and the second area. It may be positioned to correspond between (620). By performing the cutting mode through the film connection device, the removal efficiency of foreign matter generated on the film cutting surface when the film is cut is excellent, and the generation of air bubbles generated between the bonding member and the bonding area when the films are connected can be improved.

In one example, in the cutting mode, the lower suction unit 600 may be provided to suck the first film through at least one suction area and to suck foreign substances through another suction area. Since the suction of the lower intake in the cutting mode is the same as described above, this will be omitted.

The transfer mode is a mode in which the first film and the second film are transferred from the cutting area of the working plate to the attaching area.

8 and 9 are side views illustratively showing a film connection device to explain a transfer mode of a control unit according to an embodiment of the present application. 10 and 11 are enlarged side views of a film connecting device to explain a transfer mode of a control unit according to an embodiment of the present application. As shown in FIG. 8, the controller (not shown) stops suction of the upper suction part 600 and the lower suction part 400 in the transfer mode, and as shown in FIG. 10, the first film and the second film to be bonded are stopped. 2 The bonding areas 112 and 121 of the film are seated in the cutting area A, and the removal area (not shown) of the first film to be removed other than the bonding areas 112 and 121 is removed through the lower removal part, In addition to the bonding area, the removal area (not shown) of the second film to be removed is wound by the film supply unit and removed, and the bonding area 112, 121 of the first film and the second film to be bonded through the upper suction part 600 is sucked in, and the cutting part 300, the upper suction part 600, and the attaching part 700 can be raised by the first upper upper and lower adjusting part 821. Then, as shown in FIGS. 9 and 11 , the cutting part 300 and the upper suction part 600 are positioned so that the upper suction part 600 is positioned to correspond to the attachment area B by the upper back and forth adjusting part 810. ) and the attachment part 700, and/or the work plate 200, the lower part by the lower back and forth adjusting part 830 so that the upper suction part 600 is positioned to correspond to the attachment area B The suction unit 400 and the lower removal unit 500 may be moved. By moving the first film and the second film through the transfer mode, air bubbles generated between the bonding member and the bonding area when the films are connected may be reduced.

In one example, the control unit rotates the lower removal unit 500 in the transfer mode to remove the removal area of the first film and raises the second area 620 of the upper intake unit 600. Then, the removed area of the second film may be wound around the film supply unit to remove the removed area of the second film. At this time, since the first area 610 of the upper suction part 600 sucks in the bonding area of the second film, it can maintain a fixed state.

12 is a side view exemplarily showing a film connection device to explain a transfer mode of a control unit according to an embodiment of the present application. As shown in FIG. 12, in the transfer mode, the upper suction part 600 is lowered by the first upper upper and lower adjustment unit 821, and/or the work plate (by the lower upper and lower adjustment unit 840) 200) and the lower suction part 400 are raised, and suction of the upper suction part 600 is stopped, so that when the bonding area of the first film and the second film to be bonded is seated in the attachment area (B), the lower The suction unit 400 may suction and fix the bonding area of the first film and the second film, specifically, the first film and the second film through at least two suction areas.

The attachment mode is a mode in which the first film and the second film are attached in the attachment area.

13 to 16 are side views illustratively illustrating a film connection device to explain an attachment mode of a control unit according to an embodiment of the present application. 17 is an enlarged side view of a film connecting device to explain an attachment mode of a control unit according to an embodiment of the present application. As shown in FIG. 13, the controller (not shown) raises the upper suction part 600 by the first upper up and down adjusting part 821 in the attachment mode, and/or the lower up and down adjusting part 840. As a result, the work plate 200, the lower suction part 400, and the lower removal part 500 can be lowered. Then, as shown in FIG. 14, in the attachment mode, the controller (not shown) adjusts the upper suction portion by the upper back and forth adjusting portion 810 so that the attachment portion 700 is positioned to correspond to the attachment area B. 600 and the attachment part 700 are moved, and/or the work plate 200 is moved by the lower back and forth adjustment part 830 so that the attachment part 700 is positioned corresponding to the attachment area B. , the lower intake unit 400 and the lower removal unit 500 may be moved. Then, as shown in FIGS. 15 and 17, the controller (not shown) moves the attachment part 700 to the attachment area B by lowering the second upper up/down control part 822 in the attachment mode. or / or by raising the lower up and down adjusting part 840 to raise the work plate 200, lower suction part 400 and lower removal part 500 to move the attachment area B to the attachment part 700 ), and the attachment member 710 may be positioned in the bonding areas 112 and 121 of the first film and the second film, respectively, seated on the attachment area (B). Thereafter, as shown in FIGS. 16 and 17 , the controller (not shown) rotates the attaching unit 700 in the attaching mode to attach the attaching member 710 to the bonding areas 112 and 121 of the first and second films. ), it is possible to connect the first film and the second film. By connecting the cut first film and the second film through the attachment mode, it is possible to improve air bubbles generated between the attachment member and the bonding region when the films are connected.

18 is a view exemplarily shown to explain a first film and a second film connected by a film connecting device according to an embodiment of the present application. As shown in FIG. 18 , by using the film connecting device, the bonding area 112 of the first film and the bonding area 121 of the second film may be connected by an attachment member 710 . Specifically, the cut surfaces 1121 and 1211 of the first film and the second film may be connected to each other. Through this, when cutting between films, the removal efficiency of foreign substances generated on the cut surfaces 1121 and 1211 of the first and second films is excellent, and when connecting the films, the attachment member 710 and the bonding area 112, 121 It can be seen that the occurrence of air bubbles in between is improved.

This application also relates to a method for connecting films. An exemplary film connection method relates to a method of connecting films using the above-described film connection device. Therefore, since the details of the film connection method to be described later can be equally applied to the description of the film connection device, they will be omitted.

The film connection method of the present application includes a cutting step, a conveying step and an attaching step. According to the film connection method of the present application, the removal efficiency of foreign matter generated on the cut surface of the film is excellent when the film is cut, and the generation of air bubbles between the bonding member and the bonding area when the films are connected can be improved. The film connection method is performed using the above-described film connection device. Therefore, since the configuration included in the film connection device is the same as described above, it will be omitted.

The cutting step is a step of performing cutting of the first film and the second film. The cutting step is performed using the cutting mode of the controller. Therefore, a detailed description of the cutting step will be omitted since it is the same as that described in the cutting mode.

The transferring step is a step of controlling the movement of the cut first and second films from the cutting area to the attaching area. The transfer step is performed using the transfer mode of the control unit. Therefore, a detailed description of the transfer step will be omitted since it is the same as that described in the transfer mode.

The attaching step is a step of connecting the first film and the second film moved to the attaching area. The attaching step is performed using the attaching mode of the control unit. Therefore, a detailed description of the attaching step will be omitted since it is the same as that described in the attaching mode.

110: first film
111: first film removal area
112 bonding area of the first film
1121: cut surface of the first film
120: second film
121 bonding area of the second film
122: removal area of the second film
1211: cut surface of the second film
200: work plate
300: cutting part
400: lower intake
500: lower removal unit
600: upper intake
610: first area
620: second area
621: up and down control unit of the second area
700: attachment
710: attachment member
720: attachment roll
800: movement control unit
810: upper front and back control unit
820: upper up and down control unit
821: first upper upper and lower control unit
822: second upper upper and lower control unit
830: lower front and back control unit
840: lower up and down control unit
900: upper adhesive layer
1000: lower adhesive layer
1100: mesh layer
A: cutting area
B: attachment area
←: backward direction, first direction, forward
→: Forward direction, second direction, backward

Claims (20)

a film supply unit supplying a first film and a second film, respectively;
a work plate having a cutting area in which the second film is seated on the first film through the film supply unit in a laminated state and an attachment area spaced apart from the cutting area;
a cutting unit movably disposed above the working plate and cutting a bonding area between the first film and the second film;
a lower suction part having a plurality of suction areas, the work plate being fixed to the upper part and movably disposed below the work plate;
an upper suction unit movably disposed above the work plate and having a plurality of suction areas;
an attachment part movably disposed above the work plate and connecting the bonding areas of the first film and the second film with an attachment member; and
It controls the upper and lower suction parts, the cutting part, and the attaching part, and a cutting mode for performing cutting in the cutting area, a transport mode for transferring the first film and the second film from the cutting area to the attaching area, and the first film and the second film in the attaching area. A film connecting device comprising a control unit having an attachment mode for performing attachment of two films. According to claim 1,
The control unit, in the cutting mode, sucks the first film by the lower suction part, lowers the upper suction part and sucks the second film by the upper suction part, and the first film through the cutting part. and a film connecting device that cuts the second film and sucks foreign substances generated during the cutting through the lower suction part. According to claim 2,
In the cutting mode, the lower suction unit is provided to suck the first film through at least one suction area and suck foreign substances through another suction area. According to claim 1,
a lower removal unit disposed on one side of the lower suction unit and configured to remove a removal area of the first film cut through the cutting unit; and
Further comprising an upper suction unit having a first area and a second area movable up and down with respect to the first area,
In the transfer mode, the control unit is configured so that the bonding area of the first film and the second film to be bonded is seated in the cutting area, the removal area of the first film to be removed other than the bonding area is removed through the lower removal unit, and the area to be removed other than the bonding area is removed. The removal area of the second film is wound and removed by the film supply unit, and the bonding area of the first film and the second film to be bonded is sucked through the upper suction unit, and the bonding area is located corresponding to the upper suction unit. A film connecting device that moves the lower suction part and the lower removal part, or the cutting part, the upper suction part and the attaching part. According to claim 4,
In the transfer mode, the control unit rotates the lower removal unit to remove the removal area of the first film, lifts the second area of the upper suction unit, and then winds the removal area of the second film to the film supply unit to remove the second film. A film connecting device that eliminates the removal area of According to claim 4,
In the transfer mode, the lower suction unit sucks the first film and the second film through at least two suction areas when the bonding areas of the first and second films to be bonded are seated in the bonding area. According to claim 6,
The control unit connects the first film and the second film by moving the attaching unit in the attaching mode and attaching the attaching member to the bonding area of the first film and the second film. According to claim 7,
The controller connects the first film and the second film by lowering the attaching part to the bonding area of the first film and the second film and then rotating the attaching part in the attaching mode. According to claim 7,
A film connecting device comprising an attachment roll having a plurality of holes for suctioning and fixing the attachment member. According to claim 1,
The cutting unit film connecting device including a cutting member made of a circular wheel-shaped or stick-shaped knife. According to claim 1,
The upper intake unit has a plurality of holes having a diameter of 2 mm to 6 mm. According to claim 1,
A film connection device in which an upper attachment layer containing foamed silicone is provided at the bottom of the upper suction part. According to claim 12,
The upper adhesive layer is a film connecting device having a plurality of holes having a diameter of 2 mm to 6 mm. According to claim 1,
The working plate is a film connecting device having a plurality of holes having a diameter of 2 mm to 6 mm in an attachment area. According to claim 1,
A film connection device having a lower attachment layer including a mixture of foamed silicone and nickel mesh or a mixture of foamed silicone and ceramic on the top of the attachment area. According to claim 15,
The lower adhesive layer is a film connecting device having a plurality of holes having a diameter of 2 mm to 6 mm. According to claim 15,
Film connection device provided with a mesh layer laminated on top of the lower adhesive layer. 18. The method of claim 17,
The mesh layer is a film connecting device having a plurality of holes of 100 mesh to 150 mesh. According to claim 1,
The attachment member is a film connecting device that is a single-sided tape having an attachment surface in a direction facing the first film and the second film. It relates to a method for connecting films using the film connecting device according to claim 1,
A cutting step of performing cutting of the first film and the second film;
a transfer step of controlling the movement of the cut first and second films from the cutting area to the attaching area; and
and an attaching step of connecting the first film and the second film moved to the attaching area.

Images