CN220700386U - Film laser processing and laminating equipment - Google Patents

Abstract

The application discloses film laser processing and laminating equipment, including film laser processing module, slice material feeding module, laminating module and ejection of compact module, film laser processing module is used for providing the film material and carries out laser processing to it, and film laser processing module includes laser processing subassembly and film blowing subassembly, absorption processing platform, the film material receiving module that sets gradually along film material blowing direction, and laser processing subassembly is located absorption processing platform top; the flaky material feeding module comprises a flaky material feeding assembly for providing flaky materials; the laminating module is including being used for transferring the laminating subassembly that laminates to the film material that adsorbs fixed on the processing platform with the slice material that slice material feeding subassembly provided, and the ejection of compact module is used for conveying the film material that has laminated to downstream equipment with slice material. The equipment integrates the thin film laser processing procedure and the sheet material laminating procedure, effectively improves the yield of the equipment, and has compact space layout and small occupied area.

Description

Film laser processing and laminating equipment

Technical Field

The application relates to the technical field of laser processing, and more particularly relates to thin film laser processing and laminating equipment.

Background

The organic/high polymer film with patterns is widely applied to semiconductor devices, display industries and the like, when the film is applied to laminating of sheet materials, the pattern processing precision requirement on the film is high, the precision requirement on laminating of the sheet materials and the film is also high, and along with the development of the industries, the requirements of high productivity requirements on the films are increased, so that the processing productivity of the films is higher.

In addition, to meet some process requirements, it is desirable to attach the film to the sheet material. At present, the existing film processing and laminating equipment has low processing precision of patterns on films, the laminating precision is also low, and the occupied area of the equipment is large.

Disclosure of Invention

In order to solve the above problems, the application provides a thin film laser processing and laminating equipment, and the scheme is as follows: the laser processing device comprises a film laser processing module, a sheet material feeding module, a laminating module and a discharging module, wherein the film laser processing module is used for providing film materials and carrying out laser processing on the film materials, the film laser processing module comprises a laser processing assembly, and a film discharging assembly, an adsorption processing platform and a film receiving assembly which are sequentially arranged along the discharging direction of the film materials, and the laser processing assembly is positioned above the adsorption processing platform; the film discharging assembly comprises a discharging roller for providing film materials, the adsorption processing platform is used for adsorbing and fixing or loosening at least one section of the film materials provided by the film discharging assembly, and the film collecting assembly comprises a collecting roller for collecting the film materials;

The flaky material feeding module comprises a flaky material feeding assembly for providing flaky materials;

the laminating module comprises a laminating assembly for transferring the flaky materials provided by the flaky material feeding assembly to the film materials fixed on the adsorption processing platform for lamination;

the discharging module is arranged at the output end of the laminating module and is used for conveying the laminated film material and the sheet material to downstream equipment.

Preferably, the film material discharging direction is a first direction, the sheet material feeding module is also arranged along the first direction so as to provide the sheet material along the first direction, and the film laser processing module and the sheet material feeding module are arranged at intervals.

Preferably, the sheet material feeding module and the discharging module are sequentially arranged along the first direction, and the discharging module discharges along the first direction.

Preferably, the laminating machine further comprises a sheet overturning module arranged between the laminating module and the discharging module, and the sheet overturning module is used for overturning the laminated film material and the sheet material 180 degrees and then transferring the film material and the sheet material to the discharging module.

Preferably, the piece turning module comprises a large-stroke triaxial cylinder, a fine-tuning triaxial cylinder, a rotary cylinder and a vacuum chuck, wherein the fine-tuning triaxial cylinder is connected to the large-stroke triaxial cylinder, the rotary cylinder is connected to the fine-tuning triaxial cylinder, and the vacuum chuck is connected to the rotary cylinder.

Preferably, the adsorption processing platform is connected with an adsorption platform movement module below, the adsorption platform movement module is a one-dimensional movement module or a two-dimensional movement module or a three-dimensional movement module, and the adsorption platform movement module is at least used for driving the adsorption processing platform to move back and forth between the film discharging assembly and the film collecting assembly along the film material discharging direction.

Preferably, the adsorption platform movement module is a two-dimensional movement module or a three-dimensional movement module;

the film material discharging direction is a first direction, the sheet material feeding module is also arranged along the first direction to provide the sheet material along the first direction, and the film laser processing module and the sheet material feeding module are arranged at intervals;

the adsorption platform movement module is further used for driving the adsorption processing platform to move towards the sheet material feeding module along a second direction or away from the sheet material feeding module along the second direction, and the second direction is perpendicular to the first direction.

Preferably, the number of the adsorption processing platforms is at least two, and at least two adsorption processing platforms are both located between the film discharging assembly and the film collecting assembly and can move towards the sheet material feeding module or move away from the sheet material feeding module along the second direction.

Preferably, the at least one section of the film material fixed on the adsorption processing platform includes a first surface with no viscosity and a second surface with viscosity, the adsorption processing platform adsorbs the first surface of the film material, and the attaching component is used for transferring the sheet material to the second surface of the film material fixed on the adsorption processing platform.

Preferably, the laser processing assembly comprises a laser and a galvanometer device, wherein the laser is used for emitting a laser beam, and the galvanometer device is used for controlling the laser beam to move along a preset pattern; the preset patterns comprise hollowed patterns and closed contour patterns, and the closed contour patterns are used for forming separation boundaries of the thin film materials which are processed each time and the unprocessed thin film materials.

Preferably, the galvanometer device comprises a galvanometer and a galvanometer moving mechanism connected with the galvanometer, and the galvanometer moving mechanism drives the galvanometer to move so as to finish the splicing processing of the preset pattern.

Preferably, the attaching assembly comprises a horizontal linear motion module, a vertical lifting motion module and a vacuum chuck, wherein the horizontal linear motion module is connected with the vertical lifting motion module, and the vacuum chuck is connected to the horizontal linear motion module or the vertical lifting motion module;

Or the attaching assembly comprises a rotary mechanical arm and a sucker assembly connected with the rotary mechanical arm;

or the attaching component is a manipulator and can move along any direction with the sheet material.

Preferably, the attaching module further comprises a CCD positioning assembly, wherein the CCD positioning assembly is positioned above or below the attaching assembly and is used for photographing the sheet material to obtain position data of the sheet material;

the attaching component adjusts the position of the sheet material according to the position data, or,

the adsorption processing platform adjusts the position of the film material according to the position data so as to ensure the attaching precision of the film material and the sheet material.

Preferably, the film laser processing module further comprises a waste removal component, wherein the waste removal component is arranged above the adsorption processing platform or between the adsorption processing platform and the sheet material feeding module and is used for removing waste generated during laser processing of film materials.

Preferably, the film laser processing module further comprises a side clamping assembly, wherein the side clamping assembly is arranged between the film discharging assembly and the film collecting assembly and is close to the adsorption processing platform and used for clamping unprocessed film materials to prevent the film materials from deforming or breaking.

Preferably, the film discharging assembly and the film collecting assembly further comprise lifting assemblies for lifting up unprocessed film materials, and the two lifting assemblies are respectively arranged between the discharging roller and the adsorption processing platform and between the collecting roller and the adsorption processing platform;

and/or;

the film laser processing module further comprises a de-ionization module for removing static electricity, and the de-ionization module is arranged between the discharging roller and the adsorption processing platform and is close to the adsorption processing platform.

Preferably, the sheet material feeding module further comprises a sheet material rotating assembly and/or a sheet material centering assembly, wherein the sheet material rotating assembly is arranged above the sheet material feeding assembly and used for rotating the sheet material to a required angle, and the sheet material centering assembly is arranged on two sides of the sheet material feeding assembly and used for positioning the sheet material.

According to the description, compared with the prior art, the technical scheme has the following beneficial effects:

1) The application provides a film laser processing and laminating equipment for the transportation, the processing and the laminating of film material, this equipment is with film laser processing process and slice material laminating process integration, reduces the equipment volume, can effectively promote the yields of equipment, including the machining precision that has improved the pattern on the film material and the precision that film material and slice material laminate. In addition, the equipment has compact space layout, small occupied area and short conveying distance of film materials, and can improve the utilization rate of the film.

2) Because the equipment that this application provided, the film material only needs once to adsorb, does not need the secondary to adsorb before film material and slice material laminating, and laminating precision is high.

3) Under the linkage of the movable vibrating mirror device and the adsorption platform moving module which drives the adsorption processing platform to move, the equipment can realize multi-breadth splicing processing of the film materials, the processing precision and the processing breadth of the film materials can be further improved, and the equipment can be suitable for various processing patterns and has high suitability.

4) Because the equipment that this application provided still includes CCD positioning module, CCD positioning module cooperates with adsorption platform motion module or laminating subassembly for film material is higher with the laminating precision of slice material, also can increase the yields simultaneously, improve the productivity.

5) Because film laser processing module and slice material feeding module, the laminating module among this application equipment can parallel arrangement, not only area is little, can improve the productivity, still makes things convenient for equipment to maintain simultaneously.

6) In the whole overall arrangement of this application equipment, slice material feeding module and slice material ejection of compact module can establish ties upstream and downstream equipment, have guaranteed the expansibility and the compatibility of equipment.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the provided drawings without inventive effort to those skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and should not be construed as limiting the scope of the invention, since any modification, variation in proportions, or adjustment of the size, which would otherwise be used by those skilled in the art, would not have the essential significance of the present disclosure, would not affect the efficacy or otherwise be achieved, and would still fall within the scope of the present disclosure.

Fig. 1 is a schematic structural diagram of a thin film laser processing and laminating apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a sheet feeding module and a bonding module according to an embodiment of the present disclosure;

Fig. 3 is a schematic structural diagram of a sheet turning module and a discharging module according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram of a part of a structure of a thin film laser processing module according to an embodiment of the present disclosure;

FIG. 5 is a simplified schematic diagram of a structural layout of another apparatus for laser processing and bonding thin films according to an embodiment of the present application;

fig. 6 is a schematic diagram of a structural layout of another thin film laser processing and bonding apparatus according to an embodiment of the present application.

Detailed Description

Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which it is shown, and in which it is evident that the embodiments described are exemplary only some, and not all embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

As shown in fig. 1, the application provides a film laser processing and laminating device, which comprises a film laser processing module 100, a sheet material feeding module 200, a laminating module 300 and a discharging module 500, wherein the film laser processing module 100 is used for providing a film material 10 and carrying out laser processing on the film material 10, the film laser processing module 100 comprises a laser processing component, and a film discharging component 110, an adsorption processing platform 120 and a film receiving component 130 which are sequentially arranged along the discharging direction of the film material, and the laser processing component is positioned above the adsorption processing platform 120; the film discharging assembly 110 comprises a discharging roller 111 for providing the film material 10, the adsorption processing platform 120 is used for adsorbing and fixing or loosening at least one section of the film material 10 provided by the film discharging assembly 110, and the adsorption processing platform 120 can firmly adsorb the film material 10 so that the film material 10 does not displace and the precision is affected; the film take-up assembly 130 includes a take-up roller 131 for taking up the film material 10;

The sheet feed module 200 includes a sheet feed assembly 210 for providing sheet 20;

the laminating module 300 includes a laminating module 310 for transferring the sheet material 20 provided by the sheet material feeding module 210 to the film material 10 fixed on the adsorption processing platform 120 for lamination;

the discharging module 500 is disposed at an output end of the laminating module 300, and is used for conveying the laminated film material 10 and the laminated sheet material 20 to downstream equipment. The thin film laser processing and laminating equipment that this application provided can realize the transportation, laser processing and the laminating of thin film material 10, and this equipment is with thin film laser processing process and slice material laminating process integration, has reduced the equipment volume, can effectively promote the yields of equipment, including the machining precision that has improved the pattern on the thin film material and the precision that thin film material and slice material laminate. In addition, the equipment has compact space layout, small occupied area and short conveying distance of film materials, and can improve the utilization rate of the film.

As another embodiment, as shown in fig. 1, the film material discharging direction is a first direction, the sheet material feeding module 200 is also arranged along the first direction to provide the sheet material 20 along the first direction, and the film laser processing module 100 is spaced from the sheet material feeding module 200. Through this layout structure, can further reduce area, make things convenient for equipment to maintain.

As another embodiment, the sheet material feeding module 200 and the discharging module 500 are sequentially arranged along the first direction, and the discharging module 500 discharges along the first direction. Through this layout structure, can further reduce area, make things convenient for equipment to maintain.

It should be noted that, the film discharging assembly 110, the adsorption processing platform 120, and the film receiving assembly 130 are sequentially disposed along the film material discharging direction, but not always in a collinear state, the adsorption processing platform 120 may be designed to be movable according to requirements, and the moving direction thereof is determined according to the process requirements, for example, vertical and/or parallel to the first direction; in addition, the sheet material feeding module 200 may be disposed along a direction at an angle to the first direction, for example, a vertical direction, and the specific arrangement direction of the sheet material feeding module 200 may be determined according to the actual requirement, so as to achieve the purposes of film laser processing and lamination.

As another embodiment, the film laser processing and laminating device further includes a sheet turning module 400 disposed between the laminating module 300 and the discharging module 500, and configured to turn the laminated film material 10 and the sheet material 20 180 ° and then transfer the laminated film material to the discharging module 500, and by setting the sheet turning module 400, the state of the sheet material 20 in the lower film material 10 can be converted into the state of the sheet material 20 in the upper film material 10, so that the sheet material 20 is contacted with the discharging module 500 instead of the film material 10 during discharging, thereby reducing damage to the film material 10 and avoiding damage to the appearance of the processed film material.

Wherein, a form of ejection of compact module 500 is including tongue module 510, belt assembly line 520, and wherein, tongue module 510 is a conventional structure, and the end of tongue module 510 is docked with the head of belt assembly line 520, and the belt that will take assembly line 520 head through the cylinder is ejecting, makes belt assembly line 520 length change, and the belt reaches the material receiving level, and the material is transferred out to the belt rotation after receiving the material, and then the cylinder is retracted, belt position is restored. Of course, the discharging module 500 may have other structures for achieving the same purpose.

One form of the sheet turning module 400 includes a large-stroke tri-axial cylinder 410, a fine-tuning tri-axial cylinder 420, a rotary cylinder 430, and a vacuum chuck 440, wherein the fine-tuning tri-axial cylinder 420 is connected to the large-stroke tri-axial cylinder 410, the rotary cylinder 430 is connected to the fine-tuning tri-axial cylinder 420, and the vacuum chuck 440 is connected to the rotary cylinder 430. By the flap module 400 of this structure, the vacuum chuck 440 on the flap module 400 can be precisely positioned to a desired position and rotated to a desired angle, and the rotation angle of this embodiment is preferably 180 °. Of course, the flap module 400 may have other structures for achieving the same purpose.

In the whole layout of the equipment, the sheet material feeding module 200 and the discharging module 500 can be connected with upstream and downstream equipment in series, so that the expansibility and compatibility of the equipment are ensured.

Further, the at least one section of the film material 10 that is adsorbed and fixed on the adsorption processing platform 120 includes a first surface that is not adhesive and a second surface that is adhesive, the first surface of the film material 10 is adsorbed by the adsorption processing platform 120, and the attaching component 310 is used for transferring the sheet material 20 onto the second surface of the film material 10 that is fixed on the adsorption processing platform 120. Wherein, the film material 10 is wound on the discharging roller 111 of the film discharging assembly 110 in a coiled manner, when the film material 10 is discharged and moved onto the adsorption processing table 120, the adsorption processing table 120 adsorbs the first surface of the film material 10, which is not sticky, and the second surface of the film material 10, which is sticky, faces outwards, and the laser processing module processes the second surface; after the laser processing of the film material 10 is completed, the sheet material 20 is carried onto the adsorption processing table 120 and is attached to the second surface with the adhesion of the film material 10 adsorbed and fixed on the adsorption processing table 120. Because the film material 10 only needs to be adsorbed once, secondary adsorption is not needed before the film material 10 is attached to the sheet material 20, and the attaching precision is high. Further, the film material may be treated to have a tackiness on the second side after being moved from the feed roll 111 to the suction processing stage 120, or the film material 10 may be already tacky when wound around the feed roll 111, and the tacky second side faces outward when wound.

Further, the film discharging assembly 110 can perform servo unreeling or stop unreeling through a groove type photoelectric signal. The laser processing assembly processes only one section of film material 10 at a time, and after the processing of one section is completed, the film discharging assembly 110 is controlled to discharge a new section of film material for processing.

As another embodiment, the adsorption processing platform 120 is a movable processing platform, specifically, an adsorption platform moving module 121 is connected below the adsorption processing platform 120, the adsorption platform moving module 121 is a one-dimensional moving module or a two-dimensional moving module or a three-dimensional moving module, and the adsorption platform moving module 121 is at least used for driving the adsorption processing platform 120 to move back between the film discharging assembly 110 and the film collecting assembly 130 along the film material discharging direction, so that the adsorption processing platform 120 can cooperate with the discharging roller 111 and the collecting roller 131 to better realize the discharging and collecting process, and prevent unprocessed film materials from being torn off in the process of continuously discharging and collecting after a section of film materials is processed.

Further, the adsorption platform movement module 121 is a two-dimensional movement module or a three-dimensional movement module; the film material discharging direction is a first direction, the sheet material feeding module 200 is also arranged along the first direction to provide the sheet material 20 along the first direction, and the film laser processing module 100 and the sheet material feeding module 200 are arranged at intervals; the adsorption platform moving module 121 is further configured to drive the adsorption processing platform 120 to move towards the sheet material feeding module 200 along a second direction or to move away from the sheet material feeding module 200 along the second direction, where the second direction is perpendicular to the first direction. By enabling the adsorption platform movement module 121 to drive the adsorption processing platform 120 to move along the second direction perpendicular to the film material direction, the movement stroke of the adsorption processing platform 120 is short, time is saved, and meanwhile, the equipment structure is compact.

Preferably, the adsorption platform movement module 121 may be a three-axis movement module, wherein three axes refer to an X axis, a Y axis, and a θ axis, wherein the X axis may be used for feeding the film material 10, and the X axis is the same as the feeding direction of the film feeding assembly 110, that is, the first direction; the Y axis may be used to move the processed film material 10 to a sheet material attaching position, which is perpendicular to the discharging direction of the film discharging assembly 110, that is, the second direction; the theta axis can be used for angle correction when the flaky material 20 is attached to the film material 10, and rotates in the horizontal direction; the adsorption platform movement module 121 can satisfy multiple processing figures, improves the suitability and the machining precision of equipment, and to this kind of condition, adsorption platform movement module 121 can reciprocating motion between film blowing subassembly 110 and laminating module 300, and convenient adsorption processing platform 120 removes to film blowing subassembly 110 earlier and gets the material, then removes to the processing position that laser processing subassembly place and processes, removes to slice material laminating position again after finishing processing and laminates, if required, can also remove the material that the laminating is accomplished to the next station after the laminating. The specific design of the adsorption platform movement module 121 may be varied according to the actual requirements and the equipment layout, and is not limited thereto.

As another embodiment, as shown in fig. 6, the number of the adsorption processing platforms 120 is at least two, and two are taken as an example, and the two adsorption processing platforms 120 are located between the film discharging assembly 110 and the film receiving assembly 130 and can move toward the sheet material feeding module 200 or move away from the sheet material feeding module 200 along the second direction. At least two movable adsorption processing platforms 120 are arranged in this way, when the first movable adsorption processing platform 120 completes the lamination, then the second movable adsorption processing platform 120 moves to the lamination position to perform lamination, in the lamination process of the second movable adsorption processing platform 120, the sheet-shaped material 20 of the first movable adsorption processing platform 120 is taken away for subsequent operations such as sheet turning and/or discharging, and the empty second movable adsorption processing platform 120 returns to the original position again to continue the laser processing of the new section of film material 10, and after the processing is completed, the second movable adsorption processing platform moves to the vicinity of the lamination position to wait for lamination. By providing at least two movable adsorption process stations 120, throughput can be further increased.

Further, the laser processing assembly comprises a laser and a galvanometer device, wherein the laser is used for emitting laser beams, and the galvanometer device is used for controlling the laser beams to move along a preset pattern; the preset patterns comprise hollowed patterns and closed contour patterns, and the closed contour patterns are used for forming separation boundaries of the thin film materials which are processed each time and the unprocessed thin film materials. In addition, can also set up the dust extraction device that is used for getting rid of laser processing and produce the dust according to the demand, the position of dust extraction device can be diversified, arranges and dust removal effect sets up according to the structure.

As another embodiment, the galvanometer device comprises a galvanometer and a galvanometer moving mechanism connected with the galvanometer, and the galvanometer moving mechanism drives the galvanometer to move so as to finish splicing processing of the preset pattern. Specifically, the vibrating mirror moving mechanism can be a servo screw rod assembly, the servo screw rod assembly moves along with the vibrating mirror and is matched with the adsorption platform moving module 121, the thin film material 10 can be subjected to multi-breadth splicing processing, the processing precision and the processing breadth of the thin film material 10 can be further improved, and the film material can be matched with various processing patterns and is high in suitability.

As another embodiment, as shown in fig. 4, the film discharging assembly 110 and the film collecting assembly 130 further include a lifting assembly 112 for lifting up the unprocessed film material 10, where the lifting assembly 112 is disposed between the discharging roller 111 and the adsorption processing platform 120 and between the collecting roller 131 and the adsorption processing platform 120, respectively, and is used for lifting up the unprocessed film material 10 after the processing of the adsorbed section of film material 10 on the adsorption processing platform 120 is completed, so that the unprocessed film material 10 is separated from the film material 10 on the adsorption processing platform 120 along the closed contour pattern, and the processed section of film material remains on the adsorption processing platform 120; in addition, the lifting assembly 112 may not be provided, and the suction table 120 may be lifted and lowered, so that the same object can be achieved.

In addition, the film discharge assembly 110 may further include a buffer module 113 for buffering the film material 10, as desired.

Further, as shown in fig. 4, the film laser processing module 100 further includes a de-ionization module 160 for removing static electricity, wherein the de-ionization module 160 is disposed between the discharging roller 111 and the adsorption processing platform 120 and is close to the adsorption processing platform 120, and the de-ionization module 160 is disposed to optimize the processing effect.

As another embodiment, the film laser processing module 100 further includes a waste removing component 140, where the waste removing component 140 is disposed above the adsorption processing platform 120 or between the adsorption processing platform 120 and the sheet material feeding module 200, and is used for removing waste generated during laser processing of the film material 10, and the installation position of the waste removing component 140 is determined according to the overall structural layout, and is not limited thereto, and does not interfere with laser processing; preferably, as shown in fig. 1, if the space above the suction processing platform 120 is insufficient, and the suction processing platform 120 is a movable processing platform, the material suction assembly 140 is disposed on the path from the suction processing platform 120 to the bonding station, so that the working time and space can be saved. The laminating station, i.e., the station where the laminating assembly 310 applies the sheet material 20 to the film material 10. More specifically, the waste material removing assembly 140 may include a lifting cylinder, a traversing cylinder connected to the lifting cylinder, and a waste material suction cup assembly connected to the traversing cylinder, and may further include a waste material collecting box, wherein the lifting cylinder is used for lifting the waste material suction cup assembly, and the traversing cylinder is used for moving the waste material suction cup assembly to a waste material sucking position and a waste position, and the waste material suction cup assembly transfers the waste material sucked to the waste material collecting box.

As another embodiment, the film laser processing module 100 further includes a side clamping assembly disposed between the film discharging assembly 110 and the film receiving assembly 130 near the adsorption processing platform 120 for clamping the unprocessed film material 10 to prevent the film material 10 from being deformed or broken.

As another example, as shown in fig. 2, the sheet material feeding module 200 further includes a sheet material rotating assembly 220 and/or a sheet material centering assembly 230, wherein the sheet material rotating assembly 220 is configured to rotate the sheet material 20 to a desired angle, and the sheet material centering assembly 230 is configured to position the sheet material 20. The sheet material feeding assembly 210 may be a belt conveying module, and may be a single-line conveying, that is, conveying the sheet material 20 one by one, or may be a multi-line conveying, that is, conveying the sheet material 20 multiple by one, according to specific feeding requirements, and fig. 2 shows that two sheets are conveyed at a time. Wherein the sheet material rotation assembly 220 may be disposed above the sheet material feed assembly 210, the rotation angle may be 90 ° or other angles. Wherein, the sheet material centering assembly 230 may be disposed at both sides of the sheet material feeding assembly 210 to implement a centering clip positioning process. In operation, the upstream sheet material 20 moves to the rotation position of the sheet material rotating assembly 220 through the sheet material feeding assembly 210, the sheet material rotating assembly 220 rotates the sheet material 20 by 90 °, the sheet material feeding assembly 210 continues to move the sheet material 20 to the centering position of the sheet material centering assembly 230, at this time, the sheet material centering assembly 230 performs the centering operation on the sheet material 20, and then the sheet material 20 moves to the material taking position corresponding to the attaching assembly 310.

As another embodiment, the attaching assembly 310 in the attaching module 300 may be in various forms as long as it can transfer the sheet material 20 provided by the sheet material feeding assembly 210 onto the film material 10 fixed on the adsorption processing platform 120, where the attaching assembly 310 in one form includes a horizontal linear motion module 311, a vertical lifting motion module 312, and a vacuum chuck 313, the horizontal linear motion module 311 is connected to the vertical lifting motion module 312, and the vacuum chuck 313 is connected to the horizontal linear motion module 311 or the vertical lifting motion module 312, as shown in fig. 2. Alternatively, the attaching assembly 310 includes a rotating mechanical arm and a suction cup assembly connected to the rotating mechanical arm, and in a rotating manner, the suction cup assembly can move between the sheet material feeding module 200 and the film laser processing module 100, so as to obtain the sheet material 20 provided by the sheet material feeding module 200, and then transfer the sheet material 20 to the film material 10 fixed on the adsorption processing platform 120 for attaching; alternatively, the laminating module 300 may be a robot 314 (the robot is of conventional construction and not shown in particular), and when the robot 314 is used, the suction platform 120 may be moved (i.e., the film material 10 does not need to be moved) and the robot 314 may be used to move the sheet material 20. Specifically, as shown in fig. 5, after the sheet material 20 is conveyed from the sheet material feeding assembly 210, the sheet material 20 is taken by using the manipulator 314 and then placed on the adsorption processing platform 120 to be attached to the processed film material 10, and after the attachment is completed, the material after the attachment is taken by using the manipulator 314 and then the subsequent operation stations are moved to perform such operations as turning and/or discharging.

As another embodiment, the laminating module 300 further includes a CCD positioning assembly 320, where the CCD positioning assembly 320 is located above or below the laminating assembly 310, and is used to photograph the sheet material 20 to obtain position data of the sheet material 20, and the laminating assembly 310 adjusts the position of the sheet material 20 according to the position data or the adsorption processing platform 120 adjusts the position of the film material 10 according to the position data to ensure laminating accuracy of the film material 10 and the sheet material 20. The CCD positioning assembly 320 is matched with the adsorption platform movement module 121 driving the adsorption processing platform to move 120 or the CCD positioning assembly 320 is matched with the laminating assembly 310, so that the laminating precision of the film material 10 and the sheet material 20 is higher, and meanwhile, the yield and the productivity can be increased.

Example 1

In this embodiment, a number of the adsorption processing platforms 120 is taken as an example, the adsorption platform movement module 121 is a three-axis movement module, and the adsorption platform movement module 121 drives the adsorption processing platform 120 and the film material 10 to reciprocate between the film discharging assembly 110 and the attaching module 300. Wherein, the attaching assembly 310 comprises a horizontal linear motion module 311, a vertical lifting motion module 312 and a vacuum chuck 313; the adsorption processing platform 120 is used for adjusting the position of the film material 10 so as to ensure the attaching precision of the film material 10 and the sheet material 20.

The specific working process is as follows:

the film material 110 is discharged from the discharging roller 111 of the film discharging assembly 110, the buffer module 113 works to buffer the film material 10, the deionizing module 160 starts to work, the adsorption processing platform 120 starts to adsorb, after the first surface of a section to be processed of the film material 10 is firmly adsorbed on the adsorption processing platform 120, the adsorption platform moving module 121 drives the adsorption processing platform 120 and the film material 10 to move to a laser processing station where the laser processing assembly is located, the dust extraction assembly in the laser processing assembly starts to work, at the moment, the galvanometer device in the laser processing assembly controls the laser to start processing part of the pattern on the film material 10, after a part of the pattern is processed, the galvanometer moving mechanism drives the galvanometer device to move to the next processing breadth, and the rest pattern continues to be processed until the processing is completed, and a hollowed pattern and a closed contour pattern are formed.

After the processing is finished, the jacking component 112 in the film discharging component 110 and the jacking component 112 in the film collecting component 130 jack up, so that the unprocessed part in the film material 10 is separated from the adsorption processing platform 120, and at the moment, the side clamping component works to clamp the unprocessed part in the film material 10, and prevent the film material 10 from deforming or breaking; the adsorption platform movement module 121 drives the adsorption processing platform 120 and the processed film material 10 to move to a waste sucking station arranged between the adsorption processing platform 120 and the sheet material feeding module 200 for waste removal, at this time, a lifting cylinder in the waste removing assembly 140 descends, after the waste sucking disc assembly adsorbs waste, the lifting cylinder returns to the original position, the transverse moving cylinder moves to the waste discharging position, the lifting cylinder descends, the waste sucking disc assembly breaks vacuum, and the lifting cylinder and the transverse moving cylinder return to the original position. The final adsorption platform movement module 121 drives the adsorption processing platform 120 and the processed film material 10 to move to the lamination position of the sheet material.

In the process of feeding and laser processing of the film discharging assembly 110, the sheet material feeding module 200 is also working, the time for waiting for the material by the device is reduced, the productivity is effectively improved, the upstream sheet material 20 is conveyed to the sheet material rotation position where the sheet material rotation assembly 220 is located through the sheet material feeding assembly 210, the sheet material rotation assembly 220 rotates the sheet material 20 by 90 degrees, the sheet material feeding assembly 210 continuously moves the sheet material 20 to the centering position where the sheet material centering assembly 230 is located, the sheet material centering assembly 230 performs the centering operation on the sheet material 20, and then the sheet material feeding assembly 210 moves the sheet material to the material taking position. The laminating assembly 310 in the laminating module 300 works, the horizontal linear motion module 311 in the laminating assembly 310 moves to the material taking position, the vertical lifting motion module 312 descends, the vacuum chuck 313 starts to work, after the sheet material 20 is absorbed, the vertical lifting motion module 312 returns to the initial position, the horizontal linear motion module 311 moves to the station where the CCD positioning assembly 320 is located, the vertical lifting motion module 312 descends to the photographing position, and the CDD positioning module 320 photographs and acquires position data of the sheet material 20 and sends the data to the absorption platform motion module 121. The adsorption platform movement module 121 adjusts the position of the sheet material 20 according to the position data, thereby completing positioning and deviation correction, ensuring the relative position of the film material 10 and the vacuum chuck 313 (and the adsorbed sheet material 20), and ensuring the precision in bonding. At the same time, the vertical lifting movement module 312 returns to the initial position, the horizontal linear movement module 311 continues to move to the bonding station (station where the sheet material is bonded to the film material), and the vertical lifting movement module 312 descends to the bonding waiting position.

After the bonding assembly 310 and the film discharging assembly 110 are ready, the vertical lifting movement module 312 is lowered to the bonding position, the vacuum chuck 313 breaks the vacuum, and the sheet material 20 is bonded with the processed film material 10.

After the lamination is completed, the adsorption platform movement module 121 drives the adsorption processing platform 120 to move to the turnover material taking position, the fine adjustment triaxial cylinder 420 in the flaky material turnover module 400 descends, the vacuum chuck 440 starts to adsorb, after the vacuum chuck 440 fully adsorbs the laminated flaky material 20 and the film material 10, the fine adjustment triaxial cylinder 420 ascends to the upper limit, the adsorption platform movement module 121 returns to the initial position, at the moment, the large-stroke triaxial cylinder 410 descends to the lower limit, and the rotary cylinder 430 rotates for 180 degrees to wait.

Then discharging, the tongue module 510 extends to the lower part of the rotary cylinder 430, the vacuum chuck 440 breaks vacuum, the fine adjustment triaxial cylinder 420 descends to the lower limit, and the belt assembly line 510 conveys the finished product to the next station.

Example 2

As shown in fig. 5, the difference from embodiment 1 is that the adsorption processing platform 120 can be made unnecessary to move (at least to the position of the sheet material feeding module 200, only between the film discharge module 110 and the film take-up module 130). The conforming assembly 310 is modified to the form of a manipulator 314; the CDD positioning module 320 photographs and obtains the position data of the sheet material 20, then sends the data to the manipulator 314, and adjusts the position of the film material 10 by using the manipulator 314 to ensure the attaching precision of the film material 10 and the sheet material 20.

In operation, after the sheet material 20 is conveyed from the sheet material feeding assembly 210, the sheet material 20 is taken by the manipulator 314 and then placed on the adsorption processing platform 120 to be attached to the processed film material 10, and after the attachment is completed, the manipulator 314 is used to take the attached material and move the subsequent operation stations to perform such operations as turning and/or discharging.

Example 3

As shown in fig. 6, the difference from embodiment 1 is that the number of the adsorption processing platforms 120 is two, and the two adsorption processing platforms 120 are located between the film discharging assembly 110 and the film receiving assembly 130 and can move back and forth between the film discharging assembly 110 and the sheet material feeding module 200. When the first movable adsorption processing platform 120 completes the lamination, then the second movable adsorption processing platform 120 moves to the lamination position for lamination, during the lamination process of the second movable adsorption processing platform 120, the sheet material 20 of the first movable adsorption processing platform 120 is taken away for subsequent operations such as turning and/or discharging, and the empty second movable adsorption processing platform 120 returns to the original position again for continuous laser processing of a new section of film material 10, and moves to the vicinity of the lamination position for lamination after the processing is completed. By providing two movable adsorption process stations 120, throughput can be further increased.

In the present specification, each embodiment is described in a progressive manner, or a parallel manner, or a combination of progressive and parallel manners, and each embodiment is mainly described as a difference from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

It should be noted that in the description of the present application, it is to be understood that the description of the drawings and embodiments are illustrative and not restrictive. Like diagramming marks throughout the embodiments of the specification identify like structures. In addition, the drawings may exaggerate the thicknesses of some layers, films, panels, regions, etc. for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In addition, "on …" refers to positioning an element on or under another element, but not essentially on the upper side of the other element according to the direction of gravity.

The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used for convenience in describing and simplifying the present application based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or apparatus that comprises such element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (17)

1. The film laser processing and laminating equipment is characterized by comprising a film laser processing module, a sheet material feeding module, a laminating module and a discharging module, wherein the film laser processing module is used for providing film materials and carrying out laser processing on the film materials, the film laser processing module comprises a laser processing assembly, and a film discharging assembly, an adsorption processing platform and a film receiving assembly which are sequentially arranged along the discharging direction of the film materials, and the laser processing assembly is positioned above the adsorption processing platform; the film discharging assembly comprises a discharging roller for providing film materials, the adsorption processing platform is used for adsorbing and fixing or loosening at least one section of the film materials provided by the film discharging assembly, and the film collecting assembly comprises a collecting roller for collecting the film materials;

the flaky material feeding module comprises a flaky material feeding assembly for providing flaky materials;

the laminating module comprises a laminating assembly for transferring the flaky materials provided by the flaky material feeding assembly to the film materials fixed on the adsorption processing platform for lamination;

the discharging module is arranged at the output end of the laminating module and is used for conveying the laminated film material and the sheet material to downstream equipment.

2. The film laser processing and bonding apparatus according to claim 1, wherein the film material discharging direction is a first direction, the sheet material feeding module is also arranged along the first direction to provide the sheet material along the first direction, and the film laser processing module is disposed at a distance from the sheet material feeding module.

3. The thin film laser processing and attaching apparatus according to claim 2, wherein the sheet material feeding module and the discharging module are sequentially arranged along the first direction, and the discharging module discharges along the first direction.

4. The film laser processing and bonding apparatus according to claim 1, further comprising a sheet-turning module disposed between the bonding module and the discharging module, for turning the bonded film material 180 ° with the sheet-like material and transferring the film material to the discharging module.

5. The thin film laser processing and attaching apparatus according to claim 4, wherein the flap module comprises a large-stroke triaxial cylinder, a fine-tuning triaxial cylinder, a rotary cylinder and a vacuum chuck, wherein the fine-tuning triaxial cylinder is connected to the large-stroke triaxial cylinder, the rotary cylinder is connected to the fine-tuning triaxial cylinder, and the vacuum chuck is connected to the rotary cylinder.

6. The thin film laser processing and attaching device according to claim 1, wherein an adsorption platform moving module is connected below the adsorption processing platform, the adsorption platform moving module is a one-dimensional moving module, a two-dimensional moving module or a three-dimensional moving module, and the adsorption platform moving module is at least used for driving the adsorption processing platform to move back and forth between the thin film discharging assembly and the thin film collecting assembly along the thin film material discharging direction.

7. The thin film laser processing and attaching device according to claim 6, wherein the adsorption platform movement module is a two-dimensional movement module or a three-dimensional movement module;

the film material discharging direction is a first direction, the sheet material feeding module is also arranged along the first direction to provide the sheet material along the first direction, and the film laser processing module and the sheet material feeding module are arranged at intervals;

the adsorption platform movement module is further used for driving the adsorption processing platform to move towards the sheet material feeding module along a second direction or away from the sheet material feeding module along the second direction, and the second direction is perpendicular to the first direction.

8. The film laser processing and bonding apparatus according to claim 7, wherein the number of the adsorption processing platforms is at least two, and at least two of the adsorption processing platforms are located between the film discharging assembly and the film receiving assembly and are movable toward the sheet material feeding module or away from the sheet material feeding module along the second direction.

9. The apparatus of claim 1 or 2, wherein the at least one section of the thin film material that is adsorbed and fixed on the adsorption processing platform includes a first surface that is non-adhesive and a second surface that is adhesive, the adsorption processing platform adsorbs the first surface of the thin film material, and the attaching assembly is configured to transfer the sheet material to the second surface of the thin film material that is fixed on the adsorption processing platform.

10. The thin film laser processing and attaching apparatus according to claim 1 or 2, wherein said laser processing assembly comprises a laser for emitting a laser beam and a galvanometer device for controlling said laser beam to move along a predetermined pattern; the preset patterns comprise hollowed patterns and closed contour patterns, and the closed contour patterns are used for forming separation boundaries of the thin film materials which are processed each time and the unprocessed thin film materials.

11. The thin film laser processing and attaching apparatus according to claim 10, wherein the galvanometer device includes a galvanometer and a galvanometer moving mechanism connected to the galvanometer, the galvanometer moving mechanism driving the galvanometer to move to complete the stitching of the predetermined pattern.

12. The thin film laser processing and bonding apparatus according to any one of claims 1 to 8, wherein the bonding assembly comprises a horizontal rectilinear motion module, a vertical lifting motion module, and a vacuum chuck, the horizontal rectilinear motion module is connected to the vertical lifting motion module, and the vacuum chuck is connected to the horizontal rectilinear motion module or the vertical lifting motion module;

or the attaching assembly comprises a rotary mechanical arm and a sucker assembly connected with the rotary mechanical arm;

or the attaching component is a manipulator and can move along any direction with the sheet material.

13. The thin film laser processing and attaching apparatus according to claim 1 or 2, wherein said attaching module further comprises a CCD positioning assembly, said CCD positioning assembly being located above or below said attaching assembly for photographing said sheet material to obtain position data of the sheet material;

The attaching component adjusts the position of the sheet material according to the position data, or,

the adsorption processing platform adjusts the position of the film material according to the position data so as to ensure the attaching precision of the film material and the sheet material.

14. The thin film laser processing and attaching apparatus according to claim 1 or 2, wherein the thin film laser processing module further comprises a waste removing component, the waste removing component is disposed above the adsorption processing platform or between the adsorption processing platform and the sheet material feeding module, and is used for removing waste generated when the thin film material is processed by laser.

15. The thin film laser processing and attaching apparatus according to claim 1 or 2, wherein said thin film laser processing module further comprises a side clamping assembly, said side clamping assembly being disposed between said thin film discharging assembly and said thin film receiving assembly at a position close to said adsorption processing platform for clamping unprocessed thin film material to prevent the thin film material from being deformed or broken.

16. The thin film laser processing and laminating apparatus according to claim 1 or 2, wherein the thin film discharging component and the thin film collecting component further comprise lifting components for lifting up unprocessed thin film materials, respectively, and the two lifting components are respectively disposed between the discharging roller and the adsorption processing platform and between the collecting roller and the adsorption processing platform;

And/or;

the film laser processing module further comprises a de-ionization module for removing static electricity, and the de-ionization module is arranged between the discharging roller and the adsorption processing platform and is close to the adsorption processing platform.

17. The film laser processing and laminating apparatus according to claim 1 or 2, wherein the sheet material feeding module further comprises a sheet material rotating assembly and/or a sheet material centering assembly, the sheet material rotating assembly is disposed above the sheet material feeding assembly for rotating the sheet material to a desired angle, and the sheet material centering assembly is disposed on both sides of the sheet material feeding assembly for positioning the sheet material.