JP2014063945A - Sheet peeling device, sheet peeling method, sheet resticking device, and sheet resticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet peeling device, a sheet peeling method, a sheet resticking device and a sheet resticking method which can only peel a second adhesive sheet and perform resticking when the second adhesive sheet is peeled from a first adhesive sheet and the second adhesive sheet which are sequentially stuck to a plate-like member and replaced with a third adhesive sheet.SOLUTION: A first adhesive sheet AS1 and a second adhesive sheet AS2 having such size as to protrude from an outer edge of a semiconductor wafer WF are sequentially stuck to one surface of the semiconductor wafer WF. The second adhesive sheet AS2 is peeled through a peeling tape PT and replaced with a third adhesive sheet AS3 by a sheet resticking device 10. The sheet resticking device 10 includes: plate-like member holding means 11 for holding the wafer WF; sheet holding means 12 for holding a protruded part AS1A; delivery means 13 for delivering the peeling tape PT; peeling tape sticking means 14 for sticking the peeling tape to the second adhesive sheet; peeling means 16 for peeling the second adhesive sheet from the first adhesive sheet by relatively moving the wafer and the peeling tape; and sticking means 15 for sticking the third adhesive sheet to the first adhesive sheet.

Description

  The present invention relates to a sheet peeling device and a peeling method, and a sheet pasting device and a pasting method. More specifically, the present invention relates to a sheet peeling device, a peeling method, and a plate-like member for peeling an adhesive sheet stuck on a plate-like member. The present invention relates to a sheet replacing apparatus and a replacing method that can peel off an adhesive sheet attached to a sheet and replace it with another adhesive sheet.

  Various adhesive sheets such as a protective adhesive sheet and an adhesive sheet for mounting with a ring-shaped frame member are affixed to a plate-like member such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”). The Such an adhesive sheet has a characteristic suitable for performing the wafer processing process, and may not be used in common between the processes. Affixing to an adhesive sheet is performed.

  Japanese Patent Application Laid-Open No. 2004-133260 discloses a re-seat device provided with a peeler capable of peeling a dicing sheet (first sheet) affixed to a wafer and re-placing the dicing sheet with a pickup sheet (second sheet). Yes.

JP 2007-88038 A

  However, when the structure is such that another adhesive sheet is interposed between the wafer and the dicing sheet, when the dicing sheet is peeled off, the other adhesive sheet is dicing when the dicing sheet is peeled off. There is an inconvenience that the sheet is peeled off along with the sheet. Also, even if the dicing sheet can be peeled off while leaving another adhesive sheet on the wafer side, if the other adhesive sheet has a part that protrudes from the wafer, the holding means that supports the wafer is moved to the pick-up sheet sticking device. The protruding portion of the adhesive sheet is rolled up by the air flow generated when the adhesive sheet is applied, causing the inconvenience that the adhesive sheets adhere to each other or stick to the holding means.

[Object of invention]
SUMMARY OF THE INVENTION An object of the present invention is to provide a sheet peeling apparatus and a peeling device capable of avoiding adhesion between the first adhesive sheets by keeping the position or posture of the protruding portion of the first adhesive sheet having a size protruding from the outer edge of the plate-like member at a fixed position. It is in providing a method and a sheet pasting apparatus and a pasting method.
Another object of the present invention is to securely hold the first adhesive sheet and replace only the second adhesive sheet when the second adhesive sheet attached via the first adhesive sheet is replaced with the third adhesive sheet. An object of the present invention is to provide a sheet peeling apparatus and a peeling method, and a sheet pasting apparatus and a pasting method that can peel the sheet.

  In order to achieve the above object, the present invention provides a sheet peeling apparatus for peeling the second adhesive sheet from a plate-like member in which first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface. The plate-like member holding means for holding the plate-like member from the other surface side, the feeding means for feeding out the peeling tape, the peeling tape attaching means for attaching the peeling tape to the second adhesive sheet, A peeling means for peeling the second adhesive sheet from the first adhesive sheet by moving the plate-like member and the peeling tape relative to each other, and holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member The sheet holding means is further provided.

  In the sheet peeling apparatus, the sheet holding unit includes an adsorption member having an adsorption surface along the protruding portion, and the adsorption member is provided so as to be displaceable with respect to the holding surface of the plate-like member holding unit. Is adopted.

  In the present invention, the second adhesive sheet is peeled off from the plate-like member in which the first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface, and the third adhesive is adhered to the first adhesive sheet. In the sheet pasting apparatus for pasting a sheet, a plate-like member holding means for holding the plate-like member from the other surface side, a feeding means for feeding out a peeling tape, and the peeling tape attached to the second adhesive sheet A peeling tape applying means for peeling, a peeling means for peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape, and the third adhesive sheet as the first adhesive sheet. And a sheet holding means for holding a protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member.

  In the sheet pasting apparatus, the sheet holding unit includes an adsorption member having an adsorption surface along the protruding portion, and the adsorption member is provided to be displaceable with respect to the holding surface of the plate-like member holding unit. The composition is taken.

  Further, the present invention provides a sheet peeling method in which the second adhesive sheet is peeled from a plate-like member in which the first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface. Holding from the other surface side, holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member, feeding the peeling tape, and attaching the peeling tape to the second adhesive A method is adopted which includes a step of attaching to a sheet and a step of separating and peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape.

  Further, according to the present invention, the second adhesive sheet is peeled off from the plate-like member in which the first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface, and the third adhesive is adhered to the first adhesive sheet. In the sheet pasting method for pasting a sheet, a step of holding the plate-like member from the other surface side, a step of holding a protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member, and a peeling tape A step of sticking out the peeling tape to the second adhesive sheet, and a peeling step of peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape. And a sticking step of sticking the third adhesive sheet to the first adhesive sheet.

According to the present invention, since the protruding portion of the first adhesive sheet can be held by the sheet holding means, when the second adhesive sheet is peeled off, by holding the protruding portion, the second adhesive sheet can be Only the second adhesive sheet can be peeled without accompanying the first adhesive sheet.
Further, even if the plate-like member holding means is moved to the sticking means side after the second adhesive sheet is peeled off, the protruding portion is not swollen by the air flow accompanying the movement, and the adhesion between the first adhesive sheets is also possible. It can be avoided.
Furthermore, by making the suction member displaceable with respect to the holding surface of the plate-like member holding means, the protruding portion can be sucked and held and kept at a predetermined position even if the thickness of the plate-like member changes.

The schematic side view of the sheet pasting apparatus which concerns on embodiment. The schematic perspective view of a sheet | seat holding means. (A), (B) is operation | movement explanatory drawing of a sheet pasting apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up, down, left, right, front, back, etc. are shown, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction orthogonal to the page. To do.

  The sheet pasting apparatus 10 includes a second adhesive sheet AS2 from a wafer WF as a plate-like member in which a first adhesive sheet AS1 and a second adhesive sheet AS2 having a size protruding from the outer edge are sequentially pasted on one surface (upper surface). The first adhesive sheet AS1 is a protective sheet having a size that protrudes from the outer edge of the wafer WF, and the second adhesive sheet AS2 is a device that peels the first adhesive sheet AS3 on the first adhesive sheet AS1. The wafer WF is a mount sheet that integrates the ring frame RF, and the third adhesive sheet AS3 is a dicing sheet.

  The sheet pasting apparatus 10 includes a plate-like member holding unit 11 that holds the wafer WF and the ring frame RF, a sheet holding unit 12 that holds the protruding portion AS1A of the first adhesive sheet AS1 protruding from the outer edge of the wafer WF, and a peeling. The feeding means 13 for feeding out the tape PT, the peeling tape sticking means 14 for sticking the peeling tape PT to the second adhesive sheet AS2, and the adhesive for sticking the third adhesive sheet AS3 to the first adhesive sheet AS1 and the ring frame RF The sheet sticking means 15, the peeling member 16 for peeling the second adhesive sheet AS 2 from the first adhesive sheet AS 1 by relatively moving the plate-like member holding means 11 and the peeling tape PT are configured. Here, the plate-like member holding means 11, the sheet holding means 12, the feeding means 13, the peeling tape applying means 14, and the peeling means 16 constitute a sheet peeling apparatus.

  As shown in FIG. 2, the plate-like member holding unit 11 includes a table 20 having a substantially rectangular outer shape. The table 20 includes a closed-loop groove 21 that opens to the upper surface side, and the upper surface inside the groove 21 is configured as a wafer holding surface 20A that holds the wafer WF by suction from the other surface (lower surface) side of the wafer WF. The upper surface outside the groove 21 is configured as a frame holding surface 20B that holds the ring frame RF by suction. The wafer holding surface 20A and the frame holding surface 20B are formed with suction holes 23 and 24, respectively, and these suction holes 23 and 24 are configured to communicate with a decompression means such as a suction pump or a vacuum ejector (not shown). .

  The sheet holding means 12 is disposed in a groove 21 formed in the table 20, and is supported by a plurality of linear motion motors LM1 as drive devices and an output shaft 27 of these linear motion motors LM1, and has a suction hole on the upper surface. 28 and is provided with an annular suction member 26 capable of sucking and holding the protruding portion AS1A of the first adhesive sheet AS1. The suction hole 28 communicates with a decompression means such as a suction pump or a vacuum ejector (not shown). Further, in the present embodiment, a total of four linear motion motors LM1 are used, that is, the left and right target positions in FIG. The adsorption surface of the adsorption member 26 is subjected to non-adhesion treatment such as fluororesin coating or rough surface treatment.

  The feeding means 13 is supported by the frame FP and supports the peeling tape PT so that the peeling tape PT can be fed, and a driving roller 32 that gives a feeding output to the peeling tape PT by a rotation motor DM1 as a driving device. A pinch roller 33 sandwiching the peeling tape PT between the drive roller 32, a guide roller 34 positioned at the lower end of the frame FP, a recess on the upper surface, a shaft 35, a coil spring 36, and a bush 37. The tape guide plate 38 always urged to the left side in FIG. 1 through FIG. 1, the cutter blade 40, an air cylinder 41 as a drive device for raising and lowering the cutter blade 40, and the air cylinder 41 in FIG. Supported by a slider of an air cylinder 42 as a driving device that is movably supported in a direction orthogonal to the paper surface and a linear motor as a driving device (not shown). It is, is constituted by the chuck cylinder 45 as a drive device for holding the leading end side of the peeling tape PT.

  The peeling tape attaching means 14 includes a heat block 46 and an air cylinder 47 as a driving device for moving the heat block 46 up and down.

  The adhesive sheet affixing means 15 includes a support roller 50 that supports the original fabric RS in which the third adhesive sheet AS3 is temporarily attached to the strip-shaped release sheet RL at predetermined intervals, and a rotation motor DM2 as a driving device. A driving roller 51 and a pinch roller 52 for applying a repetitive output to the raw fabric RS, a peeling member 54 for peeling the third adhesive sheet AS3 from the peeling sheet RL, and a ring frame RF and a first adhesive sheet AS1 for the third adhesive sheet AS3. And a take-up roller 57 for winding the release sheet RL.

  The peeling means 16 is constituted by a linear motion motor LM2 as a drive device, and the table 20 is supported by a slider 58 of the linear motion motor LM2. .

Next, the replacement method in this embodiment is demonstrated.
First, when the first adhesive sheet AS1 is pasted and the wafer WF integrated with the ring frame RF is transferred to the table 20 via the second adhesive sheet AS2, the plate-like member holding means 11 is transferred to the table 20 by a conveying means (not shown). Drives a decompression means (not shown) to suck and hold the wafer WF and the ring frame RF by the wafer holding surface 20A and the frame holding surface 20B, respectively. Further, the sheet holding means 12 drives the linear motion motor LM1 and a decompression means (not shown) to bring the suction member 26 into contact with the protruding portion AS1A and suck and hold the protruding portion AS1A.

Next, the feeding means 13 drives a linear motor (not shown), moves the chuck cylinder 45 in the right direction, moves the tape guide plate 38 in the right direction, and sandwiches the lead end side of the peeling tape PT. Thereafter, the chuck cylinder 45 is moved leftward, and the feeding means 13 drives the rotation motor DM1 to pull out the peeling tape PT. Thereafter, the peeling tape applying means 14 drives the air cylinder 47, lowers the heat block 46, and presses and applies the peeling tape PT to the outer peripheral portion of the second adhesive sheet AS2. Thereafter, the feeding means 13 drives the air cylinders 41 and 42 to lower the cutter blade 40 and move it in the direction perpendicular to the paper surface, whereby the peeling tape PT is cut above the recess of the tape guide plate 38.
Then, after the peeling tape applying means 14 drives the air cylinder 47 and raises the heat block 46, the peeling means 16 drives the linear motor LM2 to move the table 20 to the left. Thereby, as shown in FIG. 3A, the peeled second adhesive sheet AS2 is folded back, and the second adhesive sheet AS2 is peeled from the ring frame RF and the first adhesive sheet AS1.
At this time, since the protruding portion AS1A is adsorbed and held by the adsorbing member 26, the protruding portion AS1A can be reliably separated at the interface with the second adhesive sheet AS2, and the protruding portion AS1A is peeled off accompanying the second adhesive sheet AS2. Such inconvenience does not occur.

When the peeling of the second adhesive sheet AS2 is completed, the peeling means 16 further drives the linear motor LM2, and moves the table 20 toward the adhesive sheet sticking means 15.
When it is detected by a sensor (not shown) that the table 20 has reached a predetermined position, the sticking means 15 drives the rotation motor DM2 and feeds the original fabric RS by a predetermined length, whereby the third adhesive sheet AS3 is peeled off by the release sheet RL. Is peeled off. Then, as shown in FIG. 3B, the leading end side in the feeding direction is stuck to the ring frame RF by the pressing roller 56, and the third adhesive sheet AS3 is attached to the ring frame by further feeding the raw fabric RS and moving the table 20. Affixed to the RF and first adhesive sheet AS1. At this time, since the protruding portion AS1A is held at a predetermined position (for example, in a state flat with the upper surface of the first adhesive sheet AS1) by the adsorption member 26, the protruding portion AS1A does not adhere to the third adhesive sheet AS3, or Inconvenience that the pressing force is insufficient and is easily peeled off can be eliminated. When the application of the third adhesive sheet AS3 is completed, the plate-like member holding unit 11 and the sheet holding unit 12 stop the decompression unit (not shown), and release the adsorption of the wafer WF, the protruding portion AS1A, and the ring frame RF. . Thereafter, the wafer WF is transferred to the next process by a transfer means (not shown), and thereafter the same operation is performed.

Therefore, according to such an embodiment, when the first adhesive sheet AS1 having a size protruding from the outer edge of the wafer WF exists between the wafer WF and the second adhesive sheet AS2, the first adhesive sheet As a result, it is possible to avoid that AS1 is peeled off from the wafer WF along with the second adhesive sheet AS2, and only the second adhesive sheet AS2 can be reliably peeled off.
Further, since the second adhesive sheet AS2 is peeled off and the table 20 holding the wafer WF to which only the first adhesive sheet AS1 is attached is moved, the position or posture of the protruding portion AS1A can be kept constant. The air flow causes the protruding portion AS1A to be rolled up, thereby preventing the first adhesive sheets AS1 from adhering to each other.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary, and can adopt various configurations shown below.

For example, the adsorbing member 26 of the sheet holding unit 12 may be replaced with an intermittent member.
Further, the adsorbing member 26 is lowered after the second adhesive sheet AS2 is peeled from the ring frame RF, and after the third adhesive sheet AS3 is completely attached to the ring frame RF, the adsorbing member 26 is raised to protrude the protruding portion AS1A. May be affixed to the third adhesive sheet AS3.

Moreover, in the said embodiment, although the semiconductor wafer WF was shown as a plate-shaped member, other plate-shaped members, such as a glass plate, a steel plate, or a resin plate, can also be made object, and a semiconductor wafer is silicon wafer, It may be a compound wafer. The adhesive sheet to be attached to or peeled off from such a semiconductor wafer is not limited to a protective sheet, dicing tape, and die attach film, but may be any other sheet, film, tape, etc. it can.
Furthermore, in the embodiment, a configuration is shown in which the wafer WF is replaced in a state where the wafer WF is integrated with the ring frame RF. However, the wafer WF may be a single wafer that does not include the ring frame RF.
Further, the plate-like member holding means 11 is not limited to the configuration provided to be movable via the linear motor LM2, and the adhesive sheet attaching means 15 may be movable on the plate-like member holding means 11, Both may be movable.

  Furthermore, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet pasting apparatus 11 Plate-shaped member holding means 12 Sheet holding means 13 Feeding means 14 Peeling tape sticking means 15 Sticking means 16 Peeling means 20A Holding surface 26 Adsorption member AS1 1st adhesive sheet AS1A Overhang part AS2 2nd adhesive sheet AS3 Third adhesive sheet WF Semiconductor wafer (plate-like member)

Claims (6)

In the sheet peeling apparatus for peeling the second adhesive sheet from the plate-like member in which the first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface,
Plate-like member holding means for holding the plate-like member from the other surface side;
A feeding means for feeding out the peeling tape;
A peeling tape applying means for applying the peeling tape to the second adhesive sheet;
A peeling means for peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape;
A sheet peeling apparatus, further comprising sheet holding means for holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member.   The sheet holding means includes an adsorption member having an adsorption surface along the protruding portion, and the adsorption member is provided to be displaceable with respect to the holding surface of the plate-like member holding means. The sheet peeling apparatus according to 1. Sheet pasting which peels off the 2nd adhesive sheet and sticks the 3rd adhesive sheet on the 1st adhesive sheet from the tabular member in which the 1st and 2nd adhesive sheets of the size which protrudes from the outer edge on one side were stuck in order In the replacement device,
Plate-like member holding means for holding the plate-like member from the other surface side;
A feeding means for feeding out the peeling tape;
A peeling tape applying means for applying the peeling tape to the second adhesive sheet;
A peeling means for peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape; and an adhesive sheet sticking means for sticking the third adhesive sheet to the first adhesive sheet. ,
The sheet pasting apparatus further comprising sheet holding means for holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member.   The sheet holding means includes an adsorption member having an adsorption surface along the protruding portion, and the adsorption member is provided to be displaceable with respect to the holding surface of the plate-like member holding means. 3. The sheet pasting apparatus according to 3. In the sheet peeling method of peeling the second adhesive sheet from the plate-like member in which the first and second adhesive sheets of a size protruding from the outer edge are sequentially attached to one surface,
Holding the plate-like member from the other surface side;
Holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member;
A step of feeding out the peeling tape;
Applying the release tape to the second adhesive sheet;
A sheet peeling method comprising: a step of peeling the second adhesive sheet from the first adhesive sheet and peeling the second adhesive sheet by relatively moving the plate member and the peeling tape. Sheet pasting which peels off the 2nd adhesive sheet and sticks the 3rd adhesive sheet on the 1st adhesive sheet from the tabular member in which the 1st and 2nd adhesive sheets of the size which protrudes from the outer edge on one side were stuck in order In the alternative method,
Holding the plate-like member from the other surface side;
Holding the protruding portion of the first adhesive sheet protruding from the outer edge of the plate-like member;
A step of feeding out the peeling tape;
Applying the release tape to the second adhesive sheet;
A peeling step of peeling the second adhesive sheet from the first adhesive sheet by relatively moving the plate-like member and the peeling tape;
A sheet pasting method, comprising: a pasting step of pasting the third adhesive sheet onto the first adhesive sheet.

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