KR20230005501A - Improved program operation method of three dimensional flash memory - Google Patents

Abstract

Disclosed is an improved program operation method of a three-dimensional flash memory, which can promote an effect of overcoming a limitation that an existing ISPP method has. According to one embodiment of the present invention, a three-dimensional flash memory includes: word lines formed to extend in a horizontal direction on a substrate and separately disposed in a vertical direction; and cell strings penetrating the word lines and formed to extend in the vertical direction, wherein each of the cell strings includes a data storage pattern formed to extend in the vertical direction and a vertical channel pattern covering an inner side wall of the data storage pattern and formed to extend in the vertical direction, and the data storage pattern and the vertical channel pattern constitute memory cells corresponding to the word lines. According to one embodiment of the present invention, the program operation method of the three-dimensional flash memory includes: a step of applying a program voltage, which has a value obtained by adding a step voltage to a previous program voltage applied in a previous program operation, to a selected word line corresponding to a target memory cell from among the word lines. The step voltage increases with a repetition of program operations.

Description

Improved program operation method of 3D flash memory {IMPROVED PROGRAM OPERATION METHOD OF THREE DIMENSIONAL FLASH MEMORY}

The following embodiments relate to an improved program operating method of a 3D flash memory, and more specifically, to a program operating method based on ISSP (Incremental Step Pulse Programming).

A flash memory device is an electrically erasable programmable read only memory (EEPROM) by electrically controlling input and output of data by Fowler-Nordheimtunneling or hot electron injection. , can be commonly used in computers, digital cameras, MP3 players, game systems, memory sticks, and the like.

Such a flash memory device uses an incremental step pulse programming (ISPP) method to solve a problem of deterioration of program characteristics as program operations are repeated.

The ISPP method is a program method in which a program voltage is increased and applied by a step voltage of a predetermined size as the program operation is repeated. As shown in FIG. The program voltage Vpgm2 obtained by adding the step voltage ΔV to the program voltage Vpgm1 applied in the program operation is applied, and the step voltage (ΔV) is applied to the program voltage Vpgm2 applied in the second program operation in the third program operation. The program voltage Vpgm3 to which V) is added is applied.

In this conventional ISPP method, the step voltage (ΔV), which is the difference between the previous program voltage applied in the previous program operation and the current program voltage to be applied in the current program operation, is always maintained constant regardless of repetition of the program operation. to be characterized

However, this conventional ISPP method has a limit in that it cannot prevent deterioration of program characteristics according to the degree of nitride trap of ONO used as a data storage pattern even if the program voltage is increased as the program operation is repeated.

Therefore, the following embodiments intend to propose a technique to overcome the limitations of the existing ISPP scheme.

Embodiments propose a program operation method of a 3D flash memory using an improved ISPP method in order to overcome the limitations of the existing ISPP method.

More specifically, one embodiment proposes a program operation method of a 3D flash memory in which a step voltage is increased as the program operation is repeated.

However, the technical problems to be solved by the present invention are not limited to the above problems, and can be variously expanded without departing from the technical spirit and scope of the present invention.

According to one embodiment, word lines extending in a horizontal direction on a substrate and spaced apart in a vertical direction are arranged; and cell strings passing through the word lines and extending in the vertical direction, each of the cell strings extending in the vertical direction while covering a data storage pattern extending in the vertical direction and an inner wall of the data storage pattern. A program operation method of a 3D flash memory comprising a vertical channel pattern formed, and the data storage pattern and the vertical channel pattern constitute memory cells corresponding to the word lines, wherein among the word lines and applying a program voltage, wherein the program voltage has a value obtained by adding a step voltage to a previous program voltage applied in a previous program operation, to a selected word line corresponding to a target memory cell, wherein the step voltage is It may be characterized in that it increases as it is repeated.

According to one aspect, the step voltage may be maintained constant for each program voltage range and then increased when the program voltage range changes.

According to another aspect, the step voltage at which the program voltage is increased may be continuously increased in proportion to repetition of the program operation.

Embodiments may achieve an effect of overcoming the limitations of the existing ISPP method by proposing a program operation method of a 3D flash memory using the improved ISPP method.

More specifically, one embodiment may propose a program operation method of a 3D flash memory in which a step voltage is increased as the program operation is repeated.

However, the effects of the present invention are not limited to the above effects, and can be variously extended without departing from the technical spirit and scope of the present invention.

1 is a conceptual diagram for explaining an existing ISPP scheme.
2 is a simplified circuit diagram illustrating an array of three-dimensional flash memories according to one embodiment.
3 is a plan view illustrating a structure of a 3D flash memory according to an exemplary embodiment.
FIG. 4 is a cross-sectional view showing the structure of a 3D flash memory according to an exemplary embodiment, and corresponds to a cross-section of FIG. 3 taken along line A-A'.
5 is a flowchart illustrating a program operation of a 3D flash memory according to an exemplary embodiment.
6 and 7 are conceptual views illustrating a program operation of a 3D flash memory according to an exemplary embodiment.
8 is a perspective view schematically illustrating an electronic system including a 3D flash memory according to an exemplary embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited or limited by the examples. Also, like reference numerals in each figure denote like members.

In addition, terms used in this specification (terminology) are terms used to appropriately express preferred embodiments of the present invention, which may vary according to the intention of a viewer or operator or customs in the field to which the present invention belongs. Therefore, definitions of these terms will have to be made based on the content throughout this specification. For example, in this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. Also, as used herein, "comprises" and/or "comprising" means that a referenced component, step, operation, and/or element is one or more other components, steps, operations, and/or elements. The presence or addition of elements is not excluded. In addition, although terms such as first and second are used in this specification to describe various regions, directions, shapes, etc., these regions, directions, and shapes should not be limited by these terms. These terms are only used to distinguish one area, direction or shape from another area, direction or shape. Accordingly, a portion referred to as a first portion in one embodiment may be referred to as a second portion in another embodiment.

Also, it should be understood that the various embodiments of the present invention are different from each other but are not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in one embodiment in another embodiment without departing from the spirit and scope of the present invention. In addition, it should be understood that the location, arrangement, or configuration of individual components in the scope of each embodiment presented may be changed without departing from the spirit and scope of the present invention.

Hereinafter, a 3D flash memory according to embodiments, an operating method thereof, and an electronic system including the same will be described in detail with reference to the drawings.

2 is a simplified circuit diagram illustrating an array of three-dimensional flash memories according to one embodiment.

Referring to FIG. 2 , a three-dimensional flash memory array according to an embodiment includes a common source line CSL, a plurality of bit lines BL0, BL1, and BL2, and the common source line CSL and bit lines BL0. , BL1, and BL2) may include a plurality of cell strings CSTR.

The bit lines BL0 , BL1 , and BL2 may be two-dimensionally arranged while being spaced apart from each other along the first direction D1 while extending in the second direction D2 . Here, each of the first direction D1 , the second direction D2 , and the third direction D3 are orthogonal to each other and may form a rectangular coordinate system defined by X, Y, and Z axes.

A plurality of cell strings CSTR may be connected in parallel to each of the bit lines BL0 , BL1 , and BL2 . The cell strings CSTR may be connected in common to the common source line CSL while being provided between the bit lines BL0 , BL1 , and BL2 and one common source line CSL. In this case, a plurality of common source lines CSL may be provided, and the plurality of common source lines CSL are spaced apart from each other along the second direction D2 while extending in the first direction D1 and have a two-dimensional can be arranged sequentially. The same voltage may be electrically applied to the plurality of common source lines CSL, but different voltages may be applied as each of the plurality of common source lines CSL is electrically independently controlled without being limited or limited thereto. there is.

The cell strings CSTR may be spaced apart from each other along the second direction D2 for each bit line while extending in the third direction D3 and may be arranged. According to an embodiment, each of the cell strings CSTR includes a ground select transistor GST connected to the common source line CSL and first and second strings connected in series to bit lines BL0, BL1, and BL2. Select transistors SST1 and SST2, memory cell transistors MCT connected in series while being disposed between the ground select transistor GST and the first and second string select transistors SST1 and SST2, and an erase control transistor ECT ) can be configured. Also, each of the memory cell transistors MCT may include a data storage element.

For example, each of the cell strings CSTR may include first and second string select transistors SST1 and SST2 connected in series, and the second string select transistor SST2 may include bit lines BL0 and BL1 , BL2). However, without being limited thereto, each of the cell strings CSTR may include one string select transistor. As another example, the ground select transistor GST in each of the cell strings CSTR may be composed of a plurality of MOS transistors connected in series similarly to the first and second string select transistors SST1 and SST2. .

One cell string CSTR may include a plurality of memory cell transistors MCT having different distances from the common source lines CSL. That is, the memory cell transistors MCT may be connected in series while being disposed along the third direction D3 between the first string select transistor SST1 and the ground select transistor GST. The erase control transistor ECT may be connected between the ground select transistor GST and the common source lines CSL. Each of the cell strings CSTR is formed between the first string select transistor SST1 and the uppermost one of the memory cell transistors MCT and between the ground select transistor GST and the lowermost one of the memory cell transistors MCT. Dummy cell transistors DMC connected to each other may be further included.

According to an embodiment, the first string select transistor SST1 may be controlled by the first string select lines SSL1-1, SSL1-2, and SSL1-3, and the second string select transistor SST2 may be It can be controlled by 2 string select lines (SSL2-1, SSL2-2, SSL2-3). The memory cell transistors MCT may be respectively controlled by a plurality of word lines WL0 - WLn, and the dummy cell transistors DMC may be respectively controlled by a dummy word line DWL. The ground select transistor GST may be controlled by the ground select lines GSL0 , GSL1 , and GSL2 , and the erase control transistor ECT may be controlled by the erase control line ECL. A plurality of erasure control transistors ECT may be provided. Common source lines CSL may be commonly connected to sources of erase control transistors ECT.

Gate electrodes of the memory cell transistors MCT, which are provided at substantially the same distance from the common source lines CSL, may be connected in common to one of the word lines WL0 - WLn and DWL to be in an equipotential state. . However, without being limited thereto, even if the gate electrodes of the memory cell transistors MCT are provided at substantially the same level from the common source lines CSL, the gate electrodes provided in different rows or columns may be independently controlled. there is.

Ground select lines (GSL0, GSL1, GSL2), first string select lines (SSL1-1, SSL1-2, SSL1-3) and second string select lines (SSL2-1, SSL2-2, SSL2-3) ) may extend along the first direction D1, be spaced apart from each other in the second direction D2, and be two-dimensionally arranged. ground selection lines GSL0, GSL1, and GSL2 provided at substantially the same level from the common source lines CSL, first string selection lines SSL1-1, SSL1-2, SSL1-3, and a second string The selection lines SSL2-1, SSL2-2, and SSL2-3 may be electrically separated from each other. Also, erase control transistors ECT of different cell strings CSTR may be controlled by a common erase control line ECL. The erase control transistors ECT may generate gate induced drain leakage (GIDL) during an erase operation of the memory cell array. In some embodiments, an erase voltage may be applied to the bit lines BL0 , BL1 , and BL2 and/or the common source lines CSL during an erase operation of the memory cell array, and the string select transistor SST and/or Alternatively, gate induced leakage current may be generated in the erasure control transistors ECT.

The above-described string selection line SSL may be expressed as an upper selection line USL, and the ground selection line GSL may be expressed as a lower selection line.

3 is a plan view illustrating a structure of a 3D flash memory according to an exemplary embodiment. FIG. 4 is a cross-sectional view showing the structure of a 3D flash memory according to an exemplary embodiment, and corresponds to a cross-section of FIG. 3 taken along line A-A'.

3 and 4 , the substrate SUB may be a semiconductor substrate such as a silicon substrate, a silicon-germanium substrate, a germanium substrate, or a monocrystalline epitaxial layer grown on a monocrystalline silicon substrate. . The substrate SUB may be doped with first conductivity-type impurities (eg, P-type impurities).

Stacked structures ST may be disposed on the substrate SUB. The stacked structures ST may be two-dimensionally disposed along the second direction D2 while extending in the first direction D1. In addition, the stacked structures ST may be spaced apart from each other in the second direction D2.

Each of the stacked structures ST includes gate electrodes EL1 , EL2 , and EL3 alternately stacked in a vertical direction perpendicular to the upper surface of the substrate SUB (eg, in the third direction D3 ), and interlayer insulating films ILD. can include The stacked structures ST may have substantially flat upper surfaces. That is, top surfaces of the stacked structures ST may be parallel to the top surface of the substrate SUB. Hereinafter, the vertical direction means the third direction D3 or a direction opposite to the third direction D3.

Referring back to FIG. 2 , each of the gate electrodes EL1 , EL2 , and EL3 includes an erase control line ECL, ground select lines GSL0 , GSL1 , and GSL2 sequentially stacked on the substrate SUB, and a word line. (WL0-WLn, DWL), one of the first string selection lines (SSL1-1, SSL1-2, SSL1-3) and the second string selection lines (SSL2-1, SSL2-2, SSL2-3) can be

Each of the gate electrodes EL1 , EL2 , and EL3 may have substantially the same thickness in the third direction D3 while extending in the first direction D1 . Hereinafter, the thickness means the thickness in the third direction D3. Each of the gate electrodes EL1 , EL2 , and EL3 may be formed of a conductive material. For example, each of the gate electrodes EL1 , EL2 , EL3 may be a doped semiconductor (ex, doped silicon, etc.), a metal (ex, W (tungsten), Cu (copper), Al (aluminum), Ti (titanium), It may include at least one selected from Ta (tantalum), Mo (molybdenum), Ru (ruthenium), Au (gold), etc.) or conductive metal nitride (ex, titanium nitride, tantalum nitride, etc.). Each of the gate electrodes EL1 , EL2 , and EL3 may include at least one of all metal materials that can be formed by ALD in addition to the metal material described above.

More specifically, the gate electrodes EL1 , EL2 , and EL3 include a lowermost first gate electrode EL1 , an uppermost third gate electrode EL3 , and the first and third gate electrodes EL1 and EL3 . A plurality of second gate electrodes EL2 may be included therebetween. Although each of the first gate electrode EL1 and the third gate electrode EL3 is shown and described in the singular number, this is exemplary and not limited thereto, and the first gate electrode EL1 and the third gate electrode EL3 may be used as necessary. may be provided in plural. The first gate electrode EL1 may correspond to one of the ground selection lines GSL0 , GSL1 , and GLS2 shown in FIG. 2 . The second gate electrode EL2 may correspond to any one of the word lines WL0 - WLn and DWL shown in FIG. 2 . The third gate electrode EL3 includes any one of the first string select lines SSL1-1, SSL1-2 and SSL1-3 shown in FIG. 2 or the second string select lines SSL2-1 and SSL2-2. , SSL2-3).

Although not shown, an end of each of the stacked structures ST may have a stepwise structure along the first direction D1. More specifically, the lengths of the gate electrodes EL1 , EL2 , and EL3 of the stack structures ST in the first direction D1 may decrease as the distance from the substrate SUB increases. The third gate electrode EL3 may have the smallest length in the first direction D1 and the largest distance from the substrate SUB in the third direction D3. The first gate electrode EL1 may have the longest length in the first direction D1 and the shortest distance from the substrate SUB in the third direction D3. Due to the stepped structure, the thickness of each of the stacked structures ST may decrease as the distance from the outermost one of the vertical channel structures VS described later increases, and the gate electrodes EL1, Sidewalls of EL2 and EL3 may be spaced apart at regular intervals along the first direction D1 when viewed in plan.

Each of the interlayer insulating layers ILD may have different thicknesses. For example, the lowermost and uppermost interlayer insulating layers ILD may have a smaller thickness than other interlayer insulating layers ILD. However, this is illustrative and not limited thereto, and the thickness of each of the interlayer insulating layers ILD may be different from each other according to the characteristics of the semiconductor device or all may be set to be the same. The interlayer insulating layers ILD may be formed of an insulating material to insulate between the gate electrodes EL1 , EL2 , and EL3 . For example, the interlayer insulating layers ILD may be formed of silicon oxide.

Although it has been described that interlayer insulating layers ILD are included in each of the stacked structures ST, air gaps may be included in each of the stacked structures ST instead of the interlayer insulating layers ILD. In this case, the air gaps may be alternately disposed with the gate electrodes EL1 , EL2 , and EL3 as in the interlayer insulating layer ILD to enable insulation between the gate electrodes EL1 , EL2 , and EL3 .

A plurality of channel holes CH penetrating portions of the stacked structures ST and the substrate SUB may be provided. Vertical channel structures VS may be provided in the channel holes CH. The vertical channel structures VS are the plurality of cell strings CSTR shown in FIG. 2 , and may extend in the third direction D3 while being connected to the substrate SUB. The connection of the vertical channel structures VS with the substrate SUB may be achieved by partially burying a portion of each of the vertical channel structures VS in the substrate SUB, but is not limited thereto, and the vertical channel structures VS are not limited thereto. The lower surface of (VS) may be made by contacting the upper surface of the substrate (SUB). When portions of each of the vertical channel structures VS are buried in the substrate SUB, lower surfaces of the vertical channel structures VS may be positioned at a lower level than the upper surface of the substrate SUB.

A plurality of columns of vertical channel structures VS passing through any one of the stacked structures ST may be provided. For example, as shown in FIG. 3 , columns of two vertical channel structures VS may pass through one of the stacked structures ST. However, without being limited thereto, three or more columns of vertical channel structures VS may pass through one of the stacked structures ST. In a pair of adjacent columns, the vertical channel structures VS corresponding to one column may be shifted in the first direction D1 from the vertical channel structures VS corresponding to the other adjacent column. there is. When viewed from a plan view, the vertical channel structures VS may be arranged in a zigzag shape along the first direction D1. However, without being limited thereto, the vertical channel structures VS may form an array arranged side by side in rows and columns.

Each of the vertical channel structures VS may extend from the substrate SUB in the third direction D3. In the drawing, each of the vertical channel structures VS is shown as having a column shape having the same width at the top and bottom, but is not limited thereto, and is not limited thereto. It may have a shape in which the width to (D2) is increased. This is due to the limitation that, when the channel holes CH are etched, the widths in the first and second directions D1 and D2 decrease toward the opposite direction of the third direction D3 . The upper surface of each of the vertical channel structures VS may have a circular shape, an elliptical shape, a rectangular shape, or a bar shape.

Each of the vertical channel structures VS may include a data storage pattern DSP, a vertical channel pattern VCP, a vertical semiconductor pattern VSP, and a conductive pad PAD. In each of the vertical channel structures VS, the data storage pattern DSP may have a pipe shape or macaroni shape with an open bottom, and the vertical channel pattern VCP may have a pipe shape or macaroni shape with a closed bottom. can have a shape. The vertical semiconductor pattern VSP may fill a space surrounded by the vertical channel pattern VCP and the conductive pad PAD.

The data storage pattern DSP covers the inner walls of each of the channel holes CH and contacts the vertical channel pattern VCP inwardly and contacts the sidewalls of the gate electrodes EL1 , EL2 , and EL3 outwardly. can Accordingly, the regions corresponding to the second gate electrodes EL2 of the data storage pattern DSP are the second gate electrodes along with the regions corresponding to the second gate electrodes EL2 of the vertical channel pattern VCP. Memory cells in which a memory operation (program operation, read operation, or erase operation) is performed by a voltage applied through EL2 may be configured. The memory cells correspond to the memory cell transistors MCT shown in FIG. 2 . That is, the data storage pattern DSP traps charges or holes by a voltage applied through the second gate electrodes EL2 or maintains a state of charges (eg, a polarization state of charges) in a 3D flash memory. It can act as a data repository. For example, an ONO (tunnel oxide-charge storage layer (Nitride)-blocking oxide layer) layer or a ferroelectric layer may be used as the data storage pattern DSP. Such a data storage pattern DSP may represent binary data values or multi-valued data values with changes in trapped charges or holes, or represent binary data values or multi-valued data values with changes in states of charges.

The vertical channel pattern VCP may cover an inner wall of the data storage pattern DSP. The vertical channel pattern VCP may include a first portion VCP1 and a second portion VCP2 on the first portion VCP1.

The first portion VCP1 of the vertical channel pattern VCP may be provided under each of the channel holes CH and may contact the substrate SUB. The first portion VCP1 of the vertical channel pattern VCP may be used to block, suppress, or minimize leakage current in each of the vertical channel structures VS and/or to form an epitaxial pattern. A thickness of the first portion VCP1 of the vertical channel pattern VCP may be greater than, for example, a thickness of the first gate electrode EL1. A sidewall of the first part VCP1 of the vertical channel pattern VCP may be surrounded by the data storage pattern DSP. A top surface of the first portion VCP1 of the vertical channel pattern VCP may be positioned at a higher level than a top surface of the first gate electrode EL1. More specifically, the top surface of the first part VCP1 of the vertical channel pattern VCP may be positioned between the top surface of the first gate electrode EL1 and the bottom surface of the lowermost one of the second gate electrodes EL2. A lower surface of the first portion VCP1 of the vertical channel pattern VCP may be positioned at a lower level than an uppermost surface of the substrate SUB (ie, a lower surface of a lowermost one of the interlayer insulating layers ILD). A portion of the first portion VCP1 of the vertical channel pattern VCP may overlap the first gate electrode EL1 in a horizontal direction. Hereinafter, the horizontal direction refers to an arbitrary direction extending on a plane parallel to the first and second directions D1 and D2.

The second portion VCP2 of the vertical channel pattern VCP may extend in the third direction D3 from the upper surface of the first portion VCP1. The second portion VCP2 of the vertical channel pattern VCP may be provided between the data storage pattern DSP and the vertical semiconductor pattern VSP, and may correspond to the second gate electrodes EL2. Accordingly, the second portion VCP2 of the vertical channel pattern VCP may form memory cells together with regions corresponding to the second gate electrodes EL2 of the data storage pattern DSP, as described above. .

A top surface of the second part VCP2 of the vertical channel pattern VCP may be substantially coplanar with a top surface of the vertical semiconductor pattern VSP. A top surface of the second part VCP2 of the vertical channel pattern VCP may be positioned at a level higher than a top surface of an uppermost one of the second gate electrodes EL2 . More specifically, the upper surface of the second portion VCP2 of the vertical channel pattern VCP may be positioned between the upper and lower surfaces of the third gate electrode EL3 .

The vertical channel pattern VCP is a component that transfers charges or holes to the data storage pattern DSP, and may be formed of monocrystalline silicon or polysilicon to form a channel or to be boosted by an applied voltage. However, without being limited thereto, the vertical channel pattern VCP may be formed of an oxide semiconductor material capable of blocking, suppressing, or minimizing leakage current. For example, the vertical channel pattern VCP may be formed of an oxide semiconductor material including at least one of In, Zn, and Ga having excellent leakage current characteristics, or a Group 4 semiconductor material. The vertical channel pattern VCP may be formed of, for example, a ZnOx-based material including AZO, ZTO, IZO, ITO, IGZO, or Ag-ZnO. Accordingly, the vertical channel pattern VCP may block, suppress, or minimize leakage current to the gate electrodes EL1 , EL2 , and EL3 or the substrate SUB, and at least one of the gate electrodes EL1 , EL2 , and EL3 Any one transistor characteristic (eg, threshold voltage distribution and program/read speed) may be improved, and consequently, electrical characteristics of the 3D flash memory may be improved.

The vertical semiconductor pattern VSP may be surrounded by the second portion VCP2 of the vertical channel pattern VCP. An upper surface of the vertical semiconductor pattern VSP may contact the conductive pad PAD, and a lower surface of the vertical semiconductor pattern VSP may contact the first portion VCP1 of the vertical channel pattern VCP. The vertical semiconductor pattern VSP may be spaced apart from the substrate SUB in the third direction D3. In other words, the vertical semiconductor pattern VSP may be electrically floated from the substrate SUB.

The vertical semiconductor pattern VSP may be formed of a material that helps diffusion of charges or holes in the vertical channel pattern VCP. More specifically, the vertical semiconductor pattern VSP may be formed of a material having excellent charge and hole mobility. For example, the vertical semiconductor pattern VSP may be formed of a semiconductor material doped with impurities, an intrinsic semiconductor material not doped with impurities, or a polycrystalline semiconductor material. For a more specific example, the vertical semiconductor pattern VSP may be formed of polysilicon doped with impurities of the same first conductivity type as the substrate SUB (eg, P-type impurities). That is, the vertical semiconductor pattern VSP can improve the electrical characteristics of the 3D flash memory to increase the speed of memory operation.

Referring back to FIG. 2 , the vertical channel structures VS include an erase control transistor ECT, first and second string select transistors SST1 and SST2, a ground select transistor GST, and memory cell transistors MCT. ) may correspond to channels of

Conductive pads PAD may be provided on top surfaces of the second portion VCP2 of the vertical channel pattern VCP and on top surfaces of the vertical semiconductor pattern VSP. The conductive pad PAD may be connected to an upper portion of the vertical channel pattern VCP and an upper portion of the vertical semiconductor pattern VSP. A sidewall of the conductive pad PAD may be surrounded by the data storage pattern DSP. A top surface of the conductive pad PAD may be substantially coplanar with a top surface of each of the stack structures ST (ie, a top surface of an uppermost one of the interlayer insulating layers ILD). A lower surface of the conductive pad PAD may be positioned at a lower level than an upper surface of the third gate electrode EL3 . More specifically, the lower surface of the conductive pad PAD may be positioned between the upper and lower surfaces of the third gate electrode EL3 . That is, at least a portion of the conductive pad PAD may overlap the third gate electrode EL3 in a horizontal direction.

The conductive pad PAD may be formed of a semiconductor doped with impurities or a conductive material. For example, the conductive pad PAD is doped with an impurity different from that of the vertical semiconductor pattern VSP (more precisely, an impurity of a second conductivity type (eg, N-type) different from the first conductivity type (eg, P-type)). It may be formed of a semiconductor material.

The conductive pad PAD may reduce contact resistance between the bit line BL and the vertical channel pattern VCP (or vertical semiconductor pattern VSP), which will be described later.

Although the vertical channel structures VS have been described as having a structure including the conductive pad PAD, it is not limited thereto and may have a structure in which the conductive pad PAD is omitted. In this case, as the conductive pad PAD is omitted from the vertical channel structures VS, the upper surfaces of each of the vertical channel pattern VCP and the vertical semiconductor pattern VSP are the upper surfaces of each of the stacked structures ST (ie, Each of the vertical channel pattern VCP and the vertical semiconductor pattern VSP may extend in the third direction D3 so as to be substantially coplanar with the top surface of the uppermost one of the interlayer insulating layers ILD. Also, in this case, the bit line contact plug BLPG, which will be described later, directly contacts the vertical channel pattern VCP instead of being indirectly electrically connected to the vertical channel pattern VCP through the conductive pad PAD. can be electrically connected.

Also, although it has been described that the vertical channel structures VS include the vertical semiconductor pattern VSP, the vertical semiconductor pattern VSP may be omitted without being limited or limited thereto.

In addition, although the vertical channel pattern VCP has been described as having a structure including the first part VCP1 and the second part VCP2, it is not limited thereto and may have a structure excluding the first part VCP1. can For example, the vertical channel pattern VCP is provided between the vertical semiconductor pattern VSP and the data storage pattern DSP and extends to the substrate SUB to contact the substrate SUB. can In this case, the lower surface of the vertical channel pattern VCP may be positioned at a lower level than the uppermost surface of the substrate SUB (the lower surface of the lowermost one of the interlayer insulating films ILD), and the upper surface of the vertical channel pattern VCP may be located at a level lower than that of the upper surface of the substrate SUB. A top surface of the pattern VSP may be substantially coplanar.

An isolation trench TR extending in the first direction D1 may be provided between the stacked structures ST adjacent to each other. The common source region CSR may be provided inside the substrate SUB exposed by the isolation trench TR. The common source region CSR may extend in the first direction D1 within the substrate SUB. The common source region CSR may be formed of a semiconductor material doped with impurities of the second conductivity type (eg, N-type impurities). The common source region CSR may correspond to the common source line CSL of FIG. 2 .

A common source plug CSP may be provided in the isolation trench TR. The common source plug CSP may be connected to the common source region CSR. A top surface of the common source plug CSP may be substantially coplanar with a top surface of each of the stacked structures ST (ie, a top surface of an uppermost one of the interlayer insulating layers ILD). The common source plug CSP may have a plate shape extending in the first and third directions D1 and D3. In this case, the common source plug CSP may have a shape in which a width in the second direction D2 increases toward the third direction D3.

Insulation spacers SP may be interposed between the common source plug CSP and the stacked structures ST. Insulation spacers SP may be provided to face each other between adjacent stacked structures ST. For example, the insulating spacers SP may be formed of silicon oxide, silicon nitride, silicon oxynitride, or a low-k material having a low dielectric constant.

A capping insulating layer CAP may be provided on the stacked structures ST, the vertical channel structures VS, and the common source plug CSP. The capping insulating layer CAP may cover the top surface of the uppermost one of the interlayer insulating layers ILD, the top surface of the conductive pad PAD, and the top surface of the common source plug CSP. The capping insulating layer CAP may be formed of an insulating material different from that of the interlayer insulating layers ILD. A bit line contact plug BLPG electrically connected to the conductive pad PAD may be provided inside the capping insulating layer CAP. The bit line contact plug BLPG may have a shape in which widths in the first and second directions D1 and D2 increase in the third direction D3.

A bit line BL may be provided on the capping insulating layer CAP and the bit line contact plug BLPG. The bit line BL corresponds to any one of the plurality of bit lines BL0 , BL1 , and BL2 shown in FIG. 2 , and may be formed of a conductive material to extend along the second direction D2 . The conductive material constituting the bit line BL may be the same material as the conductive material forming each of the gate electrodes EL1 , EL2 , and EL3 described above.

The bit line BL may be electrically connected to the vertical channel structures VS through the bit line contact plug BLPG. Here, that the bit line BL is connected to the vertical channel structures VS may mean that it is connected to the vertical channel pattern VCP included in the vertical channel structures VS.

The three-dimensional flash memory having such a structure includes a voltage applied to each of the cell strings CSTR, a voltage applied to the string selection line SSL, a voltage applied to each of the word lines WL0-WLn, and a ground selection line. A program operation, a read operation, and an erase operation may be performed based on the voltage applied to the GSL and the voltage applied to the common source line CSL. For example, the 3D flash memory includes a voltage applied to each of the cell strings CSTR, a voltage applied to the string select line SSL, a voltage applied to each of the word lines WL0 to WLn, and a ground select line GSL. ) and the voltage applied to the common source line (CSL), a channel is formed in the vertical channel pattern (VCP) to transfer charges or holes to the data storage pattern (DSP) of the target memory cell, thereby program operation. can be performed.

In addition, the 3D flash memory according to an embodiment is not limited or not limited to the structure described above, and may include a vertical channel pattern (VCP), a data storage pattern (DSP), and gate electrodes EL1, EL2, and EL3 according to implementation examples. , a bit line (BL), and a common source line (CSL) may be implemented in various structures.

5 is a flowchart illustrating a program operation of a 3D flash memory according to an exemplary embodiment, and FIGS. 6 and 7 are conceptual diagrams illustrating a program operation of a 3D flash memory according to an exemplary embodiment. Hereinafter, the program operating method is assumed to be performed in the 3D flash memory having the structure described with reference to FIGS. 2 to 4 . However, the program operation method described later is not limited or limited thereto, and may be performed by a 3D flash memory having a different structure to which the ISPP scheme is applicable.

Referring to FIG. 5 , in step S510, the 3D flash memory may apply a program voltage to a selected word line corresponding to a target memory cell among word lines.

In this case, the program voltage Vpgm _n may have a value obtained by adding the step voltage ΔV to the previous program operation voltage Vpgm _n−1 applied in the previous program operation as shown in Equation 1 below.

<Equation 1>

Vpgm _n =Vpgm _n-1 +ΔV

In particular, in the program operation of the 3D flash memory according to an embodiment, the step voltage ΔV is increased as the program operation is repeated.

Here, the fact that the step voltage ΔV increases as the program operation is repeated means that the step voltage ΔV continues to increase without exception as the number of repetitions of the program operation increases while the program operation is repeated, as well as the program operation. It may mean that it is increased at least once during this repetition.

For example, when the program operation is repeated, two or more preset program voltage ranges are set, so that the step voltage (ΔV) is maintained constant for each program voltage range and then increased when the program voltage range is changed and increased at least once. can For a more specific example, as shown in FIG. 6, when the program voltage is within the range of 18V to 20V, the step voltage (ΔV) is maintained constant at a value of ΔV ₁ (eg, 1V), and then the program voltage is 18V. to 20V, when it is changed within the range of 20V to 24V, the value of ΔV ₂ (eg, 2V) may be increased. That is, the 3D flash memory may repeat the program operation while increasing the step voltage ΔV differently for each program voltage range.

For another example, the step voltage ΔV may be continuously increased in proportion to repetition of the program operation. For a more specific example, as shown in FIG. 7 , the step voltage ΔV may be continuously increased in proportion to the number of repetitions of the program operation regardless of the program voltage range. Accordingly, the 3D flash memory may add a step voltage (ΔV _n ) increased from the previous step voltage (ΔV _n−1 ) to the previous program operation voltage whenever the program operation is repeated.

8 is a perspective view schematically illustrating an electronic system including a 3D flash memory according to an exemplary embodiment.

Referring to FIG. 8 , an electronic system 800 including a 3D flash memory according to embodiments includes a main board 801, a controller 802 mounted on the main board 801, and one or more semiconductor packages 803. ) and DRAM 804.

The semiconductor package 803 and the DRAM 804 may be connected to the controller 802 through wiring patterns 805 provided on the main substrate 801 .

The main board 801 may include a connector 806 including a plurality of pins coupled to an external host. The number and arrangement of the plurality of pins in the connector 806 may vary depending on the communication interface between the electronic system 800 and an external host.

The electronic system 800 may, for example, use any one of interfaces such as Universal Serial Bus (USB), Peripheral Component Interconnect Express (PCIExpress), Serial Advanced Technology Attachment (SATA), and M-Phy for Universal Flash Storage (UFS). Depending on one, you can communicate with external hosts. The electronic system 800 may be operated by power supplied from an external host through, for example, a connector 806 . The electronic system 800 may further include a Power Management Integrated Circuit (PMIC) that distributes power supplied from an external host to the controller 802 and the semiconductor package 803 .

The controller 802 can write data to the semiconductor package 803 or read data from the semiconductor package 803 and can improve the operating speed of the electronic system 800 .

The DRAM 804 may be a buffer memory for mitigating a speed difference between the semiconductor package 803, which is a data storage space, and an external host. The DRAM 804 included in the electronic system 800 may also operate as a kind of cache memory, and may provide a space for temporarily storing data in a control operation for the semiconductor package 803 . When the electronic system 800 includes the DRAM 804 , the controller 802 may further include a DRAM controller for controlling the DRAM 804 in addition to the NAND controller for controlling the semiconductor package 803 .

The semiconductor package 803 may include first and second semiconductor packages 803a and 803b spaced apart from each other. Each of the first and second semiconductor packages 803a and 803b may be a semiconductor package including a plurality of semiconductor chips 820 . Each of the first and second semiconductor packages 803a and 803b includes a package substrate 810 , semiconductor chips 820 on the package substrate 810 , and adhesive layers 830 disposed on a lower surface of each of the semiconductor chips 820 . ), connection structures 840 electrically connecting the semiconductor chips 820 and the package substrate 810 and a molding layer 850 covering the semiconductor chips 820 and the connection structures 840 on the package substrate 810 can include

The package substrate 810 may be a printed circuit board including package upper pads 811 . Each of the semiconductor chips 820 may include input/output pads 821 . Each of the semiconductor chips 820 may include the 3D flash memory described above with reference to FIGS. 3 or 4 . More specifically, each of the semiconductor chips 820 may include gate stack structures 822 and memory channel structures 823 . The gate stack structures 822 may correspond to the above-described stack structures ST, and the memory channel structures 823 may correspond to the above-described vertical channel structures VS. Accordingly, the above-described improved program operation may be performed in each of the semiconductor chips 820 .

The connection structures 840 may be, for example, bonding wires electrically connecting the input/output pads 821 and the package upper pads 811 . Accordingly, in each of the first and second semiconductor packages 803a and 803b, the semiconductor chips 820 may be electrically connected to each other using a bonding wire method, and the package upper pads 811 of the package substrate 810 and can be electrically connected. According to example embodiments, in each of the first and second semiconductor packages 803a and 803b, the semiconductor chips 820 are connected to the through electrode (Through Silicon Via) instead of the bonding wire type connection structures 840. may be electrically connected to each other.

Unlike shown, the controller 802 and the semiconductor chips 820 may be included in one package. The controller 802 and the semiconductor chips 820 may be mounted on a separate interposer substrate different from the main substrate 801, and the controller 802 and the semiconductor chips 820 may be connected to each other by wiring provided on the interposer substrate. there is.

As described above, although the embodiments have been described with limited examples and drawings, those skilled in the art can make various modifications and variations from the above description. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

Claims (3)

word lines extending in a horizontal direction on the substrate and spaced apart in a vertical direction; and cell strings passing through the word lines and extending in the vertical direction, each of the cell strings extending in the vertical direction while covering a data storage pattern extending in the vertical direction and an inner wall of the data storage pattern. A program operation method of a three-dimensional flash memory comprising a vertical channel pattern formed, wherein the data storage pattern and the vertical channel pattern configure memory cells corresponding to the word lines,
applying a program voltage (the program voltage having a value obtained by adding a step voltage to a previous program voltage applied in a previous program operation) to a selected word line corresponding to a target memory cell among the word lines;
including,
The step voltage is,
A program operation method of a three-dimensional flash memory, characterized in that the program operation is increased as the program operation is repeated. According to claim 1,
The step voltage is,
A program operation method of a three-dimensional flash memory, characterized in that the program voltage range is maintained constant for each program voltage range and then increased when the program voltage range is changed. According to claim 1,
The step voltage at which the program voltage is increased is
The method of operating a program of a three-dimensional flash memory, characterized in that continuously increased in proportion to the repetition of the program operation.

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