KR20220158795A - 열경화성 수지 조성물 및 그 경화물 - Google Patents

열경화성 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR20220158795A
KR20220158795A KR1020227037174A KR20227037174A KR20220158795A KR 20220158795 A KR20220158795 A KR 20220158795A KR 1020227037174 A KR1020227037174 A KR 1020227037174A KR 20227037174 A KR20227037174 A KR 20227037174A KR 20220158795 A KR20220158795 A KR 20220158795A
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South Korea
Prior art keywords
resin composition
parts
thermosetting resin
resin
group
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Ceased
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KR1020227037174A
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English (en)
Korean (ko)
Inventor
마사히로 소
카즈오 이시하라
토모유키 타카시마
지중휘
박찬호
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
국도화학 주식회사
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Publication of KR20220158795A publication Critical patent/KR20220158795A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
KR1020227037174A 2020-05-11 2021-04-30 열경화성 수지 조성물 및 그 경화물 Ceased KR20220158795A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020083218 2020-05-11
JPJP-P-2020-083218 2020-05-11
PCT/JP2021/017169 WO2021230104A1 (ja) 2020-05-11 2021-04-30 熱硬化性樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
KR20220158795A true KR20220158795A (ko) 2022-12-01

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KR1020227037174A Ceased KR20220158795A (ko) 2020-05-11 2021-04-30 열경화성 수지 조성물 및 그 경화물

Country Status (6)

Country Link
US (1) US20230242753A1 (https=)
JP (1) JPWO2021230104A1 (https=)
KR (1) KR20220158795A (https=)
CN (1) CN115551918A (https=)
TW (1) TW202146511A (https=)
WO (1) WO2021230104A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230272155A1 (en) * 2020-06-11 2023-08-31 Nippon Steel Chemical & Material Co., Ltd. Phenol resin, epoxy resin, methods for producing these, epoxy resin composition and cured product thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543655A (ja) 1991-08-16 1993-02-23 Asahi Chiba Kk 積層板用難燃性エポキシ樹脂組成物
JPH0710970A (ja) 1993-06-25 1995-01-13 Mitsui Toatsu Chem Inc イミド基含有フェノール樹脂およびその製造方法
JPH0733858A (ja) 1993-06-28 1995-02-03 Mitsui Toatsu Chem Inc エポキシ樹脂組成物、その硬化物および半導体装置
JP2010235823A (ja) 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2011126070A1 (ja) 2010-04-08 2011-10-13 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび積層板
WO2016208667A1 (ja) 2015-06-25 2016-12-29 日本化薬株式会社 エポキシ樹脂組成物およびその硬化物
WO2020054526A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072830B2 (ja) * 1986-10-16 1995-01-18 日本石油化学株式会社 フエノ−ル樹脂の製造法
JP3090991B2 (ja) * 1990-10-31 2000-09-25 三井化学株式会社 フェノール重合体の製造方法
US6387990B1 (en) * 1999-09-10 2002-05-14 General Electric Company Curable epoxy resin compositions with brominated triazine flame retardants
JP5255810B2 (ja) * 2007-10-12 2013-08-07 Ｊｆｅケミカル株式会社 ジシクロペンタジエン類変性フェノール樹脂の製造方法
JP5255813B2 (ja) * 2007-10-19 2013-08-07 Ｊｆｅケミカル株式会社 ジシクロペンタジエン類変性フェノール樹脂の製造方法および未反応フェノール類の再利用方法
JP6111708B2 (ja) * 2013-02-04 2017-04-12 日立化成株式会社 硬化性樹脂組成物及び電子部品装置
JP6115225B2 (ja) * 2013-03-22 2017-04-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板及びプリント配線板
JP6227954B2 (ja) * 2013-09-26 2017-11-08 株式会社日本触媒 硬化性樹脂組成物及びその用途
US11884773B2 (en) * 2018-12-19 2024-01-30 Nippon Steel Chemical & Material Co., Ltd. Phenolic resin, epoxy resin, epoxy resin composition and cured product of same
JP2023022538A (ja) * 2021-08-03 2023-02-15 株式会社Fuji 工作機械システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0543655A (ja) 1991-08-16 1993-02-23 Asahi Chiba Kk 積層板用難燃性エポキシ樹脂組成物
JPH0710970A (ja) 1993-06-25 1995-01-13 Mitsui Toatsu Chem Inc イミド基含有フェノール樹脂およびその製造方法
JPH0733858A (ja) 1993-06-28 1995-02-03 Mitsui Toatsu Chem Inc エポキシ樹脂組成物、その硬化物および半導体装置
JP2010235823A (ja) 2009-03-31 2010-10-21 Nippon Steel Chem Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
WO2011126070A1 (ja) 2010-04-08 2011-10-13 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび積層板
WO2016208667A1 (ja) 2015-06-25 2016-12-29 日本化薬株式会社 エポキシ樹脂組成物およびその硬化物
WO2020054526A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

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WO2021230104A1 (ja) 2021-11-18
US20230242753A1 (en) 2023-08-03
TW202146511A (zh) 2021-12-16
CN115551918A (zh) 2022-12-30
JPWO2021230104A1 (https=) 2021-11-18

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