JPWO2021230104A1 - - Google Patents
Info
- Publication number
- JPWO2021230104A1 JPWO2021230104A1 JP2022521840A JP2022521840A JPWO2021230104A1 JP WO2021230104 A1 JPWO2021230104 A1 JP WO2021230104A1 JP 2022521840 A JP2022521840 A JP 2022521840A JP 2022521840 A JP2022521840 A JP 2022521840A JP WO2021230104 A1 JPWO2021230104 A1 JP WO2021230104A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020083218 | 2020-05-11 | ||
| PCT/JP2021/017169 WO2021230104A1 (ja) | 2020-05-11 | 2021-04-30 | 熱硬化性樹脂組成物及びその硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021230104A1 true JPWO2021230104A1 (https=) | 2021-11-18 |
Family
ID=78525750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022521840A Pending JPWO2021230104A1 (https=) | 2020-05-11 | 2021-04-30 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230242753A1 (https=) |
| JP (1) | JPWO2021230104A1 (https=) |
| KR (1) | KR20220158795A (https=) |
| CN (1) | CN115551918A (https=) |
| TW (1) | TW202146511A (https=) |
| WO (1) | WO2021230104A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230272155A1 (en) * | 2020-06-11 | 2023-08-31 | Nippon Steel Chemical & Material Co., Ltd. | Phenol resin, epoxy resin, methods for producing these, epoxy resin composition and cured product thereof |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072830B2 (ja) * | 1986-10-16 | 1995-01-18 | 日本石油化学株式会社 | フエノ−ル樹脂の製造法 |
| JP3090991B2 (ja) * | 1990-10-31 | 2000-09-25 | 三井化学株式会社 | フェノール重合体の製造方法 |
| JPH0543655A (ja) | 1991-08-16 | 1993-02-23 | Asahi Chiba Kk | 積層板用難燃性エポキシ樹脂組成物 |
| JP3250872B2 (ja) | 1993-06-25 | 2002-01-28 | 三井化学株式会社 | イミド基含有フェノール樹脂およびその製造方法 |
| JP3214757B2 (ja) | 1993-06-28 | 2001-10-02 | 三井化学株式会社 | エポキシ樹脂組成物、その硬化物および半導体装置 |
| US6387990B1 (en) * | 1999-09-10 | 2002-05-14 | General Electric Company | Curable epoxy resin compositions with brominated triazine flame retardants |
| JP5255810B2 (ja) * | 2007-10-12 | 2013-08-07 | Ｊｆｅケミカル株式会社 | ジシクロペンタジエン類変性フェノール樹脂の製造方法 |
| JP5255813B2 (ja) * | 2007-10-19 | 2013-08-07 | Ｊｆｅケミカル株式会社 | ジシクロペンタジエン類変性フェノール樹脂の製造方法および未反応フェノール類の再利用方法 |
| JP2010235823A (ja) | 2009-03-31 | 2010-10-21 | Nippon Steel Chem Co Ltd | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP5935690B2 (ja) | 2010-04-08 | 2016-06-15 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグおよび積層板 |
| JP6111708B2 (ja) * | 2013-02-04 | 2017-04-12 | 日立化成株式会社 | 硬化性樹脂組成物及び電子部品装置 |
| JP6115225B2 (ja) * | 2013-03-22 | 2017-04-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板及びプリント配線板 |
| JP6227954B2 (ja) * | 2013-09-26 | 2017-11-08 | 株式会社日本触媒 | 硬化性樹脂組成物及びその用途 |
| WO2016208667A1 (ja) | 2015-06-25 | 2016-12-29 | 日本化薬株式会社 | エポキシ樹脂組成物およびその硬化物 |
| KR102761584B1 (ko) | 2018-09-12 | 2025-02-03 | 니폰 가야꾸 가부시끼가이샤 | 말레이미드 수지, 경화성 수지 조성물 및 그 경화물 |
| US11884773B2 (en) * | 2018-12-19 | 2024-01-30 | Nippon Steel Chemical & Material Co., Ltd. | Phenolic resin, epoxy resin, epoxy resin composition and cured product of same |
| JP2023022538A (ja) * | 2021-08-03 | 2023-02-15 | 株式会社Fuji | 工作機械システム |
-
2021
- 2021-04-30 JP JP2022521840A patent/JPWO2021230104A1/ja active Pending
- 2021-04-30 CN CN202180034047.8A patent/CN115551918A/zh active Pending
- 2021-04-30 KR KR1020227037174A patent/KR20220158795A/ko not_active Ceased
- 2021-04-30 US US17/922,972 patent/US20230242753A1/en not_active Abandoned
- 2021-04-30 WO PCT/JP2021/017169 patent/WO2021230104A1/ja not_active Ceased
- 2021-05-05 TW TW110116225A patent/TW202146511A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220158795A (ko) | 2022-12-01 |
| WO2021230104A1 (ja) | 2021-11-18 |
| US20230242753A1 (en) | 2023-08-03 |
| TW202146511A (zh) | 2021-12-16 |
| CN115551918A (zh) | 2022-12-30 |