KR20220147525A - 결함 억제를 향상시킨 폴리싱 조성물 및 기판의 폴리싱 방법 - Google Patents

결함 억제를 향상시킨 폴리싱 조성물 및 기판의 폴리싱 방법 Download PDF

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Publication number
KR20220147525A
KR20220147525A KR1020220050984A KR20220050984A KR20220147525A KR 20220147525 A KR20220147525 A KR 20220147525A KR 1020220050984 A KR1020220050984 A KR 1020220050984A KR 20220050984 A KR20220050984 A KR 20220050984A KR 20220147525 A KR20220147525 A KR 20220147525A
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KR
South Korea
Prior art keywords
chemical mechanical
mechanical polishing
group
polishing composition
phosphonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220050984A
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English (en)
Korean (ko)
Inventor
구오 위
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20220147525A publication Critical patent/KR20220147525A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/54—Quaternary phosphonium compounds
    • C07F9/5456—Arylalkanephosphonium compounds
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020220050984A 2021-04-27 2022-04-25 결함 억제를 향상시킨 폴리싱 조성물 및 기판의 폴리싱 방법 Pending KR20220147525A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/241,377 US11274230B1 (en) 2021-04-27 2021-04-27 Polishing composition and method of polishing a substrate having enhanced defect inhibition
US17/241,377 2021-04-27

Publications (1)

Publication Number Publication Date
KR20220147525A true KR20220147525A (ko) 2022-11-03

Family

ID=80683392

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220050984A Pending KR20220147525A (ko) 2021-04-27 2022-04-25 결함 억제를 향상시킨 폴리싱 조성물 및 기판의 폴리싱 방법

Country Status (5)

Country Link
US (1) US11274230B1 (https=)
JP (1) JP2022169477A (https=)
KR (1) KR20220147525A (https=)
CN (1) CN115247027B (https=)
TW (1) TWI905422B (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393469A (en) * 1992-03-20 1995-02-28 Lumigen, Inc. Polymeric phosphonium salts providing enhanced chemiluminescence from 1,2-dioxetanes
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
US9129907B2 (en) * 2006-09-08 2015-09-08 Cabot Microelectronics Corporation Onium-containing CMP compositions and methods of use thereof
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry
MY150487A (en) 2008-09-19 2014-01-30 Cabot Microelectronics Corp Barrier slurry for low-k dielectrics.
JPWO2014175397A1 (ja) * 2013-04-25 2017-02-23 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
KR102458648B1 (ko) * 2014-07-09 2022-10-26 쇼와덴코머티리얼즈가부시끼가이샤 Cmp용 연마액 및 연마 방법
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant
WO2018058347A1 (en) * 2016-09-28 2018-04-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing of tungsten using method and composition containing quaternary phosphonium compounds
KR102478439B1 (ko) * 2018-01-18 2022-12-15 쇼와덴코머티리얼즈가부시끼가이샤 연마액, 연마액 세트 및 연마 방법
US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
US10604678B1 (en) 2019-02-08 2020-03-31 Rohrn and Haas Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds
TWI794474B (zh) * 2019-04-15 2023-03-01 日商昭和電工材料股份有限公司 研磨液、研磨液套組及研磨方法

Also Published As

Publication number Publication date
US11274230B1 (en) 2022-03-15
JP2022169477A (ja) 2022-11-09
CN115247027B (zh) 2024-03-01
TW202245044A (zh) 2022-11-16
CN115247027A (zh) 2022-10-28
TWI905422B (zh) 2025-11-21

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