KR20220119880A - The Electro-conductive Contact Pin, Manufacturing Method thereof - Google Patents

Abstract

The present invention provides an electrically conductive contact pin, which has a separate functional layer on a side surface to improve characteristics. A manufacturing method for the electrically conductive contact pin includes the steps of: manufacturing a preliminary electrically conductive contact pin including first and second contact tips and an elastic part provided between the first and second contact tips by filling first metal inside a first opening pattern of a mold in which the first opening pattern is formed; and forming a second opening pattern in a masking agent to expose an end of at least one of the first and second contact tips by forming a masking agent on an upper surface and patterning the masking agent; forming a functional layer by filling a second metal into the second opening pattern; and removing the masking agent and the mold.

Description

Electrically conductive contact pin and its manufacturing method {The Electro-conductive Contact Pin, Manufacturing Method thereof}

The present invention relates to an electrically conductive contact pin and a method for manufacturing the same.

A test apparatus and test socket having a plurality of electrically conductive contact pins between a connection terminal of a semiconductor package or wafer for testing and a connection terminal on the side of the test circuit board are used in a test apparatus for a semiconductor package or a wafer for an integrated circuit. . In the electrical property test of a semiconductor device, an inspection object (semiconductor wafer or semiconductor package) is approached to an inspection device having a plurality of electrically conductive contact pins, and the electrically conductive contact pins are applied to corresponding electrode pads (or solder balls or bumps) on the inspection object. This is done by making contact. When the electrically conductive contact pin and the electrode pad on the inspection object are brought into contact, after reaching a state in which both start to contact, a process for further approaching the inspection object is performed.

Conventionally, a socket using a pogo pin as an electrically conductive contact pin contacting a semiconductor package is known. A conventional pogo pin is an elastic pin that contacts a spring between an upper contact tip and a lower contact tip and is surrounded by a barrel. However, the pogo pin of this structure has a limit in responding to a fine pitch of 300 μm or less.

In order to solve this problem, a technology for manufacturing an electrically conductive contact pin using a MEMS process is being developed. Looking at the process of manufacturing the contact pins using the MEMS process, first, a photoresist layer is applied to the surface of a conductive substrate, and then the photoresist layer is patterned. Thereafter, using the photoresist film as a mold, a metal material is deposited on the exposed surface of the conductive substrate surface in the opening by an electroplating method, and the photoresist film and the conductive substrate are removed to obtain contact pins. The contact pins manufactured using the MEMS process in this way are referred to as MEMS contact pins. The shape of the MEMS contact pin is the same as the shape of the opening formed in the mold of the photoresist film.

However, since the electrically conductive contact pin manufactured using the conventional MEMS process does not have a separate functional layer on the side thereof, there is a problem in that the efficiency of the electrically conductive contact pin is reduced.

Korea Patent Publication No. 0449308

The present invention has been devised to solve the above problems, and an object of the present invention is to improve the characteristics of the electrically conductive contact pin by providing a separate functional layer on the side of the body of the electrically conductive contact pin.

In order to achieve the object of the present invention, in the method for manufacturing an electrically conductive contact pin according to the present invention, a first metal is filled in the first opening pattern of a mold on which the first opening pattern is formed, and the first and second contact tips and manufacturing a preliminary electrically conductive contact pin including an elastic part provided between the first and second contact tips; forming a second opening pattern in the masking agent such that at least one end of the first and second contact tips is exposed by forming a masking agent on an upper surface and patterning the masking agent; forming a functional layer by filling a second metal inside the second opening pattern; and removing the masking agent and the mold.

In addition, the second opening pattern is formed along the surface shape of the ends of the first and second contact tips so that the end side surface is exposed.

In addition, the mold is an anodized film material.

In addition, the first metal filled in the first opening pattern is formed by electroplating.

In addition, the second metal filled in the second opening pattern is formed by electroplating.

Meanwhile, the method for manufacturing an electrically conductive contact pin according to the present invention includes the steps of: preparing a preliminary electrically conductive contact pin by filling a first metal in the first opening pattern of a first mold on which the first opening pattern is formed; and a second metal is filled in the second opening pattern of a second mold provided on the preliminary conductive contact pin and having the second opening pattern formed thereon to form a functional layer on at least a portion of the preliminary electrically conductive contact pin. including;

In addition, the first mold is made of an anodized film material.

In addition, the second mold is made of a photoresist material.

In addition, the second metal is formed of a material having a hardness higher than the average hardness of the first metal.

In addition, the second metal is formed of a material whose electrical conductivity is higher than the average electrical conductivity of the first metal.

On the other hand, the electrically conductive contact pin according to the present invention, the first and second contact tips; and an elastic part provided between the first and second contact tips, and a functional layer provided on at least one end of the first and second contact tips.

Further, the functional layer is formed on the side surface of the end along the surface shape of the end.

In addition, the functional layer provided in the first contact tip is formed of a material having a hardness higher than the average hardness of the metal constituting the first contact tip.

In addition, the functional layer provided on the first contact tip is formed of a material whose electrical conductivity is higher than the average electrical conductivity of the metal constituting the elastic part.

In the present invention, a separate functional layer is provided on the side of the body of the electrically conductive contact pin to improve the properties of the electrically conductive contact pin.

1 is a view showing an electrically conductive contact pin according to a preferred embodiment of the present invention.
2 and 3 are views showing a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention.

The following is merely illustrative of the principles of the invention. Therefore, those skilled in the art will be able to devise various devices that, although not explicitly described or shown herein, embody the principles of the invention and are included in the spirit and scope of the invention. In addition, it should be understood that all conditional terms and examples listed herein are, in principle, expressly intended only for the purpose of understanding the inventive concept and are not limited to the specifically enumerated embodiments and states as such. .

The above-described objects, features, and advantages will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the invention pertains will be able to easily practice the technical idea of the invention. .

Embodiments described herein will be described with reference to cross-sectional and/or perspective views, which are ideal illustrative drawings of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. In addition, the number of electrically conductive contact pins shown in the drawings is only partially shown in the drawings by way of example. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process.

In describing various embodiments, components performing the same function will be given the same names and the same reference numbers for convenience even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.

The electrically conductive contact pin according to a preferred embodiment of the present invention is provided in the inspection device and is used to electrically and physically contact the inspection object to transmit an electrical signal. The inspection apparatus may be an inspection apparatus used in a semiconductor manufacturing process, and for example, may be a probe card or a test socket depending on an object to be inspected. The inspection apparatus according to the preferred embodiment of the present invention is not limited thereto, and any apparatus for checking whether an object to be inspected is defective by applying electricity is included. The electrically conductive contact pin according to a preferred embodiment of the present invention may be manufactured by MEMS technology.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

1 is a view showing an electrically conductive contact pin 100 according to a preferred embodiment of the present invention.

The electrically conductive contact pin 100 includes an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface. Here, the upper surface means the front surface of the electrically conductive contact pin 100 with reference to FIG. 1 , the lower surface means the rear surface of the electrically conductive contact pin 100 with reference to FIG. 1 , and the side surface is a surface excluding the front and rear surfaces it means.

The electrically conductive contact pins 100 may be formed of a conductive material. Here, the conductive material is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir) or an alloy thereof, or nickel-cobalt (NiCo). At least one may be selected from an alloy, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention has an elastic part 130 provided between the first contact tip 110 , the second contact tip 120 and the first and second contact tips 110 and 120 . includes At least one of the first contact tip 110 and the second contact tip 120 is a member contacting the object to be inspected, and the other is a member contacting or bonding to the pad of the inspection device. For example, the first contact tip 110 is provided at a position in contact with the object to be inspected, and the second contact tip 120 is provided at a position in contact or bonding with the pad of the inspection device.

The first contact tip 110 includes an upper body 111 and an upper protrusion 113 . The upper body 111 is formed in a substantially elliptical shape in plan view. The shape of the upper body 111 is not limited to an elliptical shape, and includes a triangular shape, a rectangular shape, and the like. The upper protrusion 113 is formed to protrude from the end side of the upper body 111 and has a sharp triangular prism shape. A plurality of upper protrusions 113 may be formed.

The second contact tip 120 is formed in a substantially elliptical shape on a plane. The shape of the second contact tip 120 is not limited to an elliptical shape, and includes shapes such as a triangle and a square.

The elastic part 130 has one end connected to the first contact tip 110 and the other end connected to the second contact pin 120 . The elastic part 130 is elastically deformed when the first contact tip 110 and the second contact tip 120 move closer to each other or move away from each other.

The elastic part 130 includes a deformable part 131 elastically deformed by a pressing force. A plurality of deformable parts 131 are configured in the form of an elliptical ring. The deformable portion 131 is provided with two horizontal ribs 131a opposed in a direction perpendicular to the pressing force, and side ribs 131b connecting the two ribs are provided on both sides. The side ribs 131b have a rounded shape at a portion connected to the horizontal ribs 131a.

An upper connection part 133 is provided between the first contact tip 110 and the deformable part 131 so that the upper connection part 133 connects the first contact tip 110 and the deformable part 131 to each other. The upper connection part 133 has a width smaller than the width of the deformable part 131 , and the central axis of the upper connection part 133 is coaxial with the central axis of the deformable part 131 .

A lower connection part 134 is provided between the second contact tip 120 and the deformable part 131 so that the lower connection part 134 connects the second contact tip 120 and the deformable part 131 to each other. The lower connection part 134 has a width smaller than the width of the deformable part 131 , and the central axis of the lower connection part 134 is coaxial with the central axis of the deformable part 131 .

An intermediate connection part 135 is provided between the deformable part 131 and the deformable part 131 , and the intermediate connection part 135 connects the deformable part 131 and the deformable part 131 to each other. The intermediate connection part 135 has a width smaller than the width of the deformable part 131 , and the central axis of the intermediate connection part 134 is coaxial with the central axis of the deformable part 131 .

A functional layer 150 is provided at at least one end of the first and second contact tips 110 and 120 . The functional layer 150 may be provided at the end of the first contact tip 110 , and/or the functional layer 150 may be provided at the end of the second contact tip 120 .

The functional layer 150 is formed on the side surface of the end along the surface shape of the end.

The functional layer 150 provided on the first contact tip 110 covers the end side of the first contact tip 110 . The end side of the first contact tip 110 is not exposed by being covered by the functional layer 150 . The upper protrusion 113 is formed to extend from the upper body 111 toward the end in the shape of a triangular prism, and the functional layer 150 covers the exposed side of the triangular prism. Meanwhile, at least a portion of the functional layer 150 may cover a portion of the upper surface of the upper protrusion 113 . By forming the functional layer 150 to surround a portion of the end side and upper surface of the upper protrusion 113 , peeling of the functional layer 150 can be effectively prevented.

The functional layer 150 provided on the second contact tip 120 covers the end side of the second contact tip 120 . The end side of the second contact tip 120 is not exposed because it is covered by the functional layer 150 . Meanwhile, at least a portion of the functional layer 150 may cover a portion of the upper surface of the second contact tip 120 . By forming the functional layer 150 to surround a portion of the end side and upper surface of the second contact tip 120 , peeling of the functional layer 150 can be effectively prevented.

The functional layer 150 is provided at at least one end of the electrically conductive contact pin 100 to reinforce the function of one end or to add a function to one end. For example, the functional layer 150 may be employed for the purpose of preventing oxidation and/or arcing at the end side, may be employed for the purpose of preventing scratches on the inspection object, and may be employed for the purpose of improving current characteristics. can In this case, a material suitable for each purpose may be selected.

The functional layer 150 provided on the first contact tip 110 may be formed of a material whose hardness is higher than the average hardness of the metal constituting the first contact tip 110 . The first contact tip 110 may be manufactured together with the second contact tip 120 and the elastic part 130 . The first contact tip 110 , the second contact tip 120 and the elastic part 130 are platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au) ), iridium (Ir) or an alloy thereof, or a nickel-cobalt (NiCo) alloy, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy may be selected from , these conductive materials may have a multilayer structure in which a plurality of layers are stacked. The functional layer 150 is made of a material having a hardness value higher than the average hardness value (eg, Vickers hardness) of the metal constituting the first contact tip 110 , the second contact tip 120 and the elastic part 130 . can be selected. For example, the functional layer 150 may be formed of a high-hardness conductive material such as palladium (Pd) or rhodium (Rh). Through the configuration of the functional layer 150 having a relatively high hardness value, the effect of extending the life can be expected by effectively preventing abrasion of the first contact tip 110 .

The functional layer 150 provided on the first contact tip 110 may be formed of a material whose electrical conductivity is higher than the average electrical conductivity of the metal constituting the first contact tip 110 . The first contact tip 110 may be manufactured together with the second contact tip 120 and the elastic part 130 . However, since the degree of elastic deformation and electrical conductivity may be in a trade-off relationship, the material of the elastic part 130 is selected in consideration of the degree of elastic deformation so that the contact pin 100 can be elastically deformed for a long time. The material selected may have low electrical conductivity. Therefore, when the functional layer 150 having high electrical conductivity is provided on the first contact tip 110 whether or not the contact object is substantially in contact, it is possible to prevent arcing from occurring during contact. In this case, the functional layer 150 is configured to prevent arcing from occurring when the contact pad of the space converter of the probe card and the electrically conductive contact pin 100 are in contact. The functional layer 150 may be made of a material having higher electrical conductivity than the average electrical conductivity of the metal constituting the first contact tip 110, the second contact tip 120, and the elastic part 130, for example, For example, it may be made of a gold (Au) material.

Hereinafter, a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention will be described with reference to FIGS. 2 and 3 .

In the method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention, the first metal 220 is filled in the first opening pattern 210 of the first mold 200 on which the first opening pattern 210 is formed. manufacturing a preliminary electrically conductive contact pin 101 by doing so, and a second opening pattern ( and forming the functional layer 150 on at least a portion of the preliminary electrically conductive contact pin 101 by filling the second metal 320 therein.

The manufacturing of the preliminary electrically conductive contact pins 101 by filling the first metal 220 in the first opening pattern 210 of the first mold 200 on which the first opening pattern 210 is formed includes: Forming a first opening pattern 210 in one mold 200 , and filling the first opening pattern 210 with a first metal 220 to prepare a preliminary electrically conductive contact pin 101 . includes

Referring to FIG. 2A , FIG. 2A is a view for explaining the step of forming the first opening pattern 210 in the first mold 200 .

First, the first mold 200 is prepared. The first mold 200 may be made of an anodized material or a photoresist material.

Here, the anodization film refers to a film formed by anodizing a metal as a base material, and the pores refer to a hole formed in the process of forming an anodization film by anodizing the metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base material is anodized, an anodization film made of aluminum oxide (Al ₂ 0 ₃ ) material is formed on the surface of the base material. The anodic oxide film formed as described above is vertically divided into a barrier layer in which pores are not formed and a porous layer in which pores are formed. When the base material is removed from the base material on which the anodized film having a barrier layer and a porous layer is formed on the surface, only the anodized film made of aluminum oxide (Al ₂ 0 ₃ ) material remains.

The anodized film may be formed in a structure in which the barrier layer formed during anodization is removed to penetrate the top and bottom of the pores, or the barrier layer formed during anodization remains as it is and seals one end of the top and bottom of the pores.

The anodized film has a coefficient of thermal expansion of 2-3 ppm/°C. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even in a high-temperature environment in the manufacturing environment of the electrically conductive contact pin 100 , the precise electrically conductive contact pin 100 can be manufactured without thermal deformation.

A seed layer 230 is provided on one surface of the first mold 200 . The seed layer 230 may be formed of a copper (Cu) material, and may be formed by a deposition method. The seed layer 230 is used to improve the plating quality of the first metal 220 when the first metal 220 is formed using an electrolytic plating method.

Next, a step of forming the first opening pattern 210 by etching at least a portion of the first mold 200 made of the anodized film material is performed. The overall shape of the first opening pattern 210 has a shape corresponding to that of the electrically conductive contact pin 100 .

An island 240 made of an anodized film material is provided inside the first opening pattern 210 . The island 240 is a region in which the anodic oxide film is not removed when the first opening pattern 210 is formed by etching a portion of the first mold 200 . The island 240 is an anode surrounded by the first opening pattern 210 . oxide film region.

The first opening pattern 210 may be formed by etching the first mold 200 made of an anodized film material. To this end, a photoresist (not shown) is provided on the upper surface of the first mold 200 and patterned, and then the anodization film in the patterned and open area reacts with the etching solution to form the first opening pattern 210 . have. Specifically, the photosensitive material may be provided on the upper surface of the first mold 200 before the first opening pattern 210 is formed, and then exposure and development processes may be performed. At least a portion of the photosensitive material may be patterned and removed while forming an open area by an exposure and development process. At this time, the photoresist remains on the upper surface of the portion that will become the island 240 later, without being removed. An etching process is performed on the first mold 200 through an open region from which the photosensitive material has been removed by the patterning process, and the anodization film around the first mold 200 is removed except for the region that will later become the island 240 by the etching solution. One opening pattern 210 is formed. When the first mold 200 made of an anodized film material is wet-etched with an etching solution, the first opening pattern 210 having a vertical inner wall is formed.

As such, when the first metal 220 is formed using the anodized film as a mold, the shape precision of the preliminary electrically conductive contact pin 101 is improved, so that the electrically conductive contact pin 100 having a precise microstructure can be manufactured. will do

Next, referring to FIG. 2B , FIG. 2B is a view for explaining a step of manufacturing the preliminary electrically conductive contact pin 101 by filling the first metal 220 in the first opening pattern 210 .

A step of forming the preliminary electrically conductive contact pins 101 by plating the first opening pattern 210 is performed. The first metal 220 filled in the first opening pattern 210 is formed by electroplating. During electroplating, the first metal 220 may be formed using the seed layer 230 . When the plating process is completed, a planarization process may be performed. The first metal 220 protruding from the upper surface of the first mold 200 is removed and planarized through a chemical mechanical polishing (CMP) process. By performing the above steps, the preliminary electrically conductive contact pin 101 is manufactured from the first metal 220 .

Here, the first metal 220 is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir) or an alloy thereof, or palladium- It may be selected from a cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy. The first metal 220 may be formed of one metal or may have a multi-layered structure in which a plurality of conductive materials are stacked.

As described above, the first metal 220 is filled in the first opening pattern 210 of the mold 200 on which the first opening pattern 210 is formed, so that the first and second contact tips 110 and 120 and the elastic part 130 are formed. ) to complete the preparation of the preliminary electrically conductive contact pin comprising

Next, the second metal 320 is filled in the second opening pattern 310 of the second mold 300 provided on the preliminary conductive contact pin 101 and on which the second opening pattern 310 is formed. A step of forming the functional layer 150 on at least a portion of the preliminary electrically conductive contact pin 101 is performed.

The second metal 320 is filled in the second opening pattern 310 of the second mold 300 provided on the preliminary conductive contact pin 101 and in which the second opening pattern 310 is formed, thereby providing preliminary electricity. The step of forming the functional layer 150 on at least a portion of the conductive contact pin 101 includes forming the second mold 300 provided on the preliminary conductive contact pin 101 and having the second opening pattern 310 formed thereon. and forming the functional layer 150 on at least a portion of the preliminary electrically conductive contact pin 101 by filling the second opening pattern 310 with the second metal 320 .

Referring to FIG. 2C , FIG. 2C is a view for explaining the step of forming the second mold 300 provided on the preliminary conductive contact pin 101 and in which the second opening pattern 310 is formed.

Forming a masking agent 330 on the upper surface of the structure completed in step 2b and patterning the masking agent 330 so that at least one end of the first and second contact tips 110 and 120 is exposed. A step of forming the two-opening pattern 310 is performed. The masking agent 330 provided with the second opening pattern 310 serves as a second mold 300 for filling the second metal 320 .

Specifically, a masking agent 330 is first formed on the preliminary conductive contact pin 101 . The masking agent 330 may be a photosensitive material or an insulating material. For example, the masking agent 330 may be a photoresist. The masking agent 330 is entirely applied to the top surfaces of the first mold 200 and the preliminary conductive contact pins 101 so that the top surfaces of the first mold 200 and the preliminary conductive contact pins 101 are not exposed to the outside. do. Next, an exposure and development process is performed on the masking agent 330 to form the second opening pattern 310 . The second opening pattern 310 is formed along the surface shape of the ends of the first and second contact tips 110 and 120 so that the side surfaces of the ends are exposed.

Next, referring to FIG. 3A , FIG. 3A shows that the functional layer 150 is formed on at least a portion of the preliminary electrically conductive contact pin 101 by filling the second metal 320 inside the second opening pattern 310 . It is a diagram explaining the steps.

A space is formed between the seed layer 230 and the end side surfaces of the first and second contact tips 110 and 120 through the second opening pattern 310 . The second metal 320 filled in the second opening pattern 310 is formed by electroplating. By electroplating using the seed layer 230 , the second metal 320 is filled in the second opening pattern 310 to form the functional layer 150 .

The second metal 320 may be a metal of a material different from that of the first metal 220 .

The second metal 320 may have a difference in at least one characteristic of electrical conductivity and hardness compared to the first metal 220 . The second metal 320 may be a metal material having a higher hardness value than the first metal 220 , or the second metal 320 may be a metal material having a higher electrical conductivity value than the first metal 220 . Meanwhile, the first metal 220 and/or the second metal 320 may be configured by stacking a plurality of metal layers. A metal material having a high hardness value may be used, or the second metal 320 may be a metal material having an average electrical conductivity higher than that of the first metal 220 .

By controlling the time and current density of the electroplating, the functional layer 150 may be formed to have a lower height toward the end. The interior of the second opening pattern 310 has the configuration of a groove surrounded by the first mold 200 made of an anodized film material, the preliminary electrically conductive contact pins 101 and the second mold 300 made of a photoresist material. have When the second metal 320 is formed in the second opening pattern 310 by using electroplating, the second metal 320 is formed by the electrically conductive contact pins 101 as well as the seed layer 230 . As it grows, the second metal 320 relatively grows on the side of the pre-formed preliminary electrically conductive contact pin 101 . As a result, the functional layer 150 has a shape in which the height is lowered from the preliminary electrically conductive contact pin 101 toward the end side, and has a sharper shape at the end side.

Next, a step of removing the masking agent 330 and the mold 200 is performed.

Referring to FIG. 3B , it is a view illustrating a state after removing the masking agent 330 . The second mold 300 made of the material of the masking agent 330 is removed by using a solution that selectively reacts only with the second mold 300 made of the material of the masking agent 330 . Next, the first mold 200 made of the anodized film material is removed using a solution that selectively reacts only with the first mold 200 made of the anodized film material. Through this, an electrically conductive contact pin 100 as shown in FIG. 3C is manufactured.

As described above, the functional layer 150 may be provided on at least one end of the first and second contact tips 110 and 120 , but differently from this, the functional layer 150 is formed on at least a portion of the electrically conductive contact pin 100 . can be provided. The functional layer 150 may be provided on at least some of the side surfaces of the electrically conductive contact pin 100 , and for example, may be provided on the left and right end sides in addition to the upper and lower end sides of the electrically conductive contact pin 100 . have.

The electrically conductive contact pin manufactured using the conventional MEMS process has a problem in that the efficiency of the electrically conductive contact pin is reduced because a separate functional layer is not provided on the side thereof. On the other hand, in the electrically conductive contact pin 100 according to the preferred embodiment of the present invention, since the functional layer 150 is separately provided on the side thereof, the efficiency of the electrically conductive contact pin 100 can be improved. The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is prepared as a preliminary electrically conductive contact pin 100 by using the first mold 200 made of an anodized film material to form an overall electrically conductive contact pin 100 . After completing the shape and structure, by adding a functional layer 150 to the side of the preliminary electrically conductive contact pin 101 using the second mold 300 made of a photoresist material, it is applied to the side of the electrically conductive contact pin 100. It is possible to improve the efficiency of the electrically conductive contact pin 100 by adding functionality (hardness, electrical conductivity, etc.).

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. Or it can be carried out by modification.

100: electrically conductive contact pin 110: first contact tip
120: second contact tip 130: elastic part
150: functional layer 200: first mold
300: second mold

Claims (14)

A preliminary electrically conductive contact pin comprising an elastic part provided between first and second contact tips and the first and second contact tips by filling the first metal inside the first opening pattern of the mold on which the first opening pattern is formed. manufacturing;
forming a second opening pattern in the masking agent such that at least one end of the first and second contact tips is exposed by forming a masking agent on an upper surface and patterning the masking agent;
forming a functional layer by filling a second metal inside the second opening pattern; and
and removing the masking agent and the mold.
According to claim 1,
The second opening pattern is formed along the surface shape of the ends of the first and second contact tips so that the end side is exposed, the method of manufacturing an electrically conductive contact pin.
According to claim 1,
The mold is an anodized film material, the method of manufacturing an electrically conductive contact pin.
According to claim 1,
A method of manufacturing an electrically conductive contact pin, wherein the first metal filled in the first opening pattern is formed by electroplating.
According to claim 1,
A method of manufacturing an electrically conductive contact pin, wherein the second metal filled in the second opening pattern is formed by electroplating.
manufacturing a preliminary electrically conductive contact pin by filling a first metal into the first opening pattern of a first mold on which the first opening pattern is formed; and
Forming a functional layer on at least a portion of the preliminary electrically conductive contact pin by filling a second metal inside the second opening pattern of a second mold provided on the preliminary conductive contact pin and having the second opening pattern formed therein A method of manufacturing an electrically conductive contact pin comprising;
7. The method of claim 6,
The first mold is an anodized film material, the method of manufacturing an electrically conductive contact pin.
7. The method of claim 6,
The second mold is a photoresist material, the method of manufacturing an electrically conductive contact pin.
7. The method of claim 6,
The method of manufacturing an electrically conductive contact pin, wherein the second metal is formed of a material having a hardness higher than the average hardness of the first metal.
7. The method of claim 6,
The method of manufacturing an electrically conductive contact pin, wherein the second metal is formed of a material whose electrical conductivity is higher than the average electrical conductivity of the first metal.
first and second contact tips; and
Including; an elastic part provided between the first and second contact tips;
An electrically conductive contact pin comprising a functional layer provided on at least one end of the first and second contact tips.
12. The method of claim 11,
and the functional layer is formed on a side surface of the end along a surface shape of the end.
12. The method of claim 11,
The functional layer provided on the first contact tip is formed of a material having a hardness higher than the average hardness of the metal constituting the first contact tip, an electrically conductive contact pin.
12. The method of claim 11,
The functional layer provided on the first contact tip is formed of a material whose electrical conductivity is higher than the average electrical conductivity of the metal constituting the elastic part, an electrically conductive contact pin.

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