JP2001242219A - Inspection probe board and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower a contact resistance, and to execute accurate inspection, even if position shift from a semiconductor chip occurs. SOLUTION: This inspection probe board is equipped with an insulating board, a prescribed wiring pattern formed on the board, and a metal plating projection formed on the wiring pattern so as to be electrically connected to the pattern, in contacted with an external terminal of a semiconductor device or an electronic device. The metal plating projection has a hollow on the center part of a spot in contact with the external terminal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe board for testing a semiconductor device or an electronic device by being electrically connected to an external terminal, and a method of manufacturing the same.
The present invention relates to an inspection probe substrate for inspecting the quality of a semiconductor integrated circuit chip / CSP package as a single unit and a technique effective when applied to a method for manufacturing the same.

[0002]

2. Description of the Related Art A printed circuit board having a plurality of unpackaged bare chips mounted thereon is mounted on an MCM (Multi Chip Modul).
e). With the development of electronic devices, the MCM has come to be positioned as an important technology for device development as an effective means for responding to essential needs such as light and thin.

[0003] Further, even in the case of packaging, a CSP (Chip Siz) miniaturized so as to minimize the amount of package base material and to have a package area (volume) substantially equal to a chip.
e / Scale Package) is being actively developed, and device manufacturers have announced small packages of various shapes. Many of the CSP packages have a BGA structure in which external terminals are arranged with solder poles on the back surface of the package.

[0004] However, the biggest barrier of these paired chips and CSPs is the quality assured chip / package (KG).
D: Known Good Die) This is a non-destructive inspection method for selection. For this purpose, an inspection is provided in which a projection is provided to ensure electrical continuity by contacting with an electrode pad of a chip or a solder ball for an external terminal of a package. The key point is the development of a probe substrate for use.

Conventionally, a probe substrate provided with tungsten microneedles in accordance with the position of the aluminum pad of the chip has been used.

However, the number of pads and the number of terminals are increasing with the miniaturization of chips and the increase in the number of pins, and the pitch of pads and terminals is becoming increasingly narrower. There is a great restriction on the manufacture of the.

[0007] For this reason, at present, a socket incorporating a probe for KGD discrimination, which is a combination of a tape carrier and a micro bump manufacturing technique, has been developed.

In these structures, a projection is provided on a substrate provided with fine wiring at a position corresponding to a solder ball of an electrode pad of a chip or an external terminal of a package, and a chip is sandwiched between the probe substrate and an upper die. It has become.

[0009]

However, in the conventional probe board, the alignment of the projection with the electrode pad of the chip is not performed by using an image recognition fabric or the like. Since they are brought into contact with each other, the positions of the electrode pads of the chip and the protrusions of the probe substrate are usually shifted by several tens of μm due to the manufacturing accuracy of the probe substrate and the cutting accuracy of the chip.

[0010] Due to this displacement, there is only one contact portion, and the contact resistance may increase. Also,
Since the electrode pad is usually covered with an oxide film, the contact resistance tends to increase.

For this reason, the conventional probe board has a problem that an accurate inspection cannot be performed due to an increase in contact resistance.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to reduce the contact resistance even when a misalignment with a semiconductor chip occurs.
An object of the present invention is to provide an inspection probe substrate capable of performing more accurate inspection.

[0013]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present invention, typical ones will be briefly described as follows.

(1) An insulating substrate, a predetermined wiring pattern formed on the substrate, and an external terminal of a semiconductor device or an electronic device formed so as to be electrically connected to the wiring pattern. A metal-plated protrusion that comes into contact with the external terminal, wherein the metal-plated protrusion has a recess at the center of the portion that contacts the external terminal.

(2) In the inspection probe board according to (1), the metal plating projection has a drop-inhibiting projection embedded in the wiring pattern or the substrate on a side opposite to a location where the metal plating projection contacts the external terminal. The wiring pattern or the substrate has a hole for fitting the drop-off prevention protrusion at a position where the metal plating protrusion is formed.

(3) In the inspection probe board of (1), the shape of the metal plating projection is a column (cylindrical) having a hollow central portion.

(4) In the inspection probe board of (1), the shape of the metal plating projection is a polygonal pillar having a hollow central portion.

(5) In the inspection probe substrate of (1) to (4), the metal plating projection is an electroless metal plating projection formed by an electroless plating method.

(6) In the inspection probe substrate of (1) to (5), the wiring pattern and the metal plating protrusion formed thereon are collectively covered with an antioxidant metal film.

(7) In the inspection probe substrate of (6), the antioxidant metal film is made of noble metal plating.

(8) A method of manufacturing an inspection probe substrate provided with a metal plating projection which comes into contact with an external terminal of a semiconductor device or an electronic device, wherein a conductive thin film is attached to an insulating tape by using an adhesive. Create a tape carrier material with a layer structure, apply photofabrication to the surface of the tape carrier material to which the conductive thin film is attached, form a wiring pattern, and apply resist to the surface of the tape carrier material on which the wiring pattern is formed. Forming a film, forming a cylindrical or polygonal column-shaped opening in the center of the resist film at a predetermined position on the wiring pattern, and metal-plating the tape carrier material having the resist film opening formed therein; Dipping in a solution to perform electroless plating, forming a metal plating layer to a thickness that fills the opening, removing the resist film, and forming a metal layer on the wiring pattern. Kki to form a protrusion.

(9) In the method of manufacturing an inspection probe substrate according to (8), the tape carrier material on which the metal plating projections are formed is immersed in a noble metal plating solution and subjected to electroless or electrolytic plating. A noble metal plating is formed on the surface of the formed metal plating protrusion so as to fill the opening, and a metal plating protrusion on which noble metal plating is applied is formed on the wiring pattern.

(10) A method of manufacturing a probe board for inspection provided with a metal plating projection which comes into contact with an external terminal of a semiconductor device or an electronic device, wherein a conductive thin film is attached to an insulating tape using an adhesive. Create a tape carrier material with a layer structure, apply photofabrication to the surface of the tape carrier material to which the conductive thin film is attached, form a wiring pattern, and apply resist to the surface of the tape carrier material on which the wiring pattern is formed. Forming a film, forming an opening of the resist film at a predetermined position on the wiring pattern, and forming a receiving hole having an opening diameter smaller than the formed opening in the opening to reach the wiring pattern or the insulating tape. The tape carrier material having the opening and the receiving hole formed in the resist film is immersed in a metal plating solution to perform electroless plating. Part of the metal plating layer is formed to fill thickness, the resist film is removed to form a metal plating protrusions on the wiring pattern.

(11) In the method for manufacturing an inspection probe substrate according to (10), the electroless plating of the tape carrier material having the opening of the resist film and the receiving hole formed therein is performed at a predetermined height within the opening. Performed until a metal plating layer is formed, immerse the tape carrier material on which the metal plating layer is formed in a noble metal plating solution, perform electroless or electrolytic plating, and apply the electroless plating to the surface of the formed metal plating protrusion. A noble metal plating having a thickness that fills the opening is formed, the resist film is removed, and a noble metal plated projection is formed on the wiring pattern.

By doing so, the ball terminals of the semiconductor chip enter the recessed portions of the metal plating projections, and alignment becomes possible, and positional deviation can be suppressed as much as possible.

At the same time as the alignment can be performed,
By wiping the oxide film of the ball terminal at the end (edge) of the recess, the contact resistance can be reduced. Thus, more accurate inspection can be performed.

Further, by forming the metal plating projections by electroless metal plating, the hardness of the metal plating projections increases, so that it is possible to provide an inspection probe board having excellent durability.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An inspection probe board according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view for explaining the configuration of the inspection probe substrate of the present embodiment. FIG. 2 is a sectional view taken along line AA shown in FIG. 1 and 2
Are shown for easy explanation of the configuration of the main part.

As shown in FIGS. 1 and 2, an inspection probe 100 according to the present embodiment includes an insulating substrate (insulating tape) 10 made of polyimide or the like and an insulating tape 10 in accordance with the positions of external terminals of a semiconductor chip to be inspected. The wiring pattern 11 includes a wiring pattern 11 formed on the wiring pattern 11 and formed of a conductive thin film such as a copper foil, and a plating protrusion 12 provided on the wiring pattern 11 at a position where the wiring pattern 11 is connected to an external terminal.

The insulating tape 10 is made of a flexible material that is insulative and easily deformed to absorb irregularities (for example, errors in the height of ball terminals) of external terminals of the semiconductor chip.

The wiring pattern 11 is formed by etching a thin film metal which is easy to process with a conductive material, and is electrically connected to an inspection device (not shown here) via a wiring cable or the like.

As shown in FIG. 1 and FIG. 2, the plating projection 12 has a cylindrical shape with a central portion recessed (cut out). As a result, the ball terminals of the semiconductor chip enter the recessed portions, alignment becomes possible, and positional deviation can be minimized.

At the same time as the alignment can be performed,
By wiping the oxide film of the ball terminal at the end (edge) of the recess, the contact resistance can be reduced. Thereby, more accurate inspection can be performed.

Further, since the ball terminals of the semiconductor chip are brought into pressure contact with each other, they must be formed of a hard and highly conductive material in order to enhance durability. For example, it is good to form by the metal plating formed by the electroless plating method. This electroless metal plating, compared to electrolytic metal plating,
This is because the layers are hardly laminated. Here, taking nickel as an example, the Pickers hardness of the projections formed by electroless nickel plating is Hv450 to 600, and the Pickers hardness of the projections formed by electrolytic nickel plating is Hv18.
It is about 0, and the difference in hardness between the protrusions formed by the electroless plating method and the electrolytic plating method is apparent.

Among the electroless metal platings, the electroless nickel plating is particularly suitable for the plating projection 12 because it has high conductivity and is hard. Another example is electroless copper plating.

As shown in FIG. 3, the plating protrusion 12 and the wiring pattern 1 formed by the electroless metal plating are used.
Metal plating (for example, gold plating) 13 for preventing oxidation of the contact portion with the ball terminal may be applied on the first electrode.
The plating layer that covers the wiring pattern 11 and the plating protrusions 12 is not limited to the gold plating 13, and may be, for example,
Precious metal plating that is hardly oxidized, such as rhodium, palladium, platinum, and silver, is preferable. In addition, since these noble metal platings have a property of reducing the contact resistance of the plating protrusions 12, quality inspection can be performed more accurately.

Next, the inspection probe substrate 1 of the present embodiment
00 will be described with reference to the drawings. FIG.
FIG. 4 is a diagram for explaining a method of manufacturing the inspection probe substrate 100 of the present embodiment.

The inspection probe substrate 100 of the present embodiment
As shown in FIG. 4A, a tape carrier material having a three-layer structure in which a copper foil 21 is adhered to a polyimide insulating tape 10 with an adhesive 22 is formed.

Next, as shown in FIG. 4 (b), a positive type photoresist 23 is applied to the surface of the copper foil 21 of the tape carrier material, and the exposed surface of the photoresist is exposed, developed, etched, and a resist film is formed. A series of photofabrication such as peeling is performed, and a wiring pattern 11 is formed as shown in FIG.

Next, a positive type photoresist 23 for thickening is applied on the wiring pattern 11 to form a resist film, which is exposed and developed as shown in FIG. A cylindrical resist opening 24 is formed on the wiring pattern 11 at a position corresponding to an aluminum pad or a ball terminal (not shown) of the chip. Note that a dry film resist may be used instead of the positive photoresist 23 for thickening.

Next, the substrate (the insulating tape and the tape carrier material including the wiring pattern) on which the resist openings 24 are formed is immersed in a nickel plating solution to perform electroless plating, as shown in FIG. Next, a nickel plating layer (plating protrusion) 12 is applied to the inside of the resist opening so as to substantially fill the resist opening 24.

Next, as shown in FIG. 4F, the resist 23 is dissolved and removed using a dedicated stripping solution.
As shown in (g), the substrate on which the plating protrusions 12 are formed on the wiring pattern 11 is immersed in a gold plating solution to perform electroplating, and the nickel plating protrusions 12 formed on the wiring pattern 11 in an electroless manner. Gold plating 13 is formed on the surface of. In this manner, the produced substrate is cut into a desired size, and as shown in FIG. 5, an inspection probe is set in the probe socket 30 so that the ball terminals of the semiconductor chip 31 to be inspected and the nickel plating protrusions 12 are in contact with each other. Substrate 1
00 is formed.

The formation of the plating protrusions 12 is not limited to the above-described combination of gold plating / nickel plating, but may be a composite plating film containing a hard powder such as palladium, rhodium, a nickel alloy, diamond, or silica. Various combinations can be used.

The shape of the plating protrusion 12 of the present embodiment is not limited to a cylindrical shape, but may be any shape as long as it acts to draw in the ball terminal. For example, as shown in FIG. 6 (a), the center of the square pillar is recessed (excavated) into a square pillar, or as shown in FIG. 6 (b), the center of the square pillar is cylindrical. It may be recessed. In addition, the shape may be a polygonal prism.

As described above, the insulating tape, the predetermined wiring pattern formed on the substrate, and the wiring pattern are formed so as to be electrically connected to the wiring pattern. Plating projection 1 formed in a cylindrical or polygonal column shape with a concave central portion that contacts the terminal
2, the oxide film of the ball terminal can be wiped at the edge (edge) of the dent and the contact resistance can be reduced, so that more accurate inspection can be performed even when a misalignment with the semiconductor chip occurs. Can be performed.

Further, since the hardness of the plating protrusion 12 is increased by forming the plating protrusion 12 by electroless metal plating, it is possible to provide an inspection probe substrate having excellent durability.

In this embodiment, the semiconductor chip 31
Has been described, but the present invention is not limited to this semiconductor chip, and can be applied to the inspection of electronic devices.

(Embodiment 1): Embedding and forming a drop-off suppressing protrusion FIG. 7 is a view for explaining the configuration of the inspection probe board of the present embodiment 1, and FIG. 7 (a) is a sectional view thereof. 7
FIG. 8B is a diagram showing a dotted-line box C shown in FIG. Note that the overall view of the inspection probe substrate of the first embodiment is omitted because it is the same as the plan view shown in FIG.

As shown in FIG. 7A, the inspection probe 100a according to the first embodiment uses an insulating tape 1 made of polyimide or the like.
0 and a wiring pattern 1 such as a copper foil provided on the insulating tape 10 in accordance with the position of the external terminal of the semiconductor chip to be inspected.
1 and an electroless nickel plating protrusion 12 provided at a connection position between the wiring pattern 11 and an external terminal on the wiring pattern 11.
And gold plating 13 for preventing oxidation provided on the wiring pattern 11 and the plating protrusions 12.
The plating protrusion 12 has a falling-off suppressing protrusion 12a for suppressing the falling-off from the wiring pattern 11, and the wiring pattern 11 is provided at a position where the plating protrusion 12 is arranged.
The receiving hole 11a for fitting a is provided.

Also, gold plating 13 may be applied on plating protrusions 12 formed by the electroless metal plating in order to prevent oxidation of the contact portions with external terminals.

As described above, the provision of the drop-off suppressing protrusions 12a allows the plating protrusions 12 to be bonded not only to the upper surface but also to the side surface portions of the wiring pattern 11, so that the bonding can be strengthened.

Usually, the joint portion of the plating protrusion 12 is strong against a force applied in a direction perpendicular to the substrate surface, but is weak against a force from a horizontal direction including an oblique direction. For this reason, it is considered that a force including a horizontal component, which is mainly generated due to a positional deviation from the semiconductor chip to be inspected, is applied to the plating protrusions 12, so that a force that shifts in the horizontal direction acts on the joint portion, and the joint portion is weakened by metal fatigue and falls off. Can be

Therefore, the plating protrusions 12 of the first embodiment
Is connected not only to the upper surface portion of the wiring pattern 11 but also to the side surface portion thereof, and
By reaching the adhesive layer and further to the polyimide insulating tape 10, the strength in the horizontal direction with respect to the substrate surface is increased, so that the plating protrusions 12 do not fall without covering the entire wiring pattern 11 and the plating protrusions 12. It is possible to provide an inspection probe substrate which can be suppressed and which is more excellent in durability.

Further, since the plating protrusion 12 is formed by laminating plating, the provision of the falling-off suppressing protrusion 12a (receiving hole 11a) enables the plating protrusion 12 to be formed as shown in FIG.
As shown in (b), the central portion of the plating protrusion 12 that contacts the ball terminal of the semiconductor chip has a concave shape. The dent at this time is a dent without an edge portion like an inverted conical shape. However, the ball terminal of the semiconductor chip enters the dent, so that the contact area with the ball terminal increases. As described above, since the contact area is increased, the contact resistance is reduced, and the inspection can be performed more accurately.

Further, at this time, since the durability can be improved without covering the entire wiring pattern 11 and the plating protrusions 12 with expensive gold (or noble metal), a more inexpensive inspection probe board is provided. it can.

Next, the inspection probe substrate 1 of the first embodiment
00a will be described with reference to the drawings. FIG.
FIG. 5 is a diagram for explaining a method of manufacturing the inspection probe substrate 100a according to the first embodiment.

Inspection probe substrate 100a of the first embodiment
As shown in FIG. 8A, a tape carrier material having a three-layer structure in which a copper foil 21 having a thickness of 18 μm is adhered to an insulating tape 10 of polyimide having a thickness of 25 μm with an adhesive 22 having a thickness of 12 μm as shown in FIG. I do.

Next, as shown in FIG. 8 (b), a positive type photoresist 23 is applied to the surface of the copper foil 21 of the tape carrier material, and the exposed surface of the photoresist is exposed, developed, etched, and a resist film is formed. A series of photofabrication such as peeling is performed to form a wiring pattern 11 as shown in FIG.

Next, on this wiring pattern 11, a positive type photoresist 23 for thickening (for example, P
MER, etc.) to form a resist film having a thickness of about 20 μm, and then, as shown in FIG. On the wiring pattern 11, for example, a circular or polygonal resist opening 24a is formed. Note that a dry film resist may be used instead of the positive photoresist 23 for thickening.

Next, as shown in FIG. 8 (e), a receiving hole 11a having a smaller opening diameter and opening length of the formed resist opening 24a is formed by a carbon dioxide laser or the like using a wiring pattern 11 and an adhesive 22 layer. Or a depth reaching the insulating tape 10 of polyimide. In addition, this receiving hole 11
a does not necessarily need to be formed to a depth reaching the adhesive 22 layer or the insulating tape 10 made of polyimide, and is not more than 18 μm of the thickness of the wiring pattern 11 if it can be connected to the side surface of the wiring pattern 11. No problem.

Next, the substrate (tape carrier) on which the resist opening 24a and the receiving hole 11a are formed is immersed in a nickel plating solution to perform electroless plating.
As shown in FIG. 5, the resist opening 24a has a thickness of about 20 μm from the wiring pattern 11 in the resist opening so as to be almost filled.
Then, a nickel plating layer (plating protrusion) 12 is applied. At this time, the drop-off prevention protrusion 12a is formed in the receiving hole 11a.

Next, as shown in FIG. 8 (g), the substrate on which the plating protrusions 12 are formed is immersed in a gold plating solution to perform electrolytic plating, and the surface of the electroless nickel plating protrusions 12 is formed. Then, a gold plating 13 is formed.

Next, as shown in FIG. 8H, the resist 23 is dissolved and removed using a dedicated stripper, and the wiring pattern 1 is removed.
1 is a nickel-plated projection 12 on which gold plating 13 is applied
To form In this way, the prepared substrate is cut into a desired size, and an inspection probe substrate 100a to be installed in the probe socket 30 is formed as shown in FIG.

As described above, by providing the plating projection 12 with the drop-off suppressing projection 12a, it is possible to provide only a circular opening in the resist film (without providing a cylindrical opening), and to form a plating having a concave central portion. The protrusion 12 can be formed, and the recessed portion draws in the ball terminal and increases the contact area. Therefore, even if the contact resistance decreases and the semiconductor chip is misaligned, the inspection can be performed more accurately. Becomes possible.

Further, the falling-off suppressing protrusions 12 are formed on the plating protrusions 12.
By providing a, the plating protrusion 12 becomes the wiring pattern 11
Of the wiring pattern 11 and the plating projections 12 can be prevented from falling off without covering the whole of the wiring pattern 11 and the plating projections 12, and the inspection probe board having more excellent durability can be provided. Can be provided.

The inspection probe substrate 1 of the first embodiment
By applying the gold plating to the wiring pattern 11 and the plating protrusions 12 at the same time with respect to 00a, the bonding strength is further increased, and an inspection probe board having more excellent durability can be provided.

As described above, the invention made by the present inventor is:
Although specifically described based on the embodiment, the present invention
It is needless to say that the present invention is not limited to the above-described embodiment, but can be variously modified without departing from the scope of the invention.

[0069]

The effects obtained by the representative inventions among the inventions disclosed in the present invention will be briefly described.
It is as follows.

By providing the plating projections with the drop-inhibiting projections, it is possible to form plating projections having a concave central portion only by providing a circular opening in the resist film (without providing a cylindrical opening). Since the recessed portion draws in the ball terminal and increases the contact area, a more accurate inspection can be performed even when the contact resistance is reduced and the semiconductor chip is misaligned.

Further, by forming the plating protrusions by electroless metal plating, the hardness of the plating protrusions is increased, so that it is possible to provide an inspection probe substrate having excellent durability.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating a configuration of an inspection probe substrate according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line AA shown in FIG.

FIG. 3 is a plan view for explaining the configuration of a gold-plated inspection probe substrate.

FIG. 4 is a diagram for explaining a method of manufacturing the inspection probe substrate 100 according to the embodiment.

FIG. 5 is a diagram for explaining a configuration of a probe socket using a probe board for inspection.

FIG. 6 is a view for explaining another shape of the plating protrusion 12;

FIG. 7 is a diagram for explaining the configuration of the inspection probe substrate according to the first embodiment.

FIG. 8 is a diagram for explaining the method for manufacturing the inspection probe substrate according to the first embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Insulating tape 11 Wiring pattern 11a Receiving hole 12 Plating projection 12a Drop-off prevention projection 13 Gold plating 21 Copper foil 22 Adhesive 23 Resist 24, 24a Opening 30 Probe socket 31 Semiconductor chip 100, 100a Inspection probe board

Claims (11)

[Claims] An insulating substrate, a predetermined wiring pattern formed on the substrate, and an external terminal of a semiconductor device or an electronic device formed to be electrically connected to the wiring pattern. An inspection probe board comprising a metal plating protrusion that comes into contact with the metal plating protrusion, wherein the metal plating protrusion is
An inspection probe board, characterized in that it has a recess at the center of a location that contacts the external terminal. 2. The inspection probe board according to claim 1, wherein the metal plating projection has a drop-inhibiting projection embedded in the wiring pattern or the substrate on a side opposite to a portion contacting the external terminal. An inspection probe board, wherein the wiring pattern or the board has a hole for fitting the drop-off prevention projection at a position where the metal plating projection is formed. 3. The inspection probe board according to claim 1, wherein the metal plating projection has a cylindrical shape with a central portion hollowed out. 4. The inspection probe board according to claim 1, wherein the shape of the metal plating projection is a polygonal pillar whose center is hollowed out. 5. The inspection probe board according to claim 1, wherein the metal plating protrusion is
An inspection probe substrate comprising an electroless metal plating protrusion formed by an electroless plating method. 6. The inspection probe substrate according to claim 1, wherein the wiring pattern and the metal plating protrusion formed thereon are collectively covered with an antioxidant metal film. An inspection probe substrate characterized by the above-mentioned. 7. An inspection probe substrate according to claim 6, wherein said oxidation preventing metal film is a noble metal plating. 8. A wiring pattern is formed on a substrate in accordance with the position of an external terminal of a semiconductor device or an electronic device to be inspected.
What is claimed is: 1. A method for manufacturing a probe board for inspection, wherein a metal plating projection is formed on each of the wiring patterns so as to be in contact with the external terminal. Create a material, apply a photofabrication on the surface of the tape carrier material where the conductive thin film is attached, form a wiring pattern, and form a resist film on the surface of the tape carrier material where the wiring pattern is formed, A cylindrical or a polygonal column-shaped opening having a hollow central portion is formed in the resist film at a predetermined position on the wiring pattern, and the tape carrier material having the opening formed in the resist film is immersed in a metal plating solution. Performing electroless plating, forming a metal plating layer to a thickness that fills the opening,
A method for manufacturing an inspection probe substrate, wherein the resist film is removed and a metal plating protrusion is formed on the wiring pattern. 9. The method for manufacturing a probe substrate for inspection according to claim 8, wherein the tape carrier material on which the metal plating projections are formed is immersed in a noble metal plating solution to be electroless.
Alternatively, electrolytic plating is performed, a noble metal plating having a thickness that fills the opening is formed on the surface of the metal plating protrusion formed by electroless, and a metal plating protrusion on which noble metal plating is applied is formed on the wiring pattern. A method for manufacturing an inspection probe substrate, which is a feature of the present invention. 10. An inspection probe substrate having a wiring pattern formed on a substrate in accordance with the position of an external terminal of a semiconductor device or an electronic device to be inspected, and a metal plating projection formed on each of the wiring patterns to contact the external terminal. A tape carrier material having a three-layer structure in which a conductive thin film is adhered to an insulating tape using an adhesive, and a photofabrication method is applied to a surface of the tape carrier material to which the conductive thin film is adhered. To form a wiring pattern, form a resist film on the surface of the tape carrier material on which the wiring pattern is formed, form an opening in the resist film at a predetermined position on the wiring pattern, and form the formed opening. A receiving hole having a smaller opening diameter is formed at a depth reaching the wiring pattern or the insulating tape in the opening, and an opening in the resist film and a receiving hole are formed. The tape carrier material in which the holes are formed is immersed in a metal plating solution and subjected to electroless plating, a metal plating layer is formed to a thickness that fills the opening, the resist film is removed, and a metal is formed on the wiring pattern. A method for manufacturing a probe board for inspection, wherein a plating protrusion is formed. 11. The method of manufacturing a probe board for inspection according to claim 10, wherein the electroless plating of the tape carrier material having the opening of the resist film and the receiving hole is performed at a predetermined height in the opening. Until the metal plating layer is formed, immerse the tape carrier material on which the metal plating layer is formed in a noble metal plating solution, perform electroless or electrolytic plating, and perform electroless plating. To form a noble metal plating of a thickness to fill the opening,
A method for manufacturing a probe substrate for inspection, wherein the resist film is removed, and a metal plating protrusion on which noble metal plating is applied is formed on the wiring pattern.