KR20220112674A - 정보 처리장치, 정보 처리방법, 물품 제조 시스템 및 물품의 제조방법 - Google Patents

정보 처리장치, 정보 처리방법, 물품 제조 시스템 및 물품의 제조방법 Download PDF

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Publication number
KR20220112674A
KR20220112674A KR1020220007583A KR20220007583A KR20220112674A KR 20220112674 A KR20220112674 A KR 20220112674A KR 1020220007583 A KR1020220007583 A KR 1020220007583A KR 20220007583 A KR20220007583 A KR 20220007583A KR 20220112674 A KR20220112674 A KR 20220112674A
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KR
South Korea
Prior art keywords
timing
processing
substrate
substrate processing
event
Prior art date
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Pending
Application number
KR1020220007583A
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English (en)
Korean (ko)
Inventor
히로아키 후지와라
Original Assignee
캐논 가부시끼가이샤
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Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20220112674A publication Critical patent/KR20220112674A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3065—Monitoring arrangements determined by the means or processing involved in reporting the monitored data
    • G06F11/3072—Monitoring arrangements determined by the means or processing involved in reporting the monitored data where the reporting involves data filtering, e.g. pattern matching, time or event triggered, adaptive or policy-based reporting
    • G06F11/3079—Monitoring arrangements determined by the means or processing involved in reporting the monitored data where the reporting involves data filtering, e.g. pattern matching, time or event triggered, adaptive or policy-based reporting the data filtering being achieved by reporting only the changes of the monitored data
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70658—Electrical testing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by program execution, i.e. part program or machine function execution, e.g. selection of a program
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3055—Monitoring arrangements for monitoring the status of the computing system or of the computing system component, e.g. monitoring if the computing system is on, off, available, not available
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/20—Drawing from basic elements
    • G06T11/26—Drawing of charts or graphs
    • H01L21/027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computing Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020220007583A 2021-02-04 2022-01-19 정보 처리장치, 정보 처리방법, 물품 제조 시스템 및 물품의 제조방법 Pending KR20220112674A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-016443 2021-02-04
JP2021016443A JP2022119371A (ja) 2021-02-04 2021-02-04 情報処理装置、情報処理方法、及び物品の製造方法

Publications (1)

Publication Number Publication Date
KR20220112674A true KR20220112674A (ko) 2022-08-11

Family

ID=82612868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220007583A Pending KR20220112674A (ko) 2021-02-04 2022-01-19 정보 처리장치, 정보 처리방법, 물품 제조 시스템 및 물품의 제조방법

Country Status (5)

Country Link
US (1) US12362209B2 (https=)
JP (1) JP2022119371A (https=)
KR (1) KR20220112674A (https=)
CN (1) CN114859665A (https=)
TW (1) TW202232346A (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128339B2 (ja) * 2001-03-05 2008-07-30 株式会社日立製作所 試料処理装置用プロセスモニタ及び試料の製造方法
JP2004198148A (ja) * 2002-12-16 2004-07-15 Omron Corp 品質データのモニタリング方法及び装置
TWI362568B (en) 2004-09-14 2012-04-21 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
JP4653715B2 (ja) * 2006-10-13 2011-03-16 新日本製鐵株式会社 プラント操業支援装置、プラント操業支援方法、コンピュータプログラム及び記憶媒体
JP2009170612A (ja) * 2008-01-15 2009-07-30 Canon Inc 情報処理装置、情報処理方法、処理システムおよびコンピュータプログラム
US8329479B2 (en) * 2008-04-18 2012-12-11 Hitachi Kokusai Electrical Inc. Information managing method, information managing apparatus and substrate processing system
JP2009271585A (ja) * 2008-04-30 2009-11-19 Dainippon Screen Mfg Co Ltd グラフ表示装置、グラフ表示方法及びグラフ表示プログラム
JP2009283580A (ja) * 2008-05-21 2009-12-03 Renesas Technology Corp 半導体装置の生産管理システム
JP5771426B2 (ja) * 2011-03-29 2015-08-26 東京エレクトロン株式会社 情報処理装置、処理システム、処理方法、及びプログラム
US10295993B2 (en) 2011-09-01 2019-05-21 Kla-Tencor Corporation Method and system for detecting and correcting problematic advanced process control parameters
WO2014050808A1 (ja) * 2012-09-26 2014-04-03 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及び記録媒体
TWI627588B (zh) * 2015-04-23 2018-06-21 Screen Holdings Co,. Ltd. 檢查裝置及基板處理裝置
US11216995B2 (en) * 2017-06-26 2022-01-04 Kabushiki Kaisha Toshiba Visualization system
JP6693979B2 (ja) * 2018-01-30 2020-05-13 ファナック株式会社 表示装置及び工作機械
EP3726316B1 (en) * 2019-04-17 2022-06-29 ABB Schweiz AG Controlling technical equipment through quality indicators using parameterized batch-run monitoring
JP2020184167A (ja) * 2019-05-07 2020-11-12 Ｎｅｃソリューションイノベータ株式会社 酒造分析装置、酒造分析方法、プログラム、および記録媒体
JP7580263B2 (ja) * 2020-12-18 2024-11-11 東京エレクトロン株式会社 表示装置、表示方法、及び記憶媒体

Also Published As

Publication number Publication date
CN114859665A (zh) 2022-08-05
TW202232346A (zh) 2022-08-16
US20220246456A1 (en) 2022-08-04
US12362209B2 (en) 2025-07-15
JP2022119371A (ja) 2022-08-17

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PA0201 Request for examination

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