JP2022119371A - 情報処理装置、情報処理方法、及び物品の製造方法 - Google Patents

情報処理装置、情報処理方法、及び物品の製造方法 Download PDF

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Publication number
JP2022119371A
JP2022119371A JP2021016443A JP2021016443A JP2022119371A JP 2022119371 A JP2022119371 A JP 2022119371A JP 2021016443 A JP2021016443 A JP 2021016443A JP 2021016443 A JP2021016443 A JP 2021016443A JP 2022119371 A JP2022119371 A JP 2022119371A
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JP
Japan
Prior art keywords
substrate
processing
information
timing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021016443A
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English (en)
Japanese (ja)
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JP2022119371A5 (https=
Inventor
広鏡 藤原
Hiroaki Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021016443A priority Critical patent/JP2022119371A/ja
Priority to KR1020220007583A priority patent/KR20220112674A/ko
Priority to TW111102372A priority patent/TW202232346A/zh
Priority to CN202210113176.2A priority patent/CN114859665A/zh
Priority to US17/590,687 priority patent/US12362209B2/en
Publication of JP2022119371A publication Critical patent/JP2022119371A/ja
Publication of JP2022119371A5 publication Critical patent/JP2022119371A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3065—Monitoring arrangements determined by the means or processing involved in reporting the monitored data
    • G06F11/3072—Monitoring arrangements determined by the means or processing involved in reporting the monitored data where the reporting involves data filtering, e.g. pattern matching, time or event triggered, adaptive or policy-based reporting
    • G06F11/3079—Monitoring arrangements determined by the means or processing involved in reporting the monitored data where the reporting involves data filtering, e.g. pattern matching, time or event triggered, adaptive or policy-based reporting the data filtering being achieved by reporting only the changes of the monitored data
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70658—Electrical testing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by program execution, i.e. part program or machine function execution, e.g. selection of a program
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3055—Monitoring arrangements for monitoring the status of the computing system or of the computing system component, e.g. monitoring if the computing system is on, off, available, not available
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/20—Drawing from basic elements
    • G06T11/26—Drawing of charts or graphs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Computing Systems (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2021016443A 2021-02-04 2021-02-04 情報処理装置、情報処理方法、及び物品の製造方法 Pending JP2022119371A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021016443A JP2022119371A (ja) 2021-02-04 2021-02-04 情報処理装置、情報処理方法、及び物品の製造方法
KR1020220007583A KR20220112674A (ko) 2021-02-04 2022-01-19 정보 처리장치, 정보 처리방법, 물품 제조 시스템 및 물품의 제조방법
TW111102372A TW202232346A (zh) 2021-02-04 2022-01-20 資訊處理裝置、資訊處理方法、物品製造系統及物品製造方法
CN202210113176.2A CN114859665A (zh) 2021-02-04 2022-01-30 信息处理装置、信息处理方法、物品制造系统和方法
US17/590,687 US12362209B2 (en) 2021-02-04 2022-02-01 Information processing apparatus, information processing method, article manufacturing system, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021016443A JP2022119371A (ja) 2021-02-04 2021-02-04 情報処理装置、情報処理方法、及び物品の製造方法

Publications (2)

Publication Number Publication Date
JP2022119371A true JP2022119371A (ja) 2022-08-17
JP2022119371A5 JP2022119371A5 (https=) 2024-01-26

Family

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Family Applications (1)

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JP2021016443A Pending JP2022119371A (ja) 2021-02-04 2021-02-04 情報処理装置、情報処理方法、及び物品の製造方法

Country Status (5)

Country Link
US (1) US12362209B2 (https=)
JP (1) JP2022119371A (https=)
KR (1) KR20220112674A (https=)
CN (1) CN114859665A (https=)
TW (1) TW202232346A (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004198148A (ja) * 2002-12-16 2004-07-15 Omron Corp 品質データのモニタリング方法及び装置
JP2009170612A (ja) * 2008-01-15 2009-07-30 Canon Inc 情報処理装置、情報処理方法、処理システムおよびコンピュータプログラム
JP2009271585A (ja) * 2008-04-30 2009-11-19 Dainippon Screen Mfg Co Ltd グラフ表示装置、グラフ表示方法及びグラフ表示プログラム
JP2009283580A (ja) * 2008-05-21 2009-12-03 Renesas Technology Corp 半導体装置の生産管理システム
JP4653715B2 (ja) * 2006-10-13 2011-03-16 新日本製鐵株式会社 プラント操業支援装置、プラント操業支援方法、コンピュータプログラム及び記憶媒体
WO2014050808A1 (ja) * 2012-09-26 2014-04-03 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及び記録媒体
JP6754009B2 (ja) * 2017-06-26 2020-09-09 株式会社東芝 可視化システム
WO2020212271A1 (en) * 2019-04-17 2020-10-22 Abb Schweiz Ag Controlling technical equipment through quality indicators using parameterized batch-run monitoring
JP2020184167A (ja) * 2019-05-07 2020-11-12 Ｎｅｃソリューションイノベータ株式会社 酒造分析装置、酒造分析方法、プログラム、および記録媒体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128339B2 (ja) * 2001-03-05 2008-07-30 株式会社日立製作所 試料処理装置用プロセスモニタ及び試料の製造方法
TWI362568B (en) 2004-09-14 2012-04-21 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
US8329479B2 (en) * 2008-04-18 2012-12-11 Hitachi Kokusai Electrical Inc. Information managing method, information managing apparatus and substrate processing system
JP5771426B2 (ja) * 2011-03-29 2015-08-26 東京エレクトロン株式会社 情報処理装置、処理システム、処理方法、及びプログラム
US10295993B2 (en) 2011-09-01 2019-05-21 Kla-Tencor Corporation Method and system for detecting and correcting problematic advanced process control parameters
TWI627588B (zh) * 2015-04-23 2018-06-21 Screen Holdings Co,. Ltd. 檢查裝置及基板處理裝置
JP6693979B2 (ja) * 2018-01-30 2020-05-13 ファナック株式会社 表示装置及び工作機械
JP7580263B2 (ja) * 2020-12-18 2024-11-11 東京エレクトロン株式会社 表示装置、表示方法、及び記憶媒体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004198148A (ja) * 2002-12-16 2004-07-15 Omron Corp 品質データのモニタリング方法及び装置
JP4653715B2 (ja) * 2006-10-13 2011-03-16 新日本製鐵株式会社 プラント操業支援装置、プラント操業支援方法、コンピュータプログラム及び記憶媒体
JP2009170612A (ja) * 2008-01-15 2009-07-30 Canon Inc 情報処理装置、情報処理方法、処理システムおよびコンピュータプログラム
JP2009271585A (ja) * 2008-04-30 2009-11-19 Dainippon Screen Mfg Co Ltd グラフ表示装置、グラフ表示方法及びグラフ表示プログラム
JP2009283580A (ja) * 2008-05-21 2009-12-03 Renesas Technology Corp 半導体装置の生産管理システム
WO2014050808A1 (ja) * 2012-09-26 2014-04-03 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及び記録媒体
JP6754009B2 (ja) * 2017-06-26 2020-09-09 株式会社東芝 可視化システム
WO2020212271A1 (en) * 2019-04-17 2020-10-22 Abb Schweiz Ag Controlling technical equipment through quality indicators using parameterized batch-run monitoring
JP2020184167A (ja) * 2019-05-07 2020-11-12 Ｎｅｃソリューションイノベータ株式会社 酒造分析装置、酒造分析方法、プログラム、および記録媒体

Also Published As

Publication number Publication date
CN114859665A (zh) 2022-08-05
TW202232346A (zh) 2022-08-16
US20220246456A1 (en) 2022-08-04
US12362209B2 (en) 2025-07-15
KR20220112674A (ko) 2022-08-11

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