KR20220057545A - 이형 필름 및 반도체 패키지의 제조 방법 - Google Patents

이형 필름 및 반도체 패키지의 제조 방법 Download PDF

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Publication number
KR20220057545A
KR20220057545A KR1020227007429A KR20227007429A KR20220057545A KR 20220057545 A KR20220057545 A KR 20220057545A KR 1020227007429 A KR1020227007429 A KR 1020227007429A KR 20227007429 A KR20227007429 A KR 20227007429A KR 20220057545 A KR20220057545 A KR 20220057545A
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KR
South Korea
Prior art keywords
release film
layer
adhesive layer
electronic component
semiconductor package
Prior art date
Application number
KR1020227007429A
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English (en)
Korean (ko)
Inventor
야스히로 세리
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와덴코머티리얼즈가부시끼가이샤 filed Critical 쇼와덴코머티리얼즈가부시끼가이샤
Publication of KR20220057545A publication Critical patent/KR20220057545A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020227007429A 2019-09-05 2019-09-05 이형 필름 및 반도체 패키지의 제조 방법 KR20220057545A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035010 WO2021044589A1 (ja) 2019-09-05 2019-09-05 離型フィルム及び半導体パッケージの製造方法

Publications (1)

Publication Number Publication Date
KR20220057545A true KR20220057545A (ko) 2022-05-09

Family

ID=74853319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227007429A KR20220057545A (ko) 2019-09-05 2019-09-05 이형 필름 및 반도체 패키지의 제조 방법

Country Status (5)

Country Link
JP (2) JP7363905B2 (zh)
KR (1) KR20220057545A (zh)
CN (1) CN114342051A (zh)
TW (1) TWI833987B (zh)
WO (1) WO2021044589A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022180998A1 (zh) * 2021-02-25 2022-09-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005186740A (ja) 2003-12-25 2005-07-14 Aisin Seiki Co Ltd 車両の変速制御装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6126368B2 (ja) * 2012-12-06 2017-05-10 三井化学東セロ株式会社 Ｌｅｄ封止体用金型離型フィルムおよびそれを用いたｌｅｄ封止体の製造方法
DE112015001137T5 (de) * 2014-03-07 2016-11-24 Asahi Glass Company, Limited Formwerkzeugtrennfilm und Verfahren zur Herstellung eines eingekapselten Körpers
DE112016000628T5 (de) * 2015-02-06 2017-11-02 Asahi Glass Company, Limited Folie, Verfahren zu ihrer Herstellung und Verfahren zum Herstellen eines Halbleiter-Bauelements unter Verwendung der Folie

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005186740A (ja) 2003-12-25 2005-07-14 Aisin Seiki Co Ltd 車両の変速制御装置

Also Published As

Publication number Publication date
CN114342051A (zh) 2022-04-12
JPWO2021044589A1 (zh) 2021-03-11
JP7363905B2 (ja) 2023-10-18
WO2021044589A1 (ja) 2021-03-11
TWI833987B (zh) 2024-03-01
JP2023174688A (ja) 2023-12-08
TW202116951A (zh) 2021-05-01

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