KR20220055469A - 광반사용 열경화성 수지 조성물, 광반도체 소자 탑재용 기판 및 광반도체 장치 - Google Patents
광반사용 열경화성 수지 조성물, 광반도체 소자 탑재용 기판 및 광반도체 장치 Download PDFInfo
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- KR20220055469A KR20220055469A KR1020227008230A KR20227008230A KR20220055469A KR 20220055469 A KR20220055469 A KR 20220055469A KR 1020227008230 A KR1020227008230 A KR 1020227008230A KR 20227008230 A KR20227008230 A KR 20227008230A KR 20220055469 A KR20220055469 A KR 20220055469A
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- thermosetting resin
- semiconductor element
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- 239000011342 resin composition Substances 0.000 title claims abstract description 70
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 69
- 239000004065 semiconductor Substances 0.000 title claims description 108
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- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 14
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- 238000000034 method Methods 0.000 claims description 15
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- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/20—Oxides; Hydroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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| PCT/JP2019/033793 WO2021038771A1 (ja) | 2019-08-28 | 2019-08-28 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置 |
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| JP2010287837A (ja) | 2009-06-15 | 2010-12-24 | Hitachi Chem Co Ltd | 光半導体素子搭載用部材及び光半導体装置 |
| JP2012254633A (ja) | 2006-11-15 | 2012-12-27 | Hitachi Chemical Co Ltd | 熱硬化性光反射用樹脂組成物及びその製造方法、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置 |
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| KR20080063231A (ko) * | 2005-09-29 | 2008-07-03 | 이데미쓰 고산 가부시키가이샤 | 반사재 및 발광 다이오드용 반사체 |
| JP2009129801A (ja) * | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
| JP5699443B2 (ja) * | 2010-04-09 | 2015-04-08 | 日立化成株式会社 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2012030476A (ja) * | 2010-07-30 | 2012-02-16 | Sumitomo Chemical Co Ltd | 液晶ポリエステル成形体の製造方法 |
| JP2015152643A (ja) * | 2014-02-10 | 2015-08-24 | パナソニックＩｐマネジメント株式会社 | 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置 |
| JP2015189932A (ja) * | 2014-03-28 | 2015-11-02 | 株式会社ダイセル | 熱硬化性樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置 |
| WO2017131152A1 (ja) * | 2016-01-27 | 2017-08-03 | クラスターテクノロジー株式会社 | 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置 |
| JP7095239B2 (ja) * | 2017-07-28 | 2022-07-05 | 昭和電工マテリアルズ株式会社 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
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| JP2012254633A (ja) | 2006-11-15 | 2012-12-27 | Hitachi Chemical Co Ltd | 熱硬化性光反射用樹脂組成物及びその製造方法、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置 |
| JP2010287837A (ja) | 2009-06-15 | 2010-12-24 | Hitachi Chem Co Ltd | 光半導体素子搭載用部材及び光半導体装置 |
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| JPWO2021038771A1 (ja) | 2021-03-04 |
| WO2021038771A1 (ja) | 2021-03-04 |
| JP2024045302A (ja) | 2024-04-02 |
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