KR20220045561A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR20220045561A
KR20220045561A KR1020210130904A KR20210130904A KR20220045561A KR 20220045561 A KR20220045561 A KR 20220045561A KR 1020210130904 A KR1020210130904 A KR 1020210130904A KR 20210130904 A KR20210130904 A KR 20210130904A KR 20220045561 A KR20220045561 A KR 20220045561A
Authority
KR
South Korea
Prior art keywords
resin composition
group
resin
mass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020210130904A
Other languages
English (en)
Korean (ko)
Inventor
가즈히코 쓰루이
다이치 오카자키
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20220045561A publication Critical patent/KR20220045561A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020210130904A 2020-10-05 2021-10-01 수지 조성물 Pending KR20220045561A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020168490A JP7761380B2 (ja) 2020-10-05 2020-10-05 樹脂組成物
JPJP-P-2020-168490 2020-10-05

Publications (1)

Publication Number Publication Date
KR20220045561A true KR20220045561A (ko) 2022-04-12

Family

ID=81125117

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210130904A Pending KR20220045561A (ko) 2020-10-05 2021-10-01 수지 조성물

Country Status (4)

Country Link
JP (2) JP7761380B2 (https=)
KR (1) KR20220045561A (https=)
CN (1) CN114381120A (https=)
TW (1) TWI893194B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102896990B1 (ko) * 2020-12-17 2025-12-05 세키스이가세이힝코교가부시키가이샤 중공 수지 입자, 그 제조 방법, 및 그 용도
TW202442045A (zh) 2023-03-24 2024-10-16 日商味之素股份有限公司 印刷配線板及其製造方法
JP7761024B2 (ja) * 2023-06-20 2025-10-28 味の素株式会社 樹脂組成物
JP2025019459A (ja) 2023-07-28 2025-02-07 味の素株式会社 樹脂組成物
TW202547932A (zh) 2024-03-27 2025-12-16 日商味之素股份有限公司 樹脂組合物
JP2025156053A (ja) 2024-03-27 2025-10-14 味の素株式会社 樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059779A (ja) 2015-09-18 2017-03-23 味の素株式会社 プリント配線板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009040934A (ja) * 2007-08-10 2009-02-26 Nippon Steel Chem Co Ltd 硬化性樹脂組成物
JP5444986B2 (ja) * 2009-09-16 2014-03-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置
JP2013197441A (ja) 2012-03-22 2013-09-30 Toray Ind Inc 硬化物層付き回路基板の製造方法
CN103509329B (zh) * 2012-06-28 2016-01-20 中山台光电子材料有限公司 低介电树脂组成物及应用其的铜箔基板及印刷电路板
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
KR102256525B1 (ko) * 2013-11-27 2021-05-26 도레이 카부시키가이샤 반도체용 수지 조성물 및 반도체용 수지 필름, 및 이들을 사용한 반도체 장치
TWI519602B (zh) * 2014-06-06 2016-02-01 Elite Material Co Ltd Low dielectric resin composition and the application of its resin film, semi-cured film and circuit board
JP6716939B2 (ja) 2016-02-16 2020-07-01 東レ株式会社 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
CN108727942A (zh) * 2017-04-24 2018-11-02 味之素株式会社 树脂组合物
TWI773745B (zh) 2017-04-24 2022-08-11 日商味之素股份有限公司 樹脂組成物
JP7119290B2 (ja) * 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
CN112469750A (zh) * 2018-09-19 2021-03-09 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059779A (ja) 2015-09-18 2017-03-23 味の素株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
TWI893194B (zh) 2025-08-11
JP7761380B2 (ja) 2025-10-28
JP2022060800A (ja) 2022-04-15
CN114381120A (zh) 2022-04-22
TW202216895A (zh) 2022-05-01
JP2024052953A (ja) 2024-04-12

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