KR20220034644A - 적층 구조체 및 터치 센서 - Google Patents

적층 구조체 및 터치 센서 Download PDF

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Publication number
KR20220034644A
KR20220034644A KR1020210031450A KR20210031450A KR20220034644A KR 20220034644 A KR20220034644 A KR 20220034644A KR 1020210031450 A KR1020210031450 A KR 1020210031450A KR 20210031450 A KR20210031450 A KR 20210031450A KR 20220034644 A KR20220034644 A KR 20220034644A
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KR
South Korea
Prior art keywords
layer
silver
copper
substrate
laminate structure
Prior art date
Application number
KR1020210031450A
Other languages
English (en)
Korean (ko)
Inventor
샤오 청-친
리엔 시우-쳉
치우 이-원
차이 치아-양
Original Assignee
캄브리오스 필름 솔루션스 (샤먼) 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캄브리오스 필름 솔루션스 (샤먼) 코포레이션 filed Critical 캄브리오스 필름 솔루션스 (샤먼) 코포레이션
Publication of KR20220034644A publication Critical patent/KR20220034644A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020210031450A 2020-09-11 2021-03-10 적층 구조체 및 터치 센서 KR20220034644A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010953098.8 2020-09-11
CN202010953098.8A CN114173465A (zh) 2020-09-11 2020-09-11 堆叠结构及触控感测器

Publications (1)

Publication Number Publication Date
KR20220034644A true KR20220034644A (ko) 2022-03-18

Family

ID=80475425

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210031450A KR20220034644A (ko) 2020-09-11 2021-03-10 적층 구조체 및 터치 센서

Country Status (3)

Country Link
JP (1) JP2022047473A (ja)
KR (1) KR20220034644A (ja)
CN (1) CN114173465A (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150142695A (ko) * 2013-04-16 2015-12-22 멕크 가부시키가이샤 에칭액, 보급액, 및 배선 형성 방법
KR20150059194A (ko) * 2013-11-21 2015-06-01 (주)네패스디스플레이 터치패널 및 그 제조방법
TWI687306B (zh) * 2018-09-21 2020-03-11 鼎展電子股份有限公司 適於作為跡線電極的合金與使用該合金的觸控面板

Also Published As

Publication number Publication date
CN114173465A (zh) 2022-03-11
JP2022047473A (ja) 2022-03-24

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