KR20220029262A - Composition for 5W class thermally conductive pad of equipment of semi-conductor procedure - Google Patents

Abstract

The present invention relates to a heat dissipation pad composition for 5W class semiconductor equipment. The composition comprises: a silicone resin consisting of a liquid silicone gel; a ceramic heat dissipation filler dispersed in the silicone resin to increase thermal conductivity; and a silane coupling agent helping disperse the heat dissipation filler in the silicone resin, wherein the ceramic heat dissipation filler is 900 to 950 parts by weight and the silane coupling agent is 5 to 20 parts by weight based on 50 to 100 parts by weight of the silicone resin.

Description

Thermal pad composition for 5W class semiconductor equipment {Composition for 5W class thermally conductive pad of equipment of semi-conductor procedure}

The present invention relates to a heat dissipation pad composition for a 5W class semiconductor device, and more particularly, to a heat dissipation pad composition for a 5W class semiconductor device in which physical properties are improved by adding a silane coupling agent to increase the usability of a heat dissipation filler and silicon.

In general, a heat dissipation pad refers to a structure that is positioned between a heat source of an electronic device and a heat sink and serves as a TIM (thermal interface materials) that transfers heat generated from the heat source to the heat sink.

Currently, the main material of the heat dissipation pad forming the market is mostly (hydroxide) alumina (Al ₂ O ₃ ), which is manufactured in the form of a pad by adding it to a silicone resin and is sold under the name of a heat dissipation pad or a silicone pad.

The heat dissipation pad made of the silicone resin has excellent heat dissipation performance because it can be filled with a large amount of material with high thermal conductivity. may occur. In this case, the heat dissipation pad and the equipment are not completely in close contact, and an air layer is formed to lower the thermal conductivity, resulting in a problem in that the heat dissipation efficiency is lowered.

In order to solve this problem, there is a need for research and development on a heat dissipation pad material for semiconductor equipment with excellent heat dissipation efficiency.

Korean Patent Publication No. 10-2011-0013907

Therefore, the problem to be solved by the present invention is to provide a heat dissipation pad composition for semiconductor equipment with excellent physical properties at the level of 5W/m.K.

In order to achieve the above object,

The present invention provides a heat dissipation pad composition for 5W class semiconductor equipment,

Silicone resin consisting of liquid silicone gel;

a ceramic heat dissipation filler dispersed in the silicone resin to increase thermal conductivity; and

and a silane coupling agent that helps disperse the heat dissipation filler in the silicone resin.

The amount of the ceramic heat dissipation filler is 900 to 950 parts by weight, and the silane coupling agent is 5 to 20 parts by weight, based on 50 to 100 parts by weight of the silicone resin.

In one embodiment of the present invention, the heat dissipation pad is characterized in that the thermal conductivity is 4.6 W / mK or more.

In another embodiment of the present invention, the heat dissipation pad is characterized in that the elongation is in the range of 80% to 250%.

In another embodiment of the present invention, the average particle diameter of the ceramic heat dissipation filler is in the range of 0.5 to 100 μm, and the heat dissipation filler includes zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN). , aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO) and zirconia (ZrO ₂ ) from the group consisting of It is characterized in that at least one selected.

The heat dissipation pad composition according to the present invention uses a silane coupling agent to increase compatibility between the heat dissipation filler and silicone. Accordingly, the heat dissipation pad composition according to the present invention has excellent elongation while having excellent electronic shielding rate and high thermal conductivity. Accordingly, it is possible to prevent the heat dissipation pad from breaking or cracking, and accordingly, there is an advantage in that it is possible to increase the PM (preventive maintenance) of the semiconductor equipment.

1 is a schematic view showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description.

However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present invention, terms such as "comprises" or "have" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

The present invention relates to a heat dissipation pad for semiconductor equipment, and more particularly, to a heat dissipation pad for a 5W class semiconductor equipment capable of increasing PM (preventive maintenance) of semiconductor equipment by increasing heat dissipation efficiency.

Integration, weight reduction, miniaturization, and multifunctionalization are being pursued in semiconductor, electric/electronic, and automobile fields, and in particular, as semiconductors become highly integrated, more heat is generated. Therefore, research is needed to improve semiconductor performance and yield due to heat, but most of the domestic heat dissipation material companies are focused on the general industry, so the present invention completely adheres to the heat dissipation sheet in the etch equipment to form an adherend and an air layer It satisfies the stable adhesiveness and heat dissipation characteristics at high temperature to prevent heat dissipation, and can prevent cracks in the heat dissipation sheet by realizing high elongation and low hardness. As a result of research to develop a heat dissipation material capable of increasing reliability, the present invention was completed.

In general, the main material of the heat dissipation pad is mostly (hydroxide) alumina (Al ₂ O ₃ ), which is manufactured in the form of a pad by adding it to a silicone-based resin and sold under the name of a heat dissipation pad or a silicone pad.

However, the heat dissipation pad made of such a silicone resin as a material can be filled with a large amount of material with high thermal conductivity and has excellent heat dissipation performance, but the heat dissipation pad itself has high hardness and hardness, so that the heat dissipation pad is broken or cracked during the process There are times when a problem arises. In this case, there is a problem in that the heat dissipation pad and the equipment are not completely in close contact, and an air layer is formed, thereby reducing thermal conductivity.

Accordingly, an object of the present invention is to provide a heat dissipation pad for semiconductor equipment having excellent elongation while having an excellent electromagnetic wave shielding rate and high thermal conductivity by increasing the compatibility between the heat dissipation filler and silicon by using a silane coupling agent.

Hereinafter, the present invention will be described in more detail.

1 is a schematic view showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

1, the heat dissipation pad 100 for semiconductor equipment according to the present invention includes a silicone resin 110 made of liquid silicone gel and a heat dissipation filler 120 dispersed in the silicone resin 110 to increase thermal conductivity. . It is characterized in that it further comprises a silane coupling agent that helps the dispersion of the heat dissipation filler in the resin.

In the present invention, the term "heat dissipation pad" refers to a structure located between a heat source of an electronic device and a heat sink and serves as a TIM (Thermal Interface Materials) that transfers heat generated from the heat source to the heat sink. may mean a silicon heat dissipation pad for semiconductor equipment.

Silicon refers to a polymer in a shape in which silicon containing organic groups and oxygen are connected to each other by chemical bonds (a material different from silicone, which is a semiconductor). Silicone is a unique chemical that combines organic and inorganic properties. It is applied in various forms as a zero, and it is occupying a position as an essential high-performance material in most industrial fields.

On the other hand, in the present invention, in the liquid silicone gel, individual molecules exist independently due to siloxane bonds, so molecular chains can move freely with each other, so it has excellent fluidity like a liquid, and silicone rubber is a high polymer and has molecular chains Since this mutual movement is not possible, the fluidity is low, but the mutual attraction between molecules is small, so it has excellent elasticity and restoring force.

In particular, in the conventional silicon heat dissipation pad 100 , when the heat dissipation filler 120 is mixed, the heat dissipation filler is not uniformly dispersed, which causes a decrease in thermal conductivity. Accordingly, the present invention can increase the thermal conductivity to 5W class by including the silicon coupling agent, thereby improving the workability between PM (Preventive Maintenance) of the semiconductor equipment.

Liquid silicone gel has a low ion content and prevents the formation of an induction path for moisture that starts corrosion, so it can withstand high temperature and high humidity environments. characteristics can be maintained. In addition, the silicone gel has excellent adhesion, light transparency, heat and shock absorption, and does not cause a change in electrical conductivity. Furthermore, the silicone gel basically has the same polysiloxane structure as the silicone rubber, but the crosslinking density after the crosslinking reaction is smaller than that of the silicone rubber, meaning that it is cured into a soft gel that cannot be measured with a normal rubber hardness meter. As the silicone gel, various silicone gels such as dimethyl silicone gel and methylphenyl silicone gel classified according to the type of polysiloxane constituting the main chain may be used. However, a silicone gel having excellent compatibility and affinity with the silicone rubber used in the present invention may be used, and it is preferable to select and use a silicone gel of the same system as the silicone rubber.

The heat dissipation pad 100 may have an elongation of 80% or more. Here, "elongation (elongation)" means the rate at which the material elongates during a material tensile test, and can be calculated using a Zwick-Roell Universal Testing Machine (Z100) according to JIS K 6251-1 conditions, and the following formula The elongation can be calculated according to

[formula]

Elongation (%) = (length at break - initial length) / initial length × 100

Specifically, the elongation of the heat dissipation pad 100 may be 80% or more, and may be in the range of 80 to 250%. On the other hand, when the elongation of the heat dissipation pad 100 is less than 80%, the heat dissipation pad 100 and the semiconductor equipment are not completely in close contact, and the heat dissipation pad 100 is broken or cracks may occur during the process. An air layer is formed, which may cause a problem in which thermal conductivity is lowered. In addition, when the elongation of the heat dissipation pad 100 exceeds 250%, the heat dissipation pad 100 does not break or cracks do not occur, but there may be a problem that the heat dissipation pad 100 is not restored to its original shape.

In more detail, the performance of the heat dissipation pad of the present invention may be shown in Table 1 below.

Parameter Performance Thermal Conductivity (W/mK) 4.6 or higher Hardness (Shore 00) 76 or more Adhesion (gf/cm3) over 500 Elongation (%) 80 or more Specific gravity (g/cm3) 3.1 or later Oil bleeding(wt%) 0.4 or less Thermal conductivity change rate (%) 7 or less Hardness change rate (%) 9 or less

In addition, the heat dissipation filler 120 is dispersed in the silicone resin 110, and the heat dissipation pad 100 includes the heat dissipation filler 120, so that heat generated by the heat dissipation object is transferred to another layer through the heat dissipation pad. can be transmitted easily.

The average particle diameter of the heat dissipation filler 120 of the present invention is in the range of 0.5 to 100 μm, and the heat dissipation filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al) ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO), and zirconia (ZrO ₂ ) It may be at least one selected from the group consisting of And, as an example, the heat dissipation filler 120 may be alumina.

Meanwhile, the heat dissipation pad according to the present invention may have an average thickness in the range of 0.01 to 100 mm. When the thickness of the heat dissipation pad is too thin, it may be difficult to have sufficient heat dissipation characteristics. On the contrary, if it is too thick, it may be difficult to have withstand voltage characteristics, so the above-described range is preferable.

The heat dissipation pad for semiconductor equipment has a thermal conductivity of 5W class, has excellent thermal conductivity and excellent adhesion, and can prevent the heat dissipation pad from breaking or cracking, thereby increasing the PM (preventive maintenance) of semiconductor equipment There are advantages to doing it.

In particular, the present invention uses a silane coupling agent in a predetermined range to improve compatibility between the ceramic heat dissipation filler and the silicone resin composed of liquid silicone gel, and the ceramic heat dissipation filler is 900 to 950 parts by weight based on 50 to 100 parts by weight of the silicone resin. By weight, the silane coupling agent is included in an amount of 5 to 20 parts by weight. Within the above range, the heat dissipation pad of the present invention may have excellent physical properties and reliability.

Hereinafter, the present invention will be described in more detail by way of Examples and Experimental Examples.

However, the following Examples and Experimental Examples are merely illustrative of the present invention, and the content of the present invention is not limited to the following Examples and Experimental Examples.

<Example>

<Manufacture of heat dissipation pad>

A silicone resin, a heat dissipation filler, and a silane coupling agent are mixed in the composition shown in Table 2 below (all contents are parts by weight), and a semiconductor having an average thickness of 0.5 mm through a heating and pressing process at 150° C. and 100 kg _f / cm ² A heat dissipation pad for equipment was manufactured.

ingredient Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 silicone resin 100 100 100 100 100 100 heat dissipation filler 900 925 950 900 950 950 Silane coupling agent 5 10 20 - 3 25

<Experimental example>

Experimental Example 1. Measurement of thermal conductivity

The thermal conductivity of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 was measured.

Specifically, in accordance with ASTM D 5470, the thermal conductivity of the heat dissipation sheet in the vertical direction was measured using a thermal characteristic testing apparatus (TIM1400, Analysis Tech).

Experimental Example 2. Measurement of hardness

The hardness of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 was measured. Specifically, the hardness of the heat dissipation pad was measured according to ASTM D 2240 using a durometer hardness tester for a 6.4 mm (1/4 in) thick specimen.

Experimental Example 3. Adhesion Measurement

The hardness of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 was measured. Specifically, the hardness of the heat dissipation pad was measured according to ASTM D 3330 using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100).

Experimental Example 4. Measurement of elongation

In order to confirm the physical properties of the heat dissipation pad according to the present invention, the elongation of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 was measured.

Specifically, the heat dissipation pad was cut to 50 mm × 50 mm and measured using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100) according to JIS K 6251-1 conditions, and the elongation was calculated according to the following formula.

[formula]

Elongation (%) = (length at break - initial length) / initial length × 100

Experimental Example 5. Reliability Evaluation

In order to confirm the reliability of the heat dissipation pad according to the present invention, the oil bleed rate was measured by measuring the weight before and after input of the heat dissipation pad for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3, and heat conduction The degree of change in thermal conductivity was measured by measuring the degree, and the rate of change in hardness was measured by measuring hardness.

The reliability evaluation was performed under the conditions of applying a pressure of 10 kgf and a storage time of 48 hours at a storage temperature of 100° C. for a sample having a size of 100 mm * 100 mm.

The measurement results of the thermal conductivity, hardness, adhesive force, and elongation of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 are shown in Table 3 below, and the reliability evaluation results are shown in Table 4.

thermal conductivity
(W/mK) Hardness
(Shore 00) adhesiveness
(gf/cm ³ ) elongation
(%) Example 1 4.77 76 570 100 Example 2 4.93 75 539 130 Example 3 4.95 75 546 140 Comparative Example 1 3.91 76 423 70 Comparative Example 2 3.83 77 449 74 Comparative Example 3 4.67 79 483 79

Oil bleeding (wt%) Thermal Conductivity Change (%) Hardness change rate (%) Example 1 0.11 4.98 4.86 Example 2 0.21 3.12 3.48 Example 3 0.23 3.681 3.76 Comparative Example 1 1.43 7.39 10.24 Comparative Example 2 0.45 7.19 12.13% Comparative Example 3 0.41 7.96 14.13%

As can be seen in Table 3, it can be seen that the heat dissipation pads prepared in Examples 1 to 3 were all manufactured as 5W class heat dissipation pads with thermal conductivity of 4.6 W/mK or more. In addition, it can be seen that both elongation and hardness are excellent, and the adhesive strength is 500 gf/cm3 or more, and it can be attached without voids.

On the other hand, in Comparative Examples 1 and 2 using less than 5 parts by weight of the silane coupling agent, the thermal conductivity was less than 4.6 W/mK, the hardness, adhesive force and elongation were all lowered, and in Comparative Example 3, the thermal conductivity was 4.67 or more , but the adhesive strength and elongation were decreased.

In addition, as can be seen in Table 4, in terms of reliability, Examples 1 to 3 showed better results than Comparative Examples 1 to 3, and it was expected to have a longer lifespan.

That is, it can be seen that the heat dissipation pad according to the present invention contains a silane coupling agent in a predetermined range, has excellent hardness, adhesion and elongation in addition to 5W class thermal conductivity, and has high reliability.

Claims (4)

A heat dissipation pad composition for 5W class semiconductor equipment, comprising:
Silicone resin consisting of liquid silicone gel;
a ceramic heat dissipation filler dispersed in the silicone resin to increase thermal conductivity; and
and a silane coupling agent that helps disperse the heat dissipation filler in the silicone resin.
5W class heat dissipation pad composition for semiconductor equipment, characterized in that the ceramic heat dissipation filler is 900 to 950 parts by weight, and the silane coupling agent is 5 to 20 parts by weight based on 50 to 100 parts by weight of the silicone resin.
The method of claim 1,
The heat dissipation pad, a heat dissipation pad composition for a 5W class semiconductor equipment, characterized in that the thermal conductivity is 4.6 W / mK or more.
The method of claim 1,
The heat dissipation pad, a heat dissipation pad composition for a 5W class semiconductor equipment, characterized in that the elongation is in the range of 80% to 250%.
The method of claim 1,
The average particle diameter of the ceramic heat dissipation filler is in the range of 0.5 to 100 μm, and the heat dissipation filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al ₂ (OH)) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO), and zirconia (ZrO ₂ ) At least one selected from the group consisting of 5W class semiconductor equipment Heat dissipation pad composition.

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