KR102523790B1 - Composition for 3W class thermally conductive pad of equipment of semi-conductor procedure - Google Patents

Abstract

The present invention relates to a heat dissipation pad composition for 3W class semiconductor equipment, the composition comprising a silicone resin made of liquid silicone gel; a ceramic heat dissipating filler dispersed in the silicone resin to increase thermal conductivity; and a silane coupling agent for helping dispersion of the heat radiation filler in the silicone resin; wherein the ceramic heat radiation filler is 800 to 850 parts by weight and the silane coupling agent is 5 to 20 parts by weight based on 150 to 200 parts by weight of the silicone resin. characterized by

Description

Thermal pad composition for 3W class semiconductor equipment {Composition for 3W class thermally conductive pad of equipment of semi-conductor procedure}

The present invention relates to a heat-dissipating pad composition for 3W-class semiconductor equipment, and more particularly, to a heat-dissipating pad composition for 3W-class semiconductor equipment in which a silane coupling agent is added to increase the usability of a heat-dissipating filler and silicon to improve physical properties.

In general, a heat dissipation pad refers to a structure that serves as a thermal interface material (TIM) that is located between a heat source and a heat sink of an electronic device and transfers heat generated from the heat source to the heat sink.

Currently, the main material of the heat dissipation pad forming the market is mostly (hydroxide) alumina (Al ₂ O ₃ ), which is added to a silicone-based resin to form a pad and is sold under the name of a heat dissipation pad or silicon pad.

The heat dissipation pad made of the silicon-based resin can be filled with a material having high thermal conductivity in a large amount, so the heat dissipation performance is excellent, but the heat dissipation pad itself is high in hardness and hard, so that the heat dissipation pad breaks or cracks during the process. may occur. In this case, the heat dissipation pad and the equipment are not completely adhered to each other, and an air layer is formed to decrease thermal conductivity, resulting in a decrease in heat dissipation efficiency.

In order to solve this problem, research and development on heat dissipation pad materials for semiconductor equipment having excellent heat dissipation efficiency is required.

Korean Patent Publication No. 10-2011-0013907

Therefore, the problem to be solved by the present invention is to provide a heat dissipation pad composition for semiconductor equipment with excellent physical properties at the 3W / m.K level.

In order to achieve the above purpose,

The present invention is a heat dissipation pad composition for 3W class semiconductor equipment,

a silicone resin made of liquid silicone gel;

a ceramic heat dissipating filler dispersed in the silicone resin to increase thermal conductivity; and

A silane coupling agent to help disperse the heat dissipating filler in the silicone resin; and

The ceramic heat dissipating filler is 800 to 850 parts by weight and the silane coupling agent is 5 to 20 parts by weight based on 150 to 200 parts by weight of the silicone resin.

In one embodiment of the present invention, the heat dissipation pad is characterized in that the thermal conductivity is 2.8 W / mK or more.

In another embodiment of the present invention, the heat dissipation pad is characterized in that the elongation is in the range of 125% to 250%.

In another embodiment of the present invention, the average particle diameter of the ceramic radiating filler is in the range of 0.5 to 100 μm, and the radiating filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN) , from the group consisting of aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO) and zirconia (ZrO ₂ ). It is characterized in that one or more selected.

The heat dissipation pad composition according to the present invention uses a silane coupling agent to increase compatibility between the heat dissipation filler and silicone. Thus, the heat dissipation pad composition according to the present invention has excellent elongation while having excellent electromagnetic shielding and high thermal conductivity. As a result, it is possible to prevent the heat dissipation pad from breaking or cracking, and thus, there is an advantage in that preventive maintenance (PM) of the semiconductor equipment can be increased.

1 is a schematic diagram showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description.

However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of related known technologies may obscure the gist of the present invention, the detailed description will be omitted.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present invention, the term "comprises" or "has" is intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

The present invention relates to a heat dissipation pad for semiconductor equipment, and more particularly, to a heat dissipation pad for 3W class semiconductor equipment capable of increasing preventive maintenance (PM) of semiconductor equipment by increasing heat dissipation efficiency.

Integration, weight reduction, miniaturization, and multifunctionalization are being pursued in semiconductor, electric/electronic, and automobile fields, and in particular, as semiconductors become highly integrated, more heat is generated. Accordingly, research is needed to improve yield and deterioration of semiconductor performance due to heat, but most of the domestic heat dissipation material companies are focused on the general industry. It satisfies stable adhesiveness and heat dissipation characteristics at high temperatures to prevent cracking of the heat dissipation sheet by implementing high elongation and low hardness, reducing arcing during the etching process and preventing shortening of life due to material deterioration. As a result of research to develop a heat dissipation material that can increase reliability in order to do so, the present invention was completed.

Typically, most of the main material of the heat dissipation pad is (hydroxide) alumina (Al ₂ O ₃ ) is used, and it is added to a silicone-based resin to produce a pad shape and sold under the name of a heat dissipation pad or silicon pad.

However, a heat dissipation pad made of such a silicone-based resin can be filled with a material having high thermal conductivity in a large amount and has excellent heat dissipation performance, but the heat dissipation pad itself is high in hardness and hard, so that the heat dissipation pad breaks or cracks during the process. There are times when problems arise. In this case, there is a problem in that the heat dissipation pad and the equipment are not completely adhered to each other, and an air layer is formed, resulting in poor thermal conductivity.

Accordingly, an object of the present invention is to provide a heat dissipation pad for semiconductor equipment having excellent electromagnetic wave shielding and high thermal conductivity and excellent elongation by increasing compatibility between a heat dissipating filler and silicon using a silane coupling agent.

Hereinafter, the present invention will be described in more detail.

1 is a schematic diagram showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

Referring to FIG. 1 , a heat dissipation pad 100 for semiconductor equipment according to the present invention includes a silicone resin 110 made of liquid silicone gel and a heat dissipation filler 120 dispersed in the silicone resin 110 to increase thermal conductivity. . It is characterized in that it further comprises a silane coupling agent to help the dispersion of the heat radiation filler in the resin.

In the present invention, the term "thermal pad" refers to a structure that serves as a TIM (Thermal Interface Materials) that is located between a heat source and a heat sink of an electronic device and transfers heat generated from the heat source to the heat sink. may mean a silicon heat dissipation pad for semiconductor equipment.

Silicon refers to a polymer in which organosilicone containing organic groups and oxygen are connected to each other through chemical bonds (it is a different material from silicone, which is a semiconductor). Silicone is a unique chemical combination of organic and inorganic properties. It is applied in various forms as a zero, and occupies a position as an essential high-performance material in most industrial fields.

On the other hand, in the present invention, the liquid silicone gel has excellent fluidity like a liquid because individual molecules exist independently with siloxane bonds, so molecular chains can move freely with each other, and silicone rubber is a high polymer that has molecular chains Since this mutual movement is not possible, the fluidity is low, but the mutual attraction between molecules is small, so it has excellent elasticity and restoring force.

In particular, when mixing the heat-dissipating filler 120 in the conventional silicone heat-dissipating pad 100, the heat-dissipating filler is not uniformly dispersed, causing a decrease in thermal conductivity. Therefore, the present invention includes a silicon coupling agent, so that the thermal conductivity can be increased to 3W level, and accordingly, workability during preventive maintenance (PM) of semiconductor equipment can be improved.

Liquid silicone gel has a low ion content, which prevents the formation of an induction path for moisture where corrosion begins, so that it can withstand high temperature and high humidity environments. characteristics can be maintained. In addition, silicone gel has excellent adhesion, light transparency, heat and shock absorption, and does not cause a change in electrical conductivity. Further, silicone gel basically has the same polysiloxane structure as silicone rubber, but the crosslinking density after the crosslinking reaction is smaller than that of silicone rubber, meaning that it is cured into a soft gel that cannot be measured with a normal rubber hardness tester. As the silicone gel, various silicone gels such as dimethyl silicone gel and methylphenyl silicone gel classified according to the type of polysiloxane constituting the main chain may be used. However, a silicone gel having excellent compatibility and affinity with the silicone rubber used in the present invention may be used, and it is preferable to select and use a silicone gel of the same type as the silicone rubber.

The heat dissipation pad 100 may have an elongation of 125% or more. Here, "elongation" means the rate at which a material elongates during a material tensile test, and can be calculated using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100) according to JIS K 6251-1 conditions, and can be calculated using the following formula Elongation can be calculated according to

[formula]

Elongation (%) = (length at break - initial length) / initial length × 100

Specifically, the elongation of the heat dissipation pad 100 may be 125% or more, and may be in the range of 125 to 250%. On the other hand, when the elongation of the heat dissipation pad 100 is less than 125%, the heat dissipation pad 100 and the semiconductor equipment cannot be completely adhered to, and the heat dissipation pad 100 breaks or cracks may occur during the process. An air layer may be formed, causing a problem in that the thermal conductivity is lowered. In addition, when the elongation of the heat dissipation pad 100 exceeds 250%, the heat dissipation pad 100 does not break or crack, but may not be restored to its original shape.

In more detail, the performance of the heat dissipation pad of the present invention may be shown in Table 1 below.

Parameter Performance Thermal conductivity (W/mK) 2.8+ Hardness (Shore 00) over 55 Adhesion (gf/cm3) over 360 Elongation (%) over 125 Oil bleeding (wt%) 1.8 or lower Thermal conductivity change rate (%) 25% or less Hardness change rate (%) 22% or less

In addition, the heat dissipation filler 120 is dispersed in the silicone resin 110, the heat dissipation pad 100 includes the heat dissipation filler 120, and the heat generated by the object to be dissipated is transferred to another layer through the heat dissipation pad. can be easily conveyed.

The average particle diameter of the heat-dissipating filler 120 of the present invention is in the range of 0.5 to 100 μm, and the heat-dissipating filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO) and zirconia (ZrO ₂ ) may be at least one selected from the group consisting of And, for example, the heat radiation filler 120 may be alumina.

Meanwhile, the heat dissipation pad according to the present invention may have an average thickness of 0.01 to 100 mm. If the thickness of the heat dissipation pad is too thin, it may be difficult to have sufficient heat dissipation characteristics, and conversely, if it is too thick, it may be difficult to have withstand voltage characteristics, and the above range is preferable.

This heat dissipation pad for semiconductor equipment has a thermal conductivity of 3W, has excellent thermal conductivity and excellent adhesion, and can prevent the heat dissipation pad from breaking or cracking, thereby increasing PM (preventive maintenance) of semiconductor equipment. There are advantages to doing so.

In particular, the present invention uses a silane coupling agent in a predetermined range in order to improve compatibility between a ceramic heat-dissipating filler and a silicone resin made of liquid silicone gel, and the ceramic heat-dissipating filler is 800 to 850 based on 150 to 200 parts by weight of the silicone resin. Part by weight, the silane coupling agent is included in 5 to 20 parts by weight. Within the above range, the heat dissipation pad of the present invention may have excellent physical properties and reliability.

Hereinafter, the present invention will be described in more detail by examples and experimental examples.

However, the following Examples and Experimental Examples are merely illustrative of the present invention, and the contents of the present invention are not limited to the following Examples and Experimental Examples.

<Example>

<Manufacture of heat dissipation pad>

A silicone resin, a heat dissipating filler, and a silane coupling agent were mixed in the composition shown in Table 2 below (all contents are parts by weight), and a semiconductor having an average thickness of 0.5 mm was subjected to a heating and pressing process at 150 ° C and 100 kg _f / cm ² . A heat dissipation pad for the equipment was prepared.

ingredient Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 silicone resin 150 200 200 150 200 200 Thermal filler 800 850 850 800 825 850 Silane Coupling Agent 5 10 20 - 3 25

<Experimental example>

Experimental Example 1. Thermal conductivity measurement

Thermal conductivity was measured for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3.

Specifically, the thermal conductivity of the heat dissipation sheet in the vertical direction was measured using a thermal property tester (TIM1400, Analysis Tech) according to ASTM D 5470.

Experimental Example 2. Hardness measurement

Hardness was measured for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3. Specifically, the hardness of the heat dissipation pad was measured according to ASTM D 2240 using a durometer for a specimen having a thickness of 6.4 mm (1/4 in).

Experimental Example 3. Adhesion measurement

Hardness was measured for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3. Specifically, the hardness of the heat dissipation pad was measured according to ASTM D 3330 using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100).

Experimental Example 4. Measurement of elongation

In order to confirm the physical properties of the heat dissipation pad according to the present invention, the elongation was measured for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3.

Specifically, the heat dissipation pad was cut into 50 mm × 50 mm and measured using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100) according to JIS K 6251-1 conditions, and the elongation was calculated according to the following formula.

[formula]

Elongation (%) = (length at break - initial length) / initial length × 100

Experimental Example 5. Reliability evaluation

In order to confirm the reliability of the heat dissipation pad according to the present invention, for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3, the oil bleeding rate was measured by measuring the weight before and after insertion of the heat dissipation pad, and the thermal conductivity The thermal conductivity change rate was measured by measuring the degree, and the hardness change rate was measured by measuring the hardness.

The reliability evaluation was performed under the conditions of a storage temperature of 100 ° C, an applied pressure of 10 kgf, and a storage time of 48 hours for a sample having a size of 100 mm * 100 mm.

The thermal conductivity, hardness, adhesion and elongation measurement results of the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 3 are shown in Table 3 below, and reliability evaluation results are shown in Table 4.

thermal conductivity
(W/mK) Hardness
(Shore 00) adhesiveness
(gf/cm ³ ) elongation rate
(%) Example 1 2.87 56 380 200 Example 2 2.95 59 389 250 Example 3 2.98 61 397 270 Comparative Example 1 2.18 53 361 160 Comparative Example 2 2.24 54 363 180 Comparative Example 3 2.87 55 362 240

Oil bleed (wt%) Thermal conductivity change rate (%) Hardness change rate (%) Example 1 1.39 17.21 19.23 Example 2 1.13 14.32 17.32 Example 3 1.12 14.31 16.01 Comparative Example 1 2.13 27.32 23.19% Comparative Example 2 1.78 29.61 20.13% Comparative Example 3 1.82 28.19 24.13%

As can be seen in Table 3, it can be seen that the heat dissipation pads prepared in Examples 1 to 3 were all manufactured as 3W class heat dissipation pads with thermal conductivity of 2.8 W/mK or higher. In addition, it can be seen that the elongation rate and hardness are both excellent, and the adhesive strength is 360 gf/cm3 or more and can be attached without voids.

On the other hand, in the case of Comparative Examples 1 and 2 using less than 5 parts by weight of the silane coupling agent, the thermal conductivity was less than 2.8 W/mK, and the hardness, adhesive strength, and elongation were all decreased, and in the case of Comparative Example 3, the thermal conductivity was 2.87 or more. However, the adhesive force and elongation rate were lowered.

In addition, as can be seen in Table 4, in terms of reliability, Examples 1 to 3 showed better results than Comparative Examples 1 to 3, and it was expected that they would have a longer lifespan.

That is, it can be seen that the heat dissipation pad according to the present invention contains a silane coupling agent in a predetermined range, has excellent hardness, adhesive strength and elongation in addition to 3W class thermal conductivity, and has high reliability.

Claims (4)

As a heat dissipation pad composition for 3W class semiconductor equipment,
a silicone resin made of a liquid silicone gel having a siloxane bond;
a ceramic heat dissipating filler dispersed in the silicone resin to increase thermal conductivity; and
A silane coupling agent to help disperse the heat dissipating filler in the silicone resin; and
The ceramic heat radiation filler is 800 to 850 parts by weight and the silane coupling agent is 10 to 20 parts by weight, based on 150 to 200 parts by weight of the silicone resin,
The heat dissipation pad is made of the heat dissipation pad composition when the elongation is in the range of 125% to 250%, and a sample having a size of 100 mm * 100 mm is carried out under the conditions of an applied pressure of 10 kgf / cm 2 and a storage time of 48 hours at a storage temperature of 100 ° C. The heat radiation pad composition for 3W class semiconductor equipment, characterized in that the weight change rate of the heat radiation pad is 1.13 wt% or less.
According to claim 1,
The heat dissipation pad is a heat dissipation pad composition for 3W class semiconductor equipment, characterized in that the thermal conductivity is 2.8 W / mK or more.
delete According to claim 1,
The average particle diameter of the ceramic heat-radiating filler is in the range of 0.5 to 100 μm, and the heat-radiating filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO), and zirconia (ZrO ₂ ). Thermal pad composition.

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