KR20210017653A - Thermally conductive pad for equipment of semi-conductor procedure - Google Patents

Abstract

The present invention relates to a thermally conductive pad for semiconductor equipment, the thermally conductive pad comprising: a silicone resin including silicone gel and silicone rubber; and a thermally conductive filler dispersed in the silicone resin to increase thermal conductivity, wherein based on 100 parts by weight of the silicone gel, 1 to 10 parts by weight of the silicone rubber is included. In particular, the thermally conductive pad for semiconductor equipment can be prevented from being cut or having cracks, and thus has the advantage of improving preventive maintenance (PM) of the semiconductor equipment.

Description

Heat dissipation pad for semiconductor equipment {Thermally conductive pad for equipment of semi-conductor procedure}

The present invention relates to a heat dissipation pad for semiconductor equipment, and more particularly, to a heat dissipation pad for semiconductor equipment of high elongation capable of increasing the preventive maintenance (PM) of the anti-conductor equipment by increasing heat dissipation efficiency.

Typically, the heat dissipation pad refers to a structure serving as a thermal interface material (TIM) that is located between a heat source of an electronic device and a heat sink and transfers heat generated from the heat source to the heat sink.

Currently, the main material of the heat dissipation pad forming the market is mostly (hydroxylated) alumina (Al ₂ O ₃ ), and it is added to a silicone-based resin and manufactured in the form of a pad and is sold under the name of a heat dissipation pad or a silicone pad.

The heat dissipation pad made of the silicone resin is excellent in heat dissipation performance because it can fill a large amount of material with high thermal conductivity, but the heat dissipation pad itself is high in hardness and is hard, so the heat dissipation pad is broken or cracked during the process. May occur. In this case, the heat dissipation pad and the equipment cannot be completely in close contact with each other, and an air layer is formed to reduce thermal conductivity, resulting in a problem of lowering the heat dissipation efficiency.

In order to solve this problem, there is a need for research and development on a heat radiation pad material for semiconductor equipment having excellent heat radiation efficiency.

Korean Patent Publication No. 10-2011-0013907

The present invention is to solve the above-described problem, and to provide a heat dissipation pad for semiconductor equipment of high elongation capable of reducing the occurrence of cracks or breakage of the heat dissipation pad.

To achieve the above object,

The present invention,

As a heat dissipation pad for semiconductor equipment,

Silicone resins including silicone gel and silicone rubber; And

A heat dissipating filler dispersed in the silicone resin to increase thermal conductivity; Including,

Based on 100 parts by weight of the silicone gel, containing 1 to 10 parts by weight of silicone rubber,

The heat dissipation pad provides a heat dissipation pad for semiconductor equipment, characterized in that the elongation is 150% or more.

The heat dissipation pad for semiconductor equipment according to the present invention has an elongation of 150% or more, so that the heat dissipation pad can be prevented from being cut or cracked, thereby increasing the PM (preventive maintenance) of the semiconductor equipment. .

1 is a schematic diagram showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

In the present invention, various modifications may be made and various embodiments may be provided, and specific embodiments will be illustrated in the drawings and described in detail in the detailed description.

However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, when it is determined that a detailed description of a related known technology may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present invention, terms such as "comprises" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility.

The present invention relates to a heat dissipation pad for semiconductor equipment, and more particularly, to a heat dissipation pad for semiconductor equipment of high elongation capable of increasing the preventive maintenance (PM) of the anti-conductor equipment by increasing heat dissipation efficiency.

Typically, the main material of the heat dissipation pad is mostly (hydroxylated) alumina (Al ₂ O ₃ ), and it is added to a silicone resin and manufactured in the form of a pad and is sold under the name of a heat dissipation pad or a silicone pad.

However, the heat dissipation pad made of such a silicone resin can be filled with a large amount of a material with high thermal conductivity, and thus has excellent heat dissipation performance, but the heat dissipation pad itself has high hardness and is hard, so that the heat dissipation pad breaks or cracks occur during the process. There may be a problem that occurs. In this case, there is a problem that the heat dissipation pad and the equipment are not completely in close contact, and an air layer is formed, resulting in a decrease in thermal conductivity.

Accordingly, an object of the present invention is to provide a heat dissipation pad for semiconductor equipment capable of reducing the occurrence of cracks or breakage of the heat dissipation pad by increasing the elongation by including a certain amount of silicone rubber in addition to the silicone gel.

Hereinafter, the present invention will be described in more detail.

1 is a schematic diagram showing a cross section of a heat dissipation pad for semiconductor equipment according to the present invention.

Referring to FIG. 1, the heat dissipation pad 100 for semiconductor equipment according to the present invention is dispersed in a silicone resin 110 including a silicone gel and a silicone rubber, and a thermoelectric device. It includes a heat dissipation filler 120 to increase the conductivity.

In the present invention, the term "heating pad" refers to a structure that is located between a heat source of an electronic device and a heat sink and serves as a TIM (Thermal Interface Materials) that transfers heat generated from the heat source to the heat sink. May mean a silicon heat dissipation pad for semiconductor equipment.

Silicon refers to a polymer in which organosilicone containing organic groups and oxygen are connected to each other through chemical bonds (it is a different material from silicon, a semiconductor). Silicon is a unique chemical that combines organic and inorganic properties. As a material, it is applied in various forms and occupies a position as an essential high-performance material in most industrial fields.

On the other hand, in the present invention, the silicone gel (silicone gel) has a property of excellent fluidity like a liquid because individual molecules exist independently due to siloxane bonds, and the molecular chains can move freely, and silicone rubber is a high polymer and has a molecular chain. Since they cannot move to each other, the fluidity is low, but the mutual attraction between molecules is small, so it has excellent elasticity and resilience.

In particular, the conventional silicone heat dissipation pad 100 uses only silicone gel, and the pad is broken due to the low elongation of the pad, and thus PM workability is reduced, but in the present invention, the elasticity and resilience are excellent. By containing a silicone rubber having characteristics in a predetermined range, it is possible to increase the elongation and thus improve the workability between PM (Preventive Maintenance) of the semiconductor equipment.

For reference, silicone gel has low ionic content and prevents the formation of an induction path of moisture from which corrosion begins, so that it can withstand high temperature and high humidity environments, and has excellent heat/cold resistance, so it can be used in a wide temperature range of about -85℃ to 200℃. It can maintain soft and flexible properties. In addition, silicone gel is excellent in adhesion, light transparency, heat and shock absorption, and does not cause a change in electrical conductivity. Further, the silicone gel basically has the same polysiloxane structure as the silicone rubber, but the crosslinking density after the crosslinking reaction is smaller than that of the silicone rubber, and it means that the silicone gel is cured into a soft gel that cannot be measured with a conventional rubber hardness tester. As the silicone gel, various silicone gels, such as dimethyl silicone gel and methylphenyl silicone gel, classified according to the type of polysiloxane constituting the main chain may be used. However, a silicone gel having excellent compatibility and affinity with the silicone rubber used in the present invention can be used, and it is preferable to select and use a silicone gel of the same system as the silicone rubber.

In addition, silicone rubber refers to a generic term for a liquid silicone rubber (LSR), a liquid silicone rubber (LSR) made of a crosslinked polymer reinforced with silica. In the present invention, compared to the solid silicone rubber, the liquid silicone rubber has a very fast curing speed, a low viscosity, and thus it is easy to implement a product shape during molding, and has various effects in which almost no residue occurs during molding.

Such a silicone rubber has excellent elasticity and resilience, and may increase the elongation of the heat dissipation pad 100 of the present invention. Specifically, based on 100 parts by weight of the silicone gel, may include 1 to 10 parts by weight of the silicone rubber, specifically, based on 100 parts by weight of the silicone gel, including 3 to 10 parts by weight and 5 to 10 parts by weight of the silicone rubber can do. If the silicone rubber is included in less than 1 part by weight, the elongation may be small because the content of the silicone rubber is too small, and if it exceeds 10 parts by weight, the elongation may be increased, but the viscosity may rapidly increase. have. Therefore, it is preferable to include the above-described range.

The heat dissipation pad 100 may have an elongation of 150% or more. Here, "elongation" means the rate at which the material stretches during the tensile test of the material, and can be calculated using a Zwick-Roell Universal Testing Machine (Z100) according to JIS K 6251-1 conditions, and the following calculation formula Elongation can be calculated according to.

[formula]

Elongation (%) = (length at break-initial length)/initial length × 100

Specifically, the elongation of the heat dissipation pad 100 may be 150% or more, in the range of 150 to 250%, and may be 170 to 240%. On the other hand, if the elongation rate of the heat dissipation pad 100 is less than 150%, the heat dissipation pad 100 and the semiconductor equipment cannot be completely in close contact, and the heat dissipation pad 100 may be broken or cracked during the process. An air layer may be formed, resulting in a problem of lowering the thermal conductivity. In addition, when the elongation of the heat dissipation pad 100 exceeds 250%, the heat dissipation pad 100 may not be cut or cracked, but may not be restored to its original shape.

In addition, the heat dissipation filler 120 is dispersed in the silicone resin 110, and the heat dissipation pad 100 includes the heat dissipation filler 120 so that heat generated by the heat dissipation object is transferred to another layer through the heat dissipation pad. Can be easily delivered.

The heat dissipation filler 120 of the present invention is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), beryllia (BeO), and zirconia (ZrO ₂ ), may be one or more selected from the group consisting of, for example, the heat dissipation filler 120 is alumina Can be

The heat dissipation filler 120 may include a first filler 121, a second filler 122, and a third filler 123 according to the size of the particle diameter. Specifically, the first filler having an average particle diameter of 0.3 to 1.0 μm A filler 121, a second filler 122 having an average particle diameter of 0.4 to 10 µm, and a third filler 123 having an average particle diameter of 60 to 80 µm may be included. That is, the heat dissipation fillers 120 having different average particle diameters may be essentially included as three filler groups.

The first pillar 121 fills the space between the second pillar 122 and/or the third pillar 123 and may have an average particle diameter of 0.3 to 1.0 μm. Specifically, the first filler 121 may have an average particle diameter of 0.35 to 0.8 μm, an average particle diameter of 0.4 to 0.6 μm, or an average of 0.5 μm. In particular, when the particle diameter of the first filler 121 is less than 0.3 µm or exceeds 1.0 µm, there may be a problem in that the second filler 122 and/or the third filler 123 to be described later cannot be contacted. .

In addition, the first filler 121 may include 100 to 200 parts by weight, based on 100 parts by weight of the silicone gel, and may include 120 to 160 parts by weight. If the first filler 121 contains less than 100 parts by weight based on 100 parts by weight of the silicone gel, the thermal conductivity may be lowered, and if it exceeds 200 parts by weight, the thermal conductivity increases, but silicone blending before making the pad As the viscosity of the material increases, workability may decrease and mechanical properties may decrease.

The second pillar 122 fills the space between the third pillars 123 and may have an average particle diameter of 0.4 to 10 μm. Specifically, the second filler 122 may have an average particle diameter of 1 to 9 μm, an average particle diameter of 2 to 8 μm, an average particle diameter of 3 to 7 μm, an average particle diameter of 4 to 6 μm, or an average of 5 μm. have. In particular, when the particle diameter of the second filler 122 is less than 0.4 µm or exceeds 10 µm, the viscosity and thermal conductivity of the silicone formulation before pad fabrication may be affected.

In addition, the second filler 122 may include 200 to 350 parts by weight, and 250 to 300 parts by weight, based on 100 parts by weight of the silicone gel. If the second filler 122 contains less than 200 parts by weight based on 100 parts by weight of the silicone gel, the thermal conductivity may be lowered, and if it exceeds 350 parts by weight, the thermal conductivity increases, but silicone formulation before making the pad As the viscosity of the material increases, workability may decrease and mechanical properties may decrease.

The third filler 123 may have an average particle diameter in the range of 60 to 80 μm. Specifically, the third filler 123 may have an average particle diameter of 65 to 75 μm and an average particle diameter of 70 μm. In particular, when the particle diameter of the third filler 123 is less than 60 µm or exceeds 80 µm, the viscosity and thermal conductivity of the silicone formulation before pad manufacturing may be affected.

In addition, the third filler 123 may include 350 to 450 parts by weight, and may include 370 to 400 parts by weight, based on 100 parts by weight of the silicone gel. If the third filler 123 contains less than 350 parts by weight based on 100 parts by weight of the silicone gel, thermal conductivity is remarkably lowered, so it may be difficult to realize heat transfer in effect, and when it exceeds 450 parts by weight, mechanical properties There is a fear that this may drop significantly or the breakdown voltage may decrease.

Meanwhile, the heat dissipation pad according to the present invention may have an average thickness of 0.1 to 50 mm. If the thickness of the heat dissipation pad is too thin, it may be difficult to have sufficient heat dissipation characteristics, whereas if the heat dissipation pad is too thick, it may be difficult to have withstand voltage characteristics, and the above range is preferable.

Such a heat dissipation pad for semiconductor equipment has an elongation of 150% or more, and can prevent the heat dissipation pad from being cut or cracked, thereby increasing the PM (preventive maintenance) of the semiconductor equipment.

Hereinafter, the present invention will be described in more detail by examples and experimental examples.

However, the following examples and experimental examples are merely illustrative of the present invention, and the contents of the present invention are not limited to the following examples and experimental examples.

<Example>

Example 1. Manufacture of heat dissipation pad (1)

Liquid silicone gel, liquid silicone rubber, and heat dissipation filler are mixed in the composition shown in the table below, and heated and pressurized at 150℃ and 100kg _f /cm ² to produce a heat dissipation pad for semiconductor equipment with an average thickness of 0.5mm. I did.

ingredient Content (g) Remark Silicone gel 10 Silicone rubber 0 First filler (alumina) 15 Average diameter: 0.5 μm Second filler (alumina) 30 Average diameter: 5 μm Third filler (alumina) 40 Average diameter: 70 μm

Example 2. Manufacture of heat dissipation pad (2)

A heat dissipation pad was manufactured in the same manner as in Example 1, except that 0.5 g of the liquid silicone rubber was mixed.

Example 3. Manufacture of heat dissipation pad (3)

A heat dissipation pad was manufactured in the same manner as in Example 1, except that 0.75 g of the liquid silicone rubber was mixed.

<Comparative Example>

Comparative Example 1. Manufacture of heat dissipation pad (4)

A heat dissipation pad was manufactured in the same manner as in Example 1 without adding silicone rubber.

Comparative Example 2. Manufacture of heat dissipation pad (5)

A heat dissipation pad was manufactured in the same manner as in Example 1, except that 1.5 g of the liquid silicone rubber was mixed.

<Experimental Example>

Experimental Example 1. Elongation measurement

In order to confirm the physical properties of the heat dissipating pad according to the present invention, the elongation was measured for the heat dissipating pads of Examples 1 to 3 and Comparative Examples 1 to 2.

Specifically, the heat dissipation pad was cut into 50 mm × 50 mm and measured using a universal testing machine (Zwick-Roell Universal Testing Machine, Z100) according to JIS K 6251-1 conditions, and the elongation was calculated according to the following calculation formula.

[formula]

Elongation (%) = (length at break-initial length)/initial length × 100

Experimental Example 2. Measurement of thermal conductivity

Thermal conductivity was measured for the heat dissipation pads of Examples 1 to 3 and Comparative Examples 1 to 2. Specifically, the thermal conductivity of the heat dissipating sheet in the vertical direction was measured using a thermal property test apparatus (TIM1400, Analysis Tech) according to ASTM D 5470.

The elongation and thermal conductivity measurement results of the heat dissipating pads of Examples 1 to 3 and Comparative Examples 1 to 2 are shown in Table 2 below.

Elongation (%) Thermal conductivity Liquid silicone rubber content (% by weight) Example 1 170 2.5 0.5 Example 2 200 2.5 0.75 Example 3 240 2.5 1.0 Comparative Example 1 100 2.5 0 Comparative Example 2 280 2.2 1.5

As can be seen in Table 2, it was confirmed that the heat dissipation pads prepared in Examples 1 to 3 had excellent elongation and thermal conductivity. On the other hand, in the case of Comparative Example 1, the elongation was 100% and the elongation was very low. In the case of Comparative Example 2, the elongation was excellent, but there was a problem that the thermal conductivity was lowered.

That is, it was confirmed that the heat dissipation pad according to the present invention includes a liquid silicone rubber in a predetermined range, and thus has excellent elongation and thermal conductivity.

100: heat dissipation pad
110: silicone resin
120: heat dissipation filler 121: first filler
122: second filler 123: third filler

Claims (6)

As a heat dissipation pad for semiconductor equipment,
Silicone resins including silicone gel and silicone rubber; And
A heat dissipating filler dispersed in the silicone resin to increase thermal conductivity; Including,
Based on 100 parts by weight of the silicone gel, including 1 to 10 parts by weight of the silicone rubber,
The heat radiation pad is a heat radiation pad for semiconductor equipment, characterized in that the elongation of 150% or more.
The method of claim 1,
The heat radiation pad is a heat radiation pad for semiconductor equipment, characterized in that the elongation is in the range of 150% to 250%.
The method of claim 1,
A heat radiation pad for semiconductor equipment, characterized in that the thickness of the heat radiation pad ranges from 0.1 to 50 mm on average.
The method of claim 1,
The heat dissipating filler includes: a first filler having an average particle diameter of 0.3 to 1.0 µm;
A second filler having an average particle diameter of 0.4 to 10 μm; And
A third filler having an average particle diameter of 60 to 80 μm; A heat dissipation pad for semiconductor equipment comprising a.
The method of claim 4,
Based on 100 parts by weight of silicone gel, the heat dissipation filler is a heat dissipation pad for semiconductor equipment, characterized in that 100 to 200 parts by weight of the first filler, 200 to 350 parts by weight of the second filler, and 250 to 450 parts by weight of the third filler are mixed.
The method of claim 1,
The heat dissipating filler is zinc oxide (ZnO), silicon carbide (SiC), magnesia (MgO), boron nitride (BN), aluminum hydroxide (Al ₂ (OH) ₃ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN ), silicon nitride (Si ₃ N ₄ ), beryllia (BeO) and zirconia (ZrO ₂ ) at least one heat dissipation pad for semiconductor equipment selected from the group consisting of.

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