KR20220025576A - Test apparatus for electronic device - Google Patents

Abstract

The present invention relates to a test apparatus for an electronic device and, more specifically, to a test apparatus for an electronic device, for performing an aging test on an electronic device. According to an embodiment of the present invention, a test apparatus for an electronic device comprises: a support unit for supporting a test board on which electronic devices are mounted; a chamber wall unit provided to correspond to the support unit and covered on the support unit to define an accommodation space, for accommodating at least the electronic devices, of the test board; a temperature control unit including a heater unit and a cooling unit and for adjusting the temperature of the accommodation space; a connection unit connected to the test board to transmit a test signal for the electronic devices; and a control unit for controlling the temperature control unit according to a preset temperature. Therefore, the test apparatus for an electronic device can precisely control the temperature of the accommodation space defined by the chamber wall unit.

Description

Test apparatus for electronic device

The present invention relates to a test device for an electronic device, and more particularly, to a test device for an electronic device for performing an aging test on the electronic device.

Recently, with the rapid development and spread of computer technology, electronic device technology such as a memory device that can be used in connection with it is also developing rapidly.

In light of today's situation in which high integration of these electronic devices is rapidly progressing, the role played by the manufacturing and testing apparatus is more important.

In particular, among electronic devices, memory devices such as Dynamic Random Access Memory (DRAM), Solid State Drive (SSD), and Embedded Multi Media Card (eMMC) are subject to usage conditions. Since there are various types and defects may occur due to self-heating according to the use of the memory, an aging test (eg, temperature reliability test) is performed before shipping the product.

The aging test is performed in a high-temperature atmosphere by connecting the test board with a cable while placing the test board equipped with the electronic device to be tested in the chamber of the test device for reliability testing of electronic devices. For this, precise temperature control inside the chamber is required.

Korean Utility Model Publication No. 20-0221222

The present invention provides a test apparatus for an electronic device that precisely controls the temperature of an accommodation space defined by a chamber wall part.

A test apparatus for an electronic device according to an embodiment of the present invention includes a support for supporting a test board on which an electronic device is mounted; a chamber wall part provided corresponding to the support part and covered on the support part to define an accommodation space for accommodating at least the electronic device among the test board; a temperature control unit including a heater unit and a cooling unit, and controlling the temperature of the accommodation space; a connection connection unit connected to the test board to transmit a test signal for the electronic device; and a controller configured to control the temperature controller according to a preset temperature.

The chamber wall part may define a plurality of accommodating spaces independent of each other on the test board.

The test board may include a mounting unit on which the electronic device is mounted, and the mounting unit may be configured in plurality and grouped by at least one.

A plurality of groups of the mounting units may be disposed to be spaced apart from each other.

The accommodating space may be provided for each group of the mounting unit.

The test board may further include a plurality of central processing units provided corresponding to each of the accommodating spaces, and the mounting units may be grouped according to the connected central processing units, respectively.

The plurality of central processing units may be independently processed according to the group of the connected mounting units.

The temperature control unit may divide the accommodation space into a plurality of regions to control the temperature of each region, and at least one of the heater unit and the cooling unit may be configured in plurality and provided for each divided region.

The cooling unit may include a ventilation fan for discharging heat in the accommodation space.

The cooling unit may include a cooling gas supply unit for supplying a cooling gas into the accommodation space.

The controller may include a first temperature receiver configured to receive the temperature of the electronic device.

The first temperature receiver may receive the temperature of the electronic device from a temperature sensor built in the electronic device.

It is provided in the accommodation space, the temperature measurement unit for measuring the temperature of the accommodation space; further comprising, the control unit further comprises a second temperature receiver for receiving the temperature of the accommodation space measured from the temperature measurement unit can

The controller may control the temperature controller by reflecting the temperature of the accommodation space received from the second temperature receiver to the temperature of the electronic device received from the first temperature receiver.

It may further include; a gap adjusting unit for adjusting the interval between the chamber wall portion and the test board.

A transport robot provided on either side of both sides in the first axial direction of the support part and carrying the test board into and out of the test position on the support part; may further include.

The connection connection portion is provided on the opposite side of the transport robot among both sides of the first axial direction of the support portion and includes a first connection terminal selectively connected to the test board, and the test board is provided on either side of the first axial direction. It may include a second connection terminal connected to the first connection terminal on one side.

The transport robot may carry in and take out the test board in the first axial direction so that the second connection terminal faces the first connection terminal.

It may further include; a frame portion in which the plurality of chamber wall portions and the support portion are arranged in multiple stages.

The test apparatus for an electronic device according to an embodiment of the present invention controls the heater unit and the cooling unit according to a preset temperature through the control unit to adjust the temperature of the accommodation space defined by the chamber wall unit, thereby precisely controlling the temperature of the accommodation space. can In addition, the chamber wall portion may be configured to cover the test board to define a plurality of accommodating spaces on the test board. Accordingly, the mounting portion on which the electronic device is mounted can be grouped to provide an accommodating space corresponding to the connected central processing unit (CPU), and electronic devices connected to the same central processing unit can perform a test on the electronic device in the same accommodating space. and the test may be performed under relatively similar conditions among the grouped electronic devices.

And by receiving the temperature of the electronic device and controlling the temperature of the accommodation space, the temperature can be adjusted for each area (that is, by position of each electronic device) according to the measured temperature of each electronic device, and to each electronic device Therefore, the test can be carried out under a suitable temperature environment.

In addition, while controlling the temperature of the accommodating space, the temperature of the accommodating space may be reflected to the temperature of the electronic device to perform the test under a more precise temperature environment, and more accurate and reliable test results may be obtained.

In addition, a test board equipped with an electronic device can be automatically supported and removed from the support part through the transfer robot, and accordingly, the electronic device is automatically placed in the accommodating space of the chamber wall where the test for the electronic device is carried out in a high-temperature and low-temperature environment. It is possible to bring in and take out the test board equipped with In addition, the first connection terminal of the connection connection part and the second connection terminal of the test board may be aligned and coupled (or connected) by simply transporting the test board to the support part through the transport robot. That is, the connection between the first connection terminal and the second connection terminal as well as the loading and unloading of the test board may be automatically performed. Accordingly, it is possible to automatically proceed with the loading of the test board and the progress of the test, which was performed manually, so that the product operation rate (or the production yield of the product) can be improved.

1 is a diagram showing a test apparatus for an electronic device according to an embodiment of the present invention.
2 is a conceptual diagram for explaining the division of a region of an accommodation space according to an embodiment of the present invention.
3 is a diagram showing a cooling gas supply unit according to an embodiment of the present invention.
4 is a conceptual diagram for explaining a temperature sensor and a temperature measuring unit according to an embodiment of the present invention.
5 is a conceptual diagram for explaining a transport robot according to an embodiment of the present invention.
6 is a schematic view showing a frame portion according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art completely It is provided to inform you. In the description, the same reference numerals are assigned to the same components, and the sizes of the drawings may be partially exaggerated in order to accurately describe the embodiments of the present invention, and the same reference numerals refer to the same elements in the drawings.

1 is a diagram showing a test device for an electronic device according to an embodiment of the present invention, FIG. 1 (a) is a perspective view of the test device for an electronic device, and FIG. 1 (b) is a partial cross-sectional view of the test device for an electronic device am.

Referring to FIG. 1 , a test apparatus 100 for an electronic device according to an embodiment of the present invention includes a support 110 for supporting a test board 50 on which an electronic device 10 is mounted; The chamber wall part 120 provided to correspond to the support part 110 and covered on the support part 110 to define an accommodation space 121 for accommodating at least the electronic device 10 of the test board 50 . ); a temperature control unit 130 including a heater unit 131 and a cooling unit 132 and adjusting the temperature of the accommodation space; a connection connection unit 140 connected to the test board 50 to transmit a test signal for the electronic device 10; and a control unit 150 for controlling the temperature control unit 130 according to a preset temperature.

The support 110 may support a test board 50 on which the electronic device 10 is mounted, and a test (eg, an aging test or a temperature reliability test, etc.) on the electronic device 10 is performed. It is possible to support the test board 50 while it is. Here, the electronic device 10 includes a memory device such as a Dynamic Random Access Memory (DRAM), a Solid State Drive (SSD), an embedded Multi Media Card (eMMC), and a semiconductor. It may include a semiconductor device and the like.

The chamber wall part 120 may be provided corresponding to the support part 110 , and is covered on the support part 110 to define an accommodation space 121 for accommodating at least the electronic device 10 of the test board 50 . can That is, the chamber wall part 120 may have an internal accommodation space 121, and is covered on the support part 110 to form a chamber with the support part 110 and/or the test board 50, At least the electronic device 10 may be accommodated in the accommodation space 121 .

For example, the chamber wall part 120 may be configured such that one surface (eg, the lower surface) is open to form a chamber with the support 110 and/or the test board 50 , and the like, the chamber wall When the unit 120 forms a chamber with the test board 50 , the test board 50 forms (or configures) a wall of the chamber, and the electronic device 10 is accommodated in the accommodating space 121 . can That is, the chamber wall unit 120 may be provided in the form of a cover covering the mounting surface of the test board 50 on which the electronic device 10 is mounted. Here, when the chamber wall part 120 is configured such that one surface is opened to form a chamber with the support part 110 and/or the test board 50, the open surface and the wall(s) define (or surround) ) The space may be the accommodation space 121, the interval between the chamber wall unit 120 and the support unit 110 and/or the test board 50 may be adjusted, and the chamber wall unit 120 may be connected to the support unit 110 and / or spaced apart from the test board 50, the test board 50 can be carried in and out of the test position (for example, a position corresponding to the receiving space) on the support 110, and the test board 50 is When brought into (or positioned) in the test position, the chamber wall unit 120 may be brought into contact with (or in close contact with) the support unit 110 and/or the test board 50 to form a chamber. At this time, the chamber wall part 120, the support part 110, and/or the test board 50 may be configured to be coupled to each other, and may be separated (or disconnected) while being spaced apart from each other.

The chamber wall part 120 covers the mounting surface of the test board 50 so that the mounting surface and the wall(s) of the chamber wall part 120 form an accommodating space 121 , so that the electrons in the accommodating space 121 are When the element 10 is accommodated, only the electronic element 10 can be accommodated in the accommodation space 121, so that the temperature effect of the accommodation space 121 for the test can affect only the electronic element 10 as much as possible. , it is possible to minimize the influence of the temperature of the accommodating space 121 on the test board 50 . A semiconductor device such as a central processing unit (CPU) may be embedded in the test board 50 for the test of the electronic device 10 , and since these semiconductor devices are greatly affected by temperature, the test When the board 50 itself is affected by the temperature of the accommodating space 121 and thus also affects the semiconductor device, reliability of the test may be reduced. Accordingly, in the present invention, the chamber wall part 120 is provided in the shape of a cover covering the mounting surface of the test board 50 on which the electronic device 10 is mounted, and the part accommodated in the accommodation space 121 of the test board 50 . By minimizing , it is possible to minimize the influence of the temperature of the accommodation space 121 on the test board 50 .

The shape and structure of the chamber wall part 120 is not limited thereto, and has an accommodating space 121 whose temperature is controlled so that at least the electronic device 10 is placed in the accommodating space 121 for testing the electronic device 10 . If you can accept it, that's enough.

The temperature control unit 130 may adjust the temperature of the accommodation space 121 , and includes a heater unit 131 for heating the accommodation space 121 and a cooling unit 132 for cooling the accommodation space 121 . It is possible to maintain the accommodation space 121 at a preset temperature by controlling the heating and cooling of the accommodation space 121 .

The heater unit 131 may heat the accommodation space 121 , and a heating unit may be provided inside the accommodation space 121 to directly heat the air in the accommodation space 121 , Only air heated by heating may be supplied to the accommodation space 121 . For example, by heating air from the outside of the accommodation space 121 , the heated air may be supplied to the inside of the accommodation space 121 through a blower fan 135 or the like.

The cooling unit 132 may cool the accommodation space 121 by discharging heated air to the outside in the accommodation space 121 or supplying a cooling gas into the accommodation space 121 .

Through this, the electronic device 10 may be tested while maintaining the temperature environment in the accommodation space 121 at a preset temperature (or test temperature).

The connection connector 140 may be connected to the test board 50 to transmit (or transmit) a test signal for the electronic device 10 , and may be connected to the test board 50 on the support 110 , and the test board The test unit 153 of the control unit 150 that performs (or performs) a test on the electronic device 10 by connecting to 50 may be connected to the test board 50 by connecting it. In this case, the connection connection unit 140 may connect the test board 50 and the test unit 153 in a wired or wireless manner, and the test signal may be an electrical signal or a communication signal. Here, the connection connection unit 140 may be provided integrally with the test unit 153 by mutual coupling, or may be configured such that the test unit 153 is selectively connected (or coupled).

For example, the connection connection unit 140 may receive the test signal from the test unit 153 and transmit it to the electronic device 10 through the test board 50 , and transmit a response signal to the test signal to the electronic device ( 10) may be transmitted through the test board 50 and may be transmitted to the test unit 153 .

On the other hand, the test unit 153 may be a personal computer (PC), etc., may be separately provided outside and may be selectively connected to the connection connection unit 140 for use.

The control unit 150 may control the temperature control unit 130 according to a preset temperature, and may make the temperature of the accommodation space 121 to the preset temperature (eg, the test temperature), and It can be maintained at the set temperature. That is, the control unit 150 may control the heater unit 131 and the cooling unit 132 , and may control heating and cooling of the accommodation space 121 to maintain the accommodation space 121 at the preset temperature. there is.

Therefore, in the present invention, by controlling the heater unit 131 and the cooling unit 132 according to the preset temperature through the control unit 150 to adjust the temperature of the accommodation space 121 defined by the chamber wall unit 120, , it is possible to precisely control the temperature of the accommodation space 121 .

Here, the chamber wall unit 120 may define a plurality of accommodating spaces 121 independent of each other on the test board 50 . For example, the chamber wall unit 120 may form a plurality of accommodating spaces 121 separated from each other, one large space may be divided into a plurality of small spaces through a partition wall, and one surface is opened to each A plurality of accommodating spaces 121 may be provided (or defined) by connecting a plurality of walls defining (or forming) the accommodating space 121 . In this case, the heater unit 131 and the cooling unit 132 may be provided for each accommodation space 121 . Through this, the temperature of each accommodation space 121 can be independently controlled.

Accordingly, in the present invention, the chamber wall unit 120 is configured to cover the test board 50 to define a plurality of accommodating spaces 121 on the test board 50, and accordingly, each accommodating space 121 The temperature of can be independently controlled, and the temperature environment can be precisely controlled for each electronic device 10 provided in each accommodation space 121 .

In addition, the test board 50 may include a mounting part 51 on which the electronic device 10 is mounted. The mounting unit 51 may have an electronic device 10 mounted thereon, may allow one electronic device 10 to be mounted on one mounting unit 51 , or may have a plurality of electronic devices 10 mounted on one mounting unit 51 . ) may be installed. For example, the mounting part 51 may include a socket into which the electronic device 10 is inserted, and one of the sockets is provided in one mounting part 51 to mount one electronic device 10 , or , a plurality of the sockets are provided in one mounting part 51 , so that a plurality of electronic devices 10 may be mounted thereon.

In addition, the mounting unit 51 may be configured in plurality and may be grouped by at least one, and the electronic devices 10 mounted on the grouped mounting unit 51 may perform the test under the same test conditions. At this time, the grouped mounting unit 51 may be connected to the same central processing unit (CPU), and one central processing unit may be connected to a group of one mounting unit 51, and mounted on the connected group mounting unit 51 It may be linked with the electronic device 10 to perform an operation such as an operation.

Here, the accommodating space 121 may be provided for each group of the mounting part 51 , and the test may be performed under the same test conditions for each group of the mounting part 51 , and the temperature of each accommodating space 121 may be adjusted to An independent temperature environment suitable for test conditions may be provided for each accommodation space 121 .

In this case, a plurality of groups of the mounting part 51 may be disposed to be spaced apart from each other. The groups of the plurality of mounting parts 51 are arranged to be spaced apart from each other, thereby securing a space (or area) in which a partition wall or the like separating each accommodation space 121 can be provided (or positioned) on the test board 50 ( or provide). In addition, heat (or temperature) of the other accommodating space 121 in contact with the partition wall or the like may be transferred through the partition wall, etc. , may not be affected by the heat (or temperature effect) of the other accommodation space 121 transmitted through the partition wall or the like.

In addition, the test board 50 may further include a plurality of central processing units (not shown) provided corresponding to each accommodation space 51 . A plurality of central processing units (not shown) may be provided correspondingly to each of the accommodating spaces 51 , and one central processing unit (not shown) may be provided in one accommodating space 51 . The central processing unit (not shown) may be connected to the mounting unit 51 , and may perform operations such as arithmetic in conjunction with the electronic device 10 mounted on the mounting unit 51 , and through this, the electronic device 10 . test can be carried out.

At this time, the mounting units 51 may be grouped according to the central processing unit (not shown) to which they are respectively connected, and the mounting unit 51 to which the electronic device 10 to be tested is mounted under the same test conditions is installed in the same central processing unit ( not shown) can be connected. That is, the grouped mounting units 51 may be connected to the same central processing unit (not shown), and the electronic device 10 (s) mounted on the mounting unit 51 of the same group may be connected to the same central processing unit (not shown). Operations such as calculation may be performed by the .

In addition, a plurality of central processing units (not shown) may be independently processed according to a group of connected mounting units 51 . Each of the plurality of central processing units (not shown) may be interlocked with the electronic device 10 (s) mounted in the group of the connected mounting units 51 , so that (work) processing such as calculations may be performed, and each central processing unit (not shown) may be interlocked. Independent (work) processing may be performed for each processing device (not shown). Here, a plurality of central processing units (not shown) may be respectively connected to the control unit 150 , and respective processing may be performed according to the control of the control unit 150 . Accordingly, different processing may be performed (or proceeded) for each central processing unit (not shown), and the test may be performed in a different temperature environment for each accommodation space 121 . In addition, suitable (or suitable) test results can be derived (or calculated) according to the characteristics of each central processing unit (not shown), and the characteristics of each central processing unit (not shown) can be reflected in the test results to reflect the characteristics of the electronic device ( 10), it is possible to determine whether there is an abnormality (or whether it is suitable), and accordingly, the reliability of the test result can be improved.

The central processing unit (not shown) may have a slight performance difference for each central processing unit (not shown), and performance differences may occur due to the influence of temperature (eg, heat) during the test process. For this reason, a plurality of electronic devices 10 each interlocking with one of a plurality of central processing units (not shown) to perform operations such as calculations are provided in one accommodating space 121 , and the temperature of the accommodating space 121 is provided. When the test is performed while controlling Therefore, the test result may vary depending on which central processing unit (not shown) is connected. For example, even if there is no abnormality in the performance of the electronic device 10 interlocked with the central processing unit (not shown), which has a performance problem due to the influence of temperature, the test result may come out that the performance is abnormal.

However, by providing one accommodating space 121 for each central processing unit (not shown), only one accommodating space for the electronic device 10 mounted in a group of mounting units 51 connected to each central processing unit (not shown). When the test is performed in step 121, the test may be performed on the electronic device 10(s) in the accommodation space 121 under the same test conditions such as the performance of a central processing unit (not shown), and accordingly The reliability of test results may be improved. In addition, when a defect determination is made for all the electronic elements 10 in the accommodation space 121 , it is also possible to determine whether the performance of the central processing unit (not shown) is abnormal.

Accordingly, in the present invention, the mounting portion 51 on which the electronic device 10 is mounted can be grouped and provided with an accommodation space 121 corresponding to the connected central processing unit (not shown), and the same central processing unit (not shown). ) and the connected electronic devices 10 may perform a test on the electronic device 10 in the same accommodation space 121 , and the test may be conducted under relatively similar conditions between the grouped electronic devices 10 . Accordingly, a test error may be reduced, and reliability of a test result may be improved.

2 is a conceptual diagram for explaining the division of a region of an accommodation space according to an embodiment of the present invention.

Referring to FIG. 2 , the temperature controller 130 divides the accommodation space 121 into a plurality of regions to control the temperature of each region. Here, when there are a plurality of accommodation spaces 121 , each accommodation space 121 may be divided into a plurality of areas to control the temperature of each area. Since the temperature distribution may be different depending on the location even within the same accommodation space 121 , the temperature of each divided region may be controlled for a uniform temperature distribution in the accommodation space 121 . In addition, by controlling the temperature of each position (or region) according to the position of the mounting part 51 to which the electronic element 10 is mounted, even if the position is different in the same accommodation space 121, each electronic element 10 is placed The temperature environment can be made to be the same.

Here, at least one of the heater unit 131 and the cooling unit 132 may be configured in plurality and provided for each divided region. In this case, each of the divided regions may be a region corresponding to each mounting unit 51 , and the heater unit 131 and the cooling unit 132 can effectively heat and heat the electronic device 10 mounted on each mounting unit 51 . It may be provided so that it can be cooled.

For example, since both the heater unit 131 and the cooling unit 132 are provided for each divided area, when a temperature rise is required, the air in each area is heated with each heater unit 131 and when a temperature drop is required, each The air in each area can be cooled by the cooling unit 132 of the In addition, the air in the entire accommodation space 121 may be heated by the heater unit 131 to increase the temperature, and only a region requiring a temperature decrease may be cooled by the cooling unit 132 provided in the region.

In this case, the cooling unit 132 may include a ventilation fan 132a for discharging heat in the accommodation space 121 . The ventilation fan 132a may lower the temperature of the accommodation space 121 by discharging heat (eg, hot air) in the accommodation space 121 to the outside, and thus the accommodation space 121 may be cooled. there is. For example, the ventilation fan 132a may be provided above the accommodation space 121 , and the heater unit 131 may provide thermal energy in a lateral direction of the accommodation space 121 . The ventilation fan 132a may be provided in the upper portion of the accommodation space 121 , and is located above the electronic device 10 to discharge hot air (or heated air) in the accommodation space 121 upwardly to the outside. can be, and through this, it is possible to cool the accommodation space 121 . In addition, the heater unit 131 may provide thermal energy (eg, heated air) in the lateral direction of the accommodation space 121 , and the heated air is mounted on the test board 50 to protrude the electronic device 10 . ) by being discharged in the upper direction, it is possible to minimize the contact (or contact time) of the heated air to the test board 50 . For example, by heating air from the outside of the accommodation space 121, the heated air may be supplied to the inside of the accommodation space 121 through a blower fan 135 provided in the lateral direction of the accommodation space 121, etc. The heated air supplied to the inside of the accommodation space 121 may protrude from the test board 50 and may be discharged upward through the mounted electronic device 10 .

When the heater unit 131 provides heated air or thermal energy from the lower portion or upper portion, or the ventilation fan 132a is provided in the lower portion of the accommodation space 121, the heated air in the accommodation space 121 is continuously tested. In contact with the board 50, or the test board 50 is continuously affected by thermal energy, the test board 50 may be greatly affected by temperature, and the central processing unit ( (not shown) may be affected by temperature, and thus the reliability of the test may be deteriorated.

However, the heater unit 131 provides thermal energy in the lateral direction of the accommodating space 121 , and provides a ventilation fan 132a to the upper portion of the accommodating space 121 to provide heated air in the accommodating space 121 in the upper direction. When discharging, it is possible to minimize the time that the heated air in the accommodation space 121 contacts the test board 50, and the test board 50 and the central processing unit (not shown) are affected by temperature. can be minimized, and the reliability of the test can be further improved.

However, the configuration of the heater unit 131 and the cooling unit 132 is not limited thereto, and it is sufficient if the divided regions can be maintained at the preset temperature.

3 is a diagram illustrating a cooling gas supply unit according to an embodiment of the present invention.

Referring to FIG. 3 , the cooling unit 132 may (more) include a cooling gas supply unit 132b for supplying cooling gas in the accommodation space 121 . The cooling gas supply unit 132b may supply a cooling gas into the accommodation space 121 to cool the accommodation space 121 . Since it is difficult to cool the accommodation space 121 only by discharging the hot air in the accommodation space 121 to the outside using the ventilation fan 132a, the cooling gas is supplied into the accommodation space 121 for the cooling. It is possible to lower the temperature of the part to which the gas is supplied. Accordingly, the temperature of the accommodation space 121 may be more precisely controlled.

4 is a conceptual diagram for explaining a temperature sensor and a temperature measuring unit according to an embodiment of the present invention.

Referring to FIG. 4 , the controller 150 may include a first temperature receiver 151 that receives the temperature of the electronic device 10 . The first temperature receiver 151 may receive the temperature of the electronic device 10 , and the controller 150 controls the temperature of the electronic device 10 received by the first temperature receiver 151 and the preset temperature (eg, For example, the temperature controller 130 may be controlled using the difference between the temperature of the electronic device and the preset temperature), and the temperature of the accommodation space 121 may be adjusted to an appropriate test temperature. For example, the first temperature receiver 151 may receive the temperature of the electronic device 10 by communicating with the temperature sensor 11 that measures the temperature of the electronic device 10 by wire or wirelessly.

Here, the first temperature receiver 151 may receive the temperature of the electronic device 10 from the temperature sensor 11 built in the electronic device 10 . The electronic device 10 may have a built-in temperature sensor 11 such as a thermal diode, and the first temperature receiver 151 communicates with the temperature sensor 11 to receive the temperature of the electronic device 10 . can do. In general, an electronic device 10 such as a memory device may have a temperature sensor 11 built-in to notify an abnormality such as heat generation to a device such as a computer (PC) that is mounted and used, and is measured by the temperature sensor 11 . It may include an output pin through which the temperature of the electronic device 10 is output. The mounting unit 51 of the test board 50 may include a connection terminal having a connection pin connected to the output pin, and the test board 50 may output the temperature of the electronic device 10 from the output pin. and may transmit the output temperature of the electronic device 10 to the first temperature receiver 151 . The temperature of the electronic device 10 transmitted in this way may be received by the first temperature receiver 151 .

The control unit 150 performs heating through the heater unit 131 and cooling through the cooling unit 132 using the temperature of the electronic device 10 measured through the temperature sensor 11 built into the electronic device 10 . It is possible to precisely control the test temperature of the electronic device 10 , regardless of the temperature of the accommodation space 121 or the heating condition of the electronic device 10 . In addition, since the temperature of the electronic device 10 can be used without the installation of a separate temperature sensor, equipment costs can be saved. And by receiving the temperature of the electronic element 10 and controlling the temperature of the accommodation space 121, the temperature of each electronic element 10 is measured by region (ie, by position of each electronic element) according to the measured temperature. can be adjusted, and the test can be performed under a suitable temperature environment according to each electronic device 10 .

The test apparatus 100 for an electronic device according to the present invention may further include a temperature measuring unit 160 provided in the accommodation space 121 to measure the temperature of the accommodation space 121 .

The temperature measuring unit 160 may be provided in the accommodation space 121 , may measure the temperature of the accommodation space 121 , and may measure the ambient temperature in the accommodation space 121 . For example, the temperature measuring unit 160 may be installed on the test board 50 , and may be installed for each mounting unit 51 .

In addition, the control unit 150 may further include a second temperature receiving unit 152 that receives the temperature of the accommodation space 121 measured from the temperature measuring unit 160 . The second temperature receiving unit 152 may receive the temperature of the receiving space 121 measured from the temperature measuring unit 160 by communicating with the temperature measuring unit 160 by wire or wirelessly, and receiving it according to the preset temperature. It may be used (or reflected) to adjust the temperature of the space 121 .

For example, when the temperature sensor 11 is not built in the electronic device 10 , the first temperature receiver 151 may not receive the temperature of the electronic device 10 , and the temperature of the electronic device 10 may not be received. When is not received, the temperature of the accommodation space 121 may be adjusted according to the preset temperature using the measured temperature of the accommodation space 121 received from the temperature measurement unit 160 . In this case, the temperature of the accommodation space 121 may be adjusted by controlling the heater unit 131 and the cooling unit 132 to reduce a temperature difference between the preset temperature and the temperature of the accommodation space 121 .

And the control unit 150 reflects the temperature of the receiving space 121 received from the second temperature receiving unit 152 to the temperature of the electronic device 10 received from the first temperature receiving unit 151, the temperature adjusting unit 130 can control That is, in controlling the temperature control unit 130 , not only the temperature of the electronic device 10 received from the first temperature receiving unit 151 , but also the measured accommodation space 121 received from the second temperature receiving unit 152 . temperature may also be reflected. Through this, a more precise test temperature can be controlled for each electronic device 10 , and the test can be performed under a suitable temperature environment for each electronic device 10 .

Therefore, in the present invention, the temperature of the electronic device 10 received by the first temperature receiving unit 151 while controlling the temperature of the receiving space 121 is measured by the temperature measuring unit 160 (atmosphere) of the receiving space 121 . ) by reflecting the temperature, the electronic device 10 can be tested under a more precise temperature environment, and more accurate and reliable test results can be obtained.

The test apparatus 100 for an electronic device according to the present invention may further include a spacing adjusting unit (not shown) for adjusting the interval between the chamber wall unit 120 and the test board 50 .

The interval adjusting unit (not shown) can adjust the interval between the chamber wall unit 120 and the test board 50 , and spaced the chamber wall unit 120 from the test board 50 to the test position on the support unit 110 . The test board 50 can be brought in and out, and when the test board 50 is brought into (or positioned) in the test position, the chamber wall part 120 is brought into contact with (or in close contact with) the test board 50 to the chamber. can form.

For example, the gap adjusting unit (not shown) may be configured to elevate the chamber wall unit 120 on the test board 50 . Since the test board 50 is connected to the connection connection unit 140 , it is difficult to change the height by elevating the test board 50 , and when the test board 50 is attempted to be raised or lowered, the configuration becomes complicated. However, if the interval adjusting unit (not shown) is configured to elevate the chamber wall unit 120 on the test board 50 , the interval between the chamber wall unit 120 and the test board 50 can be adjusted with a simple configuration. . Here, the interval adjusting unit (not shown) may include a chamber lifting unit (not shown) for elevating the chamber wall unit 120 . The chamber lifting unit (not shown) may be configured in the form of an elevating cylinder (cylinder), and may elevate the chamber wall unit 120 using a pneumatic cylinder or the like.

5 is a conceptual diagram for explaining a transport robot according to an embodiment of the present invention.

Referring to FIG. 5 , the test apparatus 100 for an electronic device according to the present invention is provided on either side of both sides in the first axial direction of the support part 110 , and the test board 50 is placed on the support part 110 in a test position It may further include a; transport robot 170 for carrying in and out.

The transport robot 170 may be provided on either side of both sides in the first axial direction of the support part 110 , and may carry in and carry out the test board 50 to the test position on the support part 110 . That is, the transport robot 170 can support the test board 50 on the support part 110 , and place the test board 50 at the test position corresponding to the accommodation space 121 in the support part 110 ( or provided), and the test board 50 supported by the support 110 may be removed from the support 110 (or transported from the support). Here, the transport robot 170 may be provided on either side of both sides of the first axial direction of the support 110 , and move the test board 50 toward the support 110 in the first axial direction to make the test board The 50 may be supported by the support 110 , and the test board 50 supported by the support 110 is moved in the opposite direction to the support 110 in the first axial direction to be removed from the support 110 . (or retrieval) is possible. In this case, the control unit 150 may be provided on the opposite side of the transport robot 140 among both sides of the chamber wall unit 120 in the first axial direction.

For example, the transport robot 170 provides (or positions) the test board 50 at the test position on the support 110 so that the electronic device 10 mounted on the test board 50 is accommodated in the accommodating space 121 . ) can be accommodated, and the test board 50 on which the test for the electronic device 10 is completed can be transported (or carried out) from the support 110 . The transfer robot 170 supports the test board 50 on the support part 110 and the chamber wall part 120 contacts (or combines) the support part 110 and/or the test board 50 to the test board 50 can be brought into (or provided) into the accommodating space 121, and the chamber wall 120 is separated from the support 110 and/or the test board 50 to separate the test board 50 from the accommodating space 121 After being removed (or taken out) from the transfer robot 170 may retrieve the test board 50 and take out the test board 50 .

Conventionally, there was a problem that the product operation rate was low because people manually performed the installation of the electronic device 10, the loading (or input) of the test board 50, and the operation of the test program. 100 may automatically support and remove the test board 50 on which the electronic device 10 is mounted on the support 110 through the transport robot 170 . Accordingly, the test board 50 equipped with the electronic device 10 is automatically loaded into the accommodating space 121 of the chamber wall unit 120 in which the test for the electronic device 10 is carried out in an environment of high temperature and low temperature. It can be taken out, and the product utilization rate (or the production yield of the product) can be improved.

The connection connection unit 140 is provided on the opposite side of the transport robot 170 among both sides of the support unit 110 in the first axial direction, and may include a first connection terminal 141 selectively connected to the test board 50 . . The first connection terminal 141 may be provided on the opposite side of the transport robot 170 among both sides of the support unit 110 in the first axial direction, and may be selectively connected to the test board 50 . Here, as the first connection terminal 141 is connected to the test board 50 , the connection connection unit 140 and the test board 50 may be electrically (or communicatively) connected, and the test connected to the connection connection unit 140 . The test signal transmitted from the unit 153 may be transmitted to the electronic device 10 through the connection connection unit 140 and the test board 50 .

In addition, the test board 50 may include a second connection terminal 53 connected to the first connection terminal 141 on either side of both sides in the first axial direction. The second connection terminal 53 may be provided (or formed) on either side of both sides in the first axial direction, and may be connected to the first connection terminal 141 . Here, the first connection terminal 141 and the second connection terminal 53 may be configured to be coupled to each other, and the second connection terminal 53 may be coupled to and connected to the first connection terminal 141 , 1 may be electrically (or communicatively) connected to the connection terminal 141 . Through this, the connection connection unit 140 and the test board 50 may be connected, and the test unit 153 connected to the connection connection unit 140 and the test board 50 may be connected and connected, and thus the test unit 153 may be connected. ) and the test board 50 and/or the electronic device 10 may transmit/receive a signal (eg, the test signal and the response signal).

For example, the first connection terminal 141 may be configured to include a protruding pin, etc., and the second connection terminal 53 may be configured to include an insertion hole (or insertion groove) into which the protruding pin is inserted. In addition, as the protruding pin is inserted into the insertion hole (groove) and coupled, the first connection terminal 141 and the second connection terminal 53 may be coupled and connected.

In addition, the transport robot 170 can carry the test board 50 in and out in the first axial direction so that the second connection terminal 53 faces the first connection terminal 141 , and the second connection terminal 53 ) moves the test board 50 facing the first connection terminal 141 toward the first connection terminal 141 (or toward the connection connection part) in the first axial direction to bring it into the test position, , the second connection terminal 53 may be connected to the first connection terminal 141 through the loading of the test board 50 . Conversely, the second connection terminal 53 faces the first connection terminal 141 toward the test board 50 connected to the first connection terminal 141 in the first axial direction opposite to the first connection terminal 141 . The second connection terminal 53 and the first connection terminal 141 can be separated (or disconnected) by moving in the direction (or the opposite direction of the connection connection part), and can be taken out from the test position.

Accordingly, the first connection terminal 141 of the connection connection part 141 and the second connection terminal 53 of the test board 50 only by transferring the test board 50 to the support part 110 through the transport robot 170 . ) can be combined (or connected) by aligning them. That is, the connection between the first connection terminal 141 and the second connection terminal 53 as well as the loading and unloading of the test board 50 may be automatically performed. Accordingly, the loading and testing of the test board 50, which were performed manually, can be automatically performed, so that the product operation rate (or the production yield of the product) can be improved.

On the other hand, the transport robot 170 is selectively connected to the test board 50 and provided to face the upper grip part 171 and the upper grip part 171 for moving the test board 50 in the first axial direction, and the test board The guide roller ( 173) may be included. The upper grip part 171 is selectively connected to the test board 50 to move the test board 50 in the first axial direction, and supports the test board 50 to the support part 110 to perform the test. After the test is completed, the test board 50 may be removed (or retrieved) from the support 110 . At this time, the upper grip part 171 may be selectively connected to the test board 50 by being fastened and (fastened) with the test board 50 , and the upper grip part 171 and the test board 50 may be coupled to each other. It may have a fastening structure.

The lower grip part 172 may be provided to face the upper grip part 171 , and may be selectively connected to the test board 50 to move the test board 50 in the first axial direction. Here, the lower grip part 172 may be provided on the same line as the guide roller 173 or below the guide roller 173 , and may be located below the test board 50 supported by the guide roller 173 . . In this case, the lower grip portion 172 may have a different length from the upper grip portion 171 in the first axial direction. The lower grip part 172 may be selectively connected to the test board 50 at the lower part of the test board 50 , and may grip, push, and drag the test board 50 while moving in the first axial direction, and accordingly, the test board (50) may be moved in the first axial direction. In this case, the lower grip part 172 may be divided from the upper grip part 171 to move the test board 50 on the guide roller 173 .

The guide roller 173 supports the test board 50 and may rotate according to the movement of the test board 50 . Through this, it is possible to guide the movement of the test board 50 by the upper grip part 171 and the lower grip part 172, and it is possible to stably and effectively allow the test board 50 to enter and support the support part 110, and , the test board 50 may be brought into the test location. In addition, by guiding the first axial movement of the test board 50 through the guide roller 173 , the second connection terminal 53 may be aligned with and connected to the first connection terminal 141 , It may also be easy to take out the test board 50 from the test position.

For example, a plurality of guide rollers 173 may be configured and arranged in the first axial direction, and rotate along the first axial direction to guide the movement of the test board 50 . At this time, the guide rollers 173 may be arranged (or arranged) along the first axial direction in two rows spaced apart in a second axial direction intersecting the first axial direction. In this case, the guide roller 173 It is possible to secure a space in which the lower grip part 172, etc. can be provided in the lower part and/or the lower part of the test board 50, and the contact area with the test board 50 is reduced, so that the test by friction with the guide roller 173 Damage to the board 50 may be minimized.

Here, the support 110 may include a support roller 111 that supports the test board 50 transferred from the guide roller 173 . The support roller 111 may receive the test board 50 from the guide roller 173 following the guide roller 173 , and rotate according to the movement of the test board 50 to rotate the test board ( 50) can guide the movement. Accordingly, the test board 50 delivered from the guide roller 173 may be stably guided to the test position, and the test board 50 may be supported at the test position. Through this, the test board 50 may be brought into the test location. In addition, taking out the test board 50 from the test position can also be very easy because it is only necessary to move the test board 50 supported at the test position on the support roller 111 in the first axial direction. . And by guiding the first axial movement of the test board 50 on the support 110 (ie, at the test position) following the guide roller 173 through the support roller 111, more effectively the second connection terminal (53) can be connected by aligning with the first connection terminal (141).

Accordingly, the support 110 is composed of the support roller 111 and the upper grip part 171 and the lower grip part 172 move the test board 50 along the guide roller 173 extending from the support roller 111 . , the test board 50 is continuously guided by the guide roller 173 and the support roller 111 to effectively support the test board 50 on the support part 110 and to be removed from the support part 110 .

On the other hand, the support roller 111 may be configured in plurality, and the plurality of support rollers 111 are spaced apart in the second axial direction so as to minimize damage to the test board 50 due to contact friction along the first axial direction in two rows. may be arranged, and a contact area with the test board 50 may be reduced.

In addition, the upper grip part 171 and the lower grip part 172 may have a first connection member 171a and a second connection member 172a selectively connected to the test board 50 , respectively. In this case, the test board 50 is positioned at a portion (or position) where it is easy to connect (and release) the first connecting member 171a and the second connecting member 172a to the first connecting member 171a and the second connecting member 172a. It may have a to-be-connected part that can be selectively connected to the 172a.

Here, the to-be-connected portion of the test board 50 may have a mutual fastening structure capable of being fastened to the first connecting member 171a and the second connecting member 172a. For example, the to-be-connected portion may have a shape such as a fastening rod, a fastening groove, a fastening hole, or a ring (or semi-ring) shape, and the first connecting member 171a and the second connecting member 172a are the fastening rods. It may have a shape such as a gripper for gripping, an insert inserted into the fastening groove or the fastening hole, or a hook shape to be hung on the fastening groove or the fastening hole or the ring. . In this way, since the to-be-connected portion and the first connecting member 171a and the second connecting member 172a have a mutually fastening structure, the first connecting member 171a and/or the second connecting member 172a is connected to the connected portion. By tightening and pushing the test board 50 toward the support 110 , the test board 50 can be brought into the test location, and after the test board 50 is loaded into the test location, the test is completed. Until the electronic device 10 is accommodated in the receiving space 121, or the connection between the first connecting member 171a and the second connecting member 172a is performed with the connected part so as not to interfere with the progress of the test. can be turned off And when the test is completed, by (or again) fastening the first connecting member 171a and/or the second connecting member 172a with the to-be-connected part to pull the test board 50 from the test position (or Therefore), the test board 50 can be taken out from the test position.

6 is a schematic diagram illustrating a frame unit according to an embodiment of the present invention.

Referring to FIG. 6 , the test apparatus 100 for an electronic device according to the present invention may further include a frame unit 180 in which a plurality of chamber wall units 120 and support units 110 are disposed in multiple stages.

The frame unit 180 may include a plurality of chamber wall units 120 and support units 110 in multiple stages, and a plurality of accommodation spaces 121 provided by the plurality of chamber wall units 120 arranged in multiple stages. In , the test may be performed on the plurality of test boards 50 . Here, the chamber wall part 120 and the support part 110 may be configured in plurality, respectively, and may be arranged in multiple stages through the frame part 180 . At this time, the control unit 150 may also be arranged in multiple stages on the frame unit 180 to be provided to each of the chamber wall unit 120 and the support unit 110 , respectively.

When the plurality of chamber wall parts 120 and the support part 110 are arranged in multiple stages through the frame part 180, the transport robot 140 is raised and lowered by an elevator (not shown), etc., and a plurality of support parts configured in multiple stages ( Each of the test boards 50 can be supported on 110 , and the tests can be performed on a plurality of test boards 50 at once in a plurality of accommodating spaces 121 provided by a plurality of chamber wall parts 120 . In addition, one transport robot 170 may be shared by the plurality of chamber wall parts 120 and the support part 110 .

Meanwhile, the plurality of chamber wall parts 120 and the support part 110 may be symmetrically provided on both sides of the transport robot 170 in the first axial direction, respectively. In this case, one transport robot 170 is shared by the chamber wall part 120 and the support part 110 on both sides by the transport robot 170 loading the test board 50 to both sides in the first axial direction, respectively. can Accordingly, the equipment cost can be saved, the footprint of the equipment can be reduced, and the tests can be performed on the plurality of test boards 50 in the plurality of accommodating spaces 121 more effectively. .

Here, the connection connection part 140 may be provided symmetrically to correspond to each of the chamber wall parts 120 . That is, the first connection terminal 141 of the connection connection unit 140 is provided in the opposite direction with respect to the support unit 110 and/or the transport robot 170 to share one transport robot 170 in the first axial direction. The test board 50 can be carried in and out of the test position of the support 110 only by moving (or transferring) the test board 50 to and from the first connection terminal 141 and the second connection terminal ( 53) can be aligned and connected.

In addition, the chamber wall part 120 and the support part 110 may be arranged in the second axial direction, and a plurality of accommodation spaces 121 provided by the plurality of chamber wall parts 120 arranged in the second axial direction. ), the test for the plurality of test boards 50 may be performed.

When the plurality of chamber wall parts 120 and the support part 110 are arranged in the second axial direction, the transport robot 170 is moved in the second axial direction with a transfer unit (not shown) in the second axial direction. It is possible to support the test board 50 on each of the plurality of support parts 110 arranged as The above tests can be performed at once, and a single transport robot 140 can be shared by a plurality of chamber wall parts 120 and support parts 110 .

Therefore, by configuring the chamber wall part 120 and the support part 110 in plurality and stacking them in multiple stages and/or horizontally arranging them through the frame part 180, the plurality of test boards 50 (that is, the plurality of The test for the electronic device) may be performed at once (or simultaneously), and one through a lifting unit (not shown) for elevating the transport robot 170 and a transport unit (not shown) for moving the transport robot 170 . The test board 50 can be carried in and out of each of the receiving spaces 121 of the plurality of chamber wall parts 120 with the transport robot 170 of the It may be shared by a plurality of support units 110 respectively corresponding to 120 . Accordingly, the product operation rate (or the production yield of the product) can be improved, and the chamber wall part 120 and the support part 110 are arranged in multiple stages and horizontally on both sides of the transport robot 170 to maximize the product operation rate. In addition, the equipment cost can be saved and the space occupied by the equipment can be reduced.

As such, in the present invention, the temperature of the accommodation space can be precisely controlled by controlling the heater unit and the cooling unit according to a preset temperature through the controller to adjust the temperature of the accommodation space defined by the chamber wall portion. In addition, the chamber wall portion may be configured to cover the test board to define a plurality of accommodating spaces on the test board. Accordingly, the mounting portion on which the electronic device is mounted can be grouped to provide an accommodating space corresponding to the connected central processing unit, and electronic devices connected to the same central processing unit can perform a test on the electronic device in the same accommodating space, Tests may be conducted under relatively similar conditions between grouped electronic devices. And by receiving the temperature of the electronic device and controlling the temperature of the accommodation space, the temperature can be adjusted for each location of each electronic device according to the measured temperature of each electronic device, and the test can be performed under a suitable temperature environment for each electronic device. can proceed. In addition, while controlling the temperature of the accommodating space, the temperature of the accommodating space may be reflected to the temperature of the electronic device to perform the test under a more precise temperature environment, and more accurate and reliable test results may be obtained. In addition, a test board equipped with an electronic device can be automatically supported and removed from the support part through the transfer robot, and accordingly, the electronic device is automatically placed in the accommodating space of the chamber wall where the test for the electronic device is carried out in a high-temperature and low-temperature environment. It is possible to bring in and take out the test board equipped with In addition, the first connection terminal of the connection connection part and the second connection terminal of the test board may be aligned and coupled only by transporting the test board to the support part through the transport robot. That is, the connection between the first connection terminal and the second connection terminal as well as the loading and unloading of the test board may be automatically performed. Accordingly, it is possible to automatically proceed with the loading of the test board and the progress of the test, which had been done manually, so that the product operation rate can be improved.

The meaning of “on” used in the above description includes cases in which direct contact is not made, but is located opposite to the upper or lower portion, or is spaced apart from the opposite surface, and is opposite to the entire upper surface or lower surface. It is possible not only to position, but also to partially face each other, and it is used to mean that they face away from each other or directly contact the surface (upper surface or lower surface) of an object.

Although preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and common knowledge in the field to which the present invention pertains without departing from the gist of the present invention as claimed in the claims It will be understood by those having the above that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the technical protection scope of the present invention should be defined by the following claims.

10: electronic element 11: temperature sensor
50: test board 51: mounting part
52: second connection terminal 100: test device
110: support 111: support roller
120: chamber wall portion 121: accommodation space
130: temperature control unit 131: heater unit
132: cooling unit 132a: ventilation fan
132b: cooling gas supply unit 135: blowing fan
140: connection connection unit 141: first connection terminal
150: control unit 151: first temperature receiver
152: second temperature receiver 153: test unit
160: temperature measuring unit 170: transport robot
171: upper grip portion 171a: first connecting member
172: lower grip portion 172a: second connecting member
173: guide roller 180: frame part

Claims (19)

a support for supporting the test board on which the electronic device is mounted;
a chamber wall part provided corresponding to the support part and covered on the support part to define an accommodation space for accommodating at least the electronic device among the test board;
a temperature control unit including a heater unit and a cooling unit, and controlling the temperature of the accommodation space;
a connection connection unit connected to the test board to transmit a test signal for the electronic device; and
A test apparatus for an electronic device comprising a; a control unit for controlling the temperature control unit according to a preset temperature. The method according to claim 1,
The chamber wall portion is a test apparatus for an electronic device defining a plurality of the accommodating spaces independent of each other on the test board. 3. The method according to claim 2,
The test board includes a mounting part on which the electronic device is mounted,
The mounting unit is composed of a plurality of test devices for electronic devices that are grouped at least one by one. 4. The method according to claim 3,
A plurality of groups of the mounting part are spaced apart from each other and disposed in a test apparatus for an electronic device. 4. The method according to claim 3,
The accommodating space is provided for each group of the mounting unit, respectively. 4. The method according to claim 3,
The test board further comprises a plurality of central processing units provided corresponding to each of the accommodation space,
The mounting portion is a test device for an electronic device that is grouped according to the central processing unit to which each is connected. 7. The method of claim 6,
Each of the plurality of central processing units is a test device for an electronic device in which independent processing is performed according to a group of the connected mounting unit. The method according to claim 1,
The temperature control unit divides the accommodation space into a plurality of regions to control the temperature of each region,
At least one of the heater unit and the cooling unit is configured in plurality and is provided for each divided region. The method according to claim 1,
The cooling unit for an electronic device test device including a ventilation fan for discharging heat in the accommodation space. The method according to claim 1,
The cooling unit includes a cooling gas supply unit for supplying a cooling gas into the accommodation space. The method according to claim 1,
wherein the control unit includes a first temperature receiver configured to receive a temperature of the electronic device. 12. The method of claim 11,
The first temperature receiving unit is an electronic device test device for receiving the temperature of the electronic device from a temperature sensor built in the electronic device. 12. The method of claim 11,
It is provided in the accommodating space, the temperature measurement unit for measuring the temperature of the accommodating space; further comprising,
The control unit may further include a second temperature receiving unit configured to receive the temperature of the accommodation space measured from the temperature measuring unit. 14. The method of claim 13,
The controller reflects the temperature of the accommodating space received from the second temperature receiver to the temperature of the electronic element received from the first temperature receiver to control the temperature controller. The method according to claim 1,
The test apparatus for an electronic device further comprising a; space control unit for adjusting the interval between the chamber wall and the test board. The method according to claim 1,
and a transport robot provided on either side of both sides in the first axial direction of the support part, and carrying the test board in and out of the test position on the support part. 17. The method of claim 16,
The connection connection part is provided on the opposite side of the transport robot among both sides of the support part in the first axial direction, and includes a first connection terminal selectively connected to the test board,
The test board includes a second connection terminal connected to the first connection terminal on either side of both sides in the first axial direction. 18. The method of claim 17,
The transport robot is an electronic device test device for loading and unloading the test board in the first axial direction so that the second connection terminal faces the first connection terminal. The method according to claim 1,
The test apparatus for an electronic device further comprising; a frame part in which the plurality of chamber wall parts and the support parts are arranged in multiple stages.

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