KR20210158633A - Pipe constant temperature heating device for semiconductor equipment - Google Patents

Pipe constant temperature heating device for semiconductor equipment Download PDF

Info

Publication number
KR20210158633A
KR20210158633A KR1020200077202A KR20200077202A KR20210158633A KR 20210158633 A KR20210158633 A KR 20210158633A KR 1020200077202 A KR1020200077202 A KR 1020200077202A KR 20200077202 A KR20200077202 A KR 20200077202A KR 20210158633 A KR20210158633 A KR 20210158633A
Authority
KR
South Korea
Prior art keywords
constant temperature
pipe
temperature heating
coupling body
heat loss
Prior art date
Application number
KR1020200077202A
Other languages
Korean (ko)
Other versions
KR102385194B1 (en
Inventor
조영태
Original Assignee
전주대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 전주대학교 산학협력단 filed Critical 전주대학교 산학협력단
Priority to KR1020200077202A priority Critical patent/KR102385194B1/en
Publication of KR20210158633A publication Critical patent/KR20210158633A/en
Application granted granted Critical
Publication of KR102385194B1 publication Critical patent/KR102385194B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L53/00—Heating of pipes or pipe systems; Cooling of pipes or pipe systems
    • F16L53/30—Heating of pipes or pipe systems
    • F16L53/35—Ohmic-resistance heating

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pipe Accessories (AREA)
  • Resistance Heating (AREA)

Abstract

A pipe constant temperature heating device for semiconductor equipment comprises: a coupling body (110) to surround an outer diameter of a pipe (10); an insertion part (120) formed at an outer side of the coupling body (110); a constant temperature heating member (130) inserted into an inner side of the insertion part (120) to heat the coupling body (110) at a constant temperature; a heat loss prevention member (140) line-making contact with an outer side of the constant temperature heating member (130) to prevent heat loss; a fixed member (150) for cohering the heat loss prevention member (140) to fix the heat loss prevention member (140) to an outer side of the coupling body. The present invention may minimize sticking phenomenon of powder generated due to temperature change by heating a pipe at a constant temperature. In particular, the present invention may minimize heat loss and easily transfer heat to the pipe. Further, the present invention may improve processing performance of a scrubber and reduce a maintenance cost by minimizing adherence of the powder.

Description

반도체설비용 파이프 정온 가열장치{Pipe constant temperature heating device for semiconductor equipment}Pipe constant temperature heating device for semiconductor equipment

본 발명은 반도체설비용 파이프 정온 가열장치에 관한 것으로, 더욱 상세하게는 반도체 제조공정에서 사용하는 파이프의 내부에 파우더의 고착을 방지할 수 있도록 하는 반도체설비용 파이프 정온 가열장치에 관한 것이다.The present invention relates to a constant temperature heating apparatus for a pipe for a semiconductor facility, and more particularly, to a constant temperature heating apparatus for a pipe for a semiconductor facility capable of preventing the powder from sticking to the inside of a pipe used in a semiconductor manufacturing process.

일반적으로 반도체 제조공정에서 발생하는 유해가스 및 파우더를 처리하기 위해서 스크러버(Scrubber)를 사용한다. In general, a scrubber is used to treat toxic gases and powders generated in the semiconductor manufacturing process.

이러한 유해가스 및 파우더는 통상 100℃이상으로 실온에 설치한 파이프를 통과하면서 온도변화 및 화학반응으로 파이프의 내경에 고착되면서 이송효율을 저하시키는 문제를 갖게 되었다.These harmful gases and powders usually pass through a pipe installed at room temperature at 100° C. or higher, and are fixed to the inner diameter of the pipe due to temperature change and chemical reaction, thereby lowering the transport efficiency.

특히 파이프의 온도가 낮아 파우더가 가장 많이 고착하므로 스크러버의 처리성능 저하는 물론 유지보수 비용이 상승하는 문제를 갖게 되었다.In particular, since the temperature of the pipe is low and the powder adheres the most, there is a problem that the processing performance of the scrubber is lowered as well as the maintenance cost is increased.

한국등록실용신안 제20-0217509호(2001.03.15.)Korea Registered Utility Model No. 20-0217509 (2001.03.15.) 한국공개특허 제10-2002-0031823호(2002.05.03.)Korean Patent Laid-Open Patent No. 10-2002-0031823 (2002.05.03.) 한국등록특허 제10-124436호(2013.03.18.)Korean Patent Registration No. 10-124436 (2013.03.18.) 한국등록특허 제10-1320927호(2013.11.25.)Korean Patent Registration No. 10-1320927 (2013.11.25.) 한국공개특허 제10-2014-0058859호(2014.05.15.)Korean Patent Publication No. 10-2014-0058859 (2014.05.15.) 한국공개특허 제10-2015-0024754호(2015.03.09.)Korean Patent Publication No. 10-2015-0024754 (2015.03.09.)

따라서 본 발명은 상기와 같은 종래의 문제를 해결하기 위해 안출한 것으로서, Therefore, the present invention has been devised to solve the conventional problems as described above,

본 발명은 파이프를 가열하여 일정온도로 유지할 수 있으므로 파우더의 고착을 최소화할 수 있는 반도체설비용 파이프 정온 가열장치를 제공함에 목적이 있다.An object of the present invention is to provide a pipe constant temperature heating device for semiconductor equipment that can minimize the adhesion of powder by heating the pipe and maintaining it at a constant temperature.

상기 목적을 달성하기 위한 본 발명 반도체설비용 파이프 정온 가열장치(100)는,The present invention for achieving the above object is a pipe constant temperature heating device 100 for semiconductor equipment,

파이프(10)의 외경을 감싸도록 형성하는 결합몸체(110); 상기 결합몸체(110)의 외측에 형성하는 삽입부(120); 상기 삽입부(120)의 내측에 삽입하여 상기 결합몸체(110)를 일정온도로 가열하는 정온 가열부재(130); 상기 정온 가열부재(130)의 외측면에 선 접촉하여 열손실을 방지하는 열손실 방지부재(140); 상기 열손실 방지부재(140)를 밀착시켜 상기 결합몸체(110)의 외측에 고정하는 고정부재(150);를 포함하는 것을 특징으로 한다.A coupling body 110 formed to surround the outer diameter of the pipe 10; an insertion part 120 formed on the outside of the coupling body 110; a constant temperature heating member 130 inserted into the insertion part 120 to heat the coupling body 110 to a predetermined temperature; a heat loss prevention member 140 for preventing heat loss by making line contact with the outer surface of the constant temperature heating member 130; and a fixing member 150 for fixing the heat loss prevention member 140 to the outside of the coupling body 110 by closely adhering the heat loss prevention member 140 .

여기서 상기 결합몸체(110)는 다수개로 분할하되 일단에 결합돌기(111)를 형성하고, 타단에 결합홈(112)을 형성하는 것을 특징으로 한다.Here, the coupling body 110 is divided into a plurality, but a coupling protrusion 111 is formed at one end, and a coupling groove 112 is formed at the other end.

한편, 상기 삽입부(120)는 상기 결합몸체(110)의 외측에 길이방향을 따라서 형성하여 상기 정온 가열부재(130)의 고정위치를 조절할 수 있는 것을 특징으로 한다.On the other hand, the insertion part 120 is formed along the longitudinal direction on the outside of the coupling body 110, characterized in that it can adjust the fixed position of the constant temperature heating member (130).

특히 상기 정온 가열부재(130)는 PTC소자 또는 면상발열체를 사용하는 것을 특징으로 한다.In particular, the constant temperature heating member 130 is characterized by using a PTC element or a planar heating element.

또한, 상기 열손실 방지부재(140)는 하부에 상기 정온 가열부재(130)의 표면과 선 접촉할 수 있도록 형성하는 돌출부(141);를 포함하는 것을 특징으로 한다.In addition, the heat loss prevention member 140 is characterized in that it comprises a;

그리고 상기 결합몸체(110)를 외측을 빙둘러 형성하는 단열재(160);를 포함하는 것을 특징으로 한다.And it characterized in that it includes; the heat insulating material 160 for forming the coupling body 110 around the outside.

아울러 상기 단열재(160)의 외측을 빙둘러 형성하는 단열커버(170);를 포함하는 것을 특징으로 한다.In addition, it characterized in that it comprises a; heat insulating cover 170 is formed around the outside of the heat insulating material (160).

본 발명은 파이프를 일정온도로 가열하여 온도변화로 발생하는 파우더의 고착현상을 최소화할 수 있는 효과를 갖는다.The present invention has the effect of minimizing the sticking of the powder caused by the temperature change by heating the pipe to a certain temperature.

특히 본 발명은 열손실을 최소화하고 파이프로 열을 원활하게 전달할 수 있는 효과를 갖는다.In particular, the present invention has the effect of minimizing heat loss and smoothly transferring heat to the pipe.

또한, 본 발명은 파우더의 고착을 최소화하여 스크러버의 처리성능을 향상시킬 수 있음은 물론 유지보수 비용을 절감할 수 있는 효과를 갖는다.In addition, the present invention has the effect of reducing the maintenance cost as well as improving the processing performance of the scrubber by minimizing the adhesion of the powder.

도 1은 본 발명 반도체설비용 파이프 정온 가열장치의 실시예를 나타내기 위한 분리 사시도.
도 2는 본 발명 반도체설비용 파이프 정온 가열장치의 실시예를 나타내기 위한 단면도.
도 3은 본 발명 반도체설비용 파이프 정온 가열장치의 다른 실시예를 나타내기 위한 단면도.1 is an exploded perspective view showing an embodiment of a pipe constant temperature heating device for semiconductor equipment of the present invention.
2 is a cross-sectional view showing an embodiment of a pipe constant temperature heating device for semiconductor equipment of the present invention.
Figure 3 is a cross-sectional view for showing another embodiment of the present invention a pipe constant temperature heating device for semiconductor equipment.

상기한 바와 같이 본 발명의 구성을 첨부한 도면에 의해 상세히 설명하면 다음과 같다.As described above, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명 반도체설비용 파이프 정온 가열장치의 실시예를 나타내기 위한 분리 사시도이고, 도 2는 본 발명 반도체설비용 파이프 정온 가열장치의 실시예를 나타내기 위한 단면도이며, 도 3은 본 발명 반도체설비용 파이프 정온 가열장치의 다른 실시예를 나타내기 위한 단면도를 도시한 것이다.Figure 1 is an exploded perspective view showing an embodiment of the pipe constant temperature heating device for semiconductor equipment of the present invention, Figure 2 is a cross-sectional view showing an embodiment of the present invention a pipe constant temperature heating device for semiconductor equipment, Figure 3 is the present invention It is a cross-sectional view showing another embodiment of the pipe constant temperature heating device for semiconductor equipment.

본 발명은 파이프(10)의 외경을 감싸도록 형성하는 결합몸체(110); 상기 결합몸체(110)의 외측에 형성하는 삽입부(120); 상기 삽입부(120)의 내측에 삽입하여 상기 결합몸체(110)를 일정온도로 가열하는 정온 가열부재(130); 상기 정온 가열부재(130)의 외측면에 선 접촉하여 열손실을 방지하는 열손실 방지부재(140); 상기 열손실 방지부재(140)를 밀착시켜 상기 결합몸체(110)의 외측에 고정하는 고정부재(150);를 포함한다.The present invention is a coupling body 110 formed to surround the outer diameter of the pipe (10); an insertion part 120 formed on the outside of the coupling body 110; a constant temperature heating member 130 inserted into the insertion part 120 to heat the coupling body 110 to a predetermined temperature; a heat loss prevention member 140 for preventing heat loss by making line contact with the outer surface of the constant temperature heating member 130; It includes;

특히 상기 결합몸체(110)는 상기 파이프(10)의 외경을 빙둘러 감싸도록 형성한다.In particular, the coupling body 110 is formed to surround the outer diameter of the pipe (10).

여기서 상기 결합몸체(110)는 설치 및 유지보수의 용이성을 위해서 다수개로 분할하되 일단에 결합돌기(111)를 형성하고, 타단에 결합홈(112)을 형성하여 일측의 결합몸체(110)의 결합돌기(111)를 타측의 결합몸체(110)의 결합홈(112)에 끼워서 서로 결합할 수 있다.Here, the coupling body 110 is divided into a plurality for ease of installation and maintenance, but a coupling protrusion 111 is formed at one end, and a coupling groove 112 is formed at the other end to combine the coupling body 110 on one side. By inserting the projection 111 into the coupling groove 112 of the coupling body 110 on the other side, it can be coupled to each other.

아울러 상기 삽입부(120)는 상기 결합몸체(110)의 외측에 길이방향을 따라서 형성하여 상기 정온 가열부재(130)의 고정위치를 조절함으로써 상기 결합몸체(110)의 표면으로 원활하게 열 전달할 수 있다.In addition, the insertion part 120 is formed along the longitudinal direction on the outside of the coupling body 110 to adjust the fixed position of the constant temperature heating member 130 to smoothly transfer heat to the surface of the coupling body 110 . have.

그리고 상기 정온 가열부재(130)는 PTC(Positive Temperature Coefficient)소자 또는 PET(Polyethylene Terephthalate)필름에 카본블랙이 도포되어 제조된 면상발열체를 사용할 수 있다.In addition, the constant temperature heating member 130 may use a positive temperature coefficient (PTC) device or a planar heating element manufactured by coating carbon black on a polyethylene terephthalate (PET) film.

또한, 상기 열손실 방지부재(140)는 상기 정온 가열부재(130)의 작동으로 발생하는 열이 상기 결합몸체(110)로 전달되지 않고 외부로 손실되는 현상을 방지하는 역할을 수행한다.In addition, the heat loss preventing member 140 serves to prevent the heat generated by the operation of the constant temperature heating member 130 from being lost to the outside without being transferred to the coupling body 110 .

이때 상기 열손실 방지부재(140)는 스테인리스, 세라믹, 질석 등과 같이 열전도율이 낮은 재질로 형성할 수 있다.In this case, the heat loss preventing member 140 may be formed of a material having low thermal conductivity, such as stainless steel, ceramic, vermiculite, or the like.

여기서 상기 열손실 방지부재(140)는 일정두께를 갖는 판재형상으로 상기 정온 가열부재(130)의 표면과 선 접촉하여 열 손실을 최소화할 수 있도록 형성하는 돌출부(141);를 포함한다.Here, the heat loss prevention member 140 has a plate shape having a predetermined thickness, and a protrusion 141 formed to minimize heat loss by making line contact with the surface of the constant temperature heating member 130 .

그리고 상기 고정부재(150)는 상기 열손실 방지부재(140)를 밀착시키기 위해서 일정넓이를 갖도록 형성하고 볼트 등을 이용하여 상기 결합몸체(110)의 외측에 고정할 수 있다.In addition, the fixing member 150 may be formed to have a predetermined width in order to closely contact the heat loss prevention member 140 , and may be fixed to the outside of the coupling body 110 using a bolt or the like.

아울러 도 3에 도시한 바와 같이 상기 결합몸체(110)를 외측을 빙둘러 형성하는 단열재(160);를 포함하여 상기 결합몸체(110)의 열 손실을 최소화할 수 있다.In addition, as shown in FIG. 3 , the heat loss of the coupling body 110 can be minimized by including; a heat insulating material 160 that surrounds the outside of the coupling body 110 .

이때 상기 단열재(160)는 테프론 계열, 실리콘 계열, 열가소성 엘라스토머 계열, 기타 합성수지를 발포하여 제작할 수 있다.In this case, the insulating material 160 may be manufactured by foaming Teflon-based, silicone-based, thermoplastic elastomer-based, or other synthetic resins.

또한, 상기 단열재(160)의 표면에 강성을 부여할 수 있도록 코팅물질을 도포할 수 있다.In addition, a coating material may be applied to impart rigidity to the surface of the heat insulating material 160 .

그리고 도 3에 도시한 바와 같이 상기 단열재(160)의 외측을 빙둘러 형성하는 단열커버(170);를 포함하여 외측으로 방출하는 열 손실을 최소화할 수 있다.And, as shown in FIG. 3 , the heat loss to the outside can be minimized by including a heat insulating cover 170 that surrounds the outside of the insulating material 160 .

이때 상기 단열커버(170)는 내부가 비어있는 중공형태로 진공분위기를 형성하며, 스테인리스, 세라믹, 질석 등과 같이 열전도율이 낮은 재질로 형성할 수 있다.At this time, the heat insulating cover 170 forms a vacuum atmosphere in a hollow shape with an empty interior, and may be formed of a material having low thermal conductivity, such as stainless steel, ceramic, vermiculite, or the like.

이처럼 상기와 같이 본 발명의 실시한 예에 대하여 상세히 설명하였으나, 본 발명의 권리범위는 이에 한정되지 않으며, 본 발명의 실시한 예와 실질적으로 균등의 범위에 있는 것까지 본 발명의 권리범위가 포함되는 것은 당연하다.As described above, the embodiment of the present invention has been described in detail, but the scope of the present invention is not limited thereto, and the scope of the present invention is included to the extent that it is substantially equivalent to the embodiment of the present invention. Of course.

10: 파이프
100: 본 발명 반도체설비용 파이프 정온 가열장치
110: 결합몸체 111: 결합돌기
112: 결합홈
120: 삽입부
130: 정온 가열부재
140: 열손실 방지부재 141: 돌출부
150: 고정부재
160: 단열재
170: 단열커버10: pipe
100: pipe constant temperature heating device for semiconductor equipment of the present invention
110: coupling body 111: coupling projection
112: coupling groove
120: insertion part
130: constant temperature heating member
140: heat loss prevention member 141: protrusion
150: fixing member
160: insulation material
170: insulation cover

Claims (7)

파이프(10)의 외경을 감싸도록 형성하는 결합몸체(110); 상기 결합몸체(110)의 외측에 형성하는 삽입부(120); 상기 삽입부(120)의 내측에 삽입하여 상기 결합몸체(110)를 일정온도로 가열하는 정온 가열부재(130); 상기 정온 가열부재(130)의 외측면에 선 접촉하여 열손실을 방지하는 열손실 방지부재(140); 상기 열손실 방지부재(140)를 밀착시켜 상기 결합몸체(110)의 외측에 고정하는 고정부재(150);를 포함하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.A coupling body 110 formed to surround the outer diameter of the pipe 10; an insertion part 120 formed on the outside of the coupling body 110; a constant temperature heating member 130 inserted into the insertion part 120 to heat the coupling body 110 to a predetermined temperature; a heat loss prevention member 140 for preventing heat loss by making line contact with the outer surface of the constant temperature heating member 130; and a fixing member (150) for fixing the heat loss prevention member (140) to the outside of the coupling body (110). 청구항 1에 있어서, 상기 결합몸체(110)는 다수개로 분할하되 일단에 결합돌기(111)를 형성하고, 타단에 결합홈(112)을 형성하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.The pipe constant temperature heating device for semiconductor equipment according to claim 1, wherein the coupling body (110) is divided into a plurality of pieces, and a coupling protrusion (111) is formed at one end and a coupling groove (112) is formed at the other end. 청구항 1에 있어서, 상기 삽입부(120)는 상기 결합몸체(110)의 외측에 길이방향을 따라서 형성하여 상기 정온 가열부재(130)의 고정위치를 조절할 수 있는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.The positive temperature pipe for semiconductor equipment according to claim 1, wherein the insertion part 120 is formed along the longitudinal direction on the outside of the coupling body 110 to adjust the fixed position of the constant temperature heating member 130. heating device. 청구항 1에 있어서, 상기 정온 가열부재(130)는 PTC소자 또는 면상발열체를 사용하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.The pipe constant temperature heating device for semiconductor equipment according to claim 1, wherein the constant temperature heating member (130) uses a PTC element or a planar heating element. 청구항 1에 있어서, 상기 열손실 방지부재(140)는 하부에 상기 정온 가열부재(130)의 표면과 선 접촉할 수 있도록 형성하는 돌출부(141);를 포함하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.The method according to claim 1, wherein the heat loss prevention member 140 has a lower portion of the constant temperature heating member (130) and a protrusion (141) formed to be in line contact with the constant temperature pipe for semiconductor equipment, characterized in that it comprises a heating device. 청구항 1에 있어서, 상기 결합몸체(110)를 외측을 빙둘러 형성하는 단열재(160);를 포함하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.[Claim 2] The pipe constant temperature heating device for semiconductor equipment according to claim 1, comprising a heat insulating material (160) that surrounds the outer side of the coupling body (110). 청구항 6에 있어서, 상기 단열재(160)의 외측을 빙둘러 형성하는 단열커버(170);를 포함하는 것을 특징으로 하는 반도체설비용 파이프 정온 가열장치.[Claim 7] The pipe constant temperature heating device for semiconductor equipment according to claim 6, comprising a heat insulating cover (170) that surrounds the outside of the heat insulating material (160).
KR1020200077202A 2020-06-24 2020-06-24 Pipe constant temperature heating device for semiconductor equipment KR102385194B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200077202A KR102385194B1 (en) 2020-06-24 2020-06-24 Pipe constant temperature heating device for semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200077202A KR102385194B1 (en) 2020-06-24 2020-06-24 Pipe constant temperature heating device for semiconductor equipment

Publications (2)

Publication Number Publication Date
KR20210158633A true KR20210158633A (en) 2021-12-31
KR102385194B1 KR102385194B1 (en) 2022-04-11

Family

ID=79177776

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200077202A KR102385194B1 (en) 2020-06-24 2020-06-24 Pipe constant temperature heating device for semiconductor equipment

Country Status (1)

Country Link
KR (1) KR102385194B1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200217509Y1 (en) 2000-10-24 2001-03-15 한국엠에이티주식회사 Exhaust gas delivering pipe with cleaning device
KR20020031823A (en) 2000-10-24 2002-05-03 김동수 Exhaust gas delivering pipe with cleaning device
JP2008287024A (en) * 2007-05-17 2008-11-27 Murata Mach Ltd Fixing device
KR20120039174A (en) * 2010-10-15 2012-04-25 송해근 Heating jacket
KR20120052699A (en) * 2010-11-16 2012-05-24 (주)에스케이아이 Pipe cover apparatus for heatting layer
KR101320927B1 (en) 2012-12-11 2013-11-25 주식회사 엠아이 Semiconductor manufacturing apparatus having control function of powder generation
KR20140058859A (en) 2012-11-07 2014-05-15 최성귀 Heating pipe for semiconductor manufacturing apparatus
KR20150024754A (en) 2013-08-27 2015-03-09 (주)제이씨이노텍 Heating apparatus of vacuum pump for semiconductor equipment
KR20170077635A (en) * 2015-12-28 2017-07-06 김용후 Ceramic heater for hot-water boiler

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200217509Y1 (en) 2000-10-24 2001-03-15 한국엠에이티주식회사 Exhaust gas delivering pipe with cleaning device
KR20020031823A (en) 2000-10-24 2002-05-03 김동수 Exhaust gas delivering pipe with cleaning device
JP2008287024A (en) * 2007-05-17 2008-11-27 Murata Mach Ltd Fixing device
KR20120039174A (en) * 2010-10-15 2012-04-25 송해근 Heating jacket
KR20120052699A (en) * 2010-11-16 2012-05-24 (주)에스케이아이 Pipe cover apparatus for heatting layer
KR20140058859A (en) 2012-11-07 2014-05-15 최성귀 Heating pipe for semiconductor manufacturing apparatus
KR101320927B1 (en) 2012-12-11 2013-11-25 주식회사 엠아이 Semiconductor manufacturing apparatus having control function of powder generation
KR20150024754A (en) 2013-08-27 2015-03-09 (주)제이씨이노텍 Heating apparatus of vacuum pump for semiconductor equipment
KR20170077635A (en) * 2015-12-28 2017-07-06 김용후 Ceramic heater for hot-water boiler

Also Published As

Publication number Publication date
KR102385194B1 (en) 2022-04-11

Similar Documents

Publication Publication Date Title
KR102334333B1 (en) Flange clamp for semiconductor equipment with constant temperature heating function
US4786352A (en) Apparatus for in-situ chamber cleaning
US20020100517A1 (en) Insulated jackets for hot and cold piping systems and for hot and cold air ducting systems and methods of use
US7214274B2 (en) Method and apparatus for thermally insulating adjacent temperature controlled processing chambers
US7192487B2 (en) Semiconductor substrate processing chamber and accessory attachment interfacial structure
CN105953029B (en) A kind of compound insulating material for flexible duct heating
KR102385194B1 (en) Pipe constant temperature heating device for semiconductor equipment
GB2336893A (en) Flue ducting for atmospheric boilers
EP2253918A3 (en) Enclosure For Heat Transfer Devices, Methods Of Manufacture Thereof And Articles Comprising The Same
SE8405228D0 (en) PRE-INSULATED CONNECTOR
KR102338229B1 (en) Heating pipe using plate heating element
JP2004324723A (en) Pipe connection structure, and seal member with built-in heater
KR20020020827A (en) Heater device
US8378264B2 (en) Heater for piping
KR102466993B1 (en) Valve heating device of semiconductor equipment with constant temperature heating function
US20220112965A1 (en) Valve stem extension
JP2010043745A (en) Method and apparatus for providing floating seal for chamber door
CN101627148B (en) Floating slit valve for transfer chamber interface
US20210123448A1 (en) Vacuum pump
KR102161842B1 (en) Heating apparatus for three way valve of exhaust depowder module
US20020053357A1 (en) Exhaust gas delivering pipe with cleaning device
KR102134112B1 (en) Heating jacket
JP4528099B2 (en) Piping heating structure
TWI655709B (en) Platen support structure and platen
CN109841548B (en) Transfer chamber and semiconductor processing equipment

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant