KR101569201B1 - A gas pipe for manufacturing facilities of a semiconductor - Google Patents

A gas pipe for manufacturing facilities of a semiconductor Download PDF

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Publication number
KR101569201B1
KR101569201B1 KR1020150131253A KR20150131253A KR101569201B1 KR 101569201 B1 KR101569201 B1 KR 101569201B1 KR 1020150131253 A KR1020150131253 A KR 1020150131253A KR 20150131253 A KR20150131253 A KR 20150131253A KR 101569201 B1 KR101569201 B1 KR 101569201B1
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KR
South Korea
Prior art keywords
gas
semiconductor manufacturing
piece
manufacturing facility
piping
Prior art date
Application number
KR1020150131253A
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Korean (ko)
Inventor
김종규
공해원
Original Assignee
주식회사 우진아이엔에스
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Priority to KR1020150131253A priority Critical patent/KR101569201B1/en
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Publication of KR101569201B1 publication Critical patent/KR101569201B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/44—Mechanical actuating means
    • F16K31/60—Handles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K35/00—Means to prevent accidental or unauthorised actuation
    • F16K35/04—Means to prevent accidental or unauthorised actuation yieldingly resisting the actuation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)

Abstract

The present invention relates to a gas pipe for a semiconductor manufacturing facility, capable of forming a piping facility to transfer gas in a semiconductor manufacturing facility so that gas pipes are smoothly installed in a space in which the pipes are not able to be installed and loaded as a construction space is not secured due to an obstacle. The present invention comprises: a pair of inner pipe assemblies forming an inner pipe with a gas transfer space, forming a coating layer of a Viton material on the outer surface, having a cross section in a semicircular shape, and having combination piece at the side ends, extended to the outside; and a pair of outer pipe assemblies forming an outer pipe surrounding the inner pipe, formed by the combination of the inner pipe assemblies, including a coating layer of the Viton material inside, and including a flange piece including a combination groove having a semicircular shape, extended to the outside, and combined with the combination piece. An assembly piece, extended to the outside and including multiple fixing holes combined with bolts, is formed on surfaces of the outer pipe assemblies, attached to each other. Multiple combination holes to be combined with a flange of other pipes through the bolts are formed on the flange piece.

Description

[0001] The present invention relates to a gas pipe for a semiconductor manufacturing facility,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas piping installed in a semiconductor manufacturing facility, and more particularly, to a gas piping installed in a semiconductor manufacturing facility, And more particularly, to a gas piping for a semiconductor manufacturing facility capable of smoothly installing a gas piping.

Generally, in the semiconductor manufacturing process and the LCD manufacturing process, gas piping for various gas supply facilities for supplying stable and safe various kinds of reaction gases in a certain quality state to a process chamber in a clean room section is essential Respectively.

Typically, the gas supplied through the gas supply facility of the semiconductor and LCD manufacturing processes includes a generic gas called the "bulk gas" and a special material gas called the "process gas".

For example, the bulk gas is predominantly a common gas that is consumed in a relatively large amount, such as dry air, nitrogen, oxygen, hydrogen, argon, helium, etc., and the process gas is a gas such as monosilane, phosphine, nitrogen trifluoride, Special material gas is dominant.

Particularly, in the case of the process gas, unreacted gas and subsidiary gas are discharged. Therefore, toxicity, corrosiveness and flammability are very strong, so that a harmful gas such as a vacuum pump or an exhaust gas treatment device (scrubber) It must be purified into a harmless state and released into the atmosphere.

Therefore, the gas supply facilities of the semiconductor and LCD manufacturing processes require special piping facilities with sufficient cleanliness, corrosion resistance and strength to prevent contamination and leakage while maintaining the high purity of the gas while reaching the process equipment.

Such piping facilities are selected in consideration of quality, stability, maintenance, and economical efficiency. In general, stainless steel pipes having excellent corrosion resistance due to toxicity and corrosiveness of exhaust gas are mainly used.

However, the process exhaust gas of the semiconductor and LCD manufacturing process contains a large amount of reaction products and fine particles such as dust, so that the exhaust gas is rapidly powdered due to external temperature change during the process of moving to the vacuum pump or the exhaust gas treatment device, And is immersed or adhered to the inside.

In order to minimize this phenomenon, the pipe of the process gas which is more toxic and corrosive than the general gas, forms a special coating layer such as a fluorine resin layer called Teflon on the inner circumferential surface in order to protect the surface of the stainless steel pipe It is generally used.

On the other hand, Korean Patent Registration No. 10-1320550 (name: stainless steel resin composite duplex pipe and manufacturing method thereof), as described in the publication, includes a stainless steel pipe; A pair of flanges provided at both ends of the stainless steel pipe; And a resin pipe having a gasket portion inserted into a hollow portion of the stainless steel pipe to form an inner skin and bent and formed so that both ends thereof are laminated and coalesced together, wherein the gasket portion of the resin pipe is uniformly distributed from the inside to the outside of the flange In which the cross-sectional area of the pipe is 40% or more.

In addition, as disclosed in Korean Utility Model Publication No. 20-2013-0003346 (name: a pipe for transporting and transporting chemical substances and chemical substances, which is easy to identify with naked eyes for leakage), waste water and chemical transportation And an outer pipe which is made of a corrosion-resistant material and has a length in the longitudinal direction and is arranged at a predetermined distance from the outer periphery of the inner pipe, and an inner pipe The outer pipe is formed of at least one rib that connects a pipe and forms a space in the longitudinal direction between the inner pipe and the outer pipe, wherein the outer pipe is made of wastewater and chemicals that are transported and transported inside the inner pipe, When it is in the space, it is transparent so that it can be visually distinguished from the outside of the pipe The property that the waste water and chemicals, pipes for the transport and transfer is described.

In addition, in Korean Patent Registration No. 10-1320553 (name: damper unit for gas piping), as described in the publication, a hollow tube body provided between piping unit pipes, and a hollow tube body And a handle portion for rotating the blade to open and close the duct of the tube main body, wherein the tube main body comprises: a stainless steel pipe; and a plurality of stainless steel pipes, each of which is provided at both ends of the stainless steel pipe, And a resin pipe having a pair of flanges and a gasket inserted into the hollow portion of the stainless steel pipe to form a core body and having gasket portions formed at both ends of the flange so as to be stacked and joined together, And the handle portion penetrates the tube body to be coupled to the blade. And a stopping mechanism capable of setting and determining a rotation angle of the blade, wherein the stopping mechanism is provided between the shaft and the engaging portion of the handle lever, A damper unit for gas piping including a panel member having an arc-shaped stopper groove provided with a plurality of serrated cam grooves and a stopper pin provided to be elastically barbed on the handle lever so as to be movable in the stopper groove, .

1. Korean Patent Registration No. 10-1320550 2. Korean Utility Model Publication No. 20-2013-0003346 3. Korean Patent Registration No. 10-1320553

However, in the conventional gas pipelines as described above, the gas piping can not be smoothly installed in a space where the gas piping can not be loaded or installed due to the uncertainty of the installation space due to the obstacle when the gas piping is installed in the field, There was a falling problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a gas piping system and a gas piping system in which a gas pipeline is installed and installed according to an uncertainty of a construction space caused by an obstacle And to provide a gas piping for a semiconductor manufacturing facility capable of smoothly constructing a gas piping in a space where the gas piping can not be installed.

In accordance with another aspect of the present invention, there is provided a gas piping for a semiconductor manufacturing facility, the gas piping for a semiconductor manufacturing facility comprising: A coating layer of a viton material is formed on the surface of the inner tube, and a semicircular section is formed on the outer surface of the inner tube. A pair of inner tube assemblies provided with a coupling piece; Wherein the inner tube is formed of a coating layer of a viton material on the inner surface and has a semicircular shape in cross section, And a pair of outer assembly assemblies each having a flange piece extending outwardly at an end thereof and having an engaging groove formed therein to receive and engage the engaging piece, Wherein each of the outer assembly assemblies is formed with an assembly piece extending in an outward direction and having a plurality of fixing holes to which the bolts are coupled, And the flange piece is formed with a plurality of fastening holes to be engaged with flanges of other pipes through bolts.

The gas piping for a semiconductor manufacturing facility according to the present invention has a small occupied space of the components and can be carried and installed even when the installation space is small due to an obstacle when the semiconductor equipment is installed. .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a gas piping for a semiconductor manufacturing facility according to an embodiment of the present invention. FIG.
2 is a schematic perspective view showing a state of use of a gas piping for a semiconductor manufacturing facility according to the present embodiment.
3 is a schematic cross-sectional exemplary view showing a part of a gas piping for a semiconductor manufacturing facility according to this embodiment.
Fig. 4 is a schematic cross-sectional exemplary view showing the use state of a gas piping for a semiconductor manufacturing facility according to this embodiment. Fig.
5 and 6 are schematic views showing a gas piping for a semiconductor manufacturing facility according to another embodiment of the present invention.

Hereinafter, a gas pipe for a semiconductor manufacturing facility according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This embodiment is provided to more fully describe the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

1 to 4 are views showing a gas piping for a semiconductor manufacturing facility according to an embodiment of the present invention. The gas piping 1 for a semiconductor manufacturing facility according to the present embodiment is applied to a manufacturing facility for a semiconductor And is applied to a gas piping constituting a gas piping system adapted to feed and transfer various gas substances.

That is, it is applied to constituting piping equipment among semiconductor manufacturing facilities and has corrosion resistance for transporting gas having dangerousness such as toxicity and corrosiveness.

The gas piping 1 for a semiconductor manufacturing facility according to the present embodiment has an inner tube 2 formed with a space in which a gas is closely adhered through a facing surface and a gas is conveyed to the inner tube 2 and a viton material And a pair of inner tube assemblies 21 having a semicircular shape in cross section.

That is, the inner tube assemblies 21 form a space through which the gas is transferred through the engagement of the inner tube assemblies 21.

At this time, the surface of the inner tube assembly 21 is coated with viton, thereby ensuring corrosion resistance.

It is most preferable that the inner tube assembly 21 is made of stainless steel whose surface is coated with viton to ensure a desired strength and corrosion resistance.

On the other hand, at both side ends of the inner tube assembly 21, a coupling piece 211 extending in the outward direction is provided in a flange shape.

As described above, the inner pipe 2 is composed of a pair of the inner pipe assemblies 21 having a semicircular cross section, so that the space occupied by the inner pipe assemblies 21 during transportation and installation is small.

This makes it possible to efficiently and stably form the inner pipe 2 smoothly even in a construction space where the installation space is narrow due to the obstacle 5 at the time of field installation of the gas piping system and it is difficult to carry and install.

The gas piping 1 for a semiconductor manufacturing facility according to the present embodiment as described above is in the form of an outer appearance which closely contacts the inner pipe 2 formed through the engagement of the inner pipe assemblies 21 in close contact therewith, 3, a coating layer of viton material is formed on the inner surface, and a pair of outer appearance assemblies 31 having a semicircular shape in cross section.

That is, the inner tube 2, through which the gas is transferred through the coupling of the outer tube assemblies 31, is received.

At this time, the inner surface of the outer assembly 31 is coated with vitton, thereby further securing corrosion resistance.

It is most preferable that the outer appearance assembly 31 is made of a stainless steel coated on the inner surface with Viton to ensure desired strength and corrosion resistance.

Accordingly, the minimum strength required for the gas piping system in the semiconductor manufacturing facility can be secured.

The flange pieces 312 are formed at both ends of the outer assembly 31 and formed with coupling grooves 311 extending outwardly and engaging with the coupling pieces 211 while being received therein.

That is, the coupling piece 211 is fixed to the coupling groove 313 of the flange piece 312 so that the inner tube assembly 21 and the outer tube assembly 31 are engaged.

As described above, the outer tube 3 is composed of a pair of the outer tube assemblies 31 having a semicircular cross section, so that the space occupied by the outer tubes is small during transportation and installation.

This makes it possible to efficiently and stably form the appearance even in a construction space in which the installation space is narrow due to the obstacle 5 at the time of field installation of the gas piping system and is difficult to carry and install.

In the gas piping 1 for a semiconductor manufacturing facility according to the present embodiment having the above-described structure, a plurality of fixing holes, which are extended in the outward direction and are fastened with bolts, are formed on the surfaces of the outer pipe assemblies 31, And a piece 313 are respectively formed,

That is, the assembly pieces 313 are fastened through bolts, which are not shown, to quickly and smoothly join the pair of outer assembly assemblies 31 to form the outer tube 3.

The flange piece 312 is formed with a plurality of fasteners to be engaged with the flange 41 of the other pipe 4 through bolts.

Accordingly, as shown in FIG. 4, the piping system is constructed by tightening the flange 41 of the other pipe 4 with bolts.

Hereinafter, the operation and effect of the gas piping for semiconductor manufacturing equipment according to the present embodiment will be described in detail.

 As shown in FIG. 4, the gas piping 1 for a semiconductor manufacturing facility according to the present embodiment is constructed such that, during the construction of the gas piping system, the introduction and installation of the materials due to the uncertainty of the construction space by the obstacle 5 This is particularly applicable to the construction of piping systems in a stable space in an impossible space.

At this time, the inner tube assemblies 21 are first brought into the installation space and then connected to each other to form the inner tube 2. The outer tube assemblies 31 are brought into the installation space, And the outer tube 3 is formed, the assembly of the gas piping 1 is completed.

As described above, when the gas piping 1 is assembled and connected to the other piping 4, the gas piping system is constructed.

5 and 6 are views showing a gas piping for a semiconductor manufacturing facility according to another embodiment of the present invention. In the gas piping 1 for a semiconductor manufacturing facility according to the present embodiment, The coupling piece 211 is provided with a protrusion 212 protruding in the longitudinal direction and the fitting groove 311 of the flange piece 312 is provided with a fitting groove 314 into which the protrusion 212 is fitted.

Accordingly, the inner tube assembly 21 stably maintains its posture without loosing the inner space of the outer tube assembly 31.

It is preferable that the fitting groove 314 is located at the central portion of the outer tube assembly 31 and the protrusion 212 is located at the end of the inner tube assembly 21.

In this case, when assembled, the mating surfaces of the respective inner tube assemblies 21 and the mating surfaces of the outer tube assemblies 31 do not lie on a straight line, thereby improving airtightness against the inside and the outside, It can be remarkably reduced and stability can be ensured.

As described above, the gas piping 1 for a semiconductor manufacturing facility according to the present embodiment is configured such that, when the gas piping is installed, So that the construction of the piping can be smoothly performed.

It will be apparent to those skilled in the art that various modifications and equivalent arrangements may be made therein without departing from the scope of the present invention as defined by the appended claims and their equivalents. . Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

1: gas piping 2: inner pipe
21: Inner pipe assembly 211:
212: projection 3: appearance
31: Appearance assembly 311: Coupling groove
312: flange piece 313: assembly piece
314: fitting groove 4: piping
41: Flange 5: Obstacle

Claims (1)

1. A gas piping for a semiconductor manufacturing facility adapted to constitute a piping facility for transporting gas in a semiconductor manufacturing facility, the piping comprising:
A coating layer of a viton material is formed on the surface of the inner tube, and a semicircular section is formed on the outer surface of the inner tube. A pair of inner tube assemblies provided with a coupling piece;
Wherein the inner tube is formed of a coating layer of a viton material on the inner surface and has a semicircular shape in cross section, And a pair of outer assembly assemblies each having a flange piece extending outwardly at an end thereof and having an engaging groove formed therein to receive and engage the engaging piece,
On the surfaces that are in close contact with each other in the outer shell assemblies,
Each of which has a plurality of fixing holes formed therein extending in the outward direction and to which the bolts are fastened;
Wherein a plurality of fastening holes are formed in the flange part so as to engage with flanges of other pipes through bolts.
KR1020150131253A 2015-09-16 2015-09-16 A gas pipe for manufacturing facilities of a semiconductor KR101569201B1 (en)

Priority Applications (1)

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KR1020150131253A KR101569201B1 (en) 2015-09-16 2015-09-16 A gas pipe for manufacturing facilities of a semiconductor

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170002668U (en) 2016-01-18 2017-07-26 (주)지오 Pipe Connection Apparatus
KR102143578B1 (en) 2020-05-25 2020-08-13 주식회사 우진아이엔에스 Method for manufacturing a centering of
KR102422257B1 (en) * 2022-01-25 2022-07-18 주식회사 윤성이엔지 Gas pipe for semiconductor manufacturing facility
KR102474028B1 (en) * 2022-05-28 2022-12-06 주식회사 세원케이 Gas piping for semiconductor manufacturing equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336703A (en) 1999-05-31 2000-12-05 Kokusan Rasenkan Kk Repair device for spiral conduit
KR101320550B1 (en) 2012-07-09 2013-10-28 (주)다리온 Stainless steel combine synthetic resine dual pipe and fabrication method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336703A (en) 1999-05-31 2000-12-05 Kokusan Rasenkan Kk Repair device for spiral conduit
KR101320550B1 (en) 2012-07-09 2013-10-28 (주)다리온 Stainless steel combine synthetic resine dual pipe and fabrication method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170002668U (en) 2016-01-18 2017-07-26 (주)지오 Pipe Connection Apparatus
KR102143578B1 (en) 2020-05-25 2020-08-13 주식회사 우진아이엔에스 Method for manufacturing a centering of
KR102422257B1 (en) * 2022-01-25 2022-07-18 주식회사 윤성이엔지 Gas pipe for semiconductor manufacturing facility
KR102474028B1 (en) * 2022-05-28 2022-12-06 주식회사 세원케이 Gas piping for semiconductor manufacturing equipment

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