KR20210158328A - Adhesive resin composition, sheet using this composition, lid material, set of members for container, and container - Google Patents

Adhesive resin composition, sheet using this composition, lid material, set of members for container, and container Download PDF

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KR20210158328A
KR20210158328A KR1020210076809A KR20210076809A KR20210158328A KR 20210158328 A KR20210158328 A KR 20210158328A KR 1020210076809 A KR1020210076809 A KR 1020210076809A KR 20210076809 A KR20210076809 A KR 20210076809A KR 20210158328 A KR20210158328 A KR 20210158328A
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resin composition
mass
adhesive resin
container
vinyl acetate
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KR1020210076809A
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Korean (ko)
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KR102494474B1 (en
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토모노리 야마다
타이스케 아카기
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토요잉크Sc홀딩스주식회사
토요켐주식회사
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04Homopolymers or copolymers of vinyl acetate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/062Pretreatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065After-treatment
    • B05D3/067Curing or cross-linking the coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • B32B2439/40Closed containers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00Properties characterising the ingredient of the composition
    • C08L2207/06Properties of polyethylene
    • C08L2207/066LDPE (radical process)
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Packages (AREA)
  • Adhesive Tapes (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided are an adhesive resin composition which has excellent film-forming properties and forms an adhesive layer with excellent easy opening properties with respect to a container body made of plastics such as polypropylene, polystyrene, and the like and excellent boiling resistance, and a sheet, lid material, container member set, and container using the same. To achieve this, the adhesive resin composition comprises: (A) 40 to 75 mass% of an ethylene-vinyl acetate copolymer having a vinyl acetate content of 5 to 15 mass%; (B) 10 to 45 mass% (preferably 20 to 30 mass%) of a linear low-density polyethylene having a melt mass flow rate of 1 to 20 g/10 min; and (C) 15 to 30 mass% of a tackifying resin.

Description

접착성 수지 조성물, 그 조성물을 이용한 시트, 뚜껑재, 용기용 부재 세트 및 용기{ADHESIVE RESIN COMPOSITION, SHEET USING THIS COMPOSITION, LID MATERIAL, SET OF MEMBERS FOR CONTAINER, AND CONTAINER}An adhesive resin composition, a sheet using the composition, a lid material, a member set for containers, and a container TECHNICAL FIELD

이 출원은, 2020년 6월 22일에 출원된 일본 특허출원 제2020-106703호를 기초로 하는 우선권을 주장하고, 그 개시의 전부를 여기에 포함한다. This application claims priority on the basis of Japanese Patent Application No. 2020-106703 for which it applied on June 22, 2020, and takes in all the indication here.

본 발명은, 접착성 수지 조성물, 그 접착성 수지 조성물을 이용한 시트, 뚜껑재(蓋材), 용기(容器)용 부재 세트 및 용기에 관한 것이다.The present invention relates to an adhesive resin composition, a sheet using the adhesive resin composition, a lid member, a member set for a container, and a container.

최근, 식품 포장 및 공업용 포장재로서, 내열성 및 단열 보온성이 뛰어나다는 관점에서, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체가 사용되고 있다. 이들 용기 본체에 사용되는 뚜껑재로서는, 적당한 히트 실링 강도를 가지며, 또 용이(易) 박리성을 갖는 필름이 바람직하게 사용된다.In recent years, as a food packaging and industrial packaging material, the container body made from plastics, such as polypropylene and polystyrene, is used from a viewpoint of being excellent in heat resistance and heat insulation heat retention. As a lid material used for these container bodies, the film which has moderate heat-sealing strength and has easy peelability is used preferably.

폴리프로필렌 또는 폴리스티렌제의 용기 본체의 뚜껑재로 사용되는 필름으로서, 예를 들면 특허문헌 1에는 초산비닐 함유율이 30~15질량%이며, 멜트 매스 플로우 레이트(melt mass-flow rate)가 10~40g/10분인 에틸렌-초산비닐 공중합체, 점착부여제, 및 저밀도 폴리에틸렌을 포함한 수지 조성물로 이루어지는 접착제층을 구비하는 용이 박리성 필름이 개시되어 있다.As a film used as a lid material of a container body made of polypropylene or polystyrene, for example, in Patent Document 1, the vinyl acetate content is 30 to 15 mass%, and the melt mass-flow rate is 10 to 40 g An easily peelable film comprising an ethylene-vinyl acetate copolymer of /10 min, a tackifier, and an adhesive layer comprising a resin composition containing low-density polyethylene is disclosed.

일본 특허공개공보 제2019-199496호Japanese Patent Laid-Open No. 2019-199496

그러나, 특허문헌 1에 기재된 용이 박리성 필름은, 접착제층이 저밀도 폴리에틸렌을 포함하고 있기 때문에 내열성이 떨어지고, 보일·레토르트 처리가 불가능한 문제가 있다.However, since the adhesive layer contains low-density polyethylene, the easily peelable film of patent document 1 has a problem that heat resistance is inferior and a boil-retort process is impossible.

따라서, 본 발명의 과제는, 성막성이 우수하면서 동시에 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대해서 용이 개봉성 및 내(耐)보일성이 뛰어난 접착제층을 형성하는 것이 가능한 접착성 수지 조성물, 그리고 이를 이용한 시트, 뚜껑재, 부재 세트 및 용기를 제공하는 것에 있다.Accordingly, the object of the present invention is an adhesive resin composition capable of forming an adhesive layer excellent in film formability and excellent in easy opening and sealing resistance to a plastic container body such as polypropylene and polystyrene. , and to provide a sheet, a lid material, a member set and a container using the same.

본 발명자는 예의 연구를 거듭한 결과, 특정의 초산비닐 함유율을 갖는 에틸렌-초산비닐 공중합체(A), 특정의 멜트 매스 플로우 레이트를 갖는 직쇄상(直鎖狀) 저밀도 폴리에틸렌(B), 및 점착 부여 수지(C)를 소정의 배합비로 조합시킴으로써, 상기 과제를 해결하는 것을 알아내고 본 발명에 이르렀다.As a result of intensive research, the present inventors have found that an ethylene-vinyl acetate copolymer (A) having a specific vinyl acetate content, a linear low-density polyethylene (B) having a specific melt mass flow rate, and adhesive By combining imparting resin (C) at a predetermined compounding ratio, it was discovered that the above subject was solved, and the present invention was reached.

본 발명은, 초산비닐 함유율이 5~15질량%의 에틸렌-초산비닐 공중합체(A) 40~75질량%, 멜트 매스 플로우 레이트가 1~20g/10분의 직쇄상 저밀도 폴리에틸렌(B) 10~45질량%, 및 점착 부여 수지(C) 15~30질량%를 함유하는, 접착성 수지 조성물에 관한 것이다.The present invention has a vinyl acetate content of 5 to 15 mass% of an ethylene-vinyl acetate copolymer (A) of 40 to 75 mass%, a melt mass flow rate of 1 to 20 g/10 min of linear low-density polyethylene (B) 10 to It relates to the adhesive resin composition containing 45 mass % and 15-30 mass % of tackifying resin (C).

본 발명은, 멜트 매스 플로우 레이트가 1~20g/10분인, 상기 접착성 수지 조성물에 관한 것이다.The present invention relates to the adhesive resin composition having a melt mass flow rate of 1 to 20 g/10 min.

본 발명은, 에틸렌-초산비닐 공중합체(A)의 시차 주사형 열량계에 의해 측정되는 융점이 80~120℃인, 상기 접착성 수지 조성물에 관한 것이다.The present invention relates to the above adhesive resin composition, wherein the melting point of the ethylene-vinyl acetate copolymer (A) measured by a differential scanning calorimeter is 80 to 120°C.

본 발명은, 직쇄상 저밀도 폴리에틸렌(B)의 시차 주사형 열량계에 의해 측정되는 융점이 90~150℃인, 상기 접착성 수지 조성물에 관한 것이다.The present invention relates to the above adhesive resin composition, wherein the linear low-density polyethylene (B) has a melting point of 90 to 150°C as measured by a differential scanning calorimeter.

본 발명은, 점착 부여 수지(C)의 시차 주사형 열량계에 의해 측정되는 융점이 55~100℃인, 상기 접착성 수지 조성물에 관한 것이다.This invention relates to the said adhesive resin composition whose melting|fusing point measured by the differential scanning calorimeter of tackifying resin (C) is 55-100 degreeC.

본 발명은, 점착 부여 수지(C)가, 지환족 탄화수소 수지 및 테르펜 수지로 이루어진 군에서 선택되는 적어도 1종을 포함한, 상기 접착성 수지 조성물에 관한 것이다.The present invention relates to the adhesive resin composition, wherein the tackifying resin (C) contains at least one selected from the group consisting of an alicyclic hydrocarbon resin and a terpene resin.

본 발명은, 직쇄상 저밀도 폴리에틸렌(B)의 함유율이 20~30질량%인, 상기 접착성 수지 조성물에 관한 것이다.This invention relates to the said adhesive resin composition whose content rate of linear low-density polyethylene (B) is 20-30 mass %.

본 발명은, 기재 상에, 상기 접착성 수지 조성물로 이루어진 도막을 구비한시트에 관한 것이다.The present invention relates to a sheet provided with a coating film made of the adhesive resin composition on a substrate.

본 발명은, 상기 시트로 이루어지는 뚜껑재에 관한 것이다.The present invention relates to a lid member comprising the sheet.

본 발명은, 개구부를 갖는 용기 본체와, 상기 뚜껑재로 이루어지는, 개봉 가능한 용기용 부재 세트에 관한 것이다.The present invention relates to a container body having an opening, and a member set for an openable container comprising the lid member.

본 발명은, 용기 본체의 개구부가, 상기 뚜껑재에 의해 밀봉된, 개봉 가능한 용기에 관한 것이다.The present invention relates to an openable container in which an opening of the container body is sealed by the lid member.

본 발명에 의해, 성막성이 우수하면서 동시에 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대해 용이 개봉성 및 내 보일성이 뛰어난 접착제 층을 형성하는 것이 가능한 접착성 수지 조성물, 그리고 이를 이용한 시트, 뚜껑재, 부재 세트 및 용기를 제공할 수 있다.According to the present invention, an adhesive resin composition capable of forming an adhesive layer excellent in film-forming properties and excellent in easy opening and boiling resistance to a plastic container body made of polypropylene and polystyrene, etc. at the same time, and a sheet using the same; A lid material, a member set, and a container can be provided.

본 발명의 접착성 수지 조성물은, 초산비닐 함유율이 5~15질량%의 에틸렌-초산비닐 공중합체(A) 40~75질량%, 멜트 매스 플로우 레이트가 1~20g/10분의 직쇄상 저밀도 폴리에틸렌(B) 10~45질량%, 및 점착 부여 수지(C)를 15~30질량% 함유하는 것을 특징으로 한다.The adhesive resin composition of the present invention has a vinyl acetate content of 5 to 15 mass%, an ethylene-vinyl acetate copolymer (A) of 40 to 75 mass%, and a melt mass flow rate of 1 to 20 g/10 minutes of linear low-density polyethylene. (B) 10-45 mass % and 15-30 mass % of tackifying resin (C) are contained, It is characterized by the above-mentioned.

직쇄상 저밀도 폴리에틸렌(B)의 함유량은, 바람직하게는 20~30질량%이다.Content of linear low-density polyethylene (B) becomes like this. Preferably it is 20-30 mass %.

특정의 초산비닐 함유율을 갖는 에틸렌-초산비닐 공중합체(A), 특정의 멜트 매스 플로우 레이트를 갖는 직쇄상 저밀도 폴리에틸렌(B), 및 점착 부여 수지(C)를 소정의 배합비로 결합함으로써, 용이 개봉과 내열성이 뛰어나 보일 처리가 가능한 접착성 수지 조성물을 제공하는 것이 가능해진다. By combining an ethylene-vinyl acetate copolymer (A) having a specific vinyl acetate content, a linear low-density polyethylene (B) having a specific melt mass flow rate, and a tackifying resin (C) in a predetermined mixing ratio, easy opening It becomes possible to provide an adhesive resin composition which is excellent in heat resistance and can be subjected to boiling treatment.

이하, 본 발명에 관해서, 상세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

<에틸렌-초산비닐 공중합체(EVA)(A)><Ethylene-vinyl acetate copolymer (EVA) (A)>

에틸렌-초산비닐 공중합체(A)는, 에틸렌과 초산비닐을 공중합한 열가소성 수지이다. 본 발명에서 사용되는 에틸렌-초산비닐 공중합체(A)는, 초산비닐 함유율이 5~15질량%이며, 이를 충족하는 것이면 특별히 제한없이 사용할 수 있다. 이러한 에틸렌-초산비닐 공중합체를 이용함으로써, 압출 라미네이트 가공성, 저온 실링성, 및 인플레이션 가공 적성이 뛰어난 접착성 수지 조성물이 얻어진다. 에틸렌-초산비닐 공중합체는, 1종을 단독으로 사용해도 좋고, 2종 이상을 병용해도 좋다.The ethylene-vinyl acetate copolymer (A) is a thermoplastic resin obtained by copolymerizing ethylene and vinyl acetate. The ethylene-vinyl acetate copolymer (A) used in the present invention has a vinyl acetate content of 5 to 15% by mass, and as long as it satisfies this, it can be used without particular limitation. By using such an ethylene-vinyl acetate copolymer, the adhesive resin composition excellent in extrusion lamination processability, low temperature sealing property, and inflation processability is obtained. An ethylene-vinyl acetate copolymer may be used individually by 1 type, and may use 2 or more types together.

에틸렌-초산비닐 공중합체(A)의 함유량은, 접착성 수지 조성물의 전량을 기준으로서 40~75질량%이다. 에틸렌-초산비닐 공중합체(A)의 함유율이 40질량%이상이면, 개봉 강도를 손상시키지 않고, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대한 접착성이 양호해진다. 에틸렌-초산비닐 공중합체(A)의 함유량이 75질량% 이하이면, 도공 적성과 접착성의 밸런스가 뛰어나 용기 본체의 플랜지에서의 수지 잔여물과 실당김이 발생하지 않는다.The content of the ethylene-vinyl acetate copolymer (A) is 40 to 75 mass% based on the total amount of the adhesive resin composition. When the content of the ethylene-vinyl acetate copolymer (A) is 40% by mass or more, the opening strength is not impaired, and the adhesion to the container body made of plastics such as polypropylene and polystyrene becomes good. When the content of the ethylene-vinyl acetate copolymer (A) is 75% by mass or less, the balance between coating aptitude and adhesiveness is excellent, and resin residue and thread pulling on the flange of the container body do not occur.

에틸렌-초산비닐 공중합체(A)의 함유량은, 용이 개봉성 및 박리감의 관점에서, 바람직하게는 45~55질량%이다.The content of the ethylene-vinyl acetate copolymer (A) is preferably 45 to 55% by mass from the viewpoint of easy opening and peeling feeling.

에틸렌-초산비닐 공중합체(A)의 시차 주사형 열량계에 의해 측정되는 융점은, 바람직하게는 80~120℃, 보다 바람직하게는 90~110℃이다. 이 범위 내이면, 직쇄상 저밀도 폴리에틸렌(B)과의 상용성이 향상되고 도공 적성이 향상하여, 개봉 강도를 손상시키지 않고 양호한 접착력을 얻을 수 있어서 바람직하다.The melting point of the ethylene-vinyl acetate copolymer (A) as measured by a differential scanning calorimeter is preferably 80 to 120°C, more preferably 90 to 110°C. If it is in this range, compatibility with a linear low-density polyethylene (B) improves, coating aptitude improves, and favorable adhesive force can be obtained without impairing unsealing strength, and it is preferable.

에틸렌-초산비닐 공중합체(A)의 멜트 매스 플로우 레이트(MFR)는, 바람직하게는 0.5~50g/10분, 보다 바람직하게는 0.5~20g/10분, 특히 바람직하게는 0.5~10g/ 10분이다. 또한, 본 명세서에서의 멜트 매스 플로우 레이트는, JIS K7210에 준거해서 190℃, 21.168N의 조건에서 측정되는 값이다.The melt mass flow rate (MFR) of the ethylene-vinyl acetate copolymer (A) is preferably 0.5 to 50 g/10 min, more preferably 0.5 to 20 g/10 min, particularly preferably 0.5 to 10 g/10 min. to be. In addition, the melt mass flow rate in this specification is a value measured on condition of 190 degreeC and 21.168N based on JISK7210.

에틸렌-초산비닐 공중합체(A)의 밀도는, 바람직하게는 0.90~0.95g/㎤, 보다 바람직하게는 0.92~0.94g/㎤이다. 또한, 본 명세서에서의 밀도는, JIS K7112에 준거해서 피크노미터법에 의해 측정되는 값이다.The density of the ethylene-vinyl acetate copolymer (A) is preferably 0.90 to 0.95 g/cm 3 , more preferably 0.92 to 0.94 g/cm 3 . In addition, the density in this specification is a value measured by the pycnometer method based on JISK7112.

<직쇄상 저밀도 폴리에틸렌(B)><Linear low-density polyethylene (B)>

직쇄상 저밀도 폴리에틸렌(B)은, 반복 단위의 에틸렌과 약간 양의 α-올레핀을 공중합시킨 열가소성 수지이다. 본 발명에서 이용되는 직쇄상 저밀도 폴리에틸렌(B)은, 멜트 매스 플로우 레이트가 1~20g/10분이며, 이를 충족하는 것이면 특별히 제한없이 사용할 수 있다. 이러한 직쇄상 저밀도 폴리에틸렌(B)을 이용함으로써 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대한 접착성이 높아지고, 내 보일성이 뛰어난 접착성 수지 조성물이 얻어진다. 직쇄상 저밀도 폴리에틸렌(B)은, 1종을 단독으로 사용해도 좋고, 2종 이상을 병용해도 좋다.The linear low-density polyethylene (B) is a thermoplastic resin obtained by copolymerizing ethylene as a repeating unit and a small amount of ?-olefin. The linear low-density polyethylene (B) used in the present invention has a melt mass flow rate of 1 to 20 g/10 min, and as long as it satisfies this, it can be used without particular limitation. By using such a linear low-density polyethylene (B), the adhesiveness with respect to the container body made from plastics, such as polypropylene and polystyrene, is improved, and the adhesive resin composition excellent in boiling resistance is obtained. Linear low-density polyethylene (B) may be used individually by 1 type, and may use 2 or more types together.

직쇄상 저밀도 폴리에틸렌(B)의 함유율은, 접착성 수지 조성물의 전량을 기준으로서 10~45질량%이다. 직쇄상 저밀도 폴리에틸렌(B)의 함유량이 10질량% 이상이면, 접착 강도의 유지성이 양호해진다. 직쇄상 저밀도 폴리에틸렌(B)의 함유량이 45질량% 이하이면, 용융 막 균열이 발생되기 어려우며 압출 라미네이트 가공성이 뛰어나다.The content rate of the linear low-density polyethylene (B) is 10-45 mass % based on the whole quantity of an adhesive resin composition. When content of linear low-density polyethylene (B) is 10 mass % or more, the retentivity of adhesive strength will become favorable. If the content of the linear low-density polyethylene (B) is 45% by mass or less, melt film cracking is unlikely to occur and the extrusion lamination processability is excellent.

직쇄상 저밀도 폴리에틸렌(B)의 함유량은, 접착성, 고온 환경하에서의 접착 강도 유지성, 및 내 보일성의 관점에서, 바람직하게는 15~40질량%, 보다 바람직하게는 20~30질량%이다.The content of the linear low-density polyethylene (B) is preferably 15 to 40% by mass, more preferably 20 to 30% by mass from the viewpoints of adhesiveness, adhesive strength retention in a high-temperature environment, and boiling resistance.

직쇄상 저밀도 폴리에틸렌(B)의 시차 주사형 열량계에 의해 측정되는 융점은, 바람직하게는 90~150℃, 보다 바람직하게는 100~130℃이다. 상기의 범위 내이면, 적당한 접착 강도가 발현하여 저온 실링성이 보다 우수하기 때문에 바람직하다.The melting point of the linear low-density polyethylene (B) as measured by a differential scanning calorimeter is preferably 90 to 150°C, more preferably 100 to 130°C. If it is in said range, since moderate adhesive strength is expressed and it is more excellent in low-temperature sealing property, it is preferable.

직쇄상 저밀도 폴리에틸렌(B)의 밀도는, 바람직하게는 0.85~0.95g/㎤, 보다 바람직하게는 0.90~0.95g/㎤이다.The density of linear low-density polyethylene (B) becomes like this. Preferably it is 0.85-0.95 g/cm<3>, More preferably, it is 0.90-0.95 g/cm<3>.

<점착 부여 수지(C)><Tackifying resin (C)>

본 발명에서의 점착 부여 수지(C)는 특별히 제한되지 않고, 실란트 수지 분야에 있어서 공지의 점착 부여 수지에서 적당히 선택할 수 있다.The tackifying resin (C) in this invention is not restrict|limited in particular, In the field|area of a sealant resin, it can select suitably from well-known tackifying resin.

점착 부여 수지로서는, 예를 들면, 지방족 탄화수소 수지, 지환족 탄화수소 수지, 방향족계 탄화수소 수지, 폴리테르펜계 수지, 및 로진류를 들 수 있다. 폴리테르펜 수지로서는, α-피넨 및 β-피넨 등의 단독 중합 또는 공중합체, 또는 이들에 대해서 수소 첨가(수첨)한 수첨(水添) 테르펜 수지를 사용할 수 있다.As tackifying resin, aliphatic hydrocarbon resin, alicyclic hydrocarbon resin, aromatic hydrocarbon resin, polyterpene type resin, and rosins are mentioned, for example. As the polyterpene resin, a homopolymer or copolymer such as α-pinene and β-pinene, or a hydrogenated terpene resin obtained by adding (hydrogenation) to these can be used.

점착 부여 수지(C)는, 지환족 탄화수소 수지, 방향족 탄화수소 수지 및 테르펜 수지로 이루어진 군에서 선택되는 적어도 1종을 포함하는 것이 바람직하고, 보다 바람직하게는 지환족 탄화수소 수지 및 테르펜 수지로 이루어진 군에서 선택되는 적어도 1종을 포함한다.The tackifying resin (C) preferably contains at least one selected from the group consisting of alicyclic hydrocarbon resins, aromatic hydrocarbon resins and terpene resins, and more preferably from the group consisting of alicyclic hydrocarbon resins and terpene resins. It contains at least 1 type selected.

점착 부여 수지는, 1종을 단독으로 사용해도 되고, 2종 이상을 병용해도 좋다.Tackifying resin may be used individually by 1 type, and may use 2 or more types together.

점착 부여 수지(C)의 함유량은, 접착성 수지 조성물의 전량을 기준으로서 15~30질량%이다. 점착 부여 수지(C)의 함유량이 10질량% 이상이면, 개봉 강도를 손상시키지 않고, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대해서 양호한 접착성이 얻어진다. 점착 부여 수지(C)의 함유량이 30질량% 이하이면, 용융막 균열이 발생하기 어렵고, 압출 라미네이트 가공성이 뛰어나다.Content of tackifying resin (C) is 15-30 mass % on the basis of whole quantity of adhesive resin composition. If content of tackifying resin (C) is 10 mass % or more, favorable adhesiveness is acquired with respect to the container body made from plastics, such as polypropylene and polystyrene, without impairing opening strength. When content of tackifying resin (C) is 30 mass % or less, it is hard to generate|occur|produce a melt film crack, and it is excellent in extrusion lamination processability.

점착 부여 수지(C)의 함유량은, 성막성, 용이 개봉성, 및 박리감의 관점에서 바람직하게는 20~30질량%이다.Content of tackifying resin (C) becomes like this. From a viewpoint of film-forming property, easy opening property, and a peeling feeling, Preferably it is 20-30 mass %.

점착 부여 수지(C)의 연화점은, 히트 실링시의 접착성 및 용이 개봉성의 관점에서, 바람직하게는 120℃이하, 보다 바람직하게는 100~120℃이다. 또한, 본 명세서에서의 연화점은, JIS K 6863에 준거해서 구할 수 있다.The softening point of tackifying resin (C) becomes like this. From a viewpoint of the adhesiveness at the time of heat sealing, and easily openability, Preferably it is 120 degrees C or less, More preferably, it is 100-120 degreeC. In addition, the softening point in this specification can be calculated|required based on JISK6863.

점착 부여 수지(C)의 시차 주사형 열량계에 의해 측정되는 융점은, 바람직하게는 55~100℃, 보다 바람직하게는 60~80℃이다.The melting point of tackifying resin (C) as measured by a differential scanning calorimeter is preferably 55 to 100°C, more preferably 60 to 80°C.

<접착성 수지 조성물><Adhesive resin composition>

본 발명의 접착성 수지 조성물은, 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B) 및 점착 부여 수지(C)를 공지의 방법으로 혼합해서 제조할 수 있다. 제조법으로서는, 예를 들면, 각 성분을 헨쉘 믹서 및 텀블러 믹서 등의 혼합 장치에 투입해서 5~20분간 혼합하고, 얻어진 혼합물을 압출기에 투입해서 가열 혼련하고, 압출하는 방법을 들 수 있다. 압출 공정은, 통상 150~200℃에서 행해진다. 압출물은 통상 펠렛 형상으로 가공되고, 후공정에서 이용된다. 압출기로서는, 이축 압출기가 적합하게 이용되는데, 이에 제한되지 않는다.The adhesive resin composition of this invention can be manufactured by mixing an ethylene-vinyl acetate copolymer (A), a linear low-density polyethylene (B), and a tackifying resin (C) by a well-known method. As a manufacturing method, for example, each component is thrown into mixing apparatuses, such as a Henschel mixer and a tumbler mixer, and it mixes for 5 to 20 minutes, The obtained mixture is injected|thrown-in to an extruder, It heat-kneads, and the method of extruding is mentioned. An extrusion process is normally performed at 150-200 degreeC. The extrudate is usually processed into a pellet shape and used in a post-process. As the extruder, a twin screw extruder is suitably used, but is not limited thereto.

본 발명의 접착성 수지 조성물에서의, 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B) 및 점착 부여 수지(C)의 합계량은, 접착성 수지 조성물을 기준으로서 바람직하게는 95질량% 이상, 보다 바람직하게는 98질량%이상이다.The total amount of the ethylene-vinyl acetate copolymer (A), the linear low-density polyethylene (B) and the tackifying resin (C) in the adhesive resin composition of the present invention is preferably 95 mass based on the adhesive resin composition % or more, more preferably 98 mass% or more.

접착성 수지 조성물의 멜트 매스 플로우 레이트는, 바람직하게는 1~20g/10 분, 보다 바람직하게는 1~15g/10분이다. 이 범위 내이면, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대한 접착성이 우수하고 바람직하다.The melt mass flow rate of the adhesive resin composition is preferably 1 to 20 g/10 min, more preferably 1 to 15 g/10 min. If it is in this range, it is excellent in adhesiveness with respect to the container body made from plastics, such as polypropylene and polystyrene, and is preferable.

본 발명의 접착성 수지 조성물에는, 본 발명의 효과를 해치지 않는 범위에서, 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B) 및 점착 부여 수지(C) 이외의 임의의 수지 및/또는 첨가제를 배합해도 좋다. In the adhesive resin composition of the present invention, any resin other than the ethylene-vinyl acetate copolymer (A), the linear low-density polyethylene (B) and the tackifying resin (C) and/ Or you may mix|blend an additive.

임의의 수지로서는, 예를 들면, 고밀도 폴리에틸렌 및 폴리프로필렌 등의 폴리올레핀 수지, 그 산화물 및 말레산 변성물; 에틸렌-아크릴산 공중합체 및 에틸렌 -(메타)아크릴산 공중합체 등의 에틸렌-불포화 모노 카복실산 공중합체 및 그 금속염; 고밀도 폴리에틸렌 왁스, 폴리프로필렌 왁스, 피셔-트롭쉬(Fischer-Tropsch) 왁스, 파라핀 왁스, 산화 왁스, 및 말레산 변성 왁스 등의 왁스류; 들 수 있다. 임의 수지는, 1종을 단독으로 사용해도 좋고, 2종 이상을 병용해도 좋다.As arbitrary resin, For example, polyolefin resin, such as high density polyethylene and polypropylene, its oxide, and maleic acid modified material; ethylene-unsaturated monocarboxylic acid copolymers such as ethylene-acrylic acid copolymer and ethylene-(meth)acrylic acid copolymer, and metal salts thereof; waxes such as high-density polyethylene wax, polypropylene wax, Fischer-Tropsch wax, paraffin wax, oxidized wax, and maleic acid-modified wax; can be heard Arbitrary resin may be used individually by 1 type, and may use 2 or more types together.

첨가제는, 열 열화, 열 분해, 및 블로킹 등을 방지할 목적, 혹은 필름 가공 및 압출 라미네이트 가공 등의 가공 적정(適正)을 확보할 목적으로 사용할 수 있다. 첨가제로서는, 예를 들면, 에루크산 아미드 등의 유기 활제, 탄산칼슘 등의 무기 활제, 힌더드 페놀 등의 산화 방지제, 블로킹 방지제, 대전 방지제, 충전제, 방담(防曇)제, 비정질 알루미노 규산염 및 이산화 규소 등을 들 수 있다.The additive can be used for the purpose of preventing thermal deterioration, thermal decomposition, blocking, or the like, or for the purpose of ensuring proper processing such as film processing and extrusion lamination processing. Examples of the additive include an organic lubricant such as erucic acid amide, an inorganic lubricant such as calcium carbonate, an antioxidant such as hindered phenol, an antiblocking agent, an antistatic agent, a filler, an antifogging agent, an amorphous aluminosilicate and silicon dioxide.

임의 수지 및/또는 첨가제는, 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B), 및 점착 부여 수지(C)를 혼합할 때에 배합해도 좋고, 미리 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B) 또는 점착 부여 수지(C) 중 어느 것에 배합해도 좋다.Optional resins and/or additives may be blended when mixing the ethylene-vinyl acetate copolymer (A), the linear low-density polyethylene (B), and the tackifying resin (C), or the ethylene-vinyl acetate copolymer (A) ), you may mix|blend with any of linear low-density polyethylene (B) or tackifying resin (C).

<시트><sheet>

이어서, 기재 상에, 본 발명의 접착성 수지 조성물로 이루어진 도막(이하, 피막 또는 접착제층이라고도 함)이 배치된 시트에 관해서 설명한다.Next, a sheet in which a coating film (hereinafter also referred to as a film or an adhesive layer) made of the adhesive resin composition of the present invention is disposed on a substrate will be described.

접착성 수지 조성물의 기재 상으로의 배치 방법으로서는, 특별히 제한되지 않는다. 예를 들면, 전술한 바와 같이 펠렛화된 접착성 수지 조성물을 인플레이션 법 또는 캐스트법 등에 의해 필름화하고, 얻어진 필름과 기재를 적층하는 방법, 및 혼련된 접착성 수지 조성물을 직접 기재 위에 피복하는 방법을 들 수 있다. 필름과 기재는, 다른 접착제층을 통해서 적층되어도 좋다. It does not restrict|limit especially as a method of disposing the adhesive resin composition on the base material. For example, a method of filming the adhesive resin composition pelletized as described above by an inflation method or a casting method, etc., and laminating the obtained film and a substrate, and a method of directly coating the kneaded adhesive resin composition on a substrate can be heard A film and a base material may be laminated|stacked via another adhesive bond layer.

기재는, 장척 또는 컷팅된 단척의, 필름 및 시트를 포함한다.Substrates include long or cut short films and sheets.

일반적으로, 박막 성형체에 대해서는 두께에 따라서, 「필름」 또는 「시트」의 용어가 사용되는데, 이들의 명확한 정의는 없고, 이들 사이에 명확한 구별은 없다.Generally, the terms "film" or "sheet" are used for a thin film molded body depending on the thickness, but there is no clear definition of these, and there is no clear distinction between them.

이하, 기재로서 사용되는 「필름」에는, 「필름」 및 「시트」가 포함되는 것으로 한다. Hereinafter, "film" used as a base material shall include "film" and "sheet".

또한, 본 발명의 시트에 대해서도, 「필름」 및 「시트」가 포함하는 것으로한다.In addition, also about the sheet|seat of this invention, "film" and "sheet" shall be included.

기재는, 폴리에스테르 필름, 폴리아미드 필름, 및 폴리프로필렌 필름 등의, 연신 또는 미연신의 단층 필름일 수 있고, 수지 라미네이트 가공물과 같은 복수의 층을 적층한 적층 필름일 수 있다.The substrate may be a stretched or unstretched single-layer film such as a polyester film, a polyamide film, and a polypropylene film, and may be a laminated film in which a plurality of layers such as a resin laminated product are laminated.

예를 들면, 폴리에틸렌이 미리 적층되어 있는 기재를 사용하는 경우, 기재 상에 접착성 수지 조성물을 다이렉트로 압출 라미네이트해서 시트를 제조할 수 있다.For example, when a base material on which polyethylene is laminated in advance is used, the sheet can be manufactured by directly extruding and laminating the adhesive resin composition on the base material.

또한, 접착성 수지 조성물을, 폴리에틸렌 및 폴리프로필렌 등과 공압출해서 적층 필름을 얻고, 드라이 라미네이션 또는 샌드 라미네이션에 의해, 적층 필름과 기재 필름을 적층함으로써 시트를 얻을 수 있다.Moreover, a sheet|seat can be obtained by co-extruding an adhesive resin composition with polyethylene, polypropylene, etc. to obtain a laminated|multilayer film, and laminating|stacking a laminated|multilayer film and a base film by dry lamination or sand lamination.

기재와 접착제층(본 발명의 접착성 수지 조성물로 이루어지는 피막)과의 접착성을 향상시키기 위해, 기재의 접착제층을 형성하는 쪽의 표면에 대해서 미리 화염 처리, 오존 처리, 코로나 방전 처리, 또는 앵커 코트와 같은 처리를 수행할 수 있다.In order to improve the adhesiveness between the base material and the adhesive layer (film made of the adhesive resin composition of the present invention), flame treatment, ozone treatment, corona discharge treatment, or anchoring in advance with respect to the surface of the base material on which the adhesive layer is formed. Coating-like treatment can be performed.

접착제층(본 발명의 접착성 수지 조성물로 이루어진 피막)의 두께는, 바람직하게는 5μm 이상, 보다 바람직하게는 10μm 이상이다. 상한 값은, 특별히 제한되지 않고, 예를 들면, 40μm 이하이다.The thickness of the adhesive layer (film made of the adhesive resin composition of the present invention) is preferably 5 µm or more, more preferably 10 µm or more. The upper limit in particular is not restrict|limited, For example, it is 40 micrometers or less.

본 발명의 시트는, 실란트 필름으로서 적합하게 사용할 수 있다. 본 발명의 시트는, 용기의 뚜껑재 및 제대품(製袋品) 등에 적합하게 사용할 수 있다. 제대품에서는, 접착제층(본 발명의 접착성 수지 조성물로 이루어진 피막)을 내면에 배치함으로써 봉투의 입구를 실링할 수 있다. The sheet of the present invention can be suitably used as a sealant film. The sheet of the present invention can be suitably used for a lid material for a container, a finished product, and the like. In a finished product, the entrance of the bag can be sealed by disposing an adhesive layer (film made of the adhesive resin composition of the present invention) on the inner surface.

<뚜껑재><Lid material>

기재 상에 접착성 수지 조성물로 이루어진 도막이 적층된 본 발명의 시트는, 밀봉 대상인 용기 본체의 개구 형상에 맞게 재단되어 뚜껑재로서 적합하게 사용된다.The sheet of the present invention in which a coating film made of an adhesive resin composition is laminated on a substrate is cut to fit the shape of the opening of the container body to be sealed, and is suitably used as a lid material.

본 발명의 시트를 뚜껑재로서 이용하는 경우, 기재로서는 다양한 기재를 사용할 수 있다. 기재로서는, 예를 들면, 종이, 알루미늄, 폴리에스테르, 폴리에틸렌, 폴리프로필렌, 폴리스티렌, 알루미늄 증착 폴리에스테르, 알루미늄 증착 폴리프로필렌, 및 실리카 증착 폴리에스테르 등을 들 수 있다. 기재는, 단층 구조라도, 이층 이상의 적층 구조라도 좋다. When the sheet of the present invention is used as a lid material, various substrates can be used as the substrate. As a base material, paper, aluminum, polyester, polyethylene, polypropylene, polystyrene, aluminum vapor deposition polyester, aluminum vapor deposition polypropylene, silica vapor deposition polyester, etc. are mentioned, for example. The substrate may have a single-layer structure or a laminated structure with two or more layers.

본 발명의 시트에 의해 뚜껑재를 형성하는 경우, 바람직한 기재로서는, 예를 들면, 두께 5~20μm의 폴리에틸렌테레프탈레이트(PET)와, 두께 5~30μm의 폴리에틸렌(PE)과의 적층 필름을 들 수 있다.In the case of forming the lid member with the sheet of the present invention, a preferable substrate is, for example, a laminated film of polyethylene terephthalate (PET) having a thickness of 5 to 20 μm and polyethylene (PE) having a thickness of 5 to 30 μm. have.

뚜껑 재료로서는, 상기 적층 필름의 폴리에틸렌 면에, 본 발명의 접착성 수지 조성물로 이루어지는 두께 5~40μm의 피막을 적층한 것이 바람직하다.As a lid material, what laminated|stacked the film of 5-40 micrometers in thickness which consists of the adhesive resin composition of this invention on the polyethylene surface of the said laminated|multilayer film is preferable.

<용기용 부재 세트, 용기><Set of members for containers, containers>

용기 본체와 상기 뚜껑재를 결합시킨 것이 용기용 부재 세트이다. 용기 본체의 개구부가 상기 뚜껑재에 의해 밀봉된 것이 용기이며, 이 용기는 개봉 가능하다.The container body and the lid member are combined to form a container member set. A container is a container in which the opening of the container body is sealed by the lid material, and the container can be opened.

용기 본체는, 특별히 제한되지 않지만, 바람직하게는 플라스틱제의 용기 본체 혹은 내면이 플라스틱으로 덮인 용기 본체이다. 그중에서도, 본 발명의 접착성 수지 조성물은, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대한 용이 개봉성 및 내 보일성이 우수하기 때문에 폴리프로필렌제 또는 폴리스티렌제의 용기 본체, 혹은 내면이 폴리프로필렌 또는 폴리스티렌으로 덮인 용기 본체에 대해서 적합하게 사용된다.The container body is not particularly limited, but is preferably a plastic container body or a container body whose inner surface is covered with plastic. Among them, the adhesive resin composition of the present invention is excellent in easy opening and boiling resistance to a plastic container body made of polypropylene and polystyrene, etc. Alternatively, it is suitably used for a container body covered with polystyrene.

즉, 본 발명의 용기는, 바람직하게는 폴리프로필렌제 또는 폴리스티렌제의 용기 본체, 혹은 내면이 폴리프로필렌 또는 폴리스티렌으로 덮인 용기 본체의 개구부가, 상기 뚜껑재에 의해 밀봉된 것이다.That is, the container of the present invention preferably has a container body made of polypropylene or polystyrene, or an opening in a container body whose inner surface is covered with polypropylene or polystyrene, which is sealed with the lid member.

[실시 예][Example]

이하, 본 발명을 실시 예에 따라서 설명하는데, 본 발명은 이것에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described according to examples, but the present invention is not limited thereto.

[멜트 매스 플로우 레이트(MFR)][Melt Mass Flow Rate (MFR)]

MFR은, JIS K7210에 준거해서 측정했다. 멜트 인덱서 L244(다카라코교가부시키가이샤 제품)의 내경 9.55mm, 길이 162mm의 실린더에 샘플을 충전하고, 190℃에서 용융한 후, 무게 2160g, 직경 9.48mm의 플런저를 사용해서 균등하게 하중을 걸어, 실린더의 중앙부에 설치된 지름 2.1mm의 오리피스에서 단위 시간당으로 압출되는 수지량(g /10 분)으로부터, MFR을 구하였다.MFR was measured based on JISK7210. A sample was filled in a cylinder with an inner diameter of 9.55 mm and a length of 162 mm of the melt indexer L244 (manufactured by Takara Kogyo Co., Ltd.), melted at 190 ° C. , MFR was obtained from the amount of resin extruded per unit time (g/10 min) from an orifice with a diameter of 2.1 mm installed in the center of the cylinder.

[실시 예 1~9 및 비교 예 1~5][Examples 1 to 9 and Comparative Examples 1 to 5]

(접착성 수지 조성물(S-1)~(S-14)의 제조)(Production of adhesive resin compositions (S-1) to (S-14))

표 1 및 표 2에 기재된 배합 조성으로, 에틸렌-초산비닐 공중합체(A), 직쇄상 저밀도 폴리에틸렌(B), 점착 부여 수지(C), 저밀도 폴리에틸렌(D) 및 첨가제를, 헨쉘 믹서로 5분간 프리블랜딩하였다. 얻어진 프리블렌딩물을 호퍼에 투입하여 스크류 피더를 이용해서 하기 압출기에 공급하고, 하기 조건으로 압출, 펠렛 형태의 접착성 수지 조성물(S-1)~(S-14)을 제조하였다.With the formulation composition shown in Tables 1 and 2, ethylene-vinyl acetate copolymer (A), linear low-density polyethylene (B), tackifying resin (C), low-density polyethylene (D) and additives were mixed with a Henschel mixer for 5 minutes Pre-blended. The obtained pre-blended material was put into a hopper and supplied to the following extruder using a screw feeder, and extruded under the following conditions, to prepare an adhesive resin composition (S-1) to (S-14) in the form of pellets.

표 1 및 표 2 중의 배합량의 단위는, 「질량부」이다.The unit of the compounding quantity in Table 1 and Table 2 is "mass part."

<압출기 및 압출 조건><Extruder and extrusion conditions>

압출기: 아이·케이·지사 제품의 동방향 회전 2축 압출기「PMT32-40.5」,Extruder: Co-rotating twin screw extruder “PMT32-40.5” manufactured by I·K·J.

배럴 온도: 160℃(공급구의 온도: 150℃),Barrel temperature: 160°C (Temperature at the inlet: 150°C);

스크류 회전 속도: 200rpm,Screw rotation speed: 200rpm;

공급 속도: 10kg/hr.Feed rate: 10 kg/hr.

(적층 시트의 제조)(Production of laminated sheet)

기재로서, 폴리에틸렌테레프탈레이트(PET, 12μm두께)/폴리에틸렌(PE, 25μm 두께)의 적층 필름을 준비하였다. 각 예에서 얻어진 접착성 수지 조성물을, 상기 기재의 PE면에 대해서, 하기 가공 조건에서, 압출하여 라미네이트해서 적층 시트를 얻었다. 접착제층의 두께가 20μm가 되도록 성막을 행하였다.As a substrate, a laminated film of polyethylene terephthalate (PET, 12 µm thick)/polyethylene (PE, 25 µm thick) was prepared. The adhesive resin composition obtained in each example was extruded and laminated with respect to the PE surface of the said base material under the following processing conditions, and the laminated sheet was obtained. Film formation was performed so that the thickness of an adhesive bond layer might be set to 20 micrometers.

<가공 조건><Processing conditions>

압출 라미네이터: 무사시노키카이사 제품「400M/M 테스트 EXT 라미네이터」, 다이 바로 아래의 수지 온도: 200~250℃(접착성 수지 조성물의 MFR 등에 의해 바람직한 온도로 적절하게 조정함),Extrusion laminator: “400M/M test EXT laminator” manufactured by Musashino Kikai, resin temperature just below the die: 200 to 250°C (adjusted appropriately to the desired temperature by the MFR of the adhesive resin composition, etc.),

가공 속도: 30m/분,Machining speed: 30 m/min;

T다이 폭: 400mm,T die width: 400mm,

냉각 롤의 표면 온도: 20℃.Surface temperature of the cooling roll: 20°C.

(뚜껑재의 제조)(Manufacture of lid material)

얻어진 적층 시트를 90mm×90mm의 크기로 재단해서 뚜껑재를 얻었다. The obtained lamination sheet was cut into the size of 90 mm x 90 mm, and the lid|cover material was obtained.

[평가 항목과 평가 방법][Evaluation items and evaluation method]

얻어진 접착성 수지 조성물 및 적층 시트(뚜껑재)에 관해서, 다음과 같은 평가를 행하였다. 결과를 표 1 및 표 2에 나타낸다.The following evaluation was performed about the obtained adhesive resin composition and lamination|stacking sheet (lid material). A result is shown in Table 1 and Table 2.

[성막성][film-forming properties]

상기(적층 시트의 제조)에 있어서, 수지 온도를 200~260℃의 범위 내에 있는 온도로 조정한 경우에 있어서의 도공 여부를 확인했다. 또한, 막후계(膜厚計)를 이용해서 무작위로 선택한 10개소의 피막 두께를 측정했다. 접착성 수지 조성물의 성막을 하기 기준에서 평가했다.In the above (manufacture of a laminated sheet), when the resin temperature was adjusted to a temperature within the range of 200 to 260°C, it was confirmed whether or not the resin was coated. Moreover, the film thickness of 10 places randomly selected using the film thickness meter was measured. The following criteria evaluated the film-forming of the adhesive resin composition.

<평가 기준><Evaluation criteria>

A: 도공 가능, 또 10개소의 피막 두께가 20±5μm의 범위 내: 양호,A: Coating is possible, and the film thickness of 10 places is within the range of 20±5 μm: good,

C: 막 균열 또는 막 조각이 발생되어서 도공 불가, 또는 도공 가능하지만 10개소의 피막 두께가 20±5μm의 범위 외: 불량.C: Coating is impossible or coating is possible due to the occurrence of film cracks or film fragments, but the film thickness at 10 locations is outside the range of 20±5 µm: Poor.

[용이 개봉성][Easy to open]

용기 본체로서, 개구부를 갖는 폴리프로필렌제의 용기 본체(개구지름: 71mmφ) 및 개구부를 갖는 폴리스티렌제의 용기 본체(개구지름: 71mmφ)의 2종류를 준비했다.As the container body, two types were prepared: a container body made of polypropylene having an opening (opening diameter: 71 mmφ) and a container body made of polystyrene having an opening (opening diameter: 71 mmφ).

상기 2종류의 용기 본체의 개구부에 대해서 각각 뚜껑재의 피막면을 밀착시켜 게이지압 0.3MPa, 160℃, 1초간의 조건에서 열 접착을 행하여, 밀폐 용기를 제조하였다.With respect to the openings of the two types of container bodies, the coating surfaces of the lid members were each closely adhered to each other, and thermal bonding was performed under the conditions of a gauge pressure of 0.3 MPa, 160°C, and 1 second to prepare an airtight container.

얻어진 2종류의 밀폐 용기를, 온도 23℃ 상대 습도 65%의 항온 항습실 내에 24시간 방치하였다. 이 항온 항습실 내에서 각 밀봉 용기에 관해서 오토그래프(시마즈 제작소사 제품 「AGS-X」)를 이용하여, 박리 속도 200mm/분, 박리 각도 90°, 시료 폭 15mm의 조건으로, 뚜껑재의 박리 강도의 측정을 실시했다. 박리 강도의 최대 값을 개봉 강도로 하여, 용이 개봉성을 하기 기준으로 평가했다.The obtained two types of airtight containers were left to stand for 24 hours in a constant temperature and humidity chamber with a temperature of 23 degreeC and 65% of relative humidity. For each sealed container in this constant temperature and humidity chamber, using an autograph ("AGS-X" manufactured by Shimadzu Corporation), under the conditions of a peeling rate of 200 mm/min, a peeling angle of 90°, and a sample width of 15 mm, the peel strength of the lid Measurements were made. The maximum value of peeling strength was made into opening strength, and the following reference|standard evaluated easy opening property.

<평가 기준><Evaluation criteria>

A: 박리 강도의 최대 값이 10N 이상 15N 미만: 양호,A: The maximum value of peeling strength is 10N or more and less than 15N: good,

B: 박리 강도의 최대 값이 5N 이상 10N 미만: 사용 가능,B: The maximum value of peel strength is 5N or more and less than 10N: can be used;

C: 박리 강도의 최대 값이 5N 미만: 불량.C: The maximum value of peeling strength is less than 5N: Poor.

[내(耐)보일성][Invisibility]

용기 본체로서, 개구부를 갖는 폴리프로필렌제의 용기 본체(개구지름: 71mmφ) 및 개구부를 갖는 폴리스티렌제의 용기 본체(개구지름: 71mmφ)의 2종류를 준비했다. 각 용기 본체 내에 40℃의 물을 충전했다.As the container body, two types were prepared: a container body made of polypropylene having an opening (opening diameter: 71 mmφ) and a container body made of polystyrene having an opening (opening diameter: 71 mmφ). 40 degreeC water was filled in each container body.

상기 2종류의 용기 본체의 개구부에 대해 각각 뚜껑재의 피막면을 밀착시켜, 게이지압 0.3MPa, 180℃, 1초간의 조건에서, 열 접착을 행하고, 밀폐 용기를 제조하였다.With respect to the openings of the two types of container bodies, the coating surfaces of the lid members were respectively brought into close contact, and thermal bonding was performed under the conditions of a gauge pressure of 0.3 MPa and 180° C. for 1 second to manufacture an airtight container.

얻어진 2종류의 밀폐 용기를 90℃의 열탕수 중에 침지시켜서 30분 후에 뚜껑재의 분리 유무를 육안으로 관찰하고, 하기 기준으로 평가했다.The obtained two types of airtight containers were immersed in 90 degreeC boiling water, and the presence or absence of the separation|separation of a lid material was visually observed after 30 minutes, and the following reference|standard evaluated.

<평가 기준><Evaluation criteria>

A: 뚜껑재의 분리가 없음(내 보일성 있음): 양호,A: No separation of the lid material (with boiling resistance): Good,

C: 뚜껑재의 분리가 있음(내 보일성 없음): 불량.C: There is separation of the lid material (no boiling resistance): Poor.

[표 1][Table 1]

Figure pat00001
Figure pat00001

[표 2][Table 2]

Figure pat00002
Figure pat00002

표 1 및 표 2의 약호를 아래에 나타낸다.The abbreviation of Table 1 and Table 2 is shown below.

VA cont.: 초산비닐 함유율,VA cont.: Vinyl acetate content,

A1: 에틸렌-초산비닐 공중합체(초산비닐 함유율 12%), 밀도 0.931g/㎤, DSC 융점 95℃, MFR 0.8g/10분,A1: ethylene-vinyl acetate copolymer (vinyl acetate content 12%), density 0.931 g/cm 3 , DSC melting point 95° C., MFR 0.8 g/10 min,

A2: 에틸렌-초산비닐 공중합체(초산비닐 함유율 6%), 밀도 0.925g/㎤, DSC 융점 98℃, MFR 8.5g/10분.A2: Ethylene-vinyl acetate copolymer (vinyl acetate content 6%), density 0.925 g/cm 3 , DSC melting point 98° C., MFR 8.5 g/10 min.

B1: 직쇄상 저밀도 폴리에틸렌, 밀도 0.922g/㎤, DSC 융점 106℃, MFR 15.0g/10분B1: linear low-density polyethylene, density 0.922 g/cm 3 , DSC melting point 106° C., MFR 15.0 g/10 min

B2: 직쇄상 저밀도 폴리에틸렌, 밀도 0.936g/㎤, DSC 융점 124℃, MFR 2.0g/10분.B2: Linear low-density polyethylene, density 0.936g/cm<3>, DSC melting|fusing point 124 degreeC, MFR 2.0g/10min.

C1: 부분 수첨 지환족 탄화수소 수지, 연화점 110℃, DSC 융점 71℃,C1: partially hydrogenated alicyclic hydrocarbon resin, softening point 110 ℃, DSC melting point 71 ℃,

C2: 부분 수첨 지환족 탄화수소 수지, 연화점 105℃, DSC 융점 63℃,C2: partially hydrogenated alicyclic hydrocarbon resin, softening point 105 ℃, DSC melting point 63 ℃,

C3: 부분 수첨 지환족 탄화수소 수지, 연화점 136℃, DSC 융점 92℃,C3: partially hydrogenated alicyclic hydrocarbon resin, softening point 136 ℃, DSC melting point 92 ℃,

C4: 부분 수첨 지환족 탄화수소 수지, 연화점 115℃, DSC 융점 69℃,C4: partially hydrogenated alicyclic hydrocarbon resin, softening point 115 ℃, DSC melting point 69 ℃,

C5: 완전 수첨 지환족 탄화수소 수지, 연화점 125℃, DSC 융점 77℃.C5: Fully hydrogenated alicyclic hydrocarbon resin, softening point 125°C, DSC melting point 77°C.

D1: 직쇄상 저밀도 폴리에틸렌, 밀도 0.915g/㎤, DSC 융점 98℃, MFR 145g/10분.D1: Linear low-density polyethylene, density 0.915 g/cm<3>, DSC melting|fusing point 98 degreeC, MFR 145g/10min.

슬립제 :에루크산 아미드, DSC 융점 80℃,Slip agent: erucic acid amide, DSC melting point 80℃,

산화 방지제: 힌더드 페놀계 산화 방지제,Antioxidants: hindered phenolic antioxidants;

블로킹 방지제: 비정질 알루미노 규산염.Anti-blocking agent: amorphous aluminosilicate.

표 1 및 표 2에 나타내는 바와 같이, 에틸렌-초산비닐 공중합체(A) 45~70질량%, 직쇄상 저밀도 폴리에틸렌(B) 15~45질량%, 및 점착 부여 수지(C) 15~30질량%를 포함하는 본 발명의 접착성 수지 조성물로 이루어지는 접착제층은, 성막성이 우수하며 또 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체에 대해서 용이 개봉성 및 내 보일성이 우수하였다. As shown in Table 1 and Table 2, 45-70 mass % of ethylene-vinyl acetate copolymer (A), 15-45 mass % of linear low-density polyethylene (B), and 15-30 mass % of tackifying resin (C) The adhesive layer made of the adhesive resin composition of the present invention containing

특히, 에틸렌-초산비닐 공중합체(A) 45~70질량%, 직쇄상 저밀도 폴리에틸렌 (B) 20~30질량%, 및 점착 부여 수지(C) 15~30질량%이면, 종합적으로 양호한 결과가 얻어졌다.In particular, if it is 45-70 mass % of ethylene-vinyl acetate copolymer (A), 20-30 mass % of linear low-density polyethylene (B), and 15-30 mass % of tackifying resin (C), overall good results are obtained lost.

따라서, 특정의 수지 (A)~(C)를 특정 비율로 포함하는 본 발명의 접착성 수지 조성물은, 폴리프로필렌 및 폴리스티렌 등의 플라스틱제의 용기 본체의 뚜껑재용으로서 적합하다는 것을 알았다. Accordingly, it was found that the adhesive resin composition of the present invention containing the specific resins (A) to (C) in a specific ratio is suitable as a lid material for a container body made of plastic such as polypropylene and polystyrene.

Claims (10)

초산비닐 함유율이 5~15질량%의 에틸렌-초산비닐 공중합체(A) 40~75질량%, 멜트 매스 플로우 레이트가 1~20g/10분의 직쇄상 저밀도 폴리에틸렌(B) 20~30질량%, 및 점착 부여 수지(C) 15~30질량%를 함유하는, 접착성 수지 조성물.
40 to 75 mass% of an ethylene-vinyl acetate copolymer (A) having a vinyl acetate content of 5 to 15 mass%, 20 to 30 mass% of a linear low-density polyethylene (B) having a melt mass flow rate of 1 to 20 g/10 min; And the adhesive resin composition containing 15-30 mass % of tackifying resin (C).
제1항에 있어서,
멜트 매스 플로우 레이트가 1~20g/10분인 접착성 수지 조성물.
According to claim 1,
An adhesive resin composition having a melt mass flow rate of 1 to 20 g/10 min.
제1항 또는 제2항에 있어서,
에틸렌-초산비닐 공중합체(A)의 시차 주사형 열량계에 의해 측정되는 융점이 80~120℃인 접착성 수지 조성물.
3. The method of claim 1 or 2,
An adhesive resin composition having an ethylene-vinyl acetate copolymer (A) having a melting point of 80 to 120°C as measured by a differential scanning calorimeter.
제1항 또는 제2항에 있어서,
직쇄상 저밀도 폴리에틸렌(B)의 시차 주사형 열량계에 의해 측정되는 융점이 90~150℃인 접착성 수지 조성물.
3. The method of claim 1 or 2,
An adhesive resin composition having a linear low-density polyethylene (B) having a melting point of 90 to 150°C as measured by a differential scanning calorimeter.
제1항 또는 제2항에 있어서,
점착 부여 수지(C)의 시차 주사형 열량계에 의해 측정되는 융점이 55~100℃ 인 접착성 수지 조성물.
3. The method of claim 1 or 2,
The adhesive resin composition whose melting|fusing point is 55-100 degreeC as measured by the differential scanning calorimeter of tackifying resin (C).
제1항 또는 제2항에 있어서,
점착 부여 수지(C)가, 지환족 탄화수소 수지 및 테르펜 수지로 이루어진 군에서 선택되는 적어도 1종을 포함하는, 접착성 수지 조성물.
3. The method of claim 1 or 2,
The adhesive resin composition in which tackifying resin (C) contains at least 1 sort(s) selected from the group which consists of an alicyclic hydrocarbon resin and a terpene resin.
기재 위에, 제1항 또는 제2항에 기재된 접착성 수지 조성물로 이루어진 도막을 구비한 시트.
A sheet provided with a coating film made of the adhesive resin composition according to claim 1 or 2 on a substrate.
제7항에 기재된 시트로 이루어진 뚜껑재(蓋材).
A lid material comprising the sheet according to claim 7.
개구부를 갖는 용기 본체와, 제8항에 기재된 뚜껑재로 이루어지는, 개봉 가능한 용기용 부재 세트.
An openable container member set comprising a container body having an opening and the lid member according to claim 8.
용기 본체의 개구부가, 제8항에 기재된 뚜껑재에 의해 밀봉된, 개봉 가능한 용기.An openable container in which the opening of the container body is sealed with the lid material according to claim 8.
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