KR20210116250A - Mask attaching device, film forming apparatus, mask attaching method, film forming method, manufacturing method of electronic device, mask, substrate carrier, and set of substrate carrier and mask - Google Patents

Abstract

Provided is a technology to improve accuracy of film formation when mounting a mask on a returned substrate held and supported on a substrate carrier. When only a pair of peripheral sections of the substrate carrier (9), corresponding to a pair of opposite sides placed along a prescribed direction among a plurality of sides constituting a peripheral part of the substrate (5), is supported by only a carrier supporting element (8), a deflection amount (dc) of the substrate carrier (9) is larger than a deflection amount (dm) of the mask (6) when only a pair of peripheral sections of the mask (6), corresponding to a pair of opposite sides placed along a prescribed direction among the plurality of sides constituting the peripheral part of the mask (6), is supported by only a mask supporting element (16). The mask attaching apparatus comprises a substrate carrier supporting element, a mask supporting element, and a transporting element.

Description

Mask attaching apparatus, film forming apparatus, mask attaching method, film forming method, electronic device manufacturing method, mask, substrate carrier, and set of substrate carrier and mask {MASK ATTACHING DEVICE, FILM FORMING APPARATUS, MASK ATTACHING METHOD, FILM FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, MASK, SUBSTRATE CARRIER, AND SET OF SUBSTRATE CARRIER AND MASK}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask attaching apparatus, a film forming apparatus, a mask attaching method, a film forming method, a manufacturing method of an electronic device, a mask, a substrate carrier, and a set of a substrate carrier and a mask.

As a method of manufacturing an organic EL display, a mask film forming method is known in which a film of a predetermined pattern is formed by forming a film on a substrate through a mask having openings formed therein in a predetermined pattern. In the mask film forming method, after aligning the mask and the substrate, the mask and the substrate are brought into close contact to form a film.

Patent Document 1 describes that a substrate is held by a chuck plate (also referred to as a "substrate carrier"), and the substrate is conveyed with the chuck plate. And, in Patent Document 1, it is described that the substrate in a state chucked by the chuck plate is loaded into the alignment chamber, aligned with the mask in the alignment chamber, and the mask and the substrate are bonded together.

Patent Document 1: Korean Patent Publication No. 10-2018-0067031

In recent years, in order to enlarge the area of an organic electroluminescent display, or to improve production efficiency, it is calculated|required to perform film-forming using the board|substrate of a large size. Generally, at the time of manufacture of organic electroluminescent display, thin plates, such as glass and resin, are used as a board|substrate in many cases, and when the size of a board|substrate becomes large, the sag when a board|substrate is hold|maintained horizontally becomes large.

In the mask film-forming method, film-forming is performed using the mask of substantially the same size as a board|substrate. For this reason, when film-forming on a large-area board|substrate, a large-area mask is used, and not only a board|substrate but also a mask becomes easy to sag. In Patent Document 1, the sagging of the substrate is eliminated by chucking the substrate to the chuck plate. In this state, if the substrate is brought close to the mask and an attempt is made to adhere the mask to the substrate, uniform adhesion of the entire bonding surface becomes difficult, and an unacceptably large gap may be created in the gap formed between the substrate and the mask foil. . After bringing the substrate close to the mask, it is also possible to draw the mask foil to the substrate side by bringing the magnet close to the back surface of the substrate (the surface opposite to the mask side of the substrate). However, if the gap between the substrate and the mask foil When it is too large, mask foil may be pulled by magnetic force, and it may not be able to adhere to a board|substrate.

As described above, when a mask is mounted on a substrate held by a substrate carrier conventionally, a large gap is formed between the substrate and the mask foil, the adhesion between the substrate and the mask becomes insufficient, and there is a problem that the film formation accuracy is lowered.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a technique capable of improving the film-forming precision when mounting a mask on a substrate held and conveyed by a substrate carrier.

In order to solve the above problems, the mask attaching device of the present invention,

substrate carrier support means for supporting a substrate carrier holding the substrate;

a mask support means for supporting the mask;

moving means for moving at least one of the substrate carrier support means and the mask support means to switch between a state in which the substrate carrier is spaced apart from the mask and an attachment state in which the substrate carrier rests on the mask. A mask attachment device comprising:

The substrate carrier support means,

a first substrate carrier support portion supporting a periphery of a first side along a first direction of the substrate carrier;

a second substrate carrier support portion supporting a periphery of a second side of the substrate carrier along the first direction;

The mask support means,

a first mask support part supporting a periphery of a first mask side of the mask in the first direction;

a second mask support portion supporting a periphery of a second mask side of the mask along the first direction;

In the spaced state, the first substrate carrier support and the second substrate carrier support support the substrate carrier so that the amount of deflection dc of the substrate carrier is a first amount of deflection,

In the separation state, the first mask support part and the second mask support part support the mask so that a second amount of deflection (dm) of the mask is smaller than the first amount of deflection.

ADVANTAGE OF THE INVENTION According to this invention, when aligning a board|substrate carrier and a mask in a vapor deposition apparatus, it is possible to provide a technique for accurately positioning a board|substrate with a mask, and for reducing film-forming nonuniformity by making the clearance gap between a board|substrate and a mask closely_contact|adhere.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows the structure of the vapor deposition apparatus of embodiment.
It is a perspective view from the lower part of the mask holding part and a board|substrate of embodiment.
It is a block diagram of the board|substrate and a board|substrate carrier of embodiment.
Fig. 4 is an enlarged view of a substrate and carrier holder of the embodiment.
5 is a perspective view of the configuration of the vapor deposition apparatus according to the embodiment.
It is a figure of the state which is roller conveying a board|substrate and a carrier.
7 is a view of a state in which a gap is formed between the substrate and the substrate carrier.
It is a figure which shows the state of the contact surface in a seating block and a carrier receiving finger at the time of making a carrier contact via a seating block.
It is a perspective view which shows an example of a rotation translation mechanism.
10 is a plan view showing a holding state of a substrate and a mask, and an enlarged view of a mark.
11 is a flowchart showing each step of the processing in the embodiment.
It is a schematic block diagram of the in-line manufacturing system of the organic electroluminescent panel of embodiment.
13 is an explanatory diagram of an organic EL display device.

[Embodiment 1]

EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, the form for implementing this invention is demonstrated in detail by illustration based on an Example. However, the dimensions, materials, shapes, relative arrangements, and the like of components described in this embodiment are not intended to limit the scope of the present invention to only these, unless otherwise specifically stated.

1 to 11 , a mask attaching apparatus, a film forming apparatus, a mask attaching method, a film forming method, and a manufacturing method of an electronic device according to an embodiment of the present invention will be described. In the following description, the mask mounting apparatus etc. which are provided in the apparatus for manufacturing an electronic device are taken as an example and demonstrated. In addition, the case where the vacuum vapor deposition method is employ|adopted as an example as a film-forming method for manufacturing an electronic device is demonstrated. However, this invention is applicable also when employ|adopting a sputtering method as a film-forming method. In addition, the mask mounting apparatus and the like of the present invention can be applied not only to the apparatus used in the film forming process, but also to various apparatuses requiring a mask to be mounted on the substrate, and in particular, can be preferably applied to an apparatus in which a large substrate is to be processed. have. In addition, as a material of the board|substrate applied to this invention, other than glass, arbitrary materials, such as a semiconductor (for example, silicon|silicone), a polymeric film, a metal, can be selected. Moreover, as a board|substrate, the board|substrate in which films, such as polyimide, were laminated|stacked on a silicon wafer or a glass substrate, for example can also be employ|adopted. On the other hand, in the case of forming a plurality of layers on a substrate, it is also referred to as a "substrate" including the layers already formed up to the previous step. In addition, in the case of having a plurality of the same or corresponding members in the same drawing, such as various devices described below, subscripts such as a and b are sometimes indicated in the drawing, but when there is no need to distinguish them in the description, In some cases, subscripts such as a and b are omitted.

(device configuration)

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing for showing the whole structure in the alignment mechanism part of the in-line vapor deposition apparatus of this embodiment. Fig. 1(a) is a diagram for explaining the arrangement, configuration, and relationship of each portion of the alignment mechanism of the vapor deposition apparatus. Fig. 1(b) is an enlarged view of the carrier mechanism part for holding and conveying the glass substrate and the mounting state of the mask. Fig. 2 is a perspective view of the mask holding unit and the substrate in the vapor deposition apparatus of the present embodiment as viewed obliquely from below.

The vapor deposition apparatus schematically includes a chamber 4 and an alignment apparatus 1 that holds a mask 6 and a substrate 5 held by a substrate carrier portion 9 as a mask attaching apparatus and performs relative alignment. ) is provided. The chamber 4 accommodates a vapor deposition material (film-forming material) inside the chamber 4 while being able to adjust a real pressure by the real pressure control part (not shown) provided with a vacuum pump or a real pressure gauge. One evaporation source 7 (film-forming source) can be arranged, whereby the depressurized film-forming space 2 is formed inside the chamber. In the film-forming space 2, the vapor deposition material flies from the evaporation source 7 toward the board|substrate 5, and a film|membrane is formed on the board|substrate. On the other hand, in this embodiment, as shown in FIG. 2, the mask 6 has the structure in which the mask foil 6b with a thickness of about several micrometers - several tens of micrometers was welded and fixed to the mask frame 6a of a frame shape. The mask frame 6a supports the mask foil 6b in the pulled state in the surface direction (X direction and Y direction mentioned later) so that the mask foil 6b may not sag. In the mask foil 6b, an opening according to a desired film formation pattern is formed. When using a glass substrate or a substrate in which a resin film such as polyimide is formed on the glass substrate as the substrate 5, an iron alloy can be used as the main material for the mask frame 6a and the mask foil 6b, , it is preferable to use an iron alloy containing nickel. Specific examples of the iron alloy containing nickel include an invar material containing 34 mass % or more and 38 mass % or less of nickel, and a super invar material containing 30 mass % or more and 34 mass % or less of nickel and further containing cobalt. invar) material, and a low thermal expansion Fe-Ni-based plating alloy containing nickel in an amount of 38 mass% or more and 54 mass% or less.

In the illustrated example, the configuration of deposition up in which a film is formed in a state in which the film formation surface of the substrate faces downward in the direction of gravity during film formation will be described. However, it may be a configuration of deposition down in which the film is formed in a state in which the film formation surface of the substrate faces upward in the gravitational direction during film formation. Further, a configuration of side deposition may be employed in which the substrate is erected vertically and the film formation is performed in a state in which the film formation surface is substantially parallel to the direction of gravity. That is, according to the present invention, when the substrate held by the carrier and the mask are relatively brought close to each other, it is possible to accurately position the substrate carrier and the mask in a state in which drooping or sagging occurs in at least one member of the substrate. When required, it can be preferably used.

The chamber 4 has an upper partition 4a (top plate), a side wall 4b, and a bottom wall 4c. The inside of the chamber may be maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas in addition to the above-described reduced pressure atmosphere. On the other hand, "vacuum" in the present specification refers to a state in a space filled with a gas having a pressure lower than atmospheric pressure, and typically refers to a state in a space filled with a gas having a pressure lower than 1 atm (1013 hPa).

The evaporation source 7 may be provided with heating means, such as a material accommodating part, such as a crucible which accommodates a vapor deposition material, and a sheath heater, which heats a vapor deposition material, for example. Further, by providing a mechanism for moving the material accommodating portion or the entire evaporation source 7 in a plane substantially parallel to the substrate carrier portion 9 and the mask 6, the position of the ejection orifice for ejecting the vapor deposition material is determined. By displacing it relative to the substrate in the chamber 4, the film formation on the substrate may be uniform.

The alignment apparatus 1 is mounted schematically on the upper partition 4a of the chamber 4 and drives the substrate carrier 9, and the substrate 5 held by the substrate carrier 9 and the mask 6 are separated. A positioning mechanism 60 (a positioning means) for relatively positioning the position is included. The alignment apparatus 1 has a carrier support part 8 (substrate carrier support means) that holds a substrate carrier 9 , and a mask pedestal 16 (mask support means) that holds the mask 6 . .

The alignment mechanism 60 is provided outside the chamber 4 , and moves at least one of the substrate carrier support portion and the mask support portion to change the relative positional relationship between the substrate carrier 9 and the mask 6 . In this embodiment, the positioning mechanism 60 moves the carrier support 8 which is a substrate carrier support. The positioning mechanism 60 schematically includes a rotational translation mechanism 11 (in-plane moving means), a Z elevation base 13 , and a Z elevation slider 10 .

The rotational translation mechanism 11 is connected to the upper partition wall 4a of the chamber 4, and drives the Z lifting base 13 in the X direction, the Y direction, and the θ direction (these are collectively referred to as the XYθ direction). . The Z lifting base 13 is connected to the rotational translation mechanism 11 and serves as a base when the substrate carrier 9 moves in the Z direction. The Z raising/lowering slider 10 is a member movable in the Z direction along the Z guide 18 . The Z raising/lowering slider 10 is connected to the substrate carrier support 8 via the substrate holding shaft 12 .

In this configuration, at the time of XYθ driving (driving in the XYθ direction) in a plane substantially parallel to the substrate carrier 9 and the mask 6 by the rotational translation mechanism 11, the Z elevation base 13; The Z-elevating slider 10 and the substrate holding shaft 12 move integrally, and transmit a driving force to the carrier support 8 . Then, the substrate 5 held by the substrate carrier 9 is moved within a plane substantially parallel to the substrate 5 and the mask 6 . On the other hand, although the mask 6 and the board|substrate 5 are sagged by gravity as mentioned later, the board|substrate in an ideal state which does not sag with the plane substantially parallel to the board|substrate 5 and the mask 6 here. (5) and a plane approximately parallel to the mask 6 are indicated. For example, in a configuration in which the substrate 5 and the mask 6 are horizontally arranged, such as upward vapor deposition or downward vapor deposition, the rotational translation mechanism 11 moves the substrate 5 in a horizontal plane. Further, when the Z-elevating slider 10 is driven in the Z-direction with respect to the Z-elevating base 13 by the Z guide 18, the driving force is applied to the substrate holding shaft 12 (in this embodiment, four substrates are held). It has support shafts 12a, 12b, 12c, 12d On the other hand, in Fig. 2, the shaft 12d is hidden by the substrate 5 and the mask 6 and is connected to the carrier support 8 through the substrate 5 and the mask 6 (not shown). is transmitted Then, the distance of the substrate 5 with respect to the mask 6 is changed (separated or approached). That is, the Z elevation base 13, the Z elevation base 13 and the Z guide 18 function as distance changing means of the positioning means.

As in the illustrated example, by arranging the alignment mechanism 60 including a large number of movable parts outside the film forming space, it is possible to suppress the generation of dust in the film forming space or in the space where alignment is performed. Thereby, it can suppress that a mask or a board|substrate is contaminated by dust generation|occurrence|production and the film-forming precision falls. In addition, in this embodiment, although the structure in which the alignment mechanism 60 moves the board|substrate 5 in the XYθ direction and the Z direction has been described, it is not limited to this, and the alignment mechanism 60 moves the mask 6 It may be moved, and both the board|substrate 5 and the mask 6 may be moved. That is, the alignment mechanism 60 is a mechanism for moving at least one of the substrate 5 and the mask 6 , and thereby the relative positions of the substrate 5 and the mask 6 can be aligned.

FIG. 1B is an enlarged view of the substrate carrier 9 and the mask frame 6a. In addition, FIG. 3 has shown the figure which looked at the board|substrate carrier 9 and the board|substrate 5 from the back side, and demonstrates the carrier structure using these.

The substrate carrier 9 includes a carrier face plate 30 (a face plate member), a seating block 31 (a seating member), and a chuck member 32 .

The carrier face plate 30 is a plate-like member made of metal or the like, and is a member constituting a holding surface for holding the substrate 5 . The carrier face plate 30 has a certain degree of rigidity (at least higher than that of the substrate 5 ), and by holding the substrate 5 along the holding surface, sagging of the substrate 5 can be suppressed.

A plurality of seating blocks 31 are disposed outside the substrate holding area of the holding surface of the carrier face plate 30 so as to protrude from the holding surface. The seating block 31 is provided so that the board|substrate 5 may protrude toward the mask 6 side rather than the board|substrate 5 in the state hold|maintained by the board|substrate carrier 9. As shown in FIG. The substrate carrier 9 is seated on the outer peripheral frame of the mask frame 6a through the seating block 31 through an alignment operation.

The chuck member 32 is a member for holding the substrate 5 along the holding surface constituted by the carrier face plate 30 . In the present embodiment, a plurality of chuck members 32 are arranged inside a plurality of holes provided in the carrier face plate 30 as shown in FIG. 3 . An adhesive member is disposed on a portion of the chuck member 32 facing the substrate 5 , and the substrate 5 can be held by the adhesive force. The chuck member 32 may be referred to as an adhesive pad. On the other hand, it is preferable to arrange|position according to the shape of the mask 6, and, as for the chuck member 32, it is more preferable to be arrange|positioned corresponding to the grate part of the mask 6. Thereby, the influence on the temperature distribution of the film-forming area of the board|substrate 5 by the chuck member 32 coming into contact with the board|substrate 5 can be suppressed. On the other hand, in the present embodiment, a member for holding the substrate 5 by adhesive force is used as the chuck member 32 , but the present invention is not limited thereto. It is also possible to use a member (electrostatic chuck) for holding the .

The substrate carrier 9 further has a magnetic attraction means (not shown) for magnetically attracting the mask 6 through the held substrate 5 . As the magnetic attraction means, a permanent magnet, an electromagnet, or a magnet plate provided with an electromagnet can be used. In addition, the magnetic adsorption means may be provided so as to be movable relative to the carrier face plate 30 . More specifically, the magnetic adsorption means may be provided so that the distance between it and the carrier face plate 30 can be changed.

Fig. 4 is an enlarged view of the mask and carrier holder, which is used to explain the details. On the other hand, each cross-sectional view of FIGS. 1, 4, 6, 7 is a surface perpendicular|vertical to the conveyance direction of the conveyance roller 15 which is a conveying means, and passes the part which comprises one side of the frame-shaped mask frame 6a. It is a cross-sectional view in

The substrate carrier 9 holding the substrate 5 and the mask 6 are respectively conveyed along a separate conveyance path by the conveyance roller 15, and the chamber (evaporation apparatus) in which the alignment apparatus 1 was arrange|positioned. ) at different timings. Specifically, the substrate carrier 9 is first carried in into the chamber, is transmitted from the conveyance roller 15 to the carrier support part 8, and is set to be retracted above the conveyance path. Thereafter, the mask 6 is carried into the chamber and transferred from the conveying roller 15 to the mask pedestal 16 . Thereby, in the arrangement|positioning which the substrate carrier 9 and the mask 6 overlap in an up-down direction, it will be in the state supported separately, respectively. And it is possible to position the board|substrate carrier 9 with respect to the mask 6 by lowering|falling the carrier support part 8 adjusting the position of front-back, right and left.

The carrier support 8 has a carrier receiving finger 42 . The carrier receiving fingers 42 are disposed on both sides of the transport path of the substrate carrier 9 (carrier receiving fingers 42a and 42b). A pair of substrate carriers 9 on the carrier receiving surface 41 (the carrier receiving surface 41a as the first support, the carrier receiving surface 4lb as the second support) which is the upper surface of each carrier receiving finger 42 The substrate carrier 9 is supported by the peripheral region being placed.

The mask frame 6a is supported by the mask pedestal 16 via the mask receiving surface 33 . The mask receiving surface 33 is arrange|positioned on both sides of the conveyance path|route of the mask 6 (the mask receiving surface 33a as a 3rd support part, the mask receiving surface 33b as a 4th support part). As shown in FIG. 5 , the mask pedestal 16 is raised and lowered while being guided by the elevator guide 34 mounted on the mask base 19 . The lifting and lowering of the mask pedestal 16 is performed by a mask pedestal raising/lowering mechanism (not shown) disposed inside or outside the hoisting table guide 34 . Moreover, the conveyance roller 15 is arrange|positioned at the lower part of the long side of the mask 6, and the mask 6 is transmitted to the conveyance roller 15 when the mask pedestal 16 descend|falls.

Thus, in this embodiment, the square-shaped board|substrate carrier 9 and the square-shaped mask 6 convey the conveyance roller 15 by the carrier support part 8 and the mask support part (mask stand 16). They are supported along each direction. That is, in the substrate carrier 9, one set of sides (long side in this case) of the two sets of opposite sides is arranged substantially parallel to the conveying direction of the conveying roller 15, and the one set of sides (long side in this case) The periphery of the corresponding substrate carrier 9 is supported by a carrier support 8 disposed to face it. In addition, as for the mask 6, one set of sides (long side here) is arrange|positioned substantially parallel to the conveyance direction of the conveyance roller 15 among two sets of opposing sides, and respond|corresponds to the one set of sides (here long side). The mask support part arrange|positioned opposing this is supporting the periphery of the mask 6 to do. In addition, although the structure which supports the long side of the substrate carrier 9 and the mask 6 was demonstrated here, it is not limited to this, You may support the short side side. Moreover, even when the substrate carrier 9 and the mask 6 are square, it is good if it is a structure which supports the periphery of the edge of one set of two sets of sides. In addition, the conveyance direction here points out the direction in which the conveyance roller 15 conveys the mask 6 with which the mask 6 single-piece|unit or the board|substrate carrier 9 was mounted.

6 is a state in which the substrate carrier 9 is mounted on the mask frame 6a after completion of alignment, and the mask 6 is transferred to the conveying roller 15 . A plurality of conveying rollers 15 are arranged in the paper inward direction, and the substrate carrier 9 mounted on the mask 6 is conveyed by conveying the mask 6 in the paper inward direction. The mask 6 , the substrate carrier 9 , and the substrate 5 are integrated and conveyed by the conveying roller 15 while passing over the vapor deposition source 7 arranged in the inward direction of the paper, thereby removing the substrate 5 . In areas other than the portion covered by the mask foil 6b, the organic material is formed into a film.

Here, the deflection of the substrate carrier 9 supported by the carrier support 8 and the mask 6 supported by the mask support is examined. As described above, the substrate carrier 9 (holding the substrate 5) supported by the carrier support 8 is a parabola convex in the direction of gravity downward in a cross section perpendicular to the conveying direction of the conveying roller 15. The shape becomes a sagging shape. Moreover, in the cross section perpendicular|vertical to the conveyance direction of the conveyance roller 15, the mask 6 supported by the mask support part also becomes the shape which drooped in the convex parabolic shape downward in the gravity direction. In this specification, as the amounts for quantitatively handling the degree of deflection of the substrate carrier 9 and the degree of deflection of the mask 6, the carrier self-weight deflection amount dc and the mask self-weight deflection amount dm are defined as follows. .

In this specification, the carrier weight deflection amount dc is the height along the plane (the height of the virtual plane) when the substrate carrier 9 is supported along a certain plane (virtual plane) by the carrier support part 8 . ), indicates the difference (absolute value) between the reference height and the height of the part drooping by its own weight. For example, when it is intended to support the substrate carrier 9 horizontally by the carrier support part 8 , based on the height of the carrier receiving surface 41 , the reference height and the largest drooping of the substrate carrier 9 . The height of the lower surface of the substrate carrier 9 of the portion (the portion where the change in height from the height of the virtual plane is greatest) (typically the portion of the substrate carrier 9 corresponding to the middle portion between the oppositely disposed carrier supports 8 ) The difference (absolute value) with the height of the lower surface) becomes the carrier weight deflection amount dc. That is, as shown in Fig. 1B, on the lower surface of the substrate carrier 9 supported by the carrier support 8, the height of the portion in contact with the carrier receiving surface 41 is defined as the height of the imaginary plane. And the difference (absolute value) from the height of this virtual plane to the height of the part with the largest change in height is made into carrier self weight deflection amount dc. In addition, not the lower surface of the board|substrate carrier 9, you may prescribe|regulate the carrier self-weight deflection amount dc on the basis of the upper surface. In this case, you may make it acquire the height of the said virtual plane based on the height of the carrier receiving surface 41, and the thickness (height) of the board|substrate carrier 9. As shown in FIG. That is, paying attention to the portion in contact with the carrier receiving surface 41 of the substrate carrier 9, even if the value obtained by adding the thickness of the substrate carrier 9 to the height of the carrier receiving surface 41 is the height of the imaginary plane do.

In addition, in this specification, the mask self-weight deflection amount dm is the height along the plane (the height of the said virtual plane) when the mask 6 is going to be supported along a certain plane (virtual plane) by the mask support part. As a reference, it indicates the difference (absolute value) between the reference height and the height of the part drooping by its own weight. For example, when the mask 6 is to be supported horizontally by the mask support part, the reference height and the mask ( The height of the upper surface of the mask 6 of the largest drooping portion (the portion having the largest change in height from the height of the virtual plane) of 6) (typically, the mask 6 corresponding to the middle portion between the opposing mask supports) ), the difference (absolute value) with the upper surface height) becomes the mask self-weight deflection amount (dm). That is, as shown in Fig. 1B, on the upper surface of the mask 6 supported by the mask support, the height of the end portion with the smallest change in height is the height of the virtual plane, and the height of the virtual plane is The difference (absolute value) from height to the height of the part with the largest change in height is made into the mask self-weight deflection amount (dm). In addition, you may make it acquire the height of the said virtual plane based on the height of the mask receiving surface 33, and the thickness (height) of the mask 6 . That is, paying attention to the part in contact with the mask receiving surface 33 of the mask 6, the thickness of the mask 6 (for example, the thickness of the mask frame 6a and the mask at the height of the mask receiving surface 33) It is good also considering the value which added the sum of the thickness of the foil 6b) as the said virtual plane. On the other hand, not the upper surface of the mask 6, but on the basis of the lower surface, the mask self-weight deflection amount dm may be prescribed|regulated, and in this case, it is good also considering the height of the mask receiving surface 33 as reference height.

Here, since the substrate carrier 9 is for facilitating transport by suppressing the sag of the substrate 5, it is preferable to increase the rigidity of the substrate carrier 9 so as not to sag as much as possible from the viewpoint of that purpose. . On the other hand, since the mask 6 uses the high rigidity mask frame 6b so that the mask foil 6a does not sag as mentioned above, compared with the board|substrate 5, it is hard to sag. Conventionally, since the length of one side of the board|substrate 5 and the mask 6 was about 1.5 m at most, the sagging of the mask 6 was negligible. However, when the substrate 5 and the mask 6 such that the length of one side greatly exceeds 2 m, such as the 8th generation or the 10th generation, the sagging of the mask 6 cannot be ignored either. In addition, when partially supporting the rectangular mask 6 and the substrate carrier 9 so as to support only a pair of opposing sides instead of all four sides, as in the present embodiment, the sagging of the mask 6 is getting bigger That is, when the substrate carrier 9 is designed as in the conventional idea, the mask 6 is more likely to sag than the substrate carrier 9 .

As a result of intensive studies by the present inventors, it was found that, in such a case, if the rigidity of the substrate carrier 9 was made as high as possible so as not to sag, as in the conventional idea, several problems would arise. Hereinafter, by making the rigidity of the substrate carrier 9 as high as possible, the problem occurring when the carrier self-weight sag dc becomes smaller than the mask self-weight sag dm (that is, when dc < dm) will be described.

In the case of dc < dm, first, when mounting the mask 6 on the substrate 5 by placing the substrate carrier 9 on the mask 6 by contacting the substrate carrier 9 and the mask 6, When the sag of the mask 6 is excessively larger than the sag of the substrate carrier 9 , a large gap is formed between the mask foil 6a and the substrate 5 . A state in which a large gap is formed between the mask 6 and the substrate 5 is shown in FIG. 7 . When a large gap is formed between the mask foil 6a and the substrate 5, the mask 6 is adsorbed from the back side with the substrate 5 and the substrate carrier 9 interposed therebetween by a magnetic attraction means such as a magnet. Even if it is going to make the mask foil 6a closely_contact|adherent to the board|substrate 5, a clearance gap may remain. In this way, a gap ds is created between the substrate 5 held by the substrate carrier 9 and the mask 6, and when it is conveyed and formed into a film in this state, the film-forming material is used during film formation as a mask. It goes back through the gap between the foil 6a and the substrate 5, and is in a state in which a film blurring state occurs. As a result, film-forming nonuniformity arises, and there exists a possibility of causing the quality fall by the brightness|luminance nonuniformity of a display.

If dc < dm, secondly, when the substrate carrier 9 and the mask 6 are brought into contact, the contact starts from the region extending along the long side, which is the portion supported by the respective supports (carrier support, mask support). . Since the long sides of the substrate carrier 9 are all supported by the carrier receiving fingers 42 so that they are at the same height, and the long sides of the mask 6 are all supported by the mask support so that they are all at the same height, the contact starts is generated between the sides (long sides or regions extending along the long sides). When the sides are in contact, if the two sides in contact are of the same shape and in an ideal state such as approaching and contacting while keeping the two sides parallel, the entire sides will come into contact at once. Some of them start contact. And in this case, the contact start position is affected by various disturbances and changes every time, and the contact start position is randomly determined without being determined at one location. As a result, the reproducibility at the time of seating of the substrate carrier 9 and the mask 6 falls. For example, during alignment, the Z-elevating slider 10 is guided by the Z-guide 18 and descends, and the process in which the substrate carrier 9 descends according to the straightness of the Z-guide or the reproducibility of the posture. Since the paths and postures are different, it is difficult to make the contact start position constant. For this reason, since the reaction force that the substrate carrier 9 receives from the mask frame 6a changes when the contact start position is changed, the substrate carrier 9 (or the substrate 5 held by the substrate carrier 9) and the mask 6 ) after the alignment is completed, there is a fear that the shift when the substrate carrier 9 is seated on the mask 6 varies greatly each time. On the other hand, even in the case of dc = dm, as in the case of dc < dm, the behavior at the time of sitting is not stable, so it is not preferable.

Therefore, the present inventors solved the above-mentioned subject by adjusting the sag of the substrate carrier 9 and the sag of the mask 6 without daringly making the rigidity of the substrate carrier 9 too high. In the present embodiment, the rigidity of the substrate carrier 9 and the rigidity of the mask 6 are adjusted so that the carrier self-weight sag dc is larger than the mask self-weight sag dm (that is, dc > dm). By setting dc > dm, as shown in FIG. side will sag greatly. On the other hand, since the substrate 5 is held by the substrate carrier along the holding surface of the substrate carrier 9, the amount of deflection of the substrate 5 can also be regarded as equal to the amount of deflection dc in its own weight.

If the substrate carrier 9 is placed on the mask 6 in this state, the substrate carrier 9 will be placed while deforming so as to conform to the mask 6 with a smaller amount of sagging. It becomes possible to match the deflection of the carrier 9 and the mask 6 . Therefore, the clearance gap between the mask foil 6a and the board|substrate 5 can be made small enough, and it becomes possible to suppress the film|membrane blurring at the time of film-forming.

In addition, when the substrate 5 held by the substrate carrier 9 is brought into contact with the mask 6 by setting dc>dm, the contact starts from the most drooping portion on the short side of the substrate 5 . In the present embodiment, a plurality of seating blocks 31 are arranged outside the area holding the substrate 5 of the substrate carrier 9, and the seating blocks 31 are provided so as to protrude from the substrate 5, have. In addition, in this embodiment, some of the some seating blocks 31 are arrange|positioned at the center of the short side side of the board|substrate carrier 9, ie, the part which sags most. More specifically, in this embodiment, the seating block 31 is arrange|positioned in each center of two short sides of the board|substrate carrier 9, respectively. Therefore, in the present embodiment, when the substrate carrier 9 is brought into contact with the mask 6, the contact can be started from the seating block 31 arranged in the center of the short side side of the substrate carrier 9, It is possible to increase the reproducibility of seating. Moreover, the seating block 31 which comes into contact first can be used as a reference|standard of positioning, and it becomes also possible to improve the reproducibility of the position by seating.

As a method in which the carrier weight deflection amount (dc) and the mask deflection amount (dm) are set to dm < dc, for example, the material of the carrier face plate 30 is aluminum or an aluminum alloy, and the material of the mask frame 6a is iron or an iron alloy. Therefore, it is conceivable to give a difference in rigidity. In addition, if there is a constraint that the material of the carrier face plate 30 and the mask frame 6a should be the same in order to reduce the effect on the process due to the difference in thermal expansion, the secondary moment of the cross section of the mask frame 6a is calculated as the carrier face plate The method of making it larger than the cross-sectional secondary moment of (30) may be sufficient. That is, the method for realizing dm < dc as the relationship between the carrier self-weight deflection amount dc and the mask deflection amount dm is not limited to a specific method, and a known method may be appropriately applied.

In addition, the friction between the seating block 31 and the carrier receiving surface 41 is demonstrated as a characteristic of this embodiment. If dm < dc, the contact starts from the seating block 31 in the center, with the amount of deflection due to the self-weight of the substrate carrier 9 being dc and the amount of deflection under self-weight of the mask frame 6a being dm. In order to seat it stably, the relationship between the force generated in the lateral direction after the start of the contact becomes important. That is, the frictional force generated in the horizontal direction at the portion in which the center seating block 31 and the mask frame 6a come into contact with the substrate carrier 9 and the mask 6 at the starting position (contact starting position). When the relationship between (F1) and the frictional force F2 generated in the horizontal direction at the portion where the carrier receiving surface 41 and the substrate carrier 9 contact is F1 > F2, the seating block 31 in the center In the vicinity, the substrate carrier 9 does not move relative to the mask 6 , but in the vicinity of the carrier receiving surface 41 , the substrate carrier 9 slides relative to the mask 6 . Thereby, since the center seating block 31 which contacts first serves as a reference|standard of the position in a seating process, and since the position is invariant in a seating process, there exists an effect of reducing the nonuniformity of the position shift in a seating process.

In addition, the state at the time of the contact of the substrate carrier 9 and the mask 6 is demonstrated using FIG. 8 : has shown the contact state in the center seating block 31 at the time of making the board|substrate carrier 9 sit on the mask frame 6a via the seating block 31 by the hatched part a. In addition, the contact state of the board|substrate carrier 9 in the carrier receiving surface 41 is shown with the hatched part b. The substrate carrier 9 is placed on the plurality of carrier receiving surfaces 41 in a drooping state. In reality, the central portion of the large substrate carrier 9 is pulled downward in the gravitational direction due to the sagging of its own weight, and on the contrary, the outer periphery of the substrate carrier 9 is bent. That is, the contact state of the carrier receiving surface 41 becomes a line contact state like the hatched part b shown in FIG. On the other hand, since the contact state of the center seating block 31 receives the vertical load of the substrate carrier 9, almost the same contact as the diagonal portion a received on the substantially entire surface of the contact surface (lower surface) of the seating block 31 . is the state

The friction coefficient in the diagonal section a, which is the contact portion, is μ1, and the friction coefficient in the diagonal section b is μ2. Assuming that the load of the substrate carrier 9 is equally applied to each contact portion, when it is considered as a friction force in the lateral direction at the time of seating, the friction coefficient μ1 at the contact portion of the seating block 31 generated in the horizontal direction is By making it larger than the friction coefficient (μ2) of the receiving surface 41, the frictional force F1 generated at the portion where the seating block 31 and the mask frame 6a come into contact, and the carrier receiving surface 41 and the substrate carrier 9 ), the relationship between the frictional force F2 generated in the contact portion is maintained at F1 > F2 from the beginning in the process of the seating operation. Thereby, the positional shift of the substrate carrier 9 with respect to the mask 6 which may arise when the board|substrate carrier 9 is mounted on the mask 6 can be suppressed.

The contact part of the center seating block 31 and the mask frame 6a may be the contact of metal, for example, and the surface texture by which the grinding|polishing process was carried out may be sufficient as it. The contact environment is a vacuum environment, and in general, in a vacuum state, water molecules on the metal surface volatilize, thereby reducing the lubricating effect, and the friction coefficient tends to approach 1.0, and utilizing this phenomenon, the central seating block 31 ) and the friction coefficient μ1 of the contact portion of the mask frame 6 may be maximized.

The contact portion with the substrate carrier 9 on the carrier receiving surface 41 is, for example, an inorganic material, fluorine, DLC, or a coating (inorganic material coat, fluorine-based coat, ceramic-based coat, DLC coat) of which inorganic ceramic is the base material. By carrying out, the low friction process may be given. In general, coatings applicable to solid lubrication have a friction coefficient of 0.1 to 0.4 in a vacuum environment, and may minimize the friction coefficient (μ2) of the contact portion between the carrier receiving surface 41 and the substrate carrier 9 . Thereby, it becomes possible to set it as F1>F2 as a relationship of the said frictional force.

In addition, there is a difference in the degree of slippage between the substrate carrier 9 and the mask 6 and the degree of slippage between the substrate carrier 9 and the substrate carrier support 8 (carrier receiving surface 41 ). The method is technically complex, and is not limited to a specific method, and various methods may be employed depending on the configuration of the apparatus and the like. That is, the control (setting) of the friction force (coefficient of friction) can be carried out in various factors are thought to be related. In the apparatus structure of this embodiment, as shown in FIG. 8, the inventors enlarge the contact area of the seating block 31 and the mask frame 6a, and the carrier receiving surface 41 and the board|substrate carrier 9 contact It has been acquired as an empirical knowledge that reducing the area, that is, making a difference in the contact area in each contact portion, has a large contribution ratio to giving a difference in the friction coefficient in each contact portion.

The substrate holding shaft 12 is provided over the outside and the inside of the chamber 4 through a through hole provided in the upper partition 4a of the chamber 4 . In the film-forming space, the carrier support part 8 is provided in the lower part of the board|substrate holding shaft 12, and the board|substrate 5 which is a film-forming object can be hold|maintained via the board|substrate carrier 9. As shown in FIG.

The through hole is designed to be large enough for the outer diameter of the substrate holding shaft 12 so that the substrate holding shaft 12 and the upper partition wall 4a do not interfere. In the substrate holding shaft 12, the section from the through hole of the upper partition 4 to the fixed portion of the Z elevation slider 10 (a portion above the through hole) is defined as the Z elevation slider 10 and the upper partition wall. It is covered by the bellows 40 fixed to (4a). Thereby, since the substrate holding shaft 12 is covered by the closed space communicating with the chamber 4 , the entire substrate holding shaft 12 is placed in the same state as the film forming space 2 (eg, in a vacuum state). ) can be maintained. As the bellows 40, one having flexibility also in the Z-direction and the XY-direction may be used. Thereby, the resistance force generated when the bellows 40 is displaced by the operation of the alignment device 1 can be sufficiently reduced, and the load at the time of position adjustment can be reduced.

Various operations by the alignment device 1 (alignment by a rotary translation mechanism, lifting and lowering of the Z-elevating slider 10 by a distance changing means, holding the substrate by the carrier support 8, vapor deposition by the evaporation source 7 etc.) is controlled by the control unit 70 . The control unit 70 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 70 is realized when the processor executes the program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, an embedded computer or a programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 70 may be configured by circuits such as ASICs or FPGAs. In addition, the control part 70 may be provided for every vapor deposition apparatus, and one control part 70 may control a some vapor deposition apparatus.

Next, the detailed content of the alignment mechanism 60 of the alignment apparatus 1 is demonstrated with reference to FIG. 7 : is a perspective view which shows one form of an alignment mechanism. The guide for guiding the Z-elevating slider 10 in the vertical Z direction includes a plurality of (four in this case) Z-guides 18a to 18d, and is fixed to the side surface of the Z-elevating base 13 . A ball screw 27 for transmitting driving force is disposed in the center of the Z lifting slider, and the power transmitted from the motor 26 fixed to the Z lifting base 13 is transmitted through the ball screw 27 to the Z lifting slider 10 ) is transmitted to

The motor 26 has a built-in rotary encoder (not shown), and can measure the Z-direction position of the Z raising/lowering slider 10 indirectly according to the rotation speed of the encoder. By controlling the drive of the motor 26 by an external controller, precise positioning of the Z raising/lowering slider 10 in the Z direction is possible. In addition, the raising/lowering mechanism of the Z raising/lowering slider 10 is not limited to the ball screw 27 and a rotary encoder, Arbitrary mechanisms, such as a combination of a linear motor and a linear encoder, are employable.

In the configuration of FIG. 9 , the rotational translation mechanism 11 has a plurality of drive units 21a, 2lb, 21c, and 21d at four corners of the base. Each of the driving units 21a to 21d is arranged by rotating the orientation around the Z-axis by 90 degrees so that the direction of generating the driving force is different by 90 degrees for each of the four corners.

Each drive unit 21 is provided with a drive unit motor 25 which generates a drive force. Each drive unit 21 also has a first guide 22 that slides in a first direction when the force of the drive unit motor 25 is transmitted through the drive unit ball screw 46, and a first direction in the XY plane. and a second guide 23 sliding in a second direction orthogonal to . Furthermore, a rotary bearing 24 rotatable about the Z-axis is provided. For example, in the case of the drive unit 21d, it has a first guide 22 sliding in the X direction, a second guide 23 sliding in the Y direction orthogonal to the X direction, and a rotary bearing 24, , the force of the drive unit motor 25 is transmitted to the first guide 22 through the drive unit ball screw 46 . The other drive units 21a, 21b, and 21c also have a configuration similar to that of the drive unit 21d, except that their arrangement orientations differ from each other by 90 degrees.

The drive unit motor 25 incorporates a rotary encoder (not shown), so that the displacement amount of the first guide 22 can be measured. In each drive unit 21 , by controlling the drive of the drive unit motor 25 by the control unit 70 , it is possible to precisely control the position of the Z lifting base 13 in the XYθz direction.

For example, when the Z lifting base 13 is moved in the +X direction, the driving unit motor 25 applies a sliding force in the +X direction in each of the drive unit 21a and the drive unit 21d to the drive unit motor 25 . It can be generated by this, and what is necessary is just to transmit the force to the Z-elevating base 13 . In addition, when moving in the +Y direction, the drive unit motor 25 generates a sliding force in the +Y direction in each of the drive unit 21b and the drive unit 21c, and the Z lifting base 13 ) to transmit that power.

When the Z lifting base 13 is rotated +θ (rotated θz in the clockwise direction) around a rotation axis parallel to the Z axis, the drive unit 21a and the drive unit 21d arranged diagonally are used to rotate the Z axis. What is necessary is to generate a force necessary to rotate +θz around and transmit the force to the Z lifting base 13 . Alternatively, a force required for rotation may be transmitted to the Z-elevating base 13 using the drive unit 21b and the drive unit 21c.

Next, in order to detect the position of the board|substrate 5 and the mask 6, the imaging apparatus for measuring the position of each alignment mark simultaneously is demonstrated. As shown in Figs. 1 and 5, on the surface of the outer side of the upper partition wall 4a, the alignment mark (mask mark) on the mask 6 and the alignment mark (substrate mark) on the substrate 5 are obtained. An imaging device 14 (14a, 14b, 14c, 14d) serving as a position acquisition means is disposed. A through hole for imaging is provided in the upper partition 4a on the camera optical axis so that the position of the alignment mark arrange|positioned inside the chamber 4 can be measured with the imaging device 14. Window glass 17 (17a, 17b, 17c, 17d) etc. are provided in the through-hole for imaging in order to maintain the atmospheric pressure inside a chamber. Furthermore, by providing an illumination (not shown) inside or in the vicinity of the imaging device 14 and irradiating light to the vicinity of the alignment mark of the substrate and the mask, accurate measurement of the mark image is possible. In addition, in FIG. 1, the imaging device 14d and the window glass 17c, 17d are covered by another member, and are not shown in figure.

With reference to FIG.10(a) - FIG.10(c), the method of measuring the position of the board|substrate mark 37 and the mask mark 38 using the imaging device 14 is demonstrated.

FIG. 10A is a view from above of the substrate 5 on the carrier face plate 30 in a state held by the carrier support 8 . On the board|substrate 5, the board|substrate marks 37a, 37b, 37c, 37d which can be measured by the imaging device 14 are formed in the four corners of the board|substrate 5. As shown in FIG. The substrate marks 37a to 37d are simultaneously measured by the four imaging devices 14a to 14d, and the translation amount of the substrate 5 from the positional relationship of the respective center positions of the respective substrate marks 37a to 37d. , by calculating the rotation amount, the positional information of the substrate 5 can be acquired. On the other hand, a through hole is opened in the carrier face plate 30, and it is possible to measure the position of the substrate mark 37 by the imaging device 14 from the upper part.

FIG. 10B is a view of the mask frame 6a as viewed from the top. Mask marks 38a, 38b, 38c, and 38d that can be measured by an imaging device are formed in the four corners. This mask mark 38a-38d is simultaneously measured by the four imaging devices 14a, 14b, 14c, 14d, and the mask 6 from the positional relationship of each center position of 4 points of each mask mark 38a-38d. ), a translation amount, a rotation amount, etc. can be calculated, and the positional information of the mask 6 can be acquired.

FIG.10(c) schematically shows the visual field 44 of a captured image when one set out of four sets of the mask mark 38 and the board|substrate mark 37 is measured with the imaging device 14. the drawing shown. In this example, within the visual field 44 of the imaging device 14, since the board|substrate mark 37 and the mask mark 38 are measured simultaneously, it is possible to measure the relative position of mark centers. Mark center coordinates can be calculated|required using the image processing apparatus (not shown) based on the image obtained by the measurement of the imaging device 14. As shown in FIG. In addition, although the thing of a square or circular shape was shown as the mask mark 38 and the board|substrate mark 37, the shape of a mark is not limited to this. For example, it is preferable to use a shape having symmetry, such as an X mark or a cross, so that the center position can be easily calculated.

When high-precision alignment is required, a high magnification CCD camera having a high resolution of about several micrometers is used as the imaging device 14 . Since the diameter of the field of view of such a high magnification CCD camera is as narrow as several millimeters, if the position shift when the substrate carrier 9 is placed on the carrier receiving finger 42 is large, the substrate mark 37 will deviate from the field of view, and measurement it becomes impossible Accordingly, as the imaging device 14, it is preferable to provide a high magnification CCD camera and a low magnification CCD camera having a wide field of view in parallel. In that case, coarse alignment (rough alignment) is performed using a low magnification CCD camera so that the mask mark 38 and the substrate mark 37 enter the field of view of the high magnification CCD camera at the same time, and then the mask mark is performed using a high magnification CCD camera. Position measurement of (38) and the board|substrate mark 37 is performed, and high-precision alignment (fine alignment) is performed.

By using a high magnification CCD camera as the imaging device 14, the relative position of the mask frame 6a and the substrate 5 can be adjusted with precision within a few micrometers of error. However, the imaging device 14 is not limited to a CCD camera, For example, a digital camera provided with a CMOS sensor as an imaging element may be sufficient. In addition, even if the high magnification camera and the low magnification camera are not separately installed, high magnification and low magnification measurement may be possible with a single camera by using a camera or a zoom lens in which a high magnification lens and a low magnification lens can be exchanged.

From the positional information of the mask frame 6a and the positional information of the board|substrate 5 acquired by the imaging device 14, the relative positional information of the mask frame 6a and the board|substrate 5 can be acquired. This relative position information is fed back to the control part 70 of an alignment apparatus, and the drive amount of each drive part, such as the raising/lowering slider 10, the rotation translation mechanism 11, and the carrier support part 8, is controlled.

(How to place the board)

Hereinafter, the substrate 5 is set on the substrate carrier 9, the substrate 5 and the mask 6 on the substrate carrier 9 are aligned, and the substrate carrier 9 (substrate 5) is applied to the mask ( A series of operation|movement of a vapor deposition apparatus until it mounts on 6) is demonstrated.

It is a flowchart which shows the operation sequence of the vapor deposition apparatus of embodiment.

First, in step S101, a substrate carrier 9 mounted on a roller conveying mechanism (not shown) is loaded into the chamber 4 through a gate valve, and is placed on the carrier receiving fingers 42 on both sides of the carrier support 8 . is witty on A plurality of carrier receiving fingers 42a are arranged at predetermined intervals along one side of the substrate 5 (substrate carrier 9), and in the vicinity of one side of the substrate 5, the substrate carrier 9 support the periphery of A plurality of other carrier receiving fingers 42b are arranged at predetermined intervals along a second side opposite to the first side of the substrate 5, and the substrate carrier 9 is disposed in the vicinity of the second side of the substrate 5. ) to support the periphery of

Next, in step S103, the board|substrate carrier 9 is lowered and set to the height imaged with the low magnification CCD camera. Next, in step S104, the substrate mark 37 provided on the substrate 5 is imaged with a low magnification CCD camera. The control part 70 acquires the positional information of the board|substrate 5 based on the captured image, and stores it in memory.

Step S105 is executed following step S104, or when the determination in step S109 or S113 is &quot;NO&quot;

In step S105 performed subsequent to step S104, the substrate carrier 9 is lowered and set at the alignment operation height, and the position of the substrate 5 is adjusted based on the positional information obtained in step S104. .

First, speaking of the height of the substrate carrier 9, the distance between the carrier receiving surface 41 (the upper surface of the carrier receiving finger 42) and the mask 6 is changed to a lower height than in step S104 . However, at this time, the position of the carrier receiving surface 41 is set to a height at which the substrate 5 on the substrate carrier 9 drooping by its own weight does not contact the mask 6 . On the other hand, depending on the case, step S105 and step S104 may be performed at the same height.

In the alignment operation in step S105 performed subsequent to step S104, the control unit 70, based on the positional information of the substrate 5 acquired in step S104, the alignment apparatus 1 has The positioning mechanism 60 is driven. That is, the control part 70 adjusts the position of the board|substrate 5 so that the board|substrate mark 37 of the board|substrate 5 may fall within the visual field of a high magnification CCD camera. On the other hand, with respect to the mask 6, the relative position of the mask 6 and the high magnification CCD camera is adjusted in advance so that the mask mark 38 falls within the field of view (preferably the center of the field of view) of the high magnification CCD camera. have. For this reason, by the alignment operation|movement in step S105 performed following step S104, it adjusts so that both the board|substrate mark 37 and the mask mark 38 may come in the field of a high magnification CCD camera. However, at this point in time, from the relationship of the depth of field, there is a possibility that the substrate mark 37 cannot be imaged with a high magnification CCD camera. On the other hand, in the alignment operation, although the substrate 5 is moved in the XYθz direction, the substrate 5 drooping by its own weight as described above moves to a height at which it does not contact the mask 6, so the surface of the substrate 5 , or the film pattern already formed on the surface of the substrate 5 slides with the mask 6 and is not damaged.

Next, in step S106, the substrate carrier 9 is lowered, and the substrate 5 is set at a height imaged with a high magnification CCD camera.

Here, since a high magnification CCD camera with a shallow depth of field is focused on both the substrate mark 37 and the mask mark 36 to take pictures, at least a part of the substrate 5 (sagging part) comes into contact with the mask 6 . The substrate 5 is brought close to the mask 6 until a substrate mask contact is made.

Next, in step S108, the substrate mark 37 of the substrate 5 and the mask mark 38 of the mask 6 are simultaneously imaged by the high magnification CCD camera. The control part 70 acquires relative positional information of the board|substrate 5 and the mask 6 based on the captured image. The relative position information here is specifically, information regarding the distance between the center positions of the substrate mark 37 and the mask mark 38, and the direction of a position shift. Step S108 is a measurement process (measurement process) of acquiring relative position information (relative position shift amount) between the substrate 5 and the mask 6 and measuring the position shift amount between the substrate 5 and the mask 6 . )am.

Next, in step S109 , the control unit 70 determines whether the amount of positional shift between the substrate 5 and the mask 6 measured in step S108 is equal to or less than a predetermined threshold value. The predetermined threshold value is a value set in advance so that the amount of position shift between the substrate 5 and the mask 6 falls within a range in which there is no problem even when film formation is performed. The threshold value is set so as to achieve the required alignment accuracy of the substrate 5 and the mask 6 . The threshold value is, for example, such that the error is within several micrometers.

If it is determined in step S109 that the amount of position shift between the substrate 5 and the mask 6 exceeds a predetermined threshold (step S109: NO), the flow returns to step S105 and the alignment operation is executed. and the processing after step S106 is continued.

If it is determined in step S109 that the amount of position shift between the substrate 5 and the mask 6 exceeds a predetermined threshold (step S109: NO), the flow returns to step S105 and the alignment operation is executed. and the processing after step S106 is continued.

In the alignment operation performed when the determination in step S109 is NO, the control unit 70 controls the alignment apparatus 1 based on the relative position information between the substrate 5 and the mask 6 acquired in step S108. ) drives the positioning mechanism provided. That is, the control unit 70 moves the substrate 5 in the XYθz direction so that the substrate mark 37 of the substrate 5 and the mask mark 38 of the mask 6 are closer to each other to position the position. Adjust.

In the alignment operation, the substrate 5 is moved in the XYθz direction, but as described above, since the substrate 5 drooping by its own weight is moved at a height not in contact with the mask 6, the surface of the substrate 5, Alternatively, the film pattern already formed on the surface of the substrate 5 slides with the mask 6 and is not damaged.

Step S105 is an alignment process (alignment process) in which the substrate 5 is moved so that the amount of misalignment between the substrate 5 and the mask 6 is reduced, and fine alignment is performed when the determination in step S109 is NO. is done

When the determination in step S109 is YES, in step S110, the substrate carrier 9 is further lowered so that the entire substrate carrier 9 is placed on the mask frame 6a. That is, the support of the substrate carrier 9 by the carrier support 8 is released, and the substrate carrier 9 (substrate 5) and the mask frame 6a (mask 6) on which it is mounted are together, the mask It will be in the state supported by the pedestal 16 (mask support part). And in step S112, the board|substrate mark 37 and the mask mark 36 are imaged with a high magnification CCD camera, and the relative positional information of the board|substrate 5 and the mask 6 is acquired.

Next, in step S113 , the control unit 70 controls the amount of position shift between the substrate 5 and the mask 6 based on the relative position information between the substrate 5 and the mask 6 obtained in the step S112 . It is determined whether or not it is below a predetermined threshold. The predetermined threshold value is set in advance under the condition that it is within a range in which there is no problem even if film formation is performed as long as it is within the threshold value.

When it is determined in step S113 that the displacement amount between the substrate 5 and the mask 6 exceeds a predetermined threshold (step S113: NO), the carrier receiving finger 42 is moved to the substrate 5 The substrate carrier 9 is supported by raising it to a height of . On the other hand, such NO determination may occur, for example, when a position shift occurs due to external vibration between steps S109 to S114.

Then, the flow returns to step S105 to execute the alignment operation. After that, the processing after step S106 is continued.

On the other hand, when it is determined in step S113 that the displacement amount between the substrate 5 and the mask 6a is equal to or less than a predetermined threshold value (step S113: YES), the flow advances to step S114, and the mask lifting platform (16) is lowered and transferred to the conveying roller (15). Thereby, the alignment sequence is completed (END).

In the present embodiment, as a supporting step, as a pair of peripheral regions in the periphery of the substrate carrier 9 , the substrate carrier 9 corresponding to a pair of opposing sides among the four sides constituting the periphery of the substrate 5 . The opposing periphery of is supported by the substrate carrier support 8 so that the opposing periphery follows a predetermined direction. Moreover, as a pair of periphery regions in the periphery of the mask 6, opposing of the mask 6 (mask frame 6a) corresponding to a pair of opposing sides among the four sides which make up the periphery of the mask 6 . The periphery is supported by the mask support part (mask pedestal 16) so that the said opposing periphery may follow a predetermined direction. On the other hand, in the present embodiment, the predetermined direction (first direction) is the Y-axis direction, and the second direction is the X-axis direction (carrier receiving surface 41a as the first supporting part to the carrier receiving surface 4lb as the second supporting part). ) or the direction from one to the other of the pair of peripheral regions of the substrate carrier 9 supported by them), the third direction is the Z-axis direction, but is not limited thereto. In addition, although the rectangular substrate 5 and the rectangular mask 6 were respectively illustrated in this embodiment, the shape of the substrate and mask is not limited to a rectangular shape, and a predetermined direction among a plurality of sides forming the periphery of the substrate or mask. It can be set as the structure which supports a pair of peripheral regions corresponding to a pair of opposing sides arrange|positioned along the.

And, as an attaching process, the substrate carrier 9 and the mask 6 are attached from a position where the substrate carrier 9 is separated upwardly from the mask 6 , the substrate carrier 9 is placed on the mask 6 . The substrate carrier support 8 is lowered to move it into position (transition from the disengaged state to the attached state). In this embodiment, it is descended along the Z-axis direction as the third direction, but it may be a direction with some angle with respect to the Z-axis direction within a range that can realize the desired placement operation of the present invention. In addition, the mask support part may be moved without moving the substrate carrier support part 8, and both may be moved.

At this time, the substrate carrier 9 supported only by the substrate carrier support 8 and the mask 6 supported only by the mask support portion satisfy the relationship of dc > dm (Equation (1)) as described above. , each supported. Accordingly, the substrate carrier 9 and the mask 6 have the largest sag in the third direction in the substrate carrier 9 when moving from the separation position to the attachment position, and in the mask 6 , Contact is started from the portion where the deflection is greatest in the third direction.

As described above, the substrate carrier 9 does not slide with respect to the mask 6 in a direction orthogonal to the third direction when in contact with the mask 6 in movement from the separation position to the attachment position. It is supported by the substrate carrier support part 8 so that the degree of slidability with respect to the board|substrate carrier support part 8 (carrier receiving surface 41) may become large rather than an easy degree. That is, the substrate carrier 9 undergoes deformation such that the positions of both ends in the second direction are displaced in the second direction along with the resolution of the sagging state. . Thereby, the position shift of the plane direction when the board|substrate carrier 9 is mounted on the mask 6 is suppressed effectively.

Various methods may be used for the control of the magnitude of the slippery degree described above. For example, while the seating member 31 of the substrate carrier 9 is made of a metal member such as iron similar to the mask 6 (mask frame 6a), at least the contact portion of the two is a polished surface. or a grinding surface, and the contact area in the contact portion is appropriately set. On the other hand, on the carrier receiving surface 41, the frictional force to the extent that the substrate carrier 9 does not slip off when supported alone is ensured, and the substrate carrier 9 rather than between the seating member 31 and the mask 6 is provided. You may apply various coating films so that it may become easy to slide with respect to it. In addition, you may use methods other than the method demonstrated in this embodiment suitably.

According to this embodiment, when aligning the substrate carrier and the mask in the vapor deposition apparatus, it is possible to accurately position the substrate to the mask, and it is possible to mount the mask on the substrate by making the gap between the substrate and the mask sufficiently small. will do Therefore, it becomes possible to reduce film-forming nonuniformity, and it becomes possible to aim at the improvement of film-forming precision.

[Embodiment 2]

Next, another embodiment according to the present invention will be described. In Embodiment 1, the vapor deposition apparatus which performed both alignment of a board|substrate and a mask, and film-forming in one chamber was demonstrated. In the present embodiment, using at least two chambers, alignment of the substrate and the mask is performed in the first chamber as the mask attaching chamber, the mask is mounted on the substrate, and the substrate with the mask is transferred to the second chamber as the film forming chamber. Then, a film is formed on the substrate through the mask in the second chamber. That is, the film-forming apparatus which concerns on this embodiment has the alignment chamber which aligns a board|substrate and a mask, and the film-forming chamber which performs film-forming on a board|substrate. In addition, in the description of Embodiment 2, by using the same code|symbol about the structure common to Embodiment 1, description is abbreviate|omitted again about the content common to Embodiment 1 in Embodiment 2. Matters not specifically described in the second embodiment are the same as in the first embodiment.

Next, the manufacturing system (film-forming system) which implemented this invention is demonstrated. 12 : is a schematic block diagram of the manufacturing system which implemented this invention, and has illustrated the manufacturing system 300 which manufactures organic electroluminescent panel in-line. Reference numeral 90 denotes an input chamber for putting the carrier substrate and the mask on the line. In the alignment chamber 100, the alignment apparatus 1 of the present invention is mounted, the substrate 5 and the mask 6 loaded on the substrate carrier 9 are aligned with high precision, and thereafter, the conveying roller 15 transfer to the next step to start conveyance. The film formation chamber 110 forms a film on a surface other than the position covered by the mask 6 of the substrate 5 by passing the substrate 5 on the loaded substrate carrier 9 over the evaporation source 7 . .

[Embodiment 3]

<Method for manufacturing electronic device>

A method for manufacturing an electronic device using the substrate processing apparatus will be described. Here, as an example of an electronic device, the case of organic electroluminescent element used for display apparatuses, such as an organic electroluminescent display apparatus, etc. is demonstrated as an example. In addition, the electronic device which concerns on this invention is not limited to this, A thin film solar cell and organic CMOS image sensor may be sufficient. In this embodiment, there is a step of forming an organic film on the substrate 5 using the above film forming method. Moreover, after forming an organic film on the board|substrate 5, it has the process of forming a metal film or a metal oxide film. The structure of the organic electroluminescence display 600 obtained by such a process is demonstrated below.

Fig. 13A is an overall view of the organic EL display device 600, and Fig. 13B shows a cross-sectional structure of one pixel. As shown in FIG. 13A , in the display area 61 of the organic EL display device 600 , a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix shape. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 61 . In the case of the organic EL display device of this figure, the pixel 62 is constituted by a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light different from each other. . The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element. does not Moreover, each light emitting element may be comprised by laminating|stacking a some light emitting layer.

In addition, the pixel 62 is constituted by a plurality of light emitting elements that emit the same light emission, and a color filter in which a plurality of different color conversion elements are arranged in a pattern to correspond to each light emitting element is used, so that one pixel is a display area In (61), display of a desired color may be enabled. For example, the pixel 62 may be constituted by at least three white light emitting elements, and a color filter in which each of red, green, and blue color conversion elements is arranged to correspond to each light emitting element may be used. Alternatively, a color filter may be used in which the pixel 62 is composed of at least three blue light emitting elements, and each color conversion element of red, green, and colorless is arranged so as to correspond to each light emitting element. In the latter case, by using a quantum dot color filter (QD-CF) using a quantum dot (QD) material as a material constituting the color filter, the display color is higher than that of a normal organic EL display device that does not use a quantum dot color filter. area can be widened.

Fig. 13(b) is a schematic partial cross-sectional view taken along line A-B of Fig. 13(a). The pixel 62 includes, on a substrate 5 , a first electrode (anode) 64 , a hole transport layer 65 , any of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67 , It has an organic electroluminescent element provided with the 2nd electrode (cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In this embodiment, the light emitting layer 66R is an organic EL layer emitting red light, the light emitting layer 66G is an organic EL layer emitting green color, and the light emitting layer 66B is an organic EL layer emitting blue color. On the other hand, when a color filter or quantum dot color filter is used as described above, a color filter or quantum dot color filter is disposed on the light emitting side of each light emitting layer, that is, on the upper or lower part of FIG. omit

The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (which may be described as organic EL elements) emitting red, green, and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65 , the electron transport layer 67 , and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. On the other hand, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the first electrodes 64 . Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer P for protecting the organic EL element from moisture or oxygen is provided.

Next, the example of the manufacturing method of the organic electroluminescent display as an electronic device is demonstrated concretely. First, a substrate 5 on which a circuit (not shown) for driving an organic EL display device and a first electrode 64 are formed is prepared.

Next, on the substrate 5 on which the first electrode 64 is formed, a resin layer such as an acrylic resin or polyimide is formed by spin coating, and the resin layer is formed by a lithography method on the portion where the first electrode 64 is formed. The insulating layer 69 is formed by patterning so as to form an opening therein. This opening corresponds to the light emitting region in which the light emitting element actually emits light.

Next, the substrate 5 on which the insulating layer 69 is patterned is loaded into the first film forming apparatus, the substrate is held in the substrate holding unit, and the hole transport layer 65 is applied to the first electrode 64 of the display area. ) as a common layer on top. The hole transport layer 65 is formed by vacuum deposition. In reality, since the hole transport layer 65 is formed in a size larger than that of the display area 61, a very fine (high-definition) mask is unnecessary. Here, the film-forming apparatus used in the film-forming in this step and the film-forming of each following layer is the film-forming apparatus in any one of said each embodiment.

Next, the substrate 5 formed up to the hole transport layer 65 is loaded into the second film forming apparatus, and is held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the red light emitting layer 66R is formed on the portion of the substrate 5 where the red light emitting element is disposed. According to this example, a mask and a board|substrate can be laminated|stacked favorably, and high-precision film formation can be performed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green light is formed by the third film forming apparatus, and further, the light emitting layer 66B which emits blue light is formed by the fourth film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transporting layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. Each of the light-emitting layers 66R, 66G, and 66B may be a single layer or a layer in which a plurality of different layers are laminated. The electron transport layer 65 is formed as a layer common to the light emitting layers 66R, 66G, and 66B of the three colors. In this embodiment, the electron transport layer 67 and the light emitting layers 66R, 66G, and 66B are formed by vacuum deposition.

Next, the second electrode 68 is formed on the electron transport layer 67 . The second electrode may be formed by vacuum vapor deposition or may be formed by sputtering. Thereafter, the substrate on which the second electrode 68 is formed is moved to an encapsulation device to form a protective layer P by plasma CVD (sealing step), and the organic EL display device 600 is completed. In addition, although it was assumed here that the protective layer P was formed by the CVD method, it is not limited to this, You may form by the ALD method or the inkjet method.

When the substrate 5 on which the insulating layer 69 is patterned is brought into the film forming apparatus and then exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer P is completed, the light emitting layer made of the organic EL material is It may be deteriorated by moisture or oxygen. Therefore, in this example, carrying in and carrying out of the board|substrate between film-forming apparatuses is performed in a vacuum atmosphere or inert gas atmosphere.

100: alignment room
1: alignment device
8: substrate carrier support
9: Substrate carrier
60: positioning mechanism
11: Rotational translation mechanism
10: Z lift slider
13: Z lift base
18: Z guide
70: control unit
5: Substrate
6: Mask
6a: mask frame
31: seating block

Claims (29)

substrate carrier support means for supporting a substrate carrier holding the substrate;
a mask support means for supporting the mask;
moving means for moving at least one of the substrate carrier support means and the mask support means so as to switch between a state in which the substrate carrier is spaced apart from the mask and an attachment state in which the substrate carrier is placed on the mask; As a mask attaching device to
The substrate carrier support means,
a first substrate carrier support portion supporting a periphery of a first side along a first direction of the substrate carrier;
a second substrate carrier support portion supporting a periphery of a second side of the substrate carrier along the first direction;
The mask support means,
a first mask support part supporting a periphery of a first mask side of the mask in the first direction;
a second mask support portion supporting a periphery of a second mask side of the mask along the first direction;
In the spaced state, the first substrate carrier support and the second substrate carrier support support the substrate carrier so that the amount of deflection dc of the substrate carrier is a first amount of deflection,
In the separation state, the first mask support part and the second mask support part support the mask so that a second amount of deflection (dm) of the mask is smaller than the first amount of deflection. According to claim 1,
The amount of deflection (dc) of the substrate carrier is a difference between the height of the first side and the height of the central portion between the first side and the second side,
The mask attaching apparatus according to claim 1, wherein the amount of deflection (dm) of the mask is a difference between a height of the first mask side and a height of a central portion between the first mask side and the second mask side. According to claim 1,
The amount of deflection dc of the substrate carrier is a difference between the height of the first side or the second side and the height of the bottom of the substrate carrier at the lowest position,
The mask attaching apparatus according to claim 1, wherein the amount of deflection (dm) of the mask is a difference between the height of the first mask side or the second mask side and the height of the bottom of the mask at the lowest position. According to claim 1,
and a portion of the substrate carrier at the lowest position in the spaced state first contacts the mask when transitioning from the spaced state to the attach state. 5. The method of claim 4,
and the lowermost portion of the substrate carrier is in contact with the lowermost portion of the mask in the spaced apart state when transitioning from the spaced state to the attached state. 5. The method of claim 4,
The substrate carrier has a seating member provided outside a holding surface for holding the substrate and protruding toward the mask from the substrate;
The said seating member is provided in the said lowest position part of the said board|substrate carrier, The mask attaching apparatus characterized by the above-mentioned. According to claim 1,
The substrate carrier has a plurality of seating members provided outside a holding surface for holding the substrate and projecting toward the mask from the substrate. 8. The method of claim 7,
The frictional force generated between the seating member and the mask from when any one of the plurality of seating members comes into contact with the mask until all of the plurality of seating members comes into contact with the mask is The mask attaching apparatus according to claim 1, wherein the frictional force generated between the substrate carrier and the first substrate carrier support portion and the second substrate carrier support portion is greater than that of the substrate carrier. 8. The method of claim 7,
and a contact area of the plurality of seating members in contact with the mask is larger than a contact area of the substrate carrier in contact with the first substrate carrier support and the second substrate carrier support. 8. The method of claim 7,
A friction coefficient between the plurality of seating members and the mask is larger than a coefficient of friction between the substrate carrier and the first substrate carrier support portion and the second substrate carrier support portion. 8. The method of claim 7,
The mask attaching device characterized in that the contact part with the said mask of the said some seating member is comprised with the metal member. 8. The method of claim 7,
The mask attaching apparatus characterized by the above-mentioned, the contact part with the said mask of the said some seating member being comprised by the grinding|polishing surface or grinding processing surface. According to claim 1,
Each of the substrate and the mask has a rectangular shape. According to claim 1,
The mask has a frame-shaped mask frame and a mask foil supported by the mask frame,
and when switching from the separated state to the attached state, the substrate carrier first contacts the mask frame. 15. The method of claim 14,
The substrate carrier includes a face plate member made of aluminum or aluminum alloy,
Said mask frame is comprised by iron or an iron alloy, The mask attaching apparatus characterized by the above-mentioned. According to claim 1,
The apparatus for attaching a mask, wherein the first substrate carrier support portion and the second substrate carrier support portion are coated with any one of an inorganic material, a fluorine-based coat, a ceramic-based coat, and a DLC coat. 17. A mask attaching chamber comprising the mask attaching apparatus according to any one of claims 1 to 16 and attaching the mask to the substrate carrier;
a film forming chamber having film forming means for forming a film through the mask on a film forming surface of a substrate held by the substrate carrier to which the mask is attached;
and conveying means for conveying the substrate carrier with the mask in the mask attaching chamber along the first direction in the film forming chamber. A method of attaching a mask for attaching a mask to a substrate carrier holding a substrate, the method comprising:
In a state in which the substrate carrier is spaced apart from the mask, a periphery of a first side along the first direction of the substrate carrier so that the amount of deflection dc of the substrate carrier becomes the first amount of deflection; a substrate carrier supporting step of supporting a periphery of a second side along one direction;
In the separation state, the periphery of the first mask side of the mask along the first direction, and the mask along the first direction so that the deflection amount dm of the mask becomes a second deflection amount smaller than the first deflection amount a mask supporting step of supporting the periphery of the second mask side;
A mask attaching method comprising a mounting step of placing the substrate carrier supported by the substrate carrier supporting step on the mask supported by the mask supporting step. 19. The method of claim 18,
The amount of deflection (dc) of the substrate carrier is a difference between the height of the first side and the height of the central portion between the first side and the second side,
The mask attaching method according to claim 1, wherein the amount of deflection (dm) of the mask is a difference between a height of the first mask side and a height of a central portion between the first mask side and the second mask side. 19. The method of claim 18,
The amount of deflection dc of the substrate carrier is a difference between the height of the first side or the second side and the height of the bottom of the substrate carrier at the lowest position,
The mask attaching method, characterized in that the amount of sagging (dm) of the mask is a difference between the height of the side of the first mask or the side of the second mask and the height of the bottom of the mask at the lowest position. 19. The method of claim 18,
In the mounting step, a portion of the substrate carrier at the lowest position in the separation state first contacts the mask. 22. The method of claim 21,
In the mounting step, the lowermost portion of the substrate carrier is in contact with the lowermost portion of the mask in the spaced apart state. 22. The method of claim 21,
The substrate carrier has a seating member that is provided at the lowest position of the substrate carrier outside the holding surface for holding the substrate, and protrudes toward the mask rather than the substrate;
The said mounting process WHEREIN: The said seating member contacts the said mask first, The mask attaching method characterized by the above-mentioned. 19. The method of claim 18,
The substrate carrier is provided outside the holding surface for holding the substrate, and has a plurality of seating members projecting toward the mask rather than the substrate;
In the mounting step, frictional force generated between the seating member and the mask from when any one of the plurality of seating members comes into contact with the mask until all of the plurality of seating members come into contact with the mask. From a state in which the frictional force generated between the substrate carrier and the first substrate carrier supporting part supporting the periphery of the first side and the second substrate carrier supporting part supporting the periphery of the second side is smaller than the friction force between the seating member and the mask A method for attaching a mask, wherein a frictional force generated therebetween is changed to be larger than a frictional force generated between the substrate carrier and the first substrate carrier support and the second substrate carrier support. A film forming method characterized by performing film formation on a substrate held by the substrate carrier to which the mask is attached by the mask attaching method according to any one of claims 18 to 24. A method for manufacturing an electronic device, comprising a step of forming an organic film on a substrate using the film forming method according to claim 25 . A mask for film formation supported by a mask attaching apparatus for attaching a mask to a substrate carrier holding a substrate, comprising:
In a state in which the substrate carrier is spaced apart from the mask, a periphery of a first side along the first direction of the substrate carrier so that the amount of deflection dc of the substrate carrier becomes the first amount of deflection; A mask for film formation, wherein when the periphery of the second side along the first direction is supported, the amount of sag (dm) of the mask is a second amount of deflection smaller than the first amount of deflection. A substrate carrier supported by a mask attachment apparatus for attaching a mask to a substrate carrier holding a substrate, comprising:
In a state in which the substrate carrier is spaced apart from the mask, the periphery of the first mask side along the first direction of the mask and the first direction of the mask such that the amount of deflection dm of the mask becomes the second amount of deflection The substrate carrier, characterized in that when the periphery of the second mask side along the sag is supported, the amount of deflection dc of the substrate carrier is a first amount of deflection greater than the second amount of deflection. A set of a substrate carrier holding a substrate, and a mask attached to the substrate carrier, the set comprising:
When the substrate carrier is spaced apart from the mask and the periphery of the first side along the first direction of the substrate carrier and the periphery of the second side along the first direction of the substrate carrier are supported, the substrate The amount of deflection (dc) of the carrier is the first amount of deflection,
When the periphery of the first mask side along the first direction of the mask and the periphery of the second mask side along the first direction of the mask are supported in the spaced state, the amount of deflection dm of the mask is equal to the second A set of substrate carrier and mask, characterized in that the second amount of deflection is less than the first amount of deflection.

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